JP3119054B2 - Floating abrasive polishing machine - Google Patents

Floating abrasive polishing machine

Info

Publication number
JP3119054B2
JP3119054B2 JP26262393A JP26262393A JP3119054B2 JP 3119054 B2 JP3119054 B2 JP 3119054B2 JP 26262393 A JP26262393 A JP 26262393A JP 26262393 A JP26262393 A JP 26262393A JP 3119054 B2 JP3119054 B2 JP 3119054B2
Authority
JP
Japan
Prior art keywords
vibration
polishing
flatness
detecting means
detected
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP26262393A
Other languages
Japanese (ja)
Other versions
JPH07112363A (en
Inventor
洋 清水
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP26262393A priority Critical patent/JP3119054B2/en
Publication of JPH07112363A publication Critical patent/JPH07112363A/en
Application granted granted Critical
Publication of JP3119054B2 publication Critical patent/JP3119054B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明は、浮遊砥粒式研磨装置に
関し、特に上下定盤の平面度を検出するのに適した浮遊
砥粒式研磨装置に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a floating-abrasive polishing apparatus, and more particularly to a floating-abrasive polishing apparatus suitable for detecting the flatness of an upper and lower platen.

【0002】[0002]

【従来の技術】従来より、ラッピング装置と呼ばれる浮
遊砥粒式研磨装置においては、上定盤の下面及び下定盤
の上面である研磨面の平面度を修正するため、ワーク保
持用孔を有する円盤状のワーク研磨用遊星ギヤに代っ
て、修正キャリアと呼ばれるワーク保持孔がない円盤状
の修正用遊星ギヤを用いるものであった。
2. Description of the Related Art Conventionally, in a floating-abrasive polishing apparatus called a lapping apparatus, a disk having a work holding hole is used to correct the flatness of a polishing surface which is a lower surface of an upper surface plate and an upper surface of a lower surface plate. Instead of the planetary gear for polishing a workpiece, a disk-shaped planetary gear for correction called a correction carrier without a workpiece holding hole is used.

【0003】この研磨装置は、上下定盤の間に円盤状の
修正用キャリアを配置し、修正用キャリアに噛み合う太
陽ギヤとリングギヤとを相互に回転させることにより、
修正用キャリアを自転、又は自転及び公転させ、上下定
盤と修正用キャリアとの摺動によって上下定盤の研磨面
を同時に研磨するものである。
In this polishing apparatus, a disk-shaped correction carrier is arranged between an upper and lower surface plate, and a sun gear and a ring gear meshing with the correction carrier are rotated mutually, whereby
The correction carrier rotates, or rotates and revolves, and the polishing surfaces of the upper and lower platens are simultaneously polished by sliding between the upper and lower platens and the correction carrier.

【0004】この場合、上下定盤と修正用キャリアとの
間に、研磨材を水またはオイルと混合して液化させたス
ラリー状砥粒を供給し、研磨剤の持つ切刃で上下定盤の
研磨面から凸部を取り除くことにより、研磨面を修正
し、研磨面の平面度を再生するものである。
In this case, a slurry-like abrasive obtained by mixing an abrasive with water or oil and liquefied is supplied between the upper and lower platens and the repair carrier, and the upper and lower platens of the upper and lower platens are cut by a cutting blade of the abrasive. By removing the projections from the polished surface, the polished surface is corrected and the flatness of the polished surface is regenerated.

【0005】[0005]

【発明が解決しようとする課題】浮遊砥粒式研磨装置に
おいて、ワークを研磨して、そのワークの平面度を高精
度に仕上げるためには、種々の条件を満足しなければな
らない。特に、上下定盤の研磨面の平面度が悪くなる
と、ワークの厚みばらつきが大きくなるため、研磨面の
平面度維持は重要な要素になる。
In a floating abrasive type polishing apparatus, various conditions must be satisfied in order to polish a work and to finish the flatness of the work with high accuracy. In particular, when the flatness of the polished surfaces of the upper and lower stools is deteriorated, the thickness variation of the work becomes large, and thus maintaining the flatness of the polished surfaces is an important factor.

【0006】しかしながら、一般に、浮遊砥粒式研磨装
置の上下定盤は大きく且つ重量物であるため、その研磨
面の平面度測定には長時間を要し、また、高価な測定装
置が必要であった。そのうえ、ワークの研磨作業中に
は、上下定盤の研磨面にワーク及び遊星ギヤが回転しな
がら接触しているため、研磨面の平面度を測定する事が
不可能であった。また、研磨面の平面度修正には、修正
キャリアを用いて研磨装置自体で研磨面を研磨するた
め、上述と同様に、上下定盤の研磨面に修正キャリアが
回転しながら接触し、平面度修正中に研磨面の平面度を
測定することができなかった。このため、上下定盤の研
磨面の平面度を修正する時期及び修正に要する研磨時間
の設定は、経験に頼らなければならないという問題点を
有していた。
However, in general, since the upper and lower platens of the floating abrasive type polishing apparatus are large and heavy, it takes a long time to measure the flatness of the polished surface, and an expensive measuring apparatus is required. there were. In addition, during the work of polishing the work, it is impossible to measure the flatness of the polished surface because the work and the planetary gears are in contact with the polished surfaces of the upper and lower platens while rotating. In addition, in order to correct the flatness of the polished surface, since the polished surface is polished by the polishing apparatus itself using the correction carrier, the correction carrier rotates and comes into contact with the polished surfaces of the upper and lower platens in the same manner as described above. During the correction, the flatness of the polished surface could not be measured. For this reason, there has been a problem that the timing for correcting the flatness of the polished surfaces of the upper and lower platens and the setting of the polishing time required for the correction have to rely on experience.

