JP3104124B2 - Capless light bulb device - Google Patents
Capless light bulb deviceInfo
- Publication number
- JP3104124B2 JP3104124B2 JP08116923A JP11692396A JP3104124B2 JP 3104124 B2 JP3104124 B2 JP 3104124B2 JP 08116923 A JP08116923 A JP 08116923A JP 11692396 A JP11692396 A JP 11692396A JP 3104124 B2 JP3104124 B2 JP 3104124B2
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- circuit board
- printed circuit
- bulb
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Connecting Device With Holders (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、自動車等の計器等
に使用するプリント基板に取り付けられた表示用光源と
して用いる無口金電球装置の取付構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting structure of a baseless light bulb device used as a display light source mounted on a printed circuit board used for an instrument of an automobile or the like.
【０００２】[0002]
【従来の技術】従来、この種の無口金電球装置の１例を
図６を参照にして説明する。合成樹脂、ゴム等の絶縁性
部材より成る口金７は、内側に電球取付孔８を有する有
底円筒部９の底部外周にフランジ部１０を連設して形成
されている。電球取付孔８の底部には１対のリード線挿
通孔１１、１１を上下方向に貫通して設けている。フラ
ンジ部１０の側方に開口するリード線誘導孔１８、１８
をリード線挿通孔１１、１１と連通するように形成して
いる。そして、外部リード線６、６は夫々リード線挿通
孔１１、１１を経由してリード線誘導孔１８、１８より
フランジ部１０の側方へ引き出され、フランジ部１０の
側面を這わせて、フランジ部１０の上面にて係止され
る。プリント基板１４のランド１６、１６と外部リード
線６、６は半田付け１７、１７により電気的に接続され
ている。2. Description of the Related Art An example of this kind of a non-base lamp device will be described with reference to FIG. A base 7 made of an insulating member such as a synthetic resin or rubber is formed by connecting a flange 10 to the bottom outer periphery of a bottomed cylindrical portion 9 having a bulb mounting hole 8 inside. A pair of lead wire insertion holes 11 and 11 are provided at the bottom of the bulb mounting hole 8 so as to penetrate in the vertical direction. Lead wire guide holes 18, 18 opening to the side of the flange portion 10.
Are formed so as to communicate with the lead wire insertion holes 11 and 11. Then, the external lead wires 6, 6 are drawn out to the side of the flange portion 10 from the lead wire guide holes 18, 18 via the lead wire insertion holes 11, 11, respectively, and the side surfaces of the flange portion 10 are crawled to form a flange. It is locked on the upper surface of the part 10. The lands 16, 16 of the printed circuit board 14 and the external lead wires 6, 6 are electrically connected by soldering 17, 17.
【０００３】又、プリント基板に外部リード線のみが挿
通可能な一対のリード線挿通孔を穿設し、ガラスバルブ
より導出された外部リード線を夫々リード線挿通孔に挿
通して、プリント基板の裏面に沿わせて導電部に接触さ
せるように構成したものも存在する（例えば、特開平３
−８８２６２号、特開平５−１２９００５号公報参
照）。Further, a pair of lead wire insertion holes through which only external lead wires can be inserted are formed in the printed circuit board, and the external lead wires led out of the glass bulb are inserted into the respective lead wire insertion holes to form a printed circuit board. There is also one configured to be in contact with the conductive part along the back surface (for example,
-88262, JP-A-5-129005).
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、前記従
来の技術で述べたもののうち図６に示されるものは、プ
リント基板の表面でリード線とランドを半田付けにより
電気的に接続する構成であるため、計器等として使用し
た場合、電球より出力した光が半田付部や口金に吸収さ
れたり、散乱し、光の無駄が生じ、光が有効利用されな
いという問題点があった。この問題点を解決するため
に、電球の光中心位置をずらす等の対応措置を採ってい
たが、このことは却って計器等の小型化を妨げる原因と
なっていた。However, among those described in the above prior art, the one shown in FIG. 6 has a configuration in which a lead wire and a land are electrically connected by soldering on the surface of a printed circuit board. When used as an instrument or the like, there is a problem that light output from a light bulb is absorbed or scattered by a soldered portion or a base, and light is wasted, and light is not effectively used. In order to solve this problem, countermeasures such as shifting the light center position of the bulb have been taken, but this has rather hindered miniaturization of instruments and the like.
【０００５】又、特開平３−８８２６２号や特開平５−
１２９００５号公報開示の発明は、図６の発明と同様、
プリント基板の表面に電球を取り付ける構成であるの
で、光の有効利用、計器のコンパクト化を図り得ないと
いう問題点があった。Further, Japanese Patent Application Laid-Open No. 3-88262 and Japanese Patent Application Laid-Open
The invention disclosed in the 129005 publication is similar to the invention of FIG.
Since the bulb is attached to the surface of the printed circuit board, there is a problem that it is not possible to effectively use light and make the instrument compact.
【０００６】そこで、本発明はプリント基板の表面に発
光部のみを露出するように形成し、電球から出力する光
が有効に活用でき、しかも計器のコンパクト化を図り得
る無口金電球装置の取付構造を提供することを目的とす
る。In view of the above, the present invention provides a mounting structure for a baseless light bulb device which is formed so that only a light emitting portion is exposed on the surface of a printed circuit board so that light output from a light bulb can be effectively used and the instrument can be made compact. The purpose is to provide.
【０００７】[0007]
【課題を解決するための手段】上記目的を達成するため
に本発明のうち請求項１記載の発明は、底面に貫通する
１対のリード線挿通孔を有する電球取付孔が設けられ、
底部外周にフランジ部を設けた絶縁性部材より成る口金
の前記フランジ部の上面には、前記リード線挿通孔と連
通するリード線導出孔を開口すると共に、該リード線導
出孔の周囲を凹設してリード線係止溝を形成し、前記電
球取付孔に装着された無口金電球の夫々の外部リード線
が夫々のリード線挿通孔及びリード線導出孔を介してフ
ランジ部の上面に導出されて前記リード線係止溝に収納
され、プリント基板には、前記無口金電球の発光部分を
含むガラスバルブのみが前記プリント基板の表面に露出
するようにガラスバルブ取付孔を穿設し、該ガラスバル
ブ取付孔にガラスバルブを挿入し、前記リード線係止溝
内の外部リード線とプリント基板のランドを半田付けに
より電気的に接続して形成したことを特徴とする。According to a first aspect of the present invention, there is provided a light bulb mounting hole having a pair of lead wire insertion holes penetrating a bottom surface thereof.
A lead wire lead-out hole communicating with the lead wire insertion hole is opened on the upper surface of the flange part of the base made of an insulating member provided with a flange part on the outer periphery of the bottom, and the periphery of the lead wire lead-out hole is recessed. To form a lead wire retaining groove, and each external lead wire of the bulbless lamp mounted in the bulb mounting hole is led out to the upper surface of the flange portion through the respective lead wire insertion hole and lead wire lead-out hole. A glass bulb mounting hole is drilled in the printed circuit board so that only the glass bulb including the light emitting portion of the lampless bulb is exposed on the surface of the printed circuit board. A glass bulb is inserted into the bulb mounting hole, and an external lead wire in the lead wire retaining groove is electrically connected to a land of a printed circuit board by soldering.
【０００８】[0008]
【発明の実施の形態】以下、本発明について図１〜図４
に示される発明の実施の形態に基づいて詳細に説明す
る。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described with reference to FIGS.
This will be described in detail based on the embodiment of the invention shown in FIG.
【０００９】無口金電球１は、例えばバルブ径が４ｍｍ
程度のガラスバルブ２内に希ガスを封入し或は真空状態
で一端に封止部３を形成し、この封止部３により支持さ
れている２本の内部リード線４、４の内端間にはフィラ
メント５が架設され、内部リード線４、４と電気的に接
続されている。内部リード線４、４は、封止部３を気密
に外部に導出されて外部リード線６、６を形成し、外部
電源（図示せず）より電力を供給されて無口金電球１を
発光可能に形成している。The baseless bulb 1 has a bulb diameter of, for example, 4 mm.
A rare gas is sealed in the glass bulb 2 or a sealing portion 3 is formed at one end in a vacuum state, and a gap between the inner ends of the two internal lead wires 4 supported by the sealing portion 3 is formed. Is provided with a filament 5 and is electrically connected to the internal lead wires 4 and 4. The internal lead wires 4 are air-tightly led out of the sealing portion 3 to form the external lead wires 6, and are supplied with power from an external power supply (not shown) to emit the cap lamp 1. Is formed.
【００１０】口金７は、絶縁性部材、例えば合成樹脂、
ゴム等より成る。口金７は、内側に電球１を挿入するた
めの電球取付孔８を設けた有底円筒部９の基部の外面
に、全周に亘たり外側方に突出するフランジ部１０を連
設している。電球取付孔８の底部には、外部リード線
６、６を挿通するための一対のリード線挿通孔１１、１
１を上下方向に貫設している。フランジ部１０の上面に
は、外部リード線６、６を外方に導出するためのリード
線導出孔１２、１２を開口している。口金７の底壁とフ
ランジ部１０には、リード線導出孔１２、１２とリード
線挿通孔１１、１１を連通するリード線誘導孔（図示せ
ず）を設けている。リード線係止溝１３、１３は、リー
ド線導出孔１２、１２より口金７の外部へ導出された外
部リード線６、６を所定の方向へ折り曲げて収納した場
合、この外部リード線６、６がフランジ部１０の上面よ
り上方へ露出しない程度にリード線導出孔１２、１２の
周囲を窪ませて形成している。The base 7 is made of an insulating member such as a synthetic resin,
It is made of rubber or the like. The base 7 is provided with a flange 10 protruding over the entire circumference or outward on the outer surface of the base of the bottomed cylindrical portion 9 provided with the bulb mounting hole 8 for inserting the bulb 1 inside. . At the bottom of the bulb mounting hole 8, a pair of lead wire insertion holes 11, 1 for inserting the external lead wires 6, 6 are inserted.
1 extends vertically. On the upper surface of the flange portion 10, lead wire lead holes 12, 12 for leading the external lead wires 6, 6 outward are opened. The bottom wall of the base 7 and the flange portion 10 are provided with lead wire guiding holes (not shown) for connecting the lead wire outlet holes 12 and the lead wire insertion holes 11 and 11. When the external lead wires 6, 6 led out of the base 7 through the lead wire lead-out holes 12, 12 are bent in a predetermined direction and housed, the external lead wires 6, 6 are formed in the lead wire retaining grooves 13, 13. Are formed so that the periphery of the lead wire outlet holes 12 is depressed so as not to be exposed above the upper surface of the flange portion 10.
【００１１】プリント基板１４には、ガラスバルブ２を
挿入するためのガラスバルブ２の外径より僅かばかり大
径に形成されたガラスバルブ取付孔１５を所定位置に穿
設している。プリント基板１４の裏面のガラスバルブ取
付孔の近傍には、ガラスバルブ２を裏面側から取付孔１
５に挿入した場合、リード線係止溝１３、１３に収納さ
れている外部リード線６、６とランド１６、１６が対向
的な位置関係となるようにランド１６、１６を設けてい
る。The printed circuit board 14 is provided with a glass bulb mounting hole 15 having a diameter slightly larger than the outer diameter of the glass bulb 2 for inserting the glass bulb 2 at a predetermined position. In the vicinity of the glass bulb mounting hole on the back side of the printed circuit board 14, the glass bulb 2 is attached from the back side to the mounting hole 1.
The lands 16, 16 are provided so that the external leads 6, 6, which are accommodated in the lead wire retaining grooves 13, 13 and the lands 16, 16 are in a facing positional relationship when inserted into the groove 5.
【００１２】そして、本発明の実施の形態においては図
１に示すように、電球取付孔８に無口金電球１を取付
け、外部リード線６、６はリード線挿通孔１１、１１に
夫々挿通され、リード線誘導孔（図示せず）を経由して
リード線導出孔１２、１２より外部に導出されている。
外部リード線６、６は、リード線導出孔１２、１２の端
面で折り曲げられてリード線係止溝１３、１３に夫々収
納されている。プリント基板１４の裏面側から、ガラス
バルブ２をガラスバルブ取付孔１５に挿通し、プリント
基板１４の裏面にフランジ部１０の上面を面接触させ
る。リード線係止溝１３、１３内の外部リード線６、６
とランド１６、１６を半田付け１７、１７することによ
り電球１をプリント基板１４に固定する。In the embodiment of the present invention, as shown in FIG. 1, the non-base bulb 1 is attached to the bulb mounting hole 8, and the external lead wires 6, 6 are inserted into the lead wire insertion holes 11, 11, respectively. , And are led out of the lead wire lead-out holes 12 and 12 via lead wire guide holes (not shown).
The external lead wires 6, 6 are bent at the end faces of the lead wire lead-out holes 12, 12, and housed in the lead wire retaining grooves 13, 13, respectively. The glass bulb 2 is inserted into the glass bulb mounting hole 15 from the back surface side of the printed circuit board 14, and the upper surface of the flange portion 10 is brought into surface contact with the back surface of the printed circuit board 14. External lead wires 6 in the lead wire retaining grooves 13
Then, the bulb 1 is fixed to the printed board 14 by soldering the lands 16, 17.
【００１３】本実施の形態においては、プリント基板１
４の表面から発光部を含む電球１が露出するように構成
されており、図４に示すように電球１から出力する光が
プリント基板１４の表面で、所望方向へ反射し、以前の
ように吸収や散乱等による光の無駄がない。In this embodiment, the printed circuit board 1
4 is configured so that the light bulb 1 including the light-emitting portion is exposed from the surface of the light-emitting unit 4. As shown in FIG. 4, the light output from the light bulb 1 is reflected on the surface of the printed circuit board 14 in a desired direction. There is no waste of light due to absorption or scattering.
【００１４】 図５に示される発明の実施の形態につい
て説明する。説明を簡単にするため、前述の図１〜図４
に示される発明の実施の形態と同様の作用をなす部分は
同一符号を用いて説明する。図５においては、プリント
基板１４の裏面を上側にし、下方を照射するようにして
いる。他の構成は前述の図１〜図４に示される発明の実
施の形態と全く同様であるため、説明を省略する。An embodiment of the invention shown in FIG. 5 will be described. In order to simplify the description, FIGS.
Will be described using the same reference numerals. In FIG. 5, the back surface of the printed circuit board 14 is directed upward and the lower side is irradiated. Other configurations are exactly the same as those of the embodiment of the invention shown in FIGS.
【００１５】[0015]
【発明の効果】無口金電球の発光部を含むガラスバルブ
のみをプリント基板の表面から露出するように構成して
いるので、無口金電球から出力する光の吸収、散乱など
による光の無駄が無く、計器等の小型化が可能になると
いう効果がある。According to the present invention, since only the glass bulb including the light emitting portion of the lamp is exposed from the surface of the printed circuit board, there is no waste of light due to absorption and scattering of light output from the lamp. In addition, there is an effect that downsizing of instruments and the like becomes possible.
【図１】本発明の実施の形態における、無口金電球をプ
リント基板に組立てた状態を示す断面図である。FIG. 1 is a cross-sectional view showing a state in which a baseless light bulb is assembled on a printed circuit board according to an embodiment of the present invention.
【図２】無口金電球の口金への装着状態を示す説明図で
ある。FIG. 2 is an explanatory diagram showing a state in which a baseless lamp is mounted on a base.
【図３】プリント基板の裏面における要部を示す図であ
る。FIG. 3 is a diagram showing a main part on the back surface of the printed circuit board.
【図４】電球から出力する光の反射状態を示す説明図で
ある。FIG. 4 is an explanatory diagram showing a reflection state of light output from a light bulb.
【図５】本発明の他の実施の形態における断面図であ
る。FIG. 5 is a sectional view of another embodiment of the present invention.
【図６】従来例を示す説明図である。FIG. 6 is an explanatory diagram showing a conventional example.
１ 無口金電球 ２ ガラスバルブ ６ 外部リード線 ７ 口金 ８ 電球取付孔 １０ フランジ部 １１ リード線挿通孔 １２ リード線導出孔 １３ リード線係止溝 １４ プリント基板 １５ ガラスバルブ取付孔 １６ ランド １７ 半田付け DESCRIPTION OF SYMBOLS 1 Non-base bulb 2 Glass bulb 6 External lead wire 7 Base 8 Bulb mounting hole 10 Flange part 11 Lead wire insertion hole 12 Lead wire lead-out hole 13 Lead wire locking groove 14 Printed circuit board 15 Glass bulb mounting hole 16 Land 17 Soldering
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7，ＤＢ名) H01K 1/46 ──────────────────────────────────────────────────続 き Continued on front page (58) Field surveyed (Int.Cl. 7 , DB name) H01K 1/46
Claims (1)
１、１１を有する電球取付孔８が設けられ、底部外周に
フランジ部１０を設けた絶縁性部材より成る口金７の前
記フランジ部１０の上面には、前記リード線挿通孔１
１、１１と連通するリード線導出孔１２、１２を開口す
ると共に、該リード線導出孔１２、１２の周囲を凹設し
てリード線係止溝１３、１３を形成し、前記電球取付孔
８に装着された無口金電球１の夫々の外部リード線６、
６が夫々のリード線挿通孔１１、１１リード線導出孔１
２、１２を介してフランジ部１０の上面に導出されて前
記リード線係止溝１３、１３に収納され、プリント基板
１４には、前記無口金電球１の発光部分を含むガラスバ
ルブ２のみが前記プリント基板１４の表面に露出するよ
うにガラスバルブ取付孔１５を穿設し、該ガラスバルブ
取付孔１５にガラスバルブ２を挿入し、前記リード線係
止溝１３、１３内の外部リード線６、６とプリント基板
１４のランド１６、１６を半田付け１７により電気的に
接続して形成したことを特徴とする無口金電球装置の取
付構造。1. A pair of lead wire insertion holes 1 penetrating a bottom surface.
A light bulb mounting hole 8 having a lead wire insertion hole 1 is provided on an upper surface of the flange portion 10 of a base 7 made of an insulating member having a flange portion 10 provided on a bottom outer periphery.
The lead wire outlet holes 12 and 12 communicating with the light bulb mounting holes 1 and 11 are opened, and the lead wire locking holes 13 and 13 are formed by recessing the periphery of the lead wire outlet holes 12 and 12. Each external lead wire 6 of the base lamp 1 attached to the
6 are respective lead wire insertion holes 11 and 11 lead wire outlet holes 1
The glass bulb 2 including the light emitting portion of the non-base lamp 1 is provided on the printed circuit board 14 by being led out to the upper surface of the flange portion 10 via the upper and lower portions 2 and 12 and housed in the lead wire locking grooves 13 and 13. A glass bulb mounting hole 15 is drilled so as to be exposed on the surface of the printed circuit board 14, the glass bulb 2 is inserted into the glass bulb mounting hole 15, and the external lead wires 6 in the lead wire locking grooves 13, 13. 6. A mounting structure for a lampless light bulb device, wherein said mounting structure is formed by electrically connecting said lands 6 and said lands 16 of said printed circuit board 14 by soldering 17.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP08116923A JP3104124B2 (en) | 1996-04-02 | 1996-04-02 | Capless light bulb device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP08116923A JP3104124B2 (en) | 1996-04-02 | 1996-04-02 | Capless light bulb device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH09274895A JPH09274895A (en) | 1997-10-21 |
| JP3104124B2 true JP3104124B2 (en) | 2000-10-30 |
Family
ID=14699029
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP08116923A Expired - Lifetime JP3104124B2 (en) | 1996-04-02 | 1996-04-02 | Capless light bulb device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3104124B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11250868A (en) | 1998-02-28 | 1999-09-17 | Harison Electric Co Ltd | Electric bulb device to be mounted on board |
-
1996
- 1996-04-02 JP JP08116923A patent/JP3104124B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH09274895A (en) | 1997-10-21 |
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