JP3140569U - High power module - Google Patents

Abstract

A high power module is provided for use in a power electronic device.
A structure of a wafer mainly installed on a substrate and fixed on a substrate, and a copper piece and a connecting part installed on a connecting wafer. There are a plurality of lock parts on the periphery of the wafer bonded by all the connecting parts, a plurality of through holes in the substrate, and a nut tank at the lower end of each through hole. Lock parts are provided in all through-holes, and there are nuts in the structure of the lock parts. The locks are installed by drilling upward from the through-holes below the board by engaging the pillars and locks. Yes.
[Selection] Figure 2

Description

The present invention is a combination structure of high-efficiency part modules applied to a kind of electronic power, and particularly can withstand the great gravity of the modular combination structure.

The development of science and technology has already been integrated beyond the domain, and in recent years the rapid development of power electronic parts and control technology has been striking. The impact extends to power electronics technology, as well as applications in areas such as electrical energy conversion and energy saving, and improvement of daily life quality. Developed countries have already spent several years on the integration of electric power, electronics and electrical machinery, with a growing new perspective such as the liberalization of the glorious electric power electronics industry, the use in renewable energy and new energy development and the demand for power stability. In the current situation, the market potential is certainly worth noting.

As described with reference to FIG. 6, there are several screws 20 fixed to the board 10 in the internal structure of the traditional large utility part module, and the installation of the screws 20 strengthens the fixed module structure. For this reason, the screw 20 and the wafer fixed above the substrate 10 are all packaged and fixed equally to the connecting parts and the like, and are connected to the power equipment by the connecting parts. However, when a general contractor uses the high-efficiency part module, the combined power parts are often combined with the high-efficiency part module. Since the board 10 is easy to take off, it is necessary to replace the parts of the big utility rate.

The main purpose of the present invention is to provide a kind of comparatively good equipment structure with a high efficiency part module. By locking the lock parts from the bottom to the top, the lock parts can be of different sizes. It is assumed to be placed between the through hole and the expansion tank. As a result, the lock parts are firmly fixed to the wafer and bonded together when there are many parts, etc., and a relatively large gravity is applied at the connection part of the external power supply of the connection parts by utilizing the stable connection of the lock parts and the substrate. The contract is to avoid damage to the detachment of the seal packaging kit and the substrate.

See what is shown in FIGS. The structure of the large utility part module combination of this creation is mainly that a plurality of through holes 11 are provided in the substrate 1, a tank 111 is opened at the lower end opening of the through holes 11, and lock parts 2 are placed in all the through holes 11. The nut 21 is provided in the structure of the lock part 2, and the column body 22, the lock 23, and the lock part 2 are installed so as to penetrate upward through the through hole 11 below the substrate 1.

Please refer to FIG. 3 to FIG. The above-described lock part 2 is installed so as to penetrate the through hole 11 from the bottom of the substrate 1, and for this reason, the nut 21 is embedded in the expansion tank 111 of the through hole 11, and the column 22 part is placed in the through hole 11. Because the lock 23 of the lock part 2 protrudes on the surface of the substrate 1, the nut 21 of the lock part 2 is embedded in the expansion tank 111, and the through hole 11 and the expansion tank 111 have different hole diameters. In the fixed position where the nut 21 is embedded, the lock part 2 prevents the through-hole 11 from being penetrated easily.

Please continue to refer to FIG. 1 and FIG. For the wafer 3 bonded and fixed on the substrate 1 after being fixed with the lock part 2, and the copper piece 4 and the bonding part 5 placed on the connecting wafer 3, a plurality of pieces are provided on the periphery of the wafer 3 bonded with the bonding part 5. A lock part 2 is provided, and the plurality of lock parts 2 are packaged with a joint part 5 and a hermetic seal 6 respectively, and the joint part 5 is in contact with the power source of the power facility.

The lock part 2 is pierced and fixed from the bottom to the top, and the lock part 2 is placed between the large and small through-holes 11 and the expansion tank 111 with different diameters. In addition, it is covered and stabilized by wafers, bonding parts, etc., and by utilizing the stable bonding of the lock part 2 and the substrate 1, the bonding part 5 is wrapped with the seal 6 by the large gravity received at the connection point of the external power supply. Damage due to detachment of the kit and the substrate 1 can be avoided.

The solid figure of the external appearance of this invention. The three-dimensional figure of the internal structure of this invention. The exploded three-dimensional view of the structure local part of this invention. The three-dimensional view of the lock parts installed on the board | substrate of this invention. Sectional drawing which can be seen in the direction which the cross-section incision line of 5-5 shown in FIG. 4 and the arrow point. A three-dimensional diagram of the structure of the internal equipment of the well-known utilitarian parts.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Substrate 2 Lock part 3 Wafer 4 Copper piece 5 Bonding part 6 Seal 10 Substrate 11 Through hole 20 Screw 21 Nut 22 Column body 23 Lock 111 Expansion tank

Claims (1)

A fixed wafer is mainly placed on the substrate, a copper piece and a connecting part are provided by connecting the wafers, and a plurality of lock parts are provided on the periphery of the wafer where all the connecting parts are connected. The above parts are sealed and packaged, and the board has a plurality of through holes. A nut tank is provided at the lower end of each through hole, and a lock part is installed in each through hole. The structure of the lock parts includes nuts, pillars and locks, and the lock parts are installed with the through-holes below the board facing upwards.