JP3121376B2 - Polyimide laminate and cable insulated with the laminate - Google Patents

Polyimide laminate and cable insulated with the laminate

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Publication number
JP3121376B2
JP3121376B2 JP03155714A JP15571491A JP3121376B2 JP 3121376 B2 JP3121376 B2 JP 3121376B2 JP 03155714 A JP03155714 A JP 03155714A JP 15571491 A JP15571491 A JP 15571491A JP 3121376 B2 JP3121376 B2 JP 3121376B2
Authority
JP
Japan
Prior art keywords
laminate
polyimide
fluororesin
strength
heat seal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP03155714A
Other languages
Japanese (ja)
Other versions
JPH04351548A (en
Inventor
孝介 片岡
栄一郎 栗林
義秀 大成
寿則 水口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kaneka Corp
Original Assignee
Kaneka Corp
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Filing date
Publication date
Application filed by Kaneka Corp filed Critical Kaneka Corp
Priority to JP03155714A priority Critical patent/JP3121376B2/en
Publication of JPH04351548A publication Critical patent/JPH04351548A/en
Application granted granted Critical
Publication of JP3121376B2 publication Critical patent/JP3121376B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明はポリイミド積層体及び該
積層体で絶縁されたケーブルに関し、更に詳しくは、機
械的強度や絶縁破壊電圧に悪影響を与えることなく、絶
縁被覆のストリップ性不良を改善する、特定のヒートシ
ール強度を有するポリイミド積層体及び該積層体で絶縁
されたケーブルに関するものである。本発明の積層体
は、通常テープにして銅等の導体に巻かれ、モーター用
のコイル、ケーブルあるいは航空機用電線等に使用され
るものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polyimide laminate and a cable insulated by the laminate, and more particularly to a method for improving the stripping property of an insulation coating without adversely affecting mechanical strength and dielectric breakdown voltage. A polyimide laminate having a specific heat seal strength and a cable insulated with the laminate. The laminate of the present invention is usually wound into a conductor such as copper in the form of a tape, and is used for a coil, a cable for a motor, an electric wire for an aircraft, or the like.

【0002】[0002]

【従来の技術】ポリイミド積層体は上記の如く電線等の
絶縁被覆として用いられる。電線は通常、導体線にテー
プ状の上記積層体を巻き付け、その後所定の熱処理によ
りフッ素系樹脂を融着させて製造される。このようにし
て製造された電線同士を電気的に接続する場合、電線の
端部の絶縁被覆をストリップし半田等で接続される。し
かし、導体とフッ素系樹脂の接着力がポリイミドフィル
ムとフッ素系樹脂の接着力より大きいと、上記電線をス
トリップした時、導体上にフッ素系樹脂の一部が残って
しまい(ストリップ性不良)、電気的接続不良が発生す
るという問題が生じる。
2. Description of the Related Art As described above, a polyimide laminate is used as an insulating coating for electric wires and the like. The electric wire is usually manufactured by winding the tape-shaped laminate on a conductor wire and then fusing a fluororesin by a predetermined heat treatment. When the electric wires manufactured in this way are electrically connected to each other, the end portions of the electric wires are stripped of an insulating coating and connected by soldering or the like. However, if the adhesive strength between the conductor and the fluororesin is larger than the adhesive strength between the polyimide film and the fluororesin, when the electric wire is stripped, a part of the fluororesin remains on the conductor (defective stripping property), There is a problem that an electrical connection failure occurs.

【0003】[0003]

【発明が解決しようとする課題】本発明は、上記ストリ
ップ不良という問題を解決したポリイミド積層体及び該
積層体で絶縁されたケーブルを提供するものである。
SUMMARY OF THE INVENTION An object of the present invention is to provide a polyimide laminate which has solved the above-mentioned problem of strip failure and a cable insulated by the laminate.

【0004】[0004]

【課題を解決するための手段】本発明者らはかかる実情
に鑑み、ポリイミド積層体における上記絶縁被覆ストリ
ップ性不良問題について、具体的には導体とフッ素系樹
脂との接着力及びポリイミドフィルムとフッ素系樹脂と
の接着力を制御する方法について鋭意研究した結果、本
発明に至ったものである。即ち、本発明は、ポリイミド
フィルムの両面または片面にフッ素系樹脂を積層してな
り、導体の絶縁被覆として用いられる積層体において、
積層体のフッ素系樹脂面とポリイミドフィルム面とのヒ
ートシール強度が積層体のフッ素系樹脂面と銅箔のシャ
イン面とのヒートシール強度の1.5倍以上とし、絶縁
被覆のストリップ性不良を改善したことを特徴とするポ
リイミド積層体を内容とする。また、本発明は、上記ポ
リイミド積層体で絶縁被覆が施されていることを特徴と
するケーブルを内容とする。
SUMMARY OF THE INVENTION In view of the above circumstances, the present inventors have dealt with the problem of the poor insulation coating strip property in a polyimide laminate, specifically, the adhesive force between a conductor and a fluorine-based resin and the polyimide film and a fluorine-containing resin. As a result of intensive studies on a method of controlling the adhesive force with the resin, the present invention has been achieved. That is, the present invention is a laminate obtained by laminating a fluorine-based resin on both sides or one side of a polyimide film, and used as an insulating coating of a conductor,
The heat sealing strength between the fluororesin surface of the laminate and the polyimide film surface is 1.5 times or more the heat sealing strength between the fluororesin surface of the laminate and the shine surface of the copper foil. The content is a polyimide laminate characterized by being improved. Further, the present invention provides a cable characterized in that the polyimide laminate is coated with an insulating material.

【0005】ポリイミドフィルムとフッ素系樹脂の接着
力がフッ素系樹脂と導体との接着力よりも小さいと、前
記した如くストリップ性不良が発生する。接着力とは単
位面積当たりの接着力と接触面積の積で表されるもので
あるが、製造後の電線の断面を観察すると図1の様にな
っており、製造後の電線におけるポリイミドフィルムと
フッ素系樹脂間の接触面積と、フッ素系樹脂と導体の接
触面積は異なる。即ち、実際の製造工程では、導体にテ
ープ状の積層体を巻いた後フッ素系樹脂の融点以上の温
度で熱処理を施されるが、この際最内層のフッ素系樹脂
は溶融状態となり、外周面が凹凸形状で表面積の大きい
導体表面と接触するので、ポリイミドフィルムとフッ素
系樹脂の接触面積よりもフッ素系樹脂と導体の接触面積
が広くなる。
[0005] If the adhesive strength between the polyimide film and the fluororesin is smaller than the adhesive strength between the fluororesin and the conductor, stripping failure occurs as described above. The adhesive strength is expressed as the product of the adhesive strength per unit area and the contact area. When the cross section of the manufactured electric wire is observed, it is as shown in FIG. The contact area between the fluororesin and the contact area between the fluororesin and the conductor are different. That is, in the actual manufacturing process, after the tape-shaped laminate is wound around the conductor, heat treatment is performed at a temperature equal to or higher than the melting point of the fluorine-based resin. Is in contact with the conductor surface having a large surface area due to the uneven shape, so that the contact area between the fluororesin and the conductor is larger than the contact area between the polyimide film and the fluororesin.

【0006】従って、一般的に接着力の指標としてヒー
トシール強度が用いられているが、ヒートシール強度は
単位面積当たりの接着強度を表す指標であり、ストリッ
プ性を評価するにはヒートシール強度以外に接触面積を
考慮する必要がある。しかし、導体とフッ素系樹脂間の
接触面積を見積もることは困難である。そこで種々のヒ
ートシール強度を有するポリイミド積層体を用いストリ
ップ性を評価した結果、積層体のフッ素系樹脂面とポリ
イミドフィルム面とのヒートシール強度が、積層体のフ
ッ素系樹脂面と銅箔のシャイン面とのヒートシール強度
の1.5倍以上であれば、ストリップ性不良が改善され
ることを見いだした。ヒートシール強度は、ポリイミド
積層体を製造する際の焼成条件またはフッ素系系樹脂の
厚みを調整することにより制御できる。
Therefore, heat seal strength is generally used as an index of adhesive strength. However, heat seal strength is an index indicating the adhesive strength per unit area. It is necessary to consider the contact area. However, it is difficult to estimate the contact area between the conductor and the fluororesin. Therefore, as a result of evaluating the strippability using a polyimide laminate having various heat seal strengths, the heat seal strength between the fluororesin surface and the polyimide film surface of the laminate was determined by the shine between the fluororesin surface of the laminate and the copper foil. It has been found that when the heat seal strength with the surface is 1.5 times or more, the poor stripping property is improved. The heat seal strength can be controlled by adjusting the firing conditions or the thickness of the fluorine-based resin when producing the polyimide laminate.

【0007】本発明に適用されるヒートシール強度測定
法は、8cm×15cmのポリイミド積層体のフッ素系
樹脂面と銅箔のシャイン面、あるいはポリイミド積層体
のフッ素系樹脂面とポリイミドフィルム面とを重ね合わ
せ、圧力20psi、ヒートシール時間20秒、ヒート
シール温度350℃でヒートシールした後、1cm×1
5cmのサンプルを5本切り出し、インストロン・テン
サイル・テスター(INSTRON TENSILE
TESTER)にて180度剥離で100mm/min
の速度で剥離の強度を測定する。n=5の測定値の平均
をヒートシール強度とする。
[0007] The heat sealing strength measuring method applied to the present invention is a method of measuring the fluororesin surface of a polyimide laminate of 8 cm x 15 cm and the shine surface of a copper foil, or the fluororesin surface of a polyimide laminate and a polyimide film surface. After superimposing and heat-sealing at a pressure of 20 psi, a heat-sealing time of 20 seconds and a heat-sealing temperature of 350 ° C., 1 cm × 1
Cut out 5 pieces of 5cm sample and use INSTRON TENSILE tester
100mm / min by 180 degree peeling with TESTER)
The peel strength is measured at a speed of. The average of the measured values of n = 5 is defined as the heat seal strength.

【0008】本発明に適用されるポリイミドフィルム
は、ポリイミドの先駆体物質であるポリアミド酸の樹脂
溶液より得られる。ポリアミド酸は下記(1)
The polyimide film applied to the present invention is obtained from a resin solution of polyamic acid, which is a precursor of polyimide. Polyamic acid is the following (1)

【化1】 の構造式を有するものであり、4,4─ジアミノジフェ
ニルエーテルのごとき芳香族ジアミンと、ピロメリット
酸二無水物の如き芳香族テトラカルボン酸二無水物より
得られる。ポリアミド酸樹脂溶液を形成するに際しての
有機溶媒としてはN,N─ジメチルホルムアミド、N,
N─ジメチルアセトアミド等が代表的である。
Embedded image Which is obtained from an aromatic diamine such as 4,4-diaminodiphenyl ether and an aromatic tetracarboxylic dianhydride such as pyromellitic dianhydride. As an organic solvent for forming the polyamic acid resin solution, N, N─dimethylformamide, N, N
N─dimethylacetamide and the like are typical.

【0009】上記ポリアミド酸の樹脂溶液は、まずイミ
ド化促進のための脱水剤や触媒と混合される。脱水剤と
して代表的なものとしては無水酢酸、また触媒としては
第三級アミンが好ましく、代表的にはイソキノリン、β
ーピコリンがある。混合比率としてはポリアミド酸1モ
ルに対し脱水剤が1〜8モル、触媒が0.05〜1モル
が適当である。上記配合の混合物をスリットダイより4
0〜120℃のキャスティングドラムまたはベルト等の
支持台上に押し出し、5秒から5分の間に支持台上で自
己支持性のポリアミド酸ゲルフィルムとなってから支持
体より引き剥がし、そのポリアミド酸ゲルフィルムをピ
ンテンター中で100〜200℃の予備乾燥、300〜
500℃の乾燥固化(キュア)を経て、ポリイミドフィ
ルムが得られる。本発明に適用されるポリイミドフィル
ムの厚みは、7〜125μmが好適である。
The above-mentioned resin solution of polyamic acid is first mixed with a dehydrating agent or a catalyst for accelerating imidization. Acetic anhydride is preferred as a typical dehydrating agent, and a tertiary amine is preferred as a catalyst. Typically, isoquinoline, β
-There is picolin. As the mixing ratio, 1 to 8 mol of the dehydrating agent and 0.05 to 1 mol of the catalyst are suitable for 1 mol of the polyamic acid. Mix the above mixture with a slit die 4
Extruded onto a support such as a casting drum or belt at 0 to 120 ° C., formed a self-supporting polyamic acid gel film on the support in 5 seconds to 5 minutes, and then peeled off from the support, Gel film is pre-dried at 100-200 ° C in a pin tenter, 300-
After drying and curing (curing) at 500 ° C., a polyimide film is obtained. The thickness of the polyimide film applied to the present invention is preferably 7 to 125 μm.