【0007】本発明の目的は、上記問題点を解消すべく
なされたもので、ワークの研磨作業中及び上下定盤の研
磨面の平面度修正中に、研磨面の平面度を数値的に検出
し、その検出データにもとづいて研磨面の平面度を自動
的に管理できる制御装置を備えた浮遊砥粒式研磨装置を
提供することにある。
SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problems, and numerically detects the flatness of a polished surface during a work of polishing a work and a correction of the flatness of the polished surfaces of the upper and lower platens. Another object of the present invention is to provide a floating-abrasive polishing apparatus provided with a control device capable of automatically managing the flatness of a polished surface based on the detection data.

【0008】[0008]

【課題を解決するための手段】このため、本発明におい
ては、上下定盤と、該上下定盤の間に配置され、ワーク
を保持する保持孔を備えた遊星ギヤと、該遊星ギヤと噛
み合う太陽ギヤ及びリングギヤとを備え、該太陽ギヤ又
はリングギヤの少なくとも一方を回転させることによ
り、前記遊星ギヤを自転、又は自転及び公転させ、スラ
リー状砥粒を介して、前記ワークと前記上下定盤とを摺
動させることにより、前記ワークを研磨する浮遊砥粒式
研磨装置において、前記上定盤の内周及び外周近傍に前
記上定盤の振動信号を検出する振動検出手段を設け、該
振動検出手段に振動検出手段を介して検出された内周及
び外周における振動信号を比較する第1の比較手段を設
けたことを特徴とする。また、前記振動検出手段に、該
振動検出手段を介して検出された前記上定盤の内周及び
外周近傍における振動信号と、前記上定盤の内周及び外
周近傍における基準信号とを、それぞれ比較する第2の
比較手段を備えたことを特徴とする。
For this reason, according to the present invention, a planetary gear provided with an upper and lower surface plate, a holding hole for holding a work, which is disposed between the upper and lower surface plate, meshes with the planetary gear. A sun gear and a ring gear, and by rotating at least one of the sun gear or the ring gear, the planetary gear rotates, or rotates and revolves, via the slurry-like abrasive grains, the workpiece and the upper and lower platens. In the floating abrasive type polishing apparatus for polishing the work by sliding, a vibration detecting means for detecting a vibration signal of the upper surface plate is provided near an inner periphery and an outer periphery of the upper surface plate, and the vibration detection is performed. The means is provided with first comparing means for comparing the vibration signals at the inner circumference and the outer circumference detected via the vibration detecting means. Further, the vibration detecting means, a vibration signal near the inner circumference and outer circumference of the upper surface plate detected through the vibration detection means, and a reference signal near the inner circumference and outer circumference of the upper surface plate, respectively, A second comparison means for comparing is provided.

【0009】[0009]

【作用】本発明では、振動検出手段を介して上定盤の内
周と外周の振動信号を検出し、内周と外周の振動信号を
比較すること、及び、検出した内周並びに外周の振動信
号と各々の基準信号とを比較することにより、上下定盤
の研磨面の摩耗による平面度の悪化に基づく上下定盤の
変化を検出し、上下定盤の研磨面の平面度の正常又は異
常を検出することができる。
According to the present invention, vibration signals on the inner and outer circumferences of the upper platen are detected via the vibration detecting means, and the vibration signals on the inner and outer circumferences are compared. By comparing the signal with each of the reference signals, a change in the upper and lower platens due to deterioration of the flatness due to wear of the polished surfaces of the upper and lower platens is detected, and the normality or abnormality of the flatness of the polished surfaces of the upper and lower platens is detected. Can be detected.

【0010】[0010]

【実施例】本発明の一実施例である浮遊砥粒式研磨装置
を図1および図2に基づいて説明する。図において、浮
遊砥粒式研磨装置は、研磨装置本体Aと制御装置Bとか
ら構成される。このうち、研磨装置本体Aは、モータ
1,駆動軸2,上定盤3,遊星ギヤ4,下定盤5,中間
ギヤ6および7,環体8で構成される。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A floating abrasive type polishing apparatus according to an embodiment of the present invention will be described with reference to FIGS. In the figure, the floating abrasive type polishing apparatus includes a polishing apparatus main body A and a control apparatus B. The polishing apparatus main body A includes a motor 1, a drive shaft 2, an upper platen 3, a planetary gear 4, a lower platen 5, intermediate gears 6 and 7, and a ring body 8.

