JP3081140B2 - Polishing device with polishing tape - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for polishing an end face of an object to be polished with a polishing tape, and more particularly to a polishing apparatus for effectively and efficiently using a polishing tape and contacting the polishing surface at an arbitrary contact angle. Related to the device.

[0002]

2. Description of the Related Art In the same manner as the polishing of the front and back surfaces of an object to be polished, for example, a semiconductor wafer, a slurry composed of abrasive grains and a solvent is applied thereon and polished with a polishing cloth or the like. Was.

[0003]

However, in polishing using such a slurry, the wafer must be cleaned so that the slurry does not remain after polishing. If there is residual slurry, devices formed on the wafer will be defective.

[0004] Further, since such a slurry is alkaline, the waste liquid cannot be discarded unless a predetermined chemical treatment is performed after polishing.

As described above, the polishing using the conventional slurry requires cleaning after the polishing process, and also requires the treatment of the waste liquid, which requires polishing time and cost.

[0006] The semiconductor wafer is provided with notches for positioning itself. If this part is not polished, the shavings and the like existing there float at the time of device formation, and the yield is deteriorated.

[0007] Polishing of this portion is also necessary, but the desired purpose cannot be achieved by polishing with a polishing cloth using a slurry having a small notch.

Accordingly, an object of the present invention is to provide a polishing apparatus capable of polishing an object to be polished without using a slurry.

Another object of the present invention is to provide a polishing apparatus capable of performing polishing along the shape of the end face of the object to be polished.

It is a further object of the present invention to provide a polishing apparatus for performing polishing by using a polishing tape effectively and efficiently.

[0011]

A polishing apparatus using a polishing tape according to the present invention, which achieves the above object, comprises the following steps: (a) a first rotating means attached to a rotating shaft of a first rotating means perpendicularly to its axis; and plate, (b) a second rotating means attached to the first plate, (c) are opposed in parallel for the first plate, and reciprocally movable in a direction perpendicular to the axial direction A second plate attached to the first plate, (d) parallel to a plane including the second plate, one end of which is rotatably connected to the second plate, and the other end of which is connected to the second plate. A connecting rod connected to the rotating shaft of the rotating means,
Is rotatably connected to a position away from the rotation center of the rotary shaft of the second rotary means, a connecting rod where, and (e) et al provided in the second plate are at least two rollers polishing tape is applied Consisting of

When the first rotating means rotates, the first and second rotating means rotate.
When the second plate rotates about the axis and the second rotating means rotates, the second plate remains parallel to the first plate via the connecting rod in a direction perpendicular to the axial direction. Reciprocate.

When the object to be polished is a semiconductor wafer having a notch, the polishing apparatus may further include a rotation support device that supports the semiconductor wafer and rotates about the notch in a plane including the semiconductor wafer. desirable. When the rotation support device is driven, the polishing tape comes into contact with the entire notch and performs polishing.

[0014]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described with reference to FIG.

The outline of the polishing apparatus of the present invention is shown in FIGS. 1 is a front view of the polishing apparatus, FIG. 2 is a plan view of the polishing apparatus, and FIG. 3 is a side view of the polishing apparatus partially cut away along line 3-3 in FIG.

As shown in FIG. 1, the polishing apparatus 1 according to the present invention basically comprises a polishing-substance supporting / rotating mechanism 10, a moving mechanism 30 for moving the supporting / rotating mechanism 10, and a polishing head 40.

A front plate 3 perpendicular to the base plate 2
Is mounted thereon, and a polished body support rotating mechanism 10 described below is mounted via a moving mechanism 30 for moving the polished body mechanism.

The moving mechanism 30 has two rails 31a and 31b fixed to the base plate 2 (a part of the rail 31a is cut away so that the inside can be seen), and the rail is placed on the rail 31a. It has a mounting table 32 installed horizontally so as to be able to reciprocate. A support 33 is fixed to the end of the base plate 2 (left side in FIG. 1), and a ball screw 34 rotatably supported by the support 33 extends between the rails 31a and 31b in parallel with the rails. .