【0010】本発明に適用されるフッ素系樹脂は、水性
ディスパージョンが好適である。具体的には、ポリテト
ラフルオロエチレン(PTFE)、テトラフルオロエチ
レン─ヘキサフルオロプロピレン共重合体(FEP)、
テトラフルオロエチレン─パーフルオロアルキルビニル
エーテル(PFA)、テトラフルオロエチレン─エチレ
ン共重合体(ETFE)及び塩素を含むポリクロロトリ
フルオロエチレン等のフッ素樹脂を含む水性のディスパ
ージョンが挙げられ、これらは単独又は2種以上組み合
わせて用いられる。
The fluororesin applied to the present invention is preferably an aqueous dispersion. Specifically, polytetrafluoroethylene (PTFE), tetrafluoroethylene / hexafluoropropylene copolymer (FEP),
An aqueous dispersion containing a fluororesin such as tetrafluoroethylene / perfluoroalkylvinyl ether (PFA), tetrafluoroethylene / ethylene copolymer (ETFE) and chlorine-containing polychlorotrifluoroethylene, which may be used alone or It is used in combination of two or more.

【0011】このディスパージョンの固形分濃度は10
〜70重量%が適当であるが、最終の製品厚み、ディス
パージョン粘度等との関連で決定される。また、このデ
ィスパージョンの粘度は、1cp(センチポイズ)〜1
00p(ポイズ)が好ましく、より好ましくは50cp
〜5pである。
The solid content concentration of this dispersion is 10
~ 70% by weight is appropriate, but is determined in relation to the final product thickness, dispersion viscosity and the like. The viscosity of this dispersion is 1 cp (centipoise) to 1 cp (centipoise).
00p (poise) is preferable, and 50 cp is more preferable.
55p.

【0012】一方、このディスパージョンに粘度を調節
するための増粘剤、あるいはメタノール等の溶剤、塗布
時に発生する泡を消すための消泡剤、ディスパージョン
を着色するための顔料等を添加することは一向に差支え
ない。ポリイミドフィルムとフッ素系樹脂の積層体の製
造は、ポリイミドフィルムの両面または片面に水性ディ
スパージョンを所定の厚みに塗布し、所定の条件で乾
燥、焼成を行う。
On the other hand, a thickener for adjusting the viscosity, a solvent such as methanol, an antifoaming agent for eliminating bubbles generated at the time of application, a pigment for coloring the dispersion, and the like are added to the dispersion. That is no problem. In the production of a laminate of a polyimide film and a fluororesin, an aqueous dispersion is applied to both sides or one side of the polyimide film to a predetermined thickness, and dried and fired under predetermined conditions.

【0013】[0013]