【0011】研磨装置本体Aの一部をなすモータ1の回
転軸1aには駆動軸2が固定されており、この駆動軸2
の上部には太陽ギヤ2aが一体に形成され、この太陽ギ
ヤ2aは遊星ギヤ4と噛み合っている。遊星ギヤ4は薄
肉金属板よりなる円盤状ギヤであり、この実施例では上
下定盤3,5の間に合計4個配置されている。遊星ギヤ
4には複数の保持穴4aが形成されており、これら保持
穴4aには遊星ギヤ4より厚みの大きな、例えば直方体
のセラミックよりなるワークWが貫通保持されている。
A drive shaft 2 is fixed to a rotating shaft 1a of a motor 1 forming a part of the polishing apparatus main body A.
A sun gear 2a is integrally formed on the upper part of the sun gear 2, and the sun gear 2a is meshed with the planetary gear 4. The planetary gears 4 are disk-shaped gears made of a thin metal plate. In this embodiment, a total of four planetary gears 4 are arranged between the upper and lower stools 3 and 5. A plurality of holding holes 4 a are formed in the planetary gear 4, and a work W made of, for example, a rectangular parallelepiped ceramic, which is thicker than the planetary gear 4, is held in the holding holes 4 a.

【0012】駆動軸2の下部円筒面は下定盤5の中央穴
に回転自在に嵌合しており、駆動軸2の最下端部には中
間ギヤ6と噛み合う駆動ギヤ2bが一体に形成されてい
る。中間ギヤ6は別の中間ギヤ7を介して環体8の下部
ギヤ8aと噛み合っており、これら中間ギヤ6,7は固
定部6a,7aに回転自在に支持されている。したがっ
て、環体8は駆動軸2と同一方向に回転する。なお、下
定盤5と環体8は図示しない支持手段によって回転自在
に支持される。
A lower cylindrical surface of the drive shaft 2 is rotatably fitted in a center hole of the lower platen 5, and a drive gear 2 b meshing with the intermediate gear 6 is integrally formed at the lowermost end of the drive shaft 2. I have. The intermediate gear 6 meshes with a lower gear 8a of the ring body 8 via another intermediate gear 7, and these intermediate gears 6, 7 are rotatably supported by fixed portions 6a, 7a. Therefore, the ring 8 rotates in the same direction as the drive shaft 2. The lower platen 5 and the ring 8 are rotatably supported by supporting means (not shown).

【0013】環体8の下部内面には下定盤5の外周面が
摺動自在に嵌合しており、環体8と下定盤5は相対回転
自在である。環体8の上部内面には遊星ギヤ4と噛み合
うリングギヤ8bが形成されており、その上部内面には
上定盤3の外周面が摺動自在に嵌合している。これによ
り、上下定盤3,5と駆動軸2と環体8とで遊星ギヤ4
の周囲がほぼ密閉され、研磨装置本体Aが形成される。
The outer surface of the lower platen 5 is slidably fitted to the lower inner surface of the ring body 8, and the ring body 8 and the lower platen 5 are relatively rotatable. A ring gear 8b meshing with the planetary gear 4 is formed on the upper inner surface of the ring body 8, and the outer peripheral surface of the upper platen 3 is slidably fitted on the upper inner surface. Thus, the planetary gears 4 are formed by the upper and lower stools 3, 5 and the drive shaft 2 and the ring body 8.
Is substantially sealed, and a polishing apparatus main body A is formed.

【0014】尚、上下定盤の研磨面を修正する場合は、
上述例の遊星ギヤ4に置き換えて修正用キャリア(図示
せず)を用いる。修正用キャリアは薄肉金属板よりなる
上下定盤の研磨面修正用の円盤状ギヤであり、遊星ギヤ
4に比較すると、ワーク保持用孔が設けられていないも
のである。修正用キャリアを除く他の構成は、全て上述
例と同様である。
When correcting the polished surfaces of the upper and lower platens,
A correction carrier (not shown) is used in place of the planetary gear 4 of the above-described example. The correction carrier is a disc-shaped gear for correcting the polished surface of the upper and lower platens made of a thin metal plate, and is not provided with a work holding hole as compared with the planetary gear 4. All other configurations except the correction carrier are the same as those in the above-described example.

【0015】次に、本発明における制御装置Bについて
説明する。制御装置Bは、振動検出手段9,10,増幅
手段11,比較手段13から構成されるものである。
Next, the control device B according to the present invention will be described. The control device B includes vibration detecting means 9 and 10, an amplifying means 11, and a comparing means 13.