The ball screw 34 is fixed to the lower surface of the mounting table 32, and is supported by a supporting portion 35 which is screwed with a screw portion of the ball screw 34. Therefore, when the ball screw is rotated by the handle provided at one end of the ball screw 34, the support portion
The mounting table 32 can move on the rail via 35.

Although the ball screw is suitable for accurate movement of the mounting table 32, a means for accurately moving the mounting table 32, such as a pneumatic cylinder or a gear belt, can also be used.

On one side of the mounting table 32, the motor 11 is
On the other side, a shaft support 12 is fixed with the rotating shaft 12 'vertically. The rotating shaft 11 'and the rotating shaft 12' extending below the mounting table 32 are connected by a belt (indicated by a broken line in FIG. 1), and the rotation of the motor 11 is transmitted to the rotating shaft 12 '.

At the upper end of the rotating shaft 12 ', a fixing plate 13 is fixed horizontally in a direction perpendicular to its axis, and an enclosure 14 located above and below the polishing head 40 (a part of the enclosure 14 in FIG. (Notched) is fixed. Enclosure 14
A drain port 14 'is provided at the bottom of the container. This enclosure 14
The purpose of this is to prevent the scattering of liquid generated during polishing and the liquid during polishing using a liquid such as water from scattering.

A column 15 is vertically fixed to the motor 11 side of the fixed plate 13, and a mounting plate 16 for mounting the object P to be polished is horizontally fixed to the tip of the column. As shown in FIGS. 1 and 2, the tip of the mounting plate 16 on the polishing head 40 side is located near an extension of the axis of the shaft supporter 12. However, a cut is provided near the end of the polishing plate so that the polishing tape does not contact the mounting plate during polishing (indicated by a broken line in FIG. 2). Further, fixtures 16a and 16b for fixing the object to be polished P are attached to both sides of the mounting plate 16. In the apparatus shown in the figure, the fixture fixes the object to be polished with screws, but if the object to be polished is fragile, a vacuum pump is connected to the mounting plate 16 and the object is polished by suction. It is desirable to fix the body.

When the motor 11 reciprocates by a certain angle, the shaft support 12 rotates the fixed plate 13 fixed thereon on the rotating shaft.
It is reciprocated around 12 '(see FIG. 10), but on the lower surface of the fixed plate 13, so that the rotation is performed smoothly.
A support portion 13 'having a lower end in contact with the upper surface of the mounting table 32 is provided. The support portion 13 'is not always necessary, but when the mounting plate 16 is large for mounting a large object to be polished or when the fixed plate 13 is rotated quickly, the support portion is smoothly rotated. It is valid.

The apparatus described above rotates the object to be polished. However, when it is not necessary to rotate the object to be polished,
The support and the enclosure may be directly fixed to the mounting table 32.

FIG. 4 shows a front view of the polishing head, FIG. 5 shows a front view of a base plate constituting the polishing head, FIG. 6 shows a rear view of the polishing head, and FIG. 7 shows a plan view of the polishing head. FIG. 8 shows a side view of the polishing head.

The polishing head 40 has a substantially rectangular first plate 4.
1, and a substantially rectangular first plate 41
It has two plates 42, and the first plate 41 and the second plate 42 are connected to each other by four connecting members 43, 44, 45, and 46 (FIGS. 5, 7, and 8).

The connecting tool 43 (as well as other connecting tools) is composed of a connecting piece 43a fixed to the first plate 41 and a connecting piece 43b fixed to the second plate 42. Are connected to each other so that they can slide in one direction.
7). Therefore, the first plate 41 and the second plate 4
2 are opposed in parallel and can slide in one direction (vertical direction in the illustrated head).

In FIG. 5, a front view of the first plate 41 is shown by a solid line, and a front view of the second plate 42 is shown by a broken line. As shown in FIG. 5, the above-mentioned connecting pieces 43a, 44a, 45a, 46a are fixed to the surface of the first plate 41, and the upper and lower portions of the second plate 42, which will be described below, are fixed.
So that the motor (indicated by the broken line in the figure) attached to the
Rectangular first and second openings 47 and 48 are formed in the second plate.