【実施例】以下、本発明を実施例を挙げて説明するが、
本発明はこれらに限定されるものではない。 実施例1 厚み25μm、巾1020mmのポリイミドフィルム
(アピカルAH、鐘淵化学工業株式会社)に、両面のF
EP層が焼成後それぞれ2.5μmとなるように水性デ
ィスパージョンを塗布し、次に150℃で1分間乾燥を
行い、その後焼成を行った。ここで焼成条件と各焼成条
件により作製された積層体のヒートシール強度及びスト
リップ性について評価した。尚、ヒートシール強度測定
のための銅箔(導体としては銅の撚り線を想定)は、厚
み35μm(3EC、三井金属工業株式会社)を用い
た。焼成条件及びフッ素系樹脂の厚みを表1に、各水準
のヒートシール強度及びストリップ性評価結果を表2に
示す。尚、以下の表中のヒートシール強度のうち、「積
層体/銅箔」は「積層体のフッ素系樹脂面と銅箔のシャ
イン面」のヒートシール強度を意味し、また「積層体/
積層体」は「積層体のフッ素系樹脂面とポリイミドフィ
ルム面」のヒートシール強度を意味する。
The present invention will be described below with reference to examples.
The present invention is not limited to these. Example 1 A polyimide film (Apical AH, Kanegabuchi Chemical Industry Co., Ltd.) having a thickness of 25 μm and a width of 1020 mm was coated on both sides with F
An aqueous dispersion was applied so that each of the EP layers had a thickness of 2.5 μm after firing, and was then dried at 150 ° C. for 1 minute, and then fired. Here, the firing conditions and the heat seal strength and the strippability of the laminates manufactured under the respective firing conditions were evaluated. The copper foil for measuring the heat seal strength (assuming a stranded copper wire as the conductor) was 35 μm thick (3EC, Mitsui Kinzoku Kogyo Co., Ltd.). Table 1 shows the firing conditions and the thickness of the fluororesin, and Table 2 shows the results of the evaluation of the heat seal strength and the strippability at each level. In addition, among the heat seal strengths in the following table, “laminate / copper foil” means the heat seal strength of “the fluorinated resin surface of the laminate and the shine surface of the copper foil”.
The “laminate” means the heat sealing strength of the “fluorine resin surface and polyimide film surface of the laminate”.

【0014】尚、ストリップ性評価は、以下に示す条件
にて作製されたケーブルの絶縁被覆層を手動ストリッパ
ーにてストリップした際に、導体上にフッ素系樹脂が残
存しているか否かを顕微鏡(倍率50倍)で観察し評価
した。ケーブルの作製条件は、直径0.2mmの銅線1
9本のより線に10mm巾テープを50%ラップにて巻
き350℃で3分の熱処理を行った。また上記ポリイミ
ド積層体の機械的強度および絶縁破壊電圧は、焼成条件
に依存しなかった。
The strip property was evaluated by using a microscope to determine whether or not the fluororesin remained on the conductor when the insulating coating layer of the cable produced under the following conditions was stripped by a manual stripper. (Magnification: 50 times) and evaluated. The conditions for producing the cable were as follows: a copper wire 1 having a diameter of 0.2 mm;
A 10 mm tape was wound around 9 strands with 50% wrap and heat treated at 350 ° C. for 3 minutes. Further, the mechanical strength and dielectric breakdown voltage of the polyimide laminate did not depend on the firing conditions.

【0015】[0015]

【表1】 [Table 1]

【0016】[0016]

【表2】 [Table 2]

【0017】実施例2 実施例1において、焼成時間を30秒とした他は実施例
1と同様に操作した。焼成条件及びフッ素系樹脂の厚み
を表3に、各水準のヒートシール強度及びストリップ性
評価結果を表4に示す。また上記ポリイミド積層体の機
械的強度および絶縁破壊電圧は、焼成条件に依存しなか
った。
Example 2 The procedure of Example 1 was repeated except that the firing time was changed to 30 seconds. Table 3 shows the firing conditions and the thickness of the fluororesin, and Table 4 shows the results of evaluating the heat sealing strength and stripping properties at each level. Further, the mechanical strength and dielectric breakdown voltage of the polyimide laminate did not depend on the firing conditions.

【0018】[0018]

【表3】 [Table 3]

【0019】[0019]

【表4】 [Table 4]

【0020】実施例3 実施例1において、焼成時間を45秒とした他は実施例
1と同様に操作した。焼成条件及びフッ素系樹脂の厚み
を表5に、各水準のヒートシール強度及びストリップ性
評価結果を表6に示す。また上記ポリイミド積層体の機
械的強度および絶縁破壊電圧は、焼成条件に依存しなか
った。
Example 3 The procedure of Example 1 was repeated except that the firing time was changed to 45 seconds. Table 5 shows the firing conditions and the thickness of the fluorine-based resin, and Table 6 shows the results of the heat seal strength and stripability evaluation at each level. Further, the mechanical strength and dielectric breakdown voltage of the polyimide laminate did not depend on the firing conditions.

【0021】[0021]

【表5】 [Table 5]

【0022】[0022]

【表6】 [Table 6]

【0023】実施例4 実施例1において、焼成時間を60秒とした他は実施例
1と同様に操作した。焼成条件及びフッ素系樹脂の厚み
を表7に、各水準のヒートシール強度及びストリップ性
評価結果を表8に示す。また上記ポリイミド積層体の機
械的強度および絶縁破壊電圧は、焼成条件に依存しなか
った。
Example 4 The procedure of Example 1 was repeated, except that the firing time was changed to 60 seconds. Table 7 shows the firing conditions and the thickness of the fluororesin, and Table 8 shows the results of the evaluation of the heat seal strength and the strippability at each level. Further, the mechanical strength and dielectric breakdown voltage of the polyimide laminate did not depend on the firing conditions.

【0024】[0024]

【表7】 [Table 7]

【0025】[0025]

【表8】 [Table 8]

【0026】実施例5 厚み25μm、巾1020mmのポリイミドフィルム
(アピカルAH、鐘淵化学工業株式会社)に、両面のF
EP層が焼成後それぞれ1.5μmとなるように水性デ
ィスパージョンを塗布し、乾燥、焼成した。乾燥及びケ
ーブルの作製条件は実施例1に準じた。焼成条件及びフ
ッ素系樹脂の厚みを表9に、各水準のヒートシール強度
及びストリップ性評価結果を表10に示す。また上記ポ
リイミド積層体の機械的強度および絶縁破壊電圧は、焼
成条件に依存しなかった。
Example 5 A polyimide film (Apical AH, Kanegabuchi Chemical Industry Co., Ltd.) having a thickness of 25 μm and a width of 1020 mm was placed on both sides of a polyimide film.
An aqueous dispersion was applied so that each EP layer had a thickness of 1.5 μm after firing, and was dried and fired. Drying and cable preparation conditions were the same as in Example 1. Table 9 shows the firing conditions and the thickness of the fluororesin, and Table 10 shows the results of the evaluation of the heat seal strength and the strippability at each level. Further, the mechanical strength and dielectric breakdown voltage of the polyimide laminate did not depend on the firing conditions.

【0027】[0027]

【表9】 [Table 9]

【0028】[0028]

【表10】 [Table 10]

【0029】実施例6 実施例5において、焼成時間を30秒とした他は実施例
1と同様に操作した。焼成条件及びフッ素系樹脂の厚み
を表11に、各水準のヒートシール強度及びストリップ
性評価結果を表12に示す。また上記ポリイミド積層体
の機械的強度および絶縁破壊電圧は、焼成条件に依存し
なかった。
Example 6 The procedure of Example 5 was repeated, except that the firing time was changed to 30 seconds. Table 11 shows the firing conditions and the thickness of the fluorine-based resin, and Table 12 shows the evaluation results of the heat seal strength and the strippability at each level. Further, the mechanical strength and dielectric breakdown voltage of the polyimide laminate did not depend on the firing conditions.

【0030】[0030]

【表11】 [Table 11]

【0031】[0031]

【表12】 [Table 12]

【0032】実施例7 実施例5において、焼成時間を45秒とした他は実施例
1と同様に操作した。焼成条件及びフッ素系樹脂の厚み
を表13に、各水準のヒートシール強度及びストリップ
性評価結果を表14に示す。また上記ポリイミド積層体
の機械的強度および絶縁破壊電圧は、焼成条件に依存し
なかった。
Example 7 The procedure of Example 5 was repeated, except that the firing time was changed to 45 seconds. Table 13 shows the firing conditions and the thickness of the fluororesin, and Table 14 shows the results of the evaluation of the heat seal strength and the strippability at each level. Further, the mechanical strength and dielectric breakdown voltage of the polyimide laminate did not depend on the firing conditions.

【0033】[0033]

【表13】 [Table 13]

【0034】[0034]

【表14】 [Table 14]

【0035】実施例8 実施例5において、焼成時間を60秒とした他は実施例
1と同様に操作した。焼成条件及びフッ素系樹脂の厚み
を表15に、各水準のヒートシール強度及びストリップ
性評価結果を表16に示す。また上記ポリイミド積層体
の機械的強度および絶縁破壊電圧は、焼成条件に依存し
なかった。
Example 8 The procedure of Example 5 was repeated, except that the firing time was changed to 60 seconds. Table 15 shows the firing conditions and the thickness of the fluorine-based resin, and Table 16 shows the results of evaluating the heat seal strength and the strippability at each level. Further, the mechanical strength and dielectric breakdown voltage of the polyimide laminate did not depend on the firing conditions.

【0036】[0036]

【表15】 [Table 15]

【0037】[0037]

【表16】 [Table 16]

【0038】実施例9 厚み25μm、巾1020mmのポリイミドフィルム
(アピカルAH、鐘淵化学工業株式会社)に、両面のF
EP層が焼成後それぞれ3.5μmとなるように水性デ
ィスパージョンを塗布し、乾燥、焼成した。乾燥及びケ
ーブルの作製条件は実施例1に準じた。焼成条件及びフ
ッ素系樹脂の厚みを表17に、各水準のヒートシール強
度及びストリップ性評価結果を表18に示す。また上記
ポリイミド積層体の機械的強度および絶縁破壊電圧は、
焼成条件に依存しなかった。
Example 9 A polyimide film (Apical AH, Kanegabuchi Chemical Industry Co., Ltd.) having a thickness of 25 μm and a width of 1020 mm was coated on both sides with F
The aqueous dispersion was applied so that each of the EP layers had a thickness of 3.5 μm after firing, and was dried and fired. Drying and cable preparation conditions were the same as in Example 1. Table 17 shows the firing conditions and the thickness of the fluorine-based resin, and Table 18 shows the results of the evaluation of the heat seal strength and the strippability at each level. The mechanical strength and dielectric breakdown voltage of the polyimide laminate are as follows:
It did not depend on the firing conditions.

【0039】[0039]

【表17】 [Table 17]

【0040】[0040]

【表18】 [Table 18]

【0041】実施例10 実施例9において、焼成時間を30秒とした他は実施例
1と同様に操作した。焼成条件及びフッ素系樹脂の厚み
を表19に、各水準のヒートシール強度及びストリップ
性評価結果を表20に示す。また上記ポリイミド積層体
の機械的強度および絶縁破壊電圧は、焼成条件に依存し
なかった。
Example 10 The procedure of Example 9 was repeated, except that the firing time was changed to 30 seconds. Table 19 shows the firing conditions and the thickness of the fluororesin, and Table 20 shows the results of evaluating the heat seal strength and the strippability at each level. Further, the mechanical strength and dielectric breakdown voltage of the polyimide laminate did not depend on the firing conditions.

【0042】[0042]

【表19】 [Table 19]

【0043】[0043]

【表20】 [Table 20]

【0044】実施例11 実施例9において、焼成時間を45秒とした他は実施例
1と同様に操作した。焼成条件及びフッ素系樹脂の厚み
を表21に、各水準のヒートシール強度及びストリップ
性評価結果を表22に示す。また上記ポリイミド積層体
の機械的強度および絶縁破壊電圧は、焼成条件に依存し
なかった。
Example 11 The procedure of Example 9 was repeated, except that the firing time was changed to 45 seconds. Table 21 shows the firing conditions and the thickness of the fluororesin, and Table 22 shows the results of evaluating the heat seal strength and the strippability at each level. Further, the mechanical strength and dielectric breakdown voltage of the polyimide laminate did not depend on the firing conditions.

【0045】[0045]

【表21】 [Table 21]

【0046】[0046]

【表22】 [Table 22]

【0047】実施例12 実施例9において、焼成時間を60秒とした他は実施例
1と同様に操作した。焼成条件及びフッ素系樹脂の厚み
を表23に、各水準のヒートシール強度及びストリップ
性評価結果を表24に示す。また上記ポリイミド積層体
の機械的強度および絶縁破壊電圧は、焼成条件に依存し
なかった。
Example 12 The procedure of Example 9 was repeated, except that the firing time was changed to 60 seconds. Table 23 shows the firing conditions and the thickness of the fluororesin, and Table 24 shows the results of the evaluation of the heat seal strength and the strippability at each level. Further, the mechanical strength and dielectric breakdown voltage of the polyimide laminate did not depend on the firing conditions.