【0016】このうち、振動を機械的な振動信号として
検出する、例えば、振動センサーからなる振動検出手段
9,10は、上定盤3の上面の内周及び外周近傍に設置
されている。また、振動検出手段9,10には、振動検
出手段9,10で検出された振動信号を増幅する、例え
ば、アンプからなる増幅手段11が接続され、増幅手段
11には、増幅された振動信号を周波数分析する、例え
ば、FFT(高速フーリエ変換)アナライザーからなる
解析手段12が接続される。そして、解析手段12に
は、上定盤3の上面の内周近傍と外周近傍との振動信号
を比較する、例えば、演算装置(CPU)からなる比較
手段13が接続される。ここで、比較手段13は、上定
盤3の上面の内周近傍と外周近傍との振動信号を比較す
る、第1の比較手段と、上定盤3の上面の内周近傍又は
外周近傍の振動信号と各々の基準信号とを比較する、第
2の比較手段を兼ねるものである。
Among these, vibration detecting means 9 and 10 comprising a vibration sensor for detecting vibration as a mechanical vibration signal, for example, are installed near the inner periphery and the outer periphery of the upper surface of the upper platen 3. The vibration detecting means 9 and 10 are connected to, for example, an amplifying means 11 composed of an amplifier, which amplifies the vibration signal detected by the vibration detecting means 9 and 10. Is connected to an analysis unit 12 which is, for example, an FFT (Fast Fourier Transform) analyzer. The analysis means 12 is connected to a comparison means 13 for comparing vibration signals between the vicinity of the inner periphery and the vicinity of the outer periphery of the upper surface of the upper stool 3, for example, comprising a computing device (CPU). Here, the comparison means 13 compares the vibration signals between the vicinity of the inner circumference and the vicinity of the outer circumference of the upper surface of the upper stool 3 with the first comparison means and the vicinity of the inner circumference or the outer circumference of the upper surface of the upper stool 3. It also serves as second comparing means for comparing the vibration signal with each reference signal.

【0017】かかる構成の研磨装置の動作について、先
ず、研磨装置本体Aについて説明する。ワークWを研磨
する場合、下定盤5上に遊星ギヤ4を載置し、遊星ギヤ
4の保持穴4aにワークWを貫通挿入し、その上に上定
盤3を載置し、一定圧で加圧する。そして、図示しない
スラリー状砥粒を上定盤3の供給孔3aに供給する。こ
こで、モータ1を起動すると、太陽ギヤ2aが図2の左
回り方向に回転し、リングギヤ8bは太陽ギヤ2aと同
一方向に低速で回転するため、遊星ギヤ4が自転及び公
転する遊星運動を起こし、遊星ギヤ4に保持されたワー
クWの上下面は、上下定盤3,5と摺動してスラリー状
砥粒によって研磨される。
The operation of the polishing apparatus having such a configuration will first be described with respect to the polishing apparatus main body A. When polishing the work W, the planetary gear 4 is placed on the lower platen 5, the work W is inserted through the holding hole 4a of the planetary gear 4, and the upper platen 3 is placed thereon, and Apply pressure. Then, slurry-like abrasive grains (not shown) are supplied to the supply holes 3 a of the upper stool 3. Here, when the motor 1 is started, the sun gear 2a rotates counterclockwise in FIG. 2 and the ring gear 8b rotates at a low speed in the same direction as the sun gear 2a, so that the planetary gear 4 rotates and revolves in a planetary motion. The upper and lower surfaces of the work W held by the planetary gear 4 slide on the upper and lower stools 3 and 5 and are polished by the slurry-like abrasive grains.

【0018】また、上下定盤3,5の研磨面を修正する
場合、下定盤5上に、上述した遊星ギヤ4に代って修正
用の修正用キャリアを載置し、その上に上定盤3を載置
し、一定圧で加圧する。そして、上述と同様にスラリー
状砥粒を供給し、モータ1を起動すると、修正用キャリ
アが自転及び公転する遊星運動を起こし、上定盤3の下
面及び下定盤5の上面である研磨面は、修正用キャリア
の上下面と摺動してスラリー状砥粒によって研磨され
る。
When the polishing surfaces of the upper and lower stools 3 and 5 are to be corrected, a correction carrier for correction is placed on the lower stool 5 instead of the above-described planetary gear 4, and the upper stool is fixed thereon. The board 3 is placed and pressurized at a constant pressure. Then, when the slurry-like abrasive grains are supplied and the motor 1 is started in the same manner as described above, the carrier for correction causes planetary motion of revolving and revolving, and the polishing surface that is the lower surface of the upper surface plate 3 and the upper surface of the lower surface plate 5 Then, it is polished by the slurry-like abrasive grains by sliding on the upper and lower surfaces of the correction carrier.

【0019】一方、研磨装置本体Aを用いて、ワークW
を研磨作業中において、上定盤3の内周及び外周近傍の
振動を、それぞれの振動検出手段9,10を介して振動
信号として検出する。検出された振動信号は信号増幅手
段11を介して増幅され、増幅された振動信号は解析手
段12に送られ、周波数分析により振動度が解析され
る。この振動度を示すデータを受けとった第1の比較手
段13では、内周近傍の振動度と外周近傍の振動度とを
比較して、例えば、振動度の差又は商が予め設定してあ
る異常の基準値(上下定盤3,5の研磨面の平面度が正
常から異常への限界値)に達した場合、上下定盤3,5
の研磨面の平面度を異常状態と判断して、例えば、研磨
装置本体Aに装備された制御盤(図示せず)を介して、
研磨装置本体Aの運転を自動的に停止するものである。
On the other hand, the work W
During the polishing operation, vibrations near the inner and outer circumferences of the upper stool 3 are detected as vibration signals via the respective vibration detecting means 9 and 10. The detected vibration signal is amplified via the signal amplifying means 11, and the amplified vibration signal is sent to the analyzing means 12, where the vibration degree is analyzed by frequency analysis. Upon receiving the data indicating the vibration degree, the first comparing means 13 compares the vibration degree near the inner periphery with the vibration degree near the outer periphery, and for example, detects a difference or a quotient of the vibration degrees which is set in advance. (The flatness of the polished surface of the upper and lower platens 3 and 5 reaches the limit from normal to abnormal).
It is determined that the flatness of the polishing surface is abnormal, and, for example, via a control panel (not shown) mounted on the polishing apparatus main body A,
The operation of the polishing apparatus main body A is automatically stopped.

【0020】次に、上述の検出された振動信号から異常
を判断して研磨装置本体Aの運転を自動的に停止する動
作とは異なり、上下定盤3,5の研磨面の平面度を修正
研磨する場合に、修正研磨終了を振動信号と基準値を比
較することにより、研磨装置本体Aの運転を自動的に停
止する動作について説明する。
Next, unlike the operation of automatically stopping the operation of the polishing apparatus main body A by judging an abnormality from the detected vibration signal, the flatness of the polishing surfaces of the upper and lower stools 3 and 5 is corrected. An operation of automatically stopping the operation of the polishing apparatus main body A by comparing the end of the modified polishing with a vibration signal and a reference value when polishing is described.

【0021】上下定盤3,5の研磨面の平面度修正研磨
作業中において、上定盤3の内周及び外周近傍の振動
を、それぞれの振動検出手段9,10を介して振動信号
として検出する。検出された振動信号は信号増幅手段1
1を介して増幅され、増幅された振動信号は解析手段1
2に送られ、周波数分析により振動度が解析される。こ
の振動度を示すデータを受けとった第1の比較手段13
では、内周近傍の振動度と外周近傍の振動度とを比較し
て、例えば、振動度の差又は商が予め設定してある正常
の基準値(上下定盤3,5の研磨面の平面度が極めて良
好な状態を示す限界値)に達した場合、上下定盤3,5
の研磨面の平面度は理想状態として、前述と同様に制御
盤を介して、研磨装置本体Aの運転を自動的に停止する
ものである。
During the polishing operation for correcting the flatness of the polished surfaces of the upper and lower stools 3 and 5, vibrations near the inner and outer circumferences of the upper stool 3 are detected as vibration signals via respective vibration detecting means 9 and 10. I do. The detected vibration signal is transmitted to the signal amplifying unit 1
The amplified vibration signal is amplified through the
2 and the vibration degree is analyzed by frequency analysis. The first comparing means 13 receiving the data indicating the vibration degree
Then, the vibration degree near the inner circumference and the vibration degree near the outer circumference are compared, and for example, the difference or the quotient of the vibration degrees is set to a normal reference value (the plane of the polished surfaces of the upper and lower platens 3, 5). And the upper and lower stools 3,5
The flatness of the polishing surface is set to an ideal state, and the operation of the polishing apparatus main body A is automatically stopped via the control panel in the same manner as described above.

【0022】次に、他の比較手段について説明する。研
磨装置本体Aの上下定盤3,5の研磨面の平面度修正直
前の研磨作業中において、上定盤3の内周及び外周近傍
の振動を、それぞれの振動検出手段9,10を介して振
動信号として検出する。検出された振動信号は信号増幅
手段11を介して増幅され、増幅された振動信号は解析
手段12に送られ、周波数分析により振動度が解析され
る。そして、上下定盤3,5の研磨面の平面度として許
容されない、異常基準信号(上下定盤3,5の研磨面の
平面度が正常から異常への限界値)として予め第2の比
較手段13に記録しておく。
Next, another comparing means will be described. During the polishing operation immediately before the flatness of the polished surfaces of the upper and lower stools 3 and 5 of the main body A of the polisher, vibrations near the inner and outer circumferences of the upper stool 3 are detected via the respective vibration detecting means 9 and 10. Detected as a vibration signal. The detected vibration signal is amplified via the signal amplifying means 11, and the amplified vibration signal is sent to the analyzing means 12, where the vibration degree is analyzed by frequency analysis. The second comparison means is used in advance as an abnormal reference signal (a limit value of the flatness of the polished surfaces of the upper and lower platens 3 and 5 from normal to abnormal) which is not allowed as the flatness of the polished surfaces of the upper and lower platens 3 and 5. Record it in 13.

