JP3095312B2 - How to manage quartz glass jigs for the semiconductor industry. - Google Patents

How to manage quartz glass jigs for the semiconductor industry.

Info

Publication number
JP3095312B2
JP3095312B2 JP12323493A JP12323493A JP3095312B2 JP 3095312 B2 JP3095312 B2 JP 3095312B2 JP 12323493 A JP12323493 A JP 12323493A JP 12323493 A JP12323493 A JP 12323493A JP 3095312 B2 JP3095312 B2 JP 3095312B2
Authority
JP
Japan
Prior art keywords
quartz glass
semiconductor industry
jig
manage
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP12323493A
Other languages
Japanese (ja)
Other versions
JPH06313965A (en
Inventor
信一 大越
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
YAMAGATA SHIN-ETSU QUARTZ PRODUCTS CO., LTD.
Shin Etsu Quartz Products Co Ltd
Original Assignee
YAMAGATA SHIN-ETSU QUARTZ PRODUCTS CO., LTD.
Shin Etsu Quartz Products Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by YAMAGATA SHIN-ETSU QUARTZ PRODUCTS CO., LTD., Shin Etsu Quartz Products Co Ltd filed Critical YAMAGATA SHIN-ETSU QUARTZ PRODUCTS CO., LTD.
Priority to JP12323493A priority Critical patent/JP3095312B2/en
Publication of JPH06313965A publication Critical patent/JPH06313965A/en
Application granted granted Critical
Publication of JP3095312B2 publication Critical patent/JP3095312B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明は、半導体工業用石英ガラ
ス治具の管理を容易する方法に関する。
The present invention relates to a method for facilitating the management of quartz glass jigs for the semiconductor industry.

【0002】[0002]

【従来の技術】近年、半導体産業は隆盛を極め、そこで
使用される治具も多くなってきた。半導体製品は極端に
汚染を嫌うところから、前記使用治具は汚染物質を発生
するものであってはならなず、また、ウエハの製造にみ
られるように高温で処理することも多いところから高温
に耐える素材でなければならない。こうした素材として
石英ガラスがあり、半導体用治具は専ら石英ガラスで形
成されてきた。
2. Description of the Related Art In recent years, the semiconductor industry has prospered, and jigs used therein have increased. Since semiconductor products extremely dislike contamination, the jig used must not generate contaminants.Also, the processing is often performed at a high temperature as seen in the manufacture of wafers. The material must be able to withstand. As such a material, there is quartz glass, and a jig for a semiconductor has been formed exclusively of quartz glass.

【0003】ところが、石英ガラスは高価な材料である
ためその再使用が図られ、半導体を製造した後、そのま
ま再使用されることが多く、使用治具には、新しいもの
から数回使用したものまでその履歴等の様々なものが混
在する。そのため、使用治具が、どのような履歴のもの
であるか、また何回目の使用か、あるいはどのロッドで
使用したものか等を正確に管理・運用することが重要で
ある。
However, since quartz glass is an expensive material, it is reused. In many cases, semiconductor glass is reused as it is after manufacturing semiconductors. Until then, various things such as the history are mixed. Therefore, it is important to accurately manage and operate what kind of history the used jig has, how many times it has been used, which rod has been used, and the like.

【0004】この管理・運用のため、製品に認識記号を
付けることが行われており、その例が実開昭60−80
450号公報、実開昭62−41145号公報等(以下
前記公報という)にみることができる。しかしながら、
前記公報に記載されている認識記号は、レザー加工など
で凹凸が形成されているため、レザ−ビ−ムが凹凸部で
乱反射を起こし、しかも凸部と凹部との光強度差が小さ
いことも重なって、正確な読み取りができなかった。こ
の欠点を解決するため、実願昭60−132931号
(実開昭62−44355号)のマイクロフィルムにみ
るように前記凸部を鏡面加工する方法もある。確かに、
この方法では、凸部が鏡面のため、正反射が起こり前記
公報記載の識別に比べ優れたものではあるが、各種履歴
を有する半導体用治具を管理するには未だ十分なものと
はいえない。
[0004] For this management and operation, a recognition symbol is attached to a product.
No. 450, Japanese Utility Model Publication No. Sho 62-41145, and the like (hereinafter referred to as the above-mentioned publication). However,
The recognition symbol described in the above publication has irregularities formed by laser processing or the like, so that the laser beam causes irregular reflection at the irregularities, and the difference in light intensity between the convexities and the concaves may be small. Overlapping, accurate reading was not possible. In order to solve this drawback, there is a method in which the convex portion is mirror-finished as seen in a microfilm disclosed in Japanese Utility Model Application No. Sho 60-132931 (Japanese Utility Model Application Laid-Open No. Sho 62-44355). surely,
In this method, since the convex portion is a mirror surface, specular reflection occurs and is superior to the identification described in the above-mentioned publication, but it is not yet sufficient to manage a semiconductor jig having various histories. .

【0005】上記の認識記号とは別に、石英ガラスの溶
接棒を溶接する肉盛方式もある。この肉盛方式は、溶接
を火炎で行うため熱歪みが生じその除去のため再熱処理
を必要とするばかりでなく、前記熱処理時に熱変形を起
こし指定公差寸法がはずれる等の欠点を有していた。
[0005] Apart from the above recognition symbols, there is also a cladding method of welding a welding rod of quartz glass. This overlaying method has a drawback that not only a thermal distortion occurs because the welding is performed with a flame but a re-heat treatment is required for its removal, but also a thermal deformation occurs at the time of the heat treatment and a specified tolerance dimension is deviated. .

【0006】また、商品管理に使用されている印刷バー
コードの貼着も考えられるが、印刷バーコードは、印刷
インクでバーが描かれているため治具の使用時に汚染物
質が発生し半導体製品を汚染する欠点がある。
[0006] In addition, it is conceivable to attach a print barcode used for product management. However, since the print barcode has a bar drawn with printing ink, contaminants are generated when a jig is used and semiconductor products are produced. Has the disadvantage of contaminating it.

【0007】このように従来の管理方法では、半導体治
具の使用履歴、ロッド番号、使用回数等を正確に認識し
て、治具の管理・運用を迅速に、かつ的確におこなうこ
とが困難であった。
As described above, in the conventional management method, it is difficult to accurately and accurately recognize the use history, the rod number, and the number of times of use of the semiconductor jig, and to quickly and accurately manage and operate the jig. there were.

【0008】[0008]

【発明が解決しようとする課題】本発明者は、上記問題
点を解決するため鋭意研究した結果、石英ガラス治具に
不透明部分を形成し、読み取り時に該不透明部分と反対
側の面に黒紙を配し、バーコードリーダで読み取ること
により、半導体工業用石英ガラス治具の管理・運用を迅
速に、かつ的確に実施できることを発見し、本願発明を
完成したものである。
The inventor of the present invention has made intensive studies to solve the above-mentioned problems. As a result, an opaque portion was formed on a quartz glass jig, and a black paper was formed on the surface opposite to the opaque portion during reading. And found that the management and operation of the quartz glass jig for the semiconductor industry can be performed quickly and accurately by reading with a bar code reader, and the present invention has been completed.

【0009】本願発明は、半導体工業用石英ガラス治具
の管理・運用を容易にするための管理方法を提供するこ
とをその目的とする。
An object of the present invention is to provide a management method for facilitating management and operation of a quartz glass jig for the semiconductor industry.

【0010】[0010]

【課題を解決するための手段】半導体工業用石英ガラス
治具を管理する方法において、前記半導体工業用石英ガ
ラス治具表面(ただし、端面は除く。)にバー状の不透
明部分をバーコード状に間隔を設けて形成し、読み取り
時に前記不透明部分が形成された面と反対側の面に黒紙
を配置し、バーコード・リーダで読み取ることを特徴と
する半導体工業用石英ガラス治具を管理する方法に係
る。
In a method for managing a quartz glass jig for semiconductor industry, a bar-shaped opaque portion is formed in a bar code shape on a surface (excluding an end face) of the quartz glass jig for semiconductor industry. A quartz glass jig for the semiconductor industry, wherein the quartz glass jig is formed with an interval provided , black paper is arranged on a surface opposite to the surface on which the opaque portion is formed at the time of reading, and read with a bar code reader. According to the method.

