JP3110417B2 - Adapter for electronic device inspection - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device inspection system for inspecting an electronic device such as an IC device in which leads are protruded from a package. About the adapter.

[0002]

2. Description of the Related Art In a conventional adapter of this type, a lead group protruding from a package of an electronic device is sandwiched between clips of the adapter to connect the leads to a signal extraction unit on the adapter side.

[0003] For this reason, if the interval between the leads is small, it is difficult to make a connection, and the signal may be short-circuited with an adjacent lead during signal extraction (during measurement). In addition, if the lead portion is connected to a thick electronic device or the like, the clip portion expands, and a connection failure may occur when connecting to an electronic device having a thin lead.

In the adapter described in Japanese Patent Application Laid-Open No. 6-281697, a semiconductor chip package is sandwiched between hooks at both ends of the adapter body, the adapter body is fixed on the package, and arranged on both side surfaces of the adapter body. The vertically arranged contact groups (contact portions) are respectively brought into contact with the pin groups (leads) of the semiconductor chip. In the adapter body,
A probe insertion port (hole) corresponding to each pin is provided for three types of pins for signal, ground, and electrode of the semiconductor chip, and a test jack is inserted into this port. Therefore, a test is performed by inserting a probe into this jack.

However, according to this, the structure of the adapter itself becomes very complicated, and if the size of the semiconductor chip is different, an adapter for each size must be prepared. Further, since all contacts of the adapter and all pins of the semiconductor chip must be in contact with each other, high precision is required for the adapter. Therefore, the adapter becomes expensive.

[0006]

SUMMARY OF THE INVENTION It is an object of the present invention to provide a simple and reliable connection of an adapter to a lead of an electronic device, a simple structure of the adapter, and a reduction in the size of the electronic device and the shape of the lead. An object of the present invention is to provide an electronic device inspection adapter that can handle different types of electronic device inspection adapters.

[0007]

An adapter for inspecting an electronic device according to the present invention comprises a pad detachably attached to a package of an electronic device and a clip for connecting a probe. The pad is formed with an engagement portion for each lead. The probe connection clip is equipped with a positioning member that engages with the lead-specific engagement portion of the pad to position the electronic device, and a signal extraction head that magnetically attracts the electronic device lead when positioned. Have been. With this as a basic configuration, the following preferable modes can be obtained.

[0008] The positioning member of the probe connecting clip is movable by the elasticity of the elastic member.

A hook-like portion is provided at the tip of the positioning member with the lead-specific engaging portion of the pad being a concave portion.

The pad is formed in a plate shape that can be placed on a package of an electronic device, and has a fixed side portion at one end for contacting one end surface of the package, and a pad at the other end contacting the other end surface of the package. The movable holding piece for holding the package with the fixed side is urged toward the fixed side by an elastic member to be mounted.

[0011]

Next, embodiments of the present invention will be described in detail with reference to the drawings.

Referring to FIG. 1, an electronic device inspection adapter according to the present invention includes a pad 3 which is removably mounted on a package 2 of an electronic device 1 and fixed thereto, and an electronic device 1.
And a probe connection clip 5 for connecting a probe (not shown) to the lead 4.

As shown in FIGS. 2 to 4, the pad 3 is a rectangular plate having a size to cover the upper surface of the package 2. A fixed side 6 is formed at one end (short side) of the pad 3 at a right angle. On the other end side, a hollow portion 7 opening to the end surface is formed. Then, a movable pressing piece 8 having an L-shaped cross section, part of which protrudes into the hollow section 7, is slidably mounted along the hollow section 7, and the movable pressing piece 8 is urged toward the fixed side section 6. A spring 9, which is an elastic member, is disposed in the hollow portion 7.

On the upper surface of the pad 3, a rectangular concave portion 10 is provided as an engagement portion for each lead for positioning the probe connecting clip 5 along each of both side edges (long sides) of the pad 3. They are arranged at intervals.

On the other hand, the clip 5 is
1 to form upper and lower hollow portions 12 and 13 opening to the front,
Positioning member 14 and lower hollow portion 1 in upper hollow portion 12
3 is equipped with a signal extraction head 15.

That is, the positioning member 14 is supported by the upper hollow portion 12 via a spring 16 which is an elastic member, with a part of the positioning member 14 protruding into the upper hollow portion 12, while receiving elasticity by the spring 16. It can be moved slightly up and down and back and forth. The tip of the positioning member 14 protruding from the hollow portion 12 is bent downward so that the hook-like portion 17 can be fitted into the recess 10 of the pad 3.
It has become.

The signal take-out head 15 is connected to the lower hollow portion 13.
In the lower hollow portion 13 via the connecting rod 18
And only a small portion protrudes from the hollow portion 13. The signal extraction head 15 has conductivity so that signals can be extracted from the leads 4 of the electronic device 1, and is also a magnet that can be attracted to the leads 4 by magnetic force.

The rear end of the connecting rod 18 is
1 is connected to a probe socket 19 attached to the rear surface. The probe socket 19 is adapted to receive a tip of a probe (not shown).

Since the lower half of the clip body 11 having the lower hollow portion 13 is longer than the upper half portion of the clip body 11 having the upper hollow portion 12, the clip body 11 has Is formed with a step portion 20.

Next, how to use the present adapter with the clip 5 and the pad 3 will be described.

As shown in FIG. 5, the pad 3 is placed on the package 2 of the electronic device 1, the fixed side 6 of the pad 3 is in contact with one end surface of the package 2, and the movable holding piece 8 is Due to the elasticity of the package 9, the package 2 is pressed against the other end face, and the pad 3 is fixed thereon so as to sandwich the package 2.

Next, as shown in FIG. 6, the hook 5 of the positioning member 14 is fitted into an arbitrary concave portion 10 of the pad 3 with the clip 5 inclined toward the pad 3. Then, when the clip 5 is slightly pulled to be in a horizontal posture with respect to the pad 3, the signal extraction head 15 comes into contact with the lead 4 as shown in FIG. It is held by the elasticity.

To release this state, the clip 5 may be lifted obliquely from the rear side.

In the above-described example, the engaging portion for each lead of the pad 3 is the concave portion 10, but may be a convex portion. The springs 9 and 16 may be made of rubber.

[0025]

The adapter for electronic device inspection according to the present invention comprises a pad and a clip for connecting a probe. After the pad is detachably mounted on the package of the electronic device, the pad is engaged with each lead. When the positioning member of the probe connection clip is engaged and positioned, the signal extraction head can be attracted to the lead by its magnetic force, so that the adapter can be easily and reliably connected to the lead of the electronic device, and the structure is improved. Simple and cheap.

According to the second aspect of the present invention, since the positioning member of the probe connecting clip is made movable by elasticity of the elastic member, it is easy to attach and detach the pad to and from the package of the electronic device.

According to the third aspect of the present invention, the engagement portion for each lead of the pad is formed as a concave portion, and the hook-like portion is provided at the tip of the positioning member, so that the probe connecting clip can be easily positioned.

According to the fourth aspect of the present invention, the pad is fixed to the package such that the package is sandwiched between the fixed side portion of the pad and the movable holding piece, so that the size of the electronic device and the shape of the lead are different. It can also respond.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view showing a usage state of an electronic device inspection adapter according to the present invention.

FIG. 2 is a plan view of a pad constituting the adapter.

FIG. 3 is a side view of the same.

FIG. 4 is a partially cutaway side view.

FIG. 5 is a perspective view showing a state where pads are mounted on a package of the electronic device.

FIG. 6 is a side view showing a state in which the probe connecting clip is being set to a use position.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Electronic device 2 Package 3 Pad 4 Lead 5 Probe connection clip 6 Fixed side part 7 Hollow part 8 Movable holding piece 9 Spring 10 Depression (Engagement part according to lead) 11 Clip body 12.13 Hollow part 14 Positioning member 15 Signal extraction Head 16 Spring 17 Hook 18 Connecting rod 19 Probe socket 20 Step

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) G01R 31/26 G01R 1/06-1/073 H01L 21/66 H01R 33/00-33/975

Claims (4)

(57) [Claims] The present invention comprises a pad for detachably attaching to a package of an electronic device and a clip for connecting a probe, wherein an engaging portion for each lead is formed on the pad, and the engaging clip for each lead is connected to the probe connecting clip. A positioning member for positioning with respect to the electronic device by engaging with the unit;
An adapter for inspecting an electronic device, comprising: a signal extraction head which is magnetically attracted to the lead in a positioned state. 2. The electronic device inspection adapter according to claim 1, wherein the positioning member of the probe connecting clip is movable with elasticity by an elastic member. 3. The electronic device inspection adapter according to claim 1, wherein a hook-like portion is provided at a tip of the positioning member, with the engagement portion for each lead of the pad being a concave portion. 4. A pad having a plate-like shape which can be placed on a package of an electronic device, and having at one end a fixed side portion which is in contact with one end surface of the package, and at the other end, a pad which is in contact with the other end surface of the package. 4. A movable holding piece which is brought into contact with and sandwiches the package with the fixed side portion is mounted by being urged toward the fixed side portion by an elastic member.
The electronic device inspection adapter according to the above.