【0023】そして、通常のワーク研磨作業中におけ
る、上定盤3の内周及び外周近傍の振動をそれぞれ振動
検出手段9,10を介して振動信号として検出する。検
出された振動信号は信号増幅手段11を介して増幅さ
れ、増幅された振動信号は解析手段12に送られ、振動
度を解析する。この振動度を示すデータを受けとった第
2の比較手段13では、予め記録されている内周及び外
周近傍の異常基準信号と内周及び外周近傍の振動信号を
比較して、ワークWを研磨中の振動信号のレベルが異常
基準信号のレベルに達した場合、上下定盤3,5の研磨
面の平面度は異常状態として、前述と同様に制御盤を介
して、研磨装置本体Aの運転を自動的に停止するもので
ある。
Then, vibrations near the inner circumference and the outer circumference of the upper surface plate 3 during a normal work polishing operation are detected as vibration signals via vibration detecting means 9 and 10, respectively. The detected vibration signal is amplified via the signal amplifying means 11, and the amplified vibration signal is sent to the analyzing means 12, where the vibration degree is analyzed. The second comparing means 13 which has received the data indicating the degree of vibration compares the pre-recorded abnormal reference signal near the inner circumference and the outer circumference with the vibration signal near the inner circumference and the outer circumference to polish the workpiece W. When the level of the vibration signal reaches the level of the abnormal reference signal, the flatness of the polished surfaces of the upper and lower platens 3 and 5 is regarded as abnormal, and the operation of the polishing apparatus main body A is performed via the control panel in the same manner as described above. It stops automatically.

【0024】次に、上述の検出された振動信号から異常
を判断して研磨装置本体Aの運転を自動的に停止する動
作とは異なり、上下定盤3,5の研磨面の平面度を修正
研磨する場合に、修正研磨終了を内周近傍と外周近傍の
振動信号を比較することにより、研磨装置本体Aの運転
を自動的に停止する動作について説明する。
Next, unlike the operation of automatically judging the operation of the polishing apparatus main body A by judging an abnormality from the detected vibration signal, the flatness of the polished surfaces of the upper and lower platens 3 and 5 is corrected. An operation of automatically stopping the operation of the polishing apparatus main body A by comparing the end of the modified polishing with the vibration signals near the inner circumference and the outer circumference when polishing is performed will be described.

【0025】研磨装置本体Aの上下定盤3,5の研磨面
の平面度が良好な理想状態において、研磨面の修正研磨
作業中の上定盤3の内周及び外周近傍の振動を、それぞ
れの振動検出手段9,10を介して振動信号として検出
する。検出された振動信号は信号増幅手段11を介して
増幅され、増幅された振動信号は解析手段12に送ら
れ、周波数分析により振動度が解析される。そして、上
下定盤3,5の研磨面の平面度として許容される、正常
基準信号(上下定盤3,5の研磨面の平面度が極めて良
好な状態を示す限界値)として予め第2の比較手段13
に記録しておく。そして、上下定盤3,5の研磨面の修
正研磨作業中において、上定盤3の内周及び外周近傍の
振動をそれぞれ振動検出手段9,10を介して振動信号
として検出する。検出された振動信号は信号増幅手段1
1を介して増幅され、増幅された振動信号は解析手段1
2に送られ、振動度を解析する。この振動度を示すデー
タを受けとった第2の比較手段13では、予め記録され
ているそれぞれの正常基準信号とそれぞれの振動信号と
を比較して、修正研磨中の振動信号のレベルが正常基準
信号のレベルに達した場合、上下定盤3,5の研磨面の
平面度は理想状態として、前述と同様に制御盤を介し
て、研磨装置本体Aの運転を自動的に停止するものであ
る。
In an ideal state in which the flatness of the polished surfaces of the upper and lower stools 3 and 5 of the main body A of the polisher is good, vibrations near the inner and outer peripheries of the upper stool 3 during the polishing operation of the polished surface are respectively reduced. As a vibration signal via the vibration detecting means 9 and 10. The detected vibration signal is amplified via the signal amplifying means 11, and the amplified vibration signal is sent to the analyzing means 12, where the vibration degree is analyzed by frequency analysis. The normal reference signal (a limit value indicating that the flatness of the polished surfaces of the upper and lower platens 3, 5 is extremely good) which is allowed as the flatness of the polished surfaces of the upper and lower platens 3, 5 is set in advance as a second signal. Comparison means 13
To record. Then, during the correction polishing work of the polished surfaces of the upper and lower stools 3, 5, the vibrations near the inner circumference and the outer circumference of the upper stool 3 are detected as vibration signals via the vibration detection means 9, 10, respectively. The detected vibration signal is transmitted to the signal amplifying unit 1
The amplified vibration signal is amplified through the
2 to analyze the degree of vibration. The second comparing means 13 which has received the data indicating the vibration degree compares each of the previously recorded normal reference signals with each of the vibration signals, and determines that the level of the vibration signal during the correction polishing is the normal reference signal. Is reached, the flatness of the polished surfaces of the upper and lower stools 3 and 5 is set to an ideal state, and the operation of the polishing apparatus main body A is automatically stopped via the control panel in the same manner as described above.

【0026】尚、上述の制御装置Bは、一実施例を示す
ものであり、振動検出手段9,10と信号増幅手段11
と解析手段12と比較手段13とから構成されている
が、これに限定されるものでなく、研磨装置本体Aに装
備された制御盤を含めて、これらと同等機能を有し、且
つ複合化された手段が備えられてもよい。
The above-described control device B is an example of the embodiment, and includes vibration detecting means 9 and 10 and signal amplifying means 11.
And the analyzing means 12 and the comparing means 13, but the present invention is not limited to this, and has a function equivalent to these, including a control panel mounted on the main body A of the polishing apparatus. The provided means may be provided.

【0027】また、振動検出手段9,10として機械的
振動を検出する振動センサーについて説明したが、振動
センサーに代わって音響的音圧を検出するAE(ACO
USTIC EMISSION)センサーを用いて、音
圧による異常を検出してもよいものである。また、振動
センサーとAEセンサーを併用してもよいものである。
そして、振動検出手段9,10の設置位置は上定盤3に
限定されるものでなく下定盤5に設置してもよい。
Although the vibration sensor for detecting mechanical vibration has been described as the vibration detecting means 9 and 10, an AE (ACO) for detecting acoustic sound pressure instead of the vibration sensor is used.
An abnormality due to sound pressure may be detected using a USTIC EMISSION sensor. Further, the vibration sensor and the AE sensor may be used in combination.
The installation positions of the vibration detecting means 9 and 10 are not limited to the upper surface plate 3 but may be installed on the lower surface plate 5.

【0028】更に、本発明の研磨装置は上下定盤3,5
が静止し、太陽ギヤとリングギヤとが回転する2ウエイ
型及び上下定盤3,5も回転する4ウエイ型にも適用で
きるものである。
Further, the polishing apparatus of the present invention comprises upper and lower
Can be applied to a two-way type in which the sun gear and the ring gear rotate and a four-way type in which the upper and lower platens 3, 5 also rotate.

【0029】[0029]

【発明の効果】以上の説明で明らかなように、本発明に
よる平面度検出装置を備えた浮遊砥粒式研磨装置では、
ワークを研磨中に、振動検出手段を介して上定盤の内周
近傍及び外周近傍の振動信号を検出し、内周近傍及び外
周近傍の振動信号を比較することにより、上下定盤の研
磨面の平面度の異常を検出することができるものであ
る。また、上下定盤を修正研磨作業中に、振動検出手段
を介して検出した上定盤の内周近傍及び外周近傍の振動
信号と、各々の基準信号とを比較することにより、上下
定盤の研磨面の平面度の理想状態を検出することができ
るものである。
As is apparent from the above description, the floating abrasive type polishing apparatus provided with the flatness detecting device according to the present invention has:
While the workpiece is being polished, vibration signals near the inner circumference and the outer circumference of the upper surface plate are detected through the vibration detection means, and the vibration signals near the inner circumference and the outer circumference are compared, whereby the polishing surface of the upper and lower surface plates is compared. Can detect an abnormality in the flatness. Further, during the correction polishing work of the upper and lower platens, by comparing the vibration signals near the inner periphery and the outer periphery of the upper platen detected through the vibration detecting means with the respective reference signals, the upper and lower platens are compared. An ideal state of flatness of the polished surface can be detected.

【0030】このため、研磨作業中に自動的に上下定盤
の平面度が悪化すれば運転を停止でき、また、上下定盤
の平面度を修正研磨中に良好な状態になれば、自動的に
運転を停止することができる。
For this reason, if the flatness of the upper and lower platens deteriorates automatically during the polishing operation, the operation can be stopped. If the flatness of the upper and lower platens becomes good during the correction polishing, the operation can be automatically stopped. The operation can be stopped.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明に係る浮遊砥粒式研磨装置および制御装
置の一部断面正面図である。
FIG. 1 is a partially sectional front view of a floating-abrasive polishing apparatus and a control apparatus according to the present invention.

【図2】上定盤を取り外した状態の研磨装置の平面図で
ある。
FIG. 2 is a plan view of the polishing apparatus with an upper surface plate removed.