A motor 49 is mounted on the back side of the first plate 41 (see FIGS. 5, 6, 7, and 8), and its rotating shaft 49 'is provided.
Project through the first plate 41 to the front side.

At the lower end of the first plate 41, a spring supporting piece 50 for supporting a spring described below is fixed so as to project vertically to the back side.

Further, a frame member 55 is welded substantially at the center of the back side of the first plate 41 (in FIG. 6,
A partial cross section of the frame member 55 is shown). The connection piece 55 ′ of the frame member 55 is the first piece as shown in FIG.
It extends substantially parallel to the plate 41 and is vertically mounted on a rotating shaft 56 (FIGS. 2 and 3) extending through the front plate 3.

A worm wheel (not shown) is fixed to the rear end of the rotating shaft 56. A worm shaft 57 meshing with the gear extends parallel to the front plate 3, and a motor 58 at the end of the worm shaft. Are connected (see FIG. 2).
Therefore, when the motor rotates, the rotation is transmitted to the rotating shaft 56 via the worm shaft and the worm wheel. Then, the rotation of the rotation shaft 56 causes the first plate 41 to rotate. As described above, the second plate 42
It is connected to the first plate 41 by two connecting members 43, 44, 45, 46, so that the second plate 42 also rotates.

Although the illustrated device rotates the rotating shaft using a worm wheel and a worm, a motor can be directly connected to the rotating shaft.

Although the second plate 42 is substantially rectangular, as shown in FIG. 4, the polishing tape has two overhanging portions 60a and 60b overhanging on the side in contact with the object to be polished. Rollers 61a and 61b are rotatably attached to the tips.

A recess is formed between the overhang portions 60a and 60b, so that the polishing tape can be moved between the roller 61a and the roller 61a.
When the polishing tape hung between 61b is pressed against the object to be polished, the pressing is not hindered.

A motor 63 is fixed to the back surface of the second plate 42, and the rear portion of the motor extends rearward through the first opening 47 of the first plate 41 (see FIGS. 5, 6, and 7). ). The rotating shaft 63 'of the motor 63 penetrates through the first plate and protrudes to the surface, and a supply roller 62 for supplying a polishing tape thereto is attached. The motor 63 rotates the roller 62 in a rotation direction opposite to the rotation direction for supplying the polishing tape, and applies tension to the tape.

Further, below the back surface of the second plate 42,
A base member 64 (see FIGS. 5 and 8) extending through the second opening 48 is attached. A motor 65 is mounted thereon and attached to the second plate, and its rotating shaft 65 ′ extends through the second plate 42. A pull-out roller 66 for pulling out the polishing tape is attached to the rotating shaft 65 '.

As best shown in FIGS. 6 and 8,
A spring 50 ′ is arranged between the base member 64 and the spring supporting piece 50. Therefore, the spring 50 'exerts a force for constantly pushing the second plate 42 upward through the base member 64. As described below, the upward force is applied to the second plate 42 in order to slide the second plate 42 back and forth in parallel with the first plate 41, that is, to reciprocate the second plate 42. This is because a force is applied upward to the second plate 42 against the gravity acting on the second plate 42 to enable a smooth reciprocating movement.

A base member 67 is fixed to the vicinity of the roller 66 on the second plate 42, and a roller is
A tape tightening member 68 that rotatably supports a roller 67 that comes into contact with 66 is slidably mounted (see FIG.
Four).

The polishing tape T from the supply roller 62 is a roller.
It is hung on 61a and 61b, and is further arranged to pass between rollers 66 and 67 via an intermediate roller 69. When the motor 65 is driven, the polishing tape is sequentially supplied from the supply roller. At this time, when the motor 63 is also driven, the supply of the tape is restricted, so that the tape does not slack and can keep a certain tension.

Although the used tape hangs down at the rollers 66 and 67 shown in this apparatus, the used tape can be wound by attaching a polishing tape winding roