JP3118244U - Connector solder ball holding structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a solder ball holding structure for a connector which ensures that each solder ball is evenly contacted with the surface of a circuit board by sliding each solder ball up and down in a timely manner according to the surface flatness of the circuit board and the degree of warpage provide.
A solder ball holding structure of a connector is provided on a terminal 2 provided on a connector B and electrically soldered to a circuit board 4. Each terminal 2 is inserted into a plurality of terminal grooves 11 provided in the insulating base 1, and a soldering portion 22 at the lower end of the terminal 2 protrudes from the bottom of the terminal groove 11. In the soldering portion 22, solder ball holding holes 23 are provided in the lateral direction, and a partition wall 15 is provided on the insulating base 1 at an appropriate distance opposite to the holding holes 23. The inner hole edge of the holding hole 23 is an open cone-shaped opening that matches the spherical shape of the solder ball 3, the diameter of which is slightly larger than the outer diameter of the side surface of the solder ball 3, and is slightly deeper in a deep position. The solder ball 3 is held.
[Selection] Figure 8

Description

  The present invention relates to a solder ball holding structure of a connector, and in particular, automatically adjusts the height of each solder ball relative to the circuit board according to the degree of flatness and warpage of the circuit board, The present invention relates to a solder ball holding structure for a connector that enables soldering by bringing the connector into contact with the surface of a circuit board.

  As electronic circuits have advanced, the number and speed of digital processing has increased, and the number of terminal pins on each associated connector has increased. Therefore, a connector composed of a large number of terminal pins plays an important role.

  However, a connector having a very large number of terminal pins often has poor sealing when a soldering technique for soldering onto a circuit board is used for a surface mount type (SMT). This seal needed to be improved. Adding solder balls to the soldered portions of the connector terminals is a solution that has already been developed, and there are two types of solutions of the prior art: a preliminary solder ball type or an embedded solder ball type.

  FIG. 1 is a plan view showing a typical connector having a very large number of terminals arranged in an array manner. FIG. 2 is a cross-sectional view showing a state in which terminals and solder balls of a conventional embedded solder ball type connector are fixed. FIG. 3 is a bottom view showing a state when the solder balls of the connector of FIG. 2 are fixed. FIG. 4 is a cross-sectional view showing a state in which terminals and solder balls of a conventional spare solder ball type connector are fixed.

  As shown in FIGS. 1 to 4, a conventional general connector A (a spare solder ball type connector or an embedded solder ball type connector) includes an insulating base 1, a plurality of terminals 2, and a plurality of solder balls 3.

  As shown in FIGS. 2 and 3, in the embedded solder ball type connector, the insulating base 1 has a plurality of terminal grooves 11 extending along the vertical direction, and a solder ball storage chamber 12 is formed at the bottom of each terminal groove. Is provided. Each terminal 2 is inserted in each terminal groove 11. The upper end portion and the lower end portion of these terminals 2 are formed at the contact portion 21 and the soldering portion 22, respectively. The contact part 21 consists of an elastic structure, which is pressed and electrically contacted on the contacts of an electronic element (not shown). The soldering portion 22 extends downward and is provided on the side of the solder ball storage chamber 12. The plurality of spherical solder balls 3 are embedded between each solder ball storage chamber 12 and each soldering portion 22, and the height of the suppression wall 13 formed by the four walls of the solder ball storage chamber 12 and its height Depending on the pushing force and depending on the resistance of the bottom surface 14 of the solder ball storage chamber 12, the soldering portion 22 of the terminal 2 and the solder ball 3 are tightly fixed so as not to fall, and for soldering to the circuit board 4. use.

  The embedded solder ball 3 must be firmly fixed between the solder ball storage chamber 12 of the insulating base 1 and the soldering portion 22 of the terminal 2 so as not to fall off. In other words, for the connection relationship between the solder balls 3 and the terminals 2, an embedded tight method is adopted in the conventional embedded solder ball type, and the solder balls 3 are embedded so that the soldering portion 22 and the solder ball storage chamber 12 are connected. It is made to contact | adhere between the four suppression walls (1-4) 131,132,133,134.

  As shown in FIG. 4, the basic structure of the pre-solder ball type connector is similar to that of the embedded solder ball type connector, but each of the bottom ends of the soldering portions 22 of the terminals 2 is first soldered to the solder balls 3. Then, the solder ball 3 is fixed to the soldering portion of the terminal 2.

  When the solder ball 3 is fixed to the soldering portion 22 of the terminal by the above-described embedded solder ball method or preliminary solder ball method, the solder ball 3 is fixed at the position of the soldering portion 22, so that the position is adjusted up and down. Thus, each solder ball could not be fixed at a uniform height. However, it has been desired that each solder ball is in full contact with the surface of the flat circuit board 4.

  Further, as shown in FIGS. 2 and 4, since the surface of the plate-like circuit board 4 could not be held on an extremely accurate plane, the surface of the circuit board 4 slightly warped depending on the temperature and load. The plane may become incomplete, such as deformation. When the surface of the circuit board 4 became non-flat, the surface of the circuit board 4 could not be brought into full contact with the solder balls 3 at the uneven portions. For example, a gap is generated between the surface of the circuit board 4 and the lower surface 41 corresponding to the solder balls 3a which are the recesses on the surface of the circuit board 4, and cannot be contacted. For this reason, when soldering, the surfaces of the solder balls 3a and the circuit board 4 are not in contact with each other, and a sealing failure may occur.

  Therefore, a technique has been desired in which each solder ball can reliably contact each terminal of the connector and the circuit board to ensure the soldering quality.

  Therefore, the main purpose of the present invention is to ensure that each solder ball contacts the surface of the circuit board evenly by sliding each solder ball up and down in time according to the flatness and warpage of the circuit board surface. Another object is to provide a solder ball holding structure for a connector.

In order to achieve the above object, the present invention provides a new solder ball holding structure of a connector.
That is, the present invention is a connector solder ball holding structure used for soldering a plurality of terminals to a circuit board having an insulating base and a solder ball,
The insulating base is provided with a plurality of terminal grooves along the vertical direction,
The plurality of terminals are inserted into the terminal grooves of the insulating base, and the upper end and the lower end of each terminal are formed as soldering portions protruding from the contact portion and the bottom of the terminal groove, respectively.
A holding hole for holding the solder ball is provided in the lateral direction in the vicinity of the soldering portion, and a hole edge of the holding hole has a shape of an open cone-shaped opening, and the cone-shaped opening has the shape of the solder An inner diameter slightly larger than the outer diameter of the side surface of the solder ball so as to hold the ball at a deep position in a slightly loose state,
A partition wall is provided on the insulating base so as to face the holding hole at a distance,
The present invention relates to a solder ball holding structure for a connector in which a part of the solder ball is housed and positioned in the holding hole, the facing position is limited by the facing partition, and the connector slides freely in the vertical direction in the holding hole.
The present invention also relates to a solder ball holding structure for the connector, in which a holding hole is provided through the soldering portion.
Furthermore, the present invention relates to a solder ball holding structure for the connector, wherein the holding hole is formed in the shape of a concave groove portion without penetrating the soldering portion.
The present invention also relates to a solder ball holding structure for the connector, wherein the concave groove is spherical.
Furthermore, the present invention relates to a solder ball holding structure for the connector, wherein a convex base adjacent to the lower edge of the holding hole is provided in the soldering portion.
The present invention also relates to a solder ball holding structure for a connector, wherein an introduction space is provided in an insulating base, and the introduction space is provided opposite to a rear surface of a soldering portion that is an opposite surface of a conical opening.
The present invention relates to the solder ball holding structure for a connector, wherein the shape of the edge of the holding hole is any one of an elliptical cone opening, a quadrangular cone opening, a hexagonal cone opening, and an octagonal cone opening. .
The connector solder ball holding structure of the present invention is provided on a terminal to be electrically soldered to a circuit board as a connector portion. Each terminal is inserted into a plurality of terminal grooves provided on the insulating base, and a soldered portion at the lower end of the terminal protrudes from the bottom of the terminal groove.

  In the soldering portion of the present invention, solder ball holding holes are provided in the lateral direction, and a partition wall is provided on an insulating base at an appropriate distance opposite to the holding holes. The inner hole edge of the holding hole is an open cone-shaped opening that matches the spherical shape of the solder ball, and its diameter is slightly larger than the outer diameter of the side surface of the solder ball, and the solder ball is placed in a deep position in a slightly loose state. Hold. Therefore, a part of the solder ball is received and positioned in the holding hole, and the partition of the solder ball on the opposite side restricts the facing position, so that it does not fall off. Further, since the holding hole is slightly larger than the outer diameter of the side surface of the solder ball, the solder ball can be slid up and down appropriately and freely within the holding hole.

  As a result, when the connector and the circuit board are soldered, each solder ball is adjusted by sliding up and down according to the height of the circuit board surface with which it contacts, and each solder ball automatically adjusts to the surface of the circuit board. It is possible to obtain an optimum soldering effect by maintaining flat contact so as to be flat.

  The insulation base is provided with an introduction space, and this introduction space faces the rear surface of the soldered portion of the terminal (that is, the opposite surface of the conical opening), so that a surplus space is provided in the soldered portion, and the solder ball is elastic. Is introduced to the holding hole of the soldering portion.

  The soldering portion of the terminal is provided with a convex base at a position adjacent to the lower edge of the holding hole to increase the depth of the solder ball held by the holding hole.

  According to the solder ball holding structure of the connector of the present invention, each solder ball is slid up and down appropriately according to the surface flatness of the circuit board and the degree of warpage thereof, so that each solder ball contacts the surface of the circuit board uniformly. Can be secured.

  Please refer to FIG. FIG. 5 is a cross-sectional view illustrating a solder ball holding structure of a connector according to an embodiment of the present invention. FIG. 6 is a partial perspective view showing a state when the solder ball holding structure of FIG. 5 is viewed from the bottom. FIG. 7 is an enlarged perspective view showing a part of the solder ball holding structure of FIG. 5, and shows a state when the solder ball of the terminal is elastically deformed and guided in the space direction and the solder ball is introduced. FIG. 8 is a cross-sectional view showing the solder ball holding structure of FIG. 7 and shows a state where the soldered portion of the terminal is restored and the solder ball is held in the holding hole. FIG. 9 is a perspective view showing a terminal of the solder ball holding structure of FIG.

  As shown in these drawings, the connector B of the present invention includes an insulating base 1, a plurality of terminals 2, and a plurality of solder balls 3.

  The insulating base 1 is provided with a plurality of terminal grooves 11 extending along the vertical direction. Each terminal 2 is inserted into each terminal groove 11. The upper end portion and the lower end portion of the terminals 2 are formed at the contact portion 21 and the soldering portion 22, respectively. The contact portion 21 has an elastic structure and is pressed to make electrical contact with the contact point of an electronic element (not shown). The soldering portion 22 extends downward and protrudes from the bottom of the terminal groove 11. A plurality of circular solder balls 3 are respectively installed between the insulating base 1 and each soldering portion 22 and used for soldering to the circuit board 4.

  In the solder ball holding structure of the present embodiment, a solder ball holding hole 23 is installed in the lateral direction mainly at the proximal end portion of the soldering portion 22 of the terminal 2 and is at an appropriate distance opposite the holding hole. A partition wall 15 is provided on the insulating base 1. An open conical opening 24 is formed at the inner hole edge of the holding hole 23 in accordance with the spherical shape of the solder ball, and its diameter is slightly larger than the outer diameter of the side surface of the solder ball, and is deep in a slightly loose state. The solder ball 3 is held at the position. Therefore, a part of the solder ball 3 is accommodated and positioned in the holding hole 23, and the solder ball partition wall 15 on the opposite side restricts the facing position, so that the solder ball does not fall away from the holding hole. Further, by making the inner diameter of the holding hole 23 slightly larger than the outer diameter of the side surface of the solder ball 3 that has entered the holding hole 23, the solder ball 3 can freely slide up and down within the holding hole 23. To.

  In the drawing showing the present embodiment, the holding hole 23 is shown as a circular conical opening. However, the shape of the holding hole 23 is not limited to this, and the solder ball 3 does not fall off and remains inside the holding hole 23. As long as it can move up and down, a polygonal pyramid opening such as an elliptical cone opening, a quadrangular pyramid opening, a hexagonal cone opening, an octagonal pyramid opening, and the like may be used.

  Further, since the solder balls 3 can slide up and down, when the connector B of the present invention and the circuit board 4 are soldered, the solder balls 3 are brought to the height of the surface of the circuit board with which they are contacted. They are adjusted by sliding up and down, and each solder ball is automatically flattened with the surface of the circuit board to maintain full contact. Therefore, the soldering performed between the terminal 2 and the circuit board 4 can be most effectively performed.

  In addition, the present invention is not a method in which the solder ball 3 is sandwiched and fixed by four surfaces, but one side of the solder ball 3 is held so as to move by the holding hole 23 of the soldering portion 22 of the terminal 2 and the partition wall 15 on the opposite side. Do not block the other side of the solder ball. Therefore, when the circuit board 4 is subjected to surface mount type (SMT) soldering, the high-temperature hot air of the soldering is easily guided to each solder ball 3 to increase the soldering effect.

  Moreover, in the soldering part 22 of the terminal 2, when the convex base 25 is further provided in the lower edge location of the holding hole 23, the stability of the solder ball 3 which the holding hole 23 hold | maintains increases.

  The introduction base 16 can be provided in the insulating base 1. In such a case, the introduction space faces the rear surface of the soldering portion 22 of the terminal 2 (that is, the opposite surface of the conical opening 24), and an extra space is provided to the soldering portion 22, whereby the solder ball 3 is soldered. Due to the elasticity, the soldering part 22 can be expanded to the introduction space 16 side, so that the solder ball 3 can be more easily introduced into the holding hole 23 of the soldering part 22. That is, when the solder ball 3 is inserted from the bottom of the insulating base 1, the soldering portion 22 is pushed toward the introduction space 16 (FIG. 6). When the maximum outer diameter of the solder ball 3 passes through the bottom end of the soldering portion 22 and is introduced to the holding hole 23, the soldering portion 22 is restored to hold the solder ball 3 together with the partition wall 15.

  FIG. 10 is a perspective view illustrating terminals of a solder ball holding structure for a connector according to another embodiment of the present invention. FIG. 11 is a perspective view showing a state when the terminal of FIG. 10 is viewed from another angle. As shown in FIGS. 5 to 9, the holding hole 23 of the present embodiment penetrates the soldering portion 22 of the terminal 2 in the lateral direction. 10 and FIG. 11 is provided so as to maintain the shape of the conical opening without penetrating the soldering portion 22, and is formed in a holding hole having a spherical concave groove portion, for example. The holding hole 23 having 26 is formed, and the hole edge of the holding hole having the concave groove portion is a conical opening, which still has a function of moving up and down and holding the solder ball 3. .

  In the present invention, the preferred embodiments have been disclosed as described above, but these are not intended to limit the present invention in any way, and anyone who is familiar with the technology can make various modifications within the scope and spirit of the present invention. Changes and corrections can be made. Therefore, the scope of protection of the present invention is based on the contents specified in the utility model registration request.

  According to the present invention, each solder ball is slid appropriately up and down to ensure uniform contact of each solder ball and soldered portion with the circuit board surface in accordance with the flatness and warpage of the circuit board surface. can do.

It is a top view which shows the connector of a prior art. It is sectional drawing which shows a state when the terminal and solder ball of the embedded solder ball type connector of a prior art are fixed. It is a bottom view which shows a state when the solder ball of the connector of FIG. 2 is fixed. It is sectional drawing which shows a state when the terminal of a spare solder ball type connector and a solder ball are fixed. It is sectional drawing which shows the holding structure of the solder ball of the connector by one Embodiment of this invention. FIG. 6 is a perspective view showing a state when the solder ball holding structure of FIG. 5 is viewed from the bottom. FIG. 6 is an enlarged view showing the solder ball holding structure of FIG. 5, and an enlarged view showing a state where the solder ball is introduced by elastically deforming the soldering portion of the terminal in the direction of the introduction space. It is sectional drawing which shows the holding structure of the solder ball | bowl of FIG. 7, and shows the state when the soldering part of a terminal restores and puts the solder ball into the holding hole, and is hold | maintained. It is a perspective view which shows the terminal of the solder ball holding structure of FIG. It is a perspective view which shows the terminal of the solder ball holding structure of the connector by other suitable embodiment of this invention. It is a perspective view which shows a state when the terminal of FIG. 10 is seen from another angle.

Explanation of symbols

A Conventional connector
B Connector 1 of the present invention Insulation base 2 Terminal 3 Solder ball 4 Circuit board 11 Terminal groove 13 Suppression wall 15 Partition 16 Introduction space 21 Contact part 22 Soldering part 23 Holding hole 24 Conical opening 25 Convex base 26 Concave groove part 131 Suppression wall 1
132 Suppression wall 2
133 Suppression wall 3
134 Suppression wall 4

Claims (7)

A solder ball holding structure for a connector used for soldering a plurality of terminals to a circuit board having an insulating base and a solder ball,
The insulating base is provided with a plurality of terminal grooves along the vertical direction,
The plurality of terminals are inserted into the terminal grooves of the insulating base, and the upper end and the lower end of each terminal are formed as soldering portions protruding from the contact portion and the bottom of the terminal groove, respectively.
A holding hole for holding the solder ball is provided in the lateral direction in the vicinity of the soldering portion, and a hole edge of the holding hole has a shape of an open cone-shaped opening, and the cone-shaped opening is formed by the solder ball. Having an inner diameter slightly larger than the outer diameter of the side surface of the solder ball so as to hold it at a deep position in a slightly loose state,
A partition wall is provided on the insulating base so as to face the holding hole at a distance,
A solder ball holding structure for a connector, wherein a part of the solder ball is received and positioned in the holding hole, the facing position is limited by the facing partition wall, and freely slides up and down in the holding hole.   The solder ball holding structure for a connector according to claim 1, wherein the holding hole is formed through the soldering portion.   2. The solder ball holding structure for a connector according to claim 1, wherein the holding hole is formed in the shape of a concave groove portion without penetrating the soldering portion.   4. The solder ball holding structure for a connector according to claim 3, wherein the concave groove is spherical.   The solder ball holding structure for a connector according to claim 1, wherein the soldering portion is provided with a convex base in contact with a lower edge of the holding hole.   2. The connector solder according to claim 1, wherein an introduction space for introducing a solder ball into the insulating base is provided, and the introduction space is provided relative to a rear surface of the soldering portion opposite to the conical opening. Ball holding structure.   2. The solder ball holding structure for a connector according to claim 1, wherein the shape of the hole edge of the holding hole is any one of an elliptical cone opening, a quadrangular cone opening, a hexagonal cone opening, and an octagonal cone opening.

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