【0048】[0048]

【表23】 [Table 23]

【0049】[0049]

【表24】 [Table 24]

【0050】[0050]

【発明の効果】本発明の特定のヒートシール強度を有す
るポリイミド積層体を用いることにより、機械的強度及
び絶縁破壊電圧には影響を与えることなく絶縁被覆のス
トリップ性不良を改善することができる。
By using the polyimide laminate having a specific heat seal strength of the present invention, it is possible to improve the stripping defect of the insulating coating without affecting the mechanical strength and the dielectric breakdown voltage.

【図面の簡単な説明】[Brief description of the drawings]

【図1】電線の断面図である。FIG. 1 is a sectional view of an electric wire.

───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭62−223236(JP,A) 特開 昭62−162543(JP,A) 特開 平4−303652(JP,A) 特開 平4−303651(JP,A) 特公 昭49−12900(JP,B1) 国際公開90/9853(WO,A1) (58)調査した分野(Int.Cl.7,DB名) B32B 1/00 - 35/00 ────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-62-223236 (JP, A) JP-A-62-162543 (JP, A) JP-A-4-303652 (JP, A) JP-A-4- 303651 (JP, A) JP 49-12900 (JP, B1) WO 90/9853 (WO, A1) (58) Fields investigated (Int. Cl. 7 , DB name) B32B 1/00-35 / 00

Claims (3)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 ポリイミドフィルムの両面または片面に
フッ素系樹脂を積層してなり、導体の絶縁被覆として用
いられる積層体において、積層体のフッ素系樹脂面とポ
リイミドフィルム面とのヒートシール強度が積層体のフ
ッ素系樹脂面と銅箔のシャイン面とのヒートシール強度
の1.5倍以上とし、絶縁被覆のストリップ性不良を改
善したことを特徴とするポリイミド積層体。
1. A laminate comprising a polyimide film laminated on both surfaces or one surface with a fluororesin, and used as an insulating coating of a conductor, the heat seal strength between the fluororesin surface of the laminate and the polyimide film surface is increased. A polyimide laminate characterized in that the heat sealing strength between the fluorine resin surface of the body and the shine surface of the copper foil is 1.5 times or more, and the stripping property of the insulation coating is improved.
【請求項2】 フッ素系樹脂が水性ディスパージョンで
ある請求項1記載のポリイミド積層体。
2. The polyimide laminate according to claim 1, wherein the fluororesin is an aqueous dispersion.
【請求項3】 請求項1又は2記載のポリイミド積層体
で絶縁被覆が施されていることを特徴とするケーブル。
3. A cable having an insulation coating with the polyimide laminate according to claim 1.
JP03155714A 1991-05-29 1991-05-29 Polyimide laminate and cable insulated with the laminate Expired - Lifetime JP3121376B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP03155714A JP3121376B2 (en) 1991-05-29 1991-05-29 Polyimide laminate and cable insulated with the laminate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP03155714A JP3121376B2 (en) 1991-05-29 1991-05-29 Polyimide laminate and cable insulated with the laminate

Publications (2)

Publication Number Publication Date
JPH04351548A JPH04351548A (en) 1992-12-07
JP3121376B2 true JP3121376B2 (en) 2000-12-25

Family

ID=15611893

Family Applications (1)

Application Number Title Priority Date Filing Date
JP03155714A Expired - Lifetime JP3121376B2 (en) 1991-05-29 1991-05-29 Polyimide laminate and cable insulated with the laminate

Country Status (1)

Country Link
JP (1) JP3121376B2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0771838B1 (en) * 1995-10-04 2005-04-06 Kaneka Corporation Fluoro-carbon resinous laminate of improved surface property and method of producing said laminate
US7022402B2 (en) * 2003-07-14 2006-04-04 E. I. Du Pont De Nemours And Company Dielectric substrates comprising a polymide core layer and a high temperature fluoropolymer bonding layer, and methods relating thereto
US20100209681A1 (en) * 2007-09-06 2010-08-19 Grant Richard Lee Polyimide films comprising fluoropolymer coating and methods
JP2009093978A (en) * 2007-10-11 2009-04-30 Mitsubishi Electric Corp Coil conductor, induction-heating coil, and induction-heating cooking oven

Also Published As

Publication number Publication date
JPH04351548A (en) 1992-12-07

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