【0011】 [0011]

【0012】上記不透明部分の形成に際し、バ−コ−ド
1の両端部に図1に示すように幅10mm以上の不透明
処理部2を形成する。この不透明処理部の形成によりバ
−コ−ド・リ−ダの読み取りが可能となる。
In forming the opaque portion, opaque portions 2 having a width of 10 mm or more are formed at both ends of the bar code 1 as shown in FIG. The bar code reader can be read by forming the opaque processing section.

【0013】[0013]

【実施例】1辺が100mm、厚さが5mmの正方形状
の透明な石英ガラス板の表面に図1の白部で示す不透明
部をサンドブラスト法で形成した。この正方形状の石英
ガラス板の裏面に黒紙を当てて、周知のバーコード・リ
ーダで読んだところ図2に示す識別記号が読み取れた。
読み取り信号は図2に見るように印刷バーコードと殆ど
変わることのない正確なものであった。
EXAMPLE An opaque portion indicated by a white portion in FIG. 1 was formed on the surface of a square transparent quartz glass plate having a side of 100 mm and a thickness of 5 mm by sandblasting. When the black paper was put on the back surface of the square quartz glass plate and read with a well-known bar code reader, the identification symbol shown in FIG. 2 was read.
The read signal was accurate with little change from the printed barcode as seen in FIG.

【0014】[0014]

【発明の効果】本発明の方法によれば、治具上にバー状
の不透明部を形成するという単純な手段で通常のバーコ
ードと同様の作用をさせることができ、治具の品質管理
が迅速、かつ的確に行なえる。
According to the method of the present invention, the same operation as a normal bar code can be performed by a simple means of forming a bar-shaped opaque portion on a jig, and quality control of the jig can be performed. It can be done quickly and accurately.

【図面の簡単な説明】[Brief description of the drawings]

【図1】 不透明部を形成した石英ガラス治具の部分図
である。
FIG. 1 is a partial view of a quartz glass jig in which an opaque portion is formed.

【図2】 バーコード・リーダで読み取った識別信号で
ある
FIG. 2 shows an identification signal read by a barcode reader.

───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭62−41145(JP,A) 特開 平2−310685(JP,A) ──────────────────────────────────────────────────続 き Continuation of front page (56) References JP-A-62-41145 (JP, A) JP-A-2-310685 (JP, A)

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】半導体工業用石英ガラス治具を管理する方
法において、前記半導体工業用石英ガラス治具表面(た
だし、端面は除く。)にバー状の不透明部分をバーコー
ド状に間隔を設けて形成し、読み取り時に前記不透明部
分が形成された面と反対側の面に黒紙を配置し、バーコ
ード・リーダで読み取ることを特徴とする半導体工業用
石英ガラス治具を管理する方法。
1. A method for managing semiconductor industrial quartz glass jig, the semiconductor industry for a quartz glass jig surface (where the end faces are excluded.) The bar-shaped opaque portion barcode
A quartz glass jig for the semiconductor industry, wherein a black paper is arranged on a surface opposite to the surface on which the opaque portion is formed at the time of reading, and the bar is read by a bar code reader. How to manage.
JP12323493A 1993-04-28 1993-04-28 How to manage quartz glass jigs for the semiconductor industry. Expired - Fee Related JP3095312B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12323493A JP3095312B2 (en) 1993-04-28 1993-04-28 How to manage quartz glass jigs for the semiconductor industry.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12323493A JP3095312B2 (en) 1993-04-28 1993-04-28 How to manage quartz glass jigs for the semiconductor industry.

Publications (2)

Publication Number Publication Date
JPH06313965A JPH06313965A (en) 1994-11-08
JP3095312B2 true JP3095312B2 (en) 2000-10-03

Family

ID=14855526

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12323493A Expired - Fee Related JP3095312B2 (en) 1993-04-28 1993-04-28 How to manage quartz glass jigs for the semiconductor industry.

Country Status (1)

Country Link
JP (1) JP3095312B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10572860B2 (en) 2014-11-27 2020-02-25 Techno Quartz Inc. Product provided with management information

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8655071B2 (en) 2011-02-24 2014-02-18 Sharp Laboratories Of America, Inc. Methods and systems for determining a document region-of-interest in an image

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10572860B2 (en) 2014-11-27 2020-02-25 Techno Quartz Inc. Product provided with management information

Also Published As

Publication number Publication date
JPH06313965A (en) 1994-11-08

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