【符号の説明】[Explanation of symbols]

W ワーク 2a 太陽ギヤ 3 上定盤 4 遊星ギヤ 5 下定盤 8b リングギヤ 9,10 振動検出手段 11 信号増幅手段 12 増幅手段 13 比較手段 W Work 2a Sun gear 3 Upper surface plate 4 Planet gear 5 Lower surface plate 8b Ring gear 9,10 Vibration detection means 11 Signal amplification means 12 Amplification means 13 Comparison means

Claims (2)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】上下定盤と、該上下定盤の間に配置され、
ワークを保持する保持孔を備えた遊星ギヤと、該遊星ギ
ヤと噛み合う太陽ギヤ及びリングギヤとを備え、該太陽
ギヤ又はリングギヤの少なくとも一方を回転させること
により、前記遊星ギヤを自転、又は自転及び公転させ、
スラリー状砥粒を介して、前記ワークと前記上下定盤と
を摺動させることにより、前記ワークを研磨する浮遊砥
粒式研磨装置において、 前記上定盤の内周及び外周近傍に前記上定盤の振動信号
を検出する振動検出手段を設け、該振動検出手段に該振
動検出手段を介して検出された内周及び外周における振
動信号を比較する第1の比較手段を設けたことを特徴と
する浮遊砥粒式研磨装置。
1. An upper and lower platen, disposed between the upper and lower platens,
A planetary gear having a holding hole for holding a work, a sun gear and a ring gear meshing with the planetary gear are provided, and by rotating at least one of the sun gear and the ring gear, the planetary gear rotates, or rotates and revolves. Let
In a floating abrasive type polishing apparatus for polishing the work by sliding the work and the upper and lower platens through slurry-like abrasive grains, the upper platen is provided near the inner periphery and the outer periphery of the upper platen. A vibration detecting means for detecting a vibration signal of the panel; and a first comparing means for comparing the vibration signals on the inner circumference and the outer circumference detected via the vibration detecting means with the vibration detecting means. Floating abrasive polishing equipment.
【請求項2】前記振動検出手段に該振動検出手段を介し
て検出された前記上定盤の内周及び外周近傍における振
動信号と、前記上定盤の内周及び外周近傍における基準
信号とを、それぞれ比較する第2の比較手段を備えたこ
とを特徴とする請求項1記載の浮遊砥粒式研磨装置。
2. A method according to claim 1, wherein said vibration detecting means converts a vibration signal detected in the vicinity of the inner and outer circumferences of said upper platen detected through said vibration detecting means and a reference signal in the vicinity of the inner and outer circumferences of said upper platen. 2. A floating abrasive polishing apparatus according to claim 1, further comprising a second comparing means for comparing each of them.
JP26262393A 1993-10-20 1993-10-20 Floating abrasive polishing machine Expired - Fee Related JP3119054B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP26262393A JP3119054B2 (en) 1993-10-20 1993-10-20 Floating abrasive polishing machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26262393A JP3119054B2 (en) 1993-10-20 1993-10-20 Floating abrasive polishing machine

Publications (2)

Publication Number Publication Date
JPH07112363A JPH07112363A (en) 1995-05-02
JP3119054B2 true JP3119054B2 (en) 2000-12-18

Family

ID=17378369

Family Applications (1)

Application Number Title Priority Date Filing Date
JP26262393A Expired - Fee Related JP3119054B2 (en) 1993-10-20 1993-10-20 Floating abrasive polishing machine

Country Status (1)

Country Link
JP (1) JP3119054B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0810064B1 (en) * 1996-05-30 2002-09-25 Ebara Corporation Polishing apparatus having interlock function

Also Published As

Publication number Publication date
JPH07112363A (en) 1995-05-02

Similar Documents

Publication Publication Date Title
US6585562B2 (en) Method and apparatus for polishing control with signal peak analysis
EP0687526B1 (en) Polishing method and apparatus for automatic reduction of wafer taper in single-wafer polishing
TW201600235A (en) Chemical mechanical polishing retaining ring with integrated sensor
US6296553B1 (en) Grinding method, surface grinder, workpiece support, mechanism and work rest
US7294041B1 (en) Moving head for semiconductor wafer polishing apparatus
JP3119054B2 (en) Floating abrasive polishing machine
KR20160113619A (en) Workpiece machining device and workpiece machining method
US20060194512A1 (en) Thickness control method and double side polisher
CN102458763B (en) Method for machining flat workpieces
EP0579298B1 (en) Method of manufacturing a plate having a plane main surface, method of manufacturing a plate having parallel main surfaces, and device suitable for implementing said methods
JP3120921B2 (en) Lap machine abnormality detection device
JP2019030963A (en) Wafer chamfering device
JPH11254311A (en) Thin-board-shaped work breakage prevention method during grinding
JP2020049612A (en) Double surface polishing device and double surface polishing method of workpiece
US6971944B2 (en) Method and control system for improving CMP process by detecting and reacting to harmonic oscillation
JPH07227756A (en) Method and device for polishing work
WO2002038336A1 (en) A method and apparatus for controlled polishing
JPH11183447A (en) Method for predicting cracking of material to be machined and machining method and grinding machine employing it
JPH07112365A (en) Suspended abrasive grain type polishing device
JP3222360B2 (en) Flat lapping machine and polishing method using the same
JPH11254304A (en) Surface plate with built-in sensor
JPH11254299A (en) Shape measuring device for abrasive cloth
JPH07111255A (en) Wafer polisher
JPH066259B2 (en) Double-sided grinding machine with double-sided grinding machine and method for detecting grindstone shape
JP2000190218A (en) Abrasive grain layer removal watching method and watching device for grinding wheel

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees