JP3096261U - Structure of printed wiring board for wireless transmission equipment - Google Patents

Abstract

(57) [Problem] To improve the non-defective rate of a printed wiring board used in a wireless transmission device and to reduce the manufacturing cost.
Provide a structure of a printed wiring board for a wireless transmission device. The first printed wiring board mainly includes a high-frequency module, a first printed wiring board, and a second printed wiring board. The first printed wiring board includes high-frequency device-related electronic components. The high-frequency module 10 having a function of transmitting and receiving wireless signals is formed, and the area of the second printed wiring board 21 is larger than the first printed wiring board, and includes the high-frequency module 10 which has been confirmed as a non-defective product. The first printed wiring board 12 is disposed on the surface of the second printed wiring board 21.

Description

[Detailed description of the device]

[0001]

[Technical field to which the device belongs]

  The present invention is a structure of a printed wiring board of a wireless transmission device, particularly, a plurality of printed wiring boards. It relates to the structure when using a plate.

[0002]

[Prior art]

  With the development of wireless communication technology, mobile phones have become an essential communication means for modern people. Becoming one, and gradually replacing the use of LAN cables with wireless LAN In one modern era, within many company organizations, it became the old cable-laying office environment. Instead, wireless digital data communication is already widely used. There are also many public places such as international airports, hotels, chain-style coffee shops, etc. More and more wireless LANs are being installed in buildings, providing services to consumers in need. It The user can use a personal computer or PDA with a wireless LAN card installed. , Connect to the access point with the shortest distance, start sending and receiving e-mail, and -You can use the internet, play online games, etc. Internet resources can be operated without being restricted.

[0003]   In addition to access points, the wireless transmission devices used in wireless LAN are gateways. B, router, etc. The printed wiring boards used in these wireless transmission devices are The part uses surface mount technology, baseband, media access control, high frequency device Each circuit component such as a vice is mounted on the printed wiring board. Generally, high frequency data In order to support high-frequency signal transmission / reception processing by the device, the circuit design and component mounting There are many strict requirements, and how to obtain accurate and stable operation of high frequency devices It has become an important issue in wireless transmission device technology.

[0004]   To ensure good data transmission and stable operation, the newly established wireless LAN U-NII (47CFR15.401) of Rotocol 802.11a is a frequency band around 5 GHz. Wireless LAN protocols 802.11b, 802.11gISM (47CFR15. 247) uses the frequency band of 2.400-2.4835 GHz with a transmission power of 1000 mW or less. It is prescribed to use.

[0005]

[Problems to be solved by the device]

  However, in general, frequency bands of different protocols will have different high frequency data. Vice must be used, and different high frequency devices can be mounted on the printed wiring board. When mounted, the high-frequency device and associated resistors and capacitors on the printed wiring board A major issue in quality control is whether or not the effects of parts such as sensors produce the expected effects. It has become a problem. In the unlikely event that the high-frequency device and the electronic components built into it as a whole If the quality of the printed wiring board is defective as a result of the test, do not replace the entire printed wiring board. Therefore, the manufacturing cost will increase significantly. For this reason, Increase in manufacturing cost due to incompatibility of printed wiring board due to replacement of wave device Whether or not to avoid it is an important issue in the current industry.

[0006]   The present invention improves the yield rate of printed wiring boards used in wireless transmission equipment, and Providing a structure for a printed wiring board for wireless transmission devices that enables lowering the strike It is intended.

[0007]

[Means for Solving the Problems]

  The printed wiring board structure of the present invention is mainly used for the high frequency module and the first and second printers. Including a wiring board, the high-frequency module has a function of transmitting and receiving radio signals, From the first printed wiring board and the high-frequency device installed on the first printed wiring board Become. The area of the second printed wiring board is smaller than that of the first printed wiring board. And place the first printed wiring board on the surface of the second printed wiring board. It

[0008]   The printed wiring board including all circuit components is divided into two, large and small, and the high frequency The vise is connected to the first printed wiring board (small), and the first printed wiring board is A high frequency module is formed by including electronic components related to the frequency device. The high frequency module Before connecting the module to the second printed wiring board (large), conduct a test and Make sure the Joule is good. As a result, the high frequency module will not be defective. In some cases, all that is required is to replace the first printed wiring board and then the second printed wiring board. The advantage is that there is no need to consider the type of high-frequency device in the circuit design of the wiring board. Be done.

[0009]

[Embodiment of device]

  Hereinafter, the structure of the printed wiring board for a wireless transmission device of the present invention will be described in detail with reference to the drawings. Reveal   High-frequency signals are an important part of wireless signal transmission, and their advantages and disadvantages are wireless signals. Affect the effectiveness and quality of transmission. As shown in FIG. The high-frequency module 10 is formed by installing it on the surface of the lint wiring board 12. The first On the surface of the printed wiring board 12, electronic parts such as resistors, capacitors and inductors are provided. The product is installed and connected to the high frequency device 11 to transmit and receive high frequency signals. .

[0010]   Generally, the quality and stability of the high frequency module 10 are difficult to control. There is a current situation. The high frequency module 10 of the present invention can be tested in advance. , Confirm that there is no problem with the strength and directionality of the radio wave output, then perform the next operation. You can enter the industry. It was confirmed that the high frequency module 10 was a good product. Then, the connector 13 of the first printed wiring board 12 is attached to the surface of the second printed wiring board 21. Connected to the pad 24 of with solder paste, and connect the two printed wiring boards shown in FIG. A structure 20 of a printed wiring board for a wireless transmission device including the same is formed. In other words, the The structure 20 of the printed wiring board for the wireless transmission device includes a first printed wiring board 12 and a second printed wiring board 12. The first printed wiring board 12 comprises a high frequency device 11 The second printed wiring board 21 is a base van that is commonly used in wireless transmission devices. The second printed wiring board 21 has an area of the first It is larger than the printed wiring board 12.

[0011]   The structure 20 of the printed wiring board for a wireless transmission device of the present invention is the entire printed wiring board. In addition to avoiding loss due to discarding, the high frequency device 11 802.11a, 802.11b, individually corresponding to the applied frequency band and protocol difference Various protocols such as 802.11d, 802.11e, 802.11f, 802.11g, 802.11i, Bluetooth, etc. It is possible to form a high-frequency module that adapts to the module. Thus, the second The printed wiring board 21 can be standardized, and different types of high frequency Since it is sufficient to install the module 10, it is suitable for mass production. Also the problem The high-quality device and production capacity are greatly increased by separating the high frequency device 11 Can be improved.

[0012]   The high-frequency module 10 and the second printed wiring board 21 are connected by a soldering method. In addition to joining with paste, jointing (Connecting Finger), socket It is also convenient to replace the high-frequency module 10 as it can be connected by a cable or the like. Was However, the manufacturing costs may increase, so it is necessary to consider various related factors. There is a point.

[0013]   The present invention can use three or more printed wiring boards if necessary. . For example, two relatively small printed wiring boards, each with its own function. Joules can be formed and placed on a large printed wiring board or stacked in three layers. You can Besides, it is installed on the first printed wiring board 12. Is not limited to the high frequency device 11, but may be a device having other functions. May be installed. By using the concept of modularized structure of the present invention, It can improve the product rate and production capacity, and reduce the manufacturing cost.

[0014]   The printed wiring board structure 20 for the wireless transmission device includes a router, an access point, In addition to being applicable to wireless signal transmission products such as gateways and mobile phones, in the future Information appliances such as refrigerators, ovens, and security systems that may become wireless It can also be applied to products, improving convenience in daily life.

[0015]   The technical contents and technical features of the present invention are as described above, but The scope of claims for new model registration is not limited to the above-mentioned embodiment, but the actual contents of the creation of the present invention can be realized. Any changes or modifications that belong to the quality are included in the scope of claims for utility model registration of the present invention. Shall be provided.

[0016]

[Effect of device]

  Generally, the quality and stability of the high frequency module 10 are difficult to control. However, the high frequency module 10 of the present invention is mounted on the second printed wiring board 21. Before that, the test can be conducted in advance, and the strength and directionality of the radio wave output should be questioned. After confirming that there is no problem, you can proceed to the next work, so the product yield is good. And lead to a significant increase in production capacity. If the high frequency module is defective Since only the first printed wiring board 12 needs to be replaced, manufacturing costs can be reduced. To Furthermore, the model of the high frequency device should be used for the circuit design of the second printed wiring board 21. It is possible to standardize the second printed wiring board 21 without having to consider it. Mass production because it is only necessary to install different types of high-frequency modules 10. Is perfect for In addition, the concept of the printed wiring board modularized structure of the present invention is Compatible with wireless signal transmission products such as data, access points, gateways, mobile phones, etc. In addition to being used, refrigerators, ovens, etc. that may become wireless in the future Can be applied to home information appliances such as security systems, improving convenience in daily life To do.

[Brief description of drawings]

FIG. 1 is an exploded view showing a structure of a printed wiring board for a wireless transmission device of the present invention.

FIG. 2 is an assembly view showing a structure of a printed wiring board for a wireless transmission device of the present invention.

[Explanation of symbols]

20 Structure of printed wiring board for wireless transmission equipment

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Creator Jen Juns             Taiwan 840, Kao Siun, Dash             Cyan, Joutan Road, Lane               72, number 2

Claims (9)

[Scope of utility model registration request] 1. A first printed wiring board including a high-frequency module, comprising an electronic circuit component relating to reception and transmission of an RF signal, a high-frequency device installed on the first printed wiring board, and an area of the first printed wiring board. The printed wiring board is larger than the area of the printed wiring board, the first printed wiring board is installed on the surface of the second printed wiring board, the circuit design of the second printed wiring board and the type of the high frequency device. The structure of a printed wiring board for a wireless transmission device, which is irrelevant, and wherein the high-frequency module is assembled after removing a defective high-frequency device in a preceding test. 2. The circuit component of the first printed wiring board,
The structure of the printed wiring board for a wireless transmission device according to claim 1, comprising a resistor, a capacitor, and an inductor. 3. The structure of a printed wiring board for a wireless transmission device according to claim 1, wherein the second printed wiring board includes a baseband component. 4. The structure of a printed wiring board for a wireless transmission device according to claim 1, wherein the second printed wiring board includes a media access control component. 5. The structure of a printed wiring board for a wireless transmission device according to claim 1, wherein the first and second printed wiring boards are joined by a solder paste. 6. The structure of a printed wiring board for a wireless transmission device according to claim 1, wherein a socket for connecting the first printed wiring board is provided on the surface of the second printed wiring board. 7. The structure of a printed wiring board for a wireless transmission device according to claim 1, wherein a joint for connecting the first printed wiring board is provided on the surface of the second printed wiring board. 8. The structure of a printed wiring board for a wireless transmission device according to claim 1, which is applied to an access point, a gateway, and a router. 9. The high frequency module includes 802.11a, 80
2.11b, 802.11d, 802.11e, 802.11f, 802.11g, 802.11
The structure of a printed wiring board for a wireless transmission device according to claim 1, wherein any one of i and Bluetooth wireless LAN protocols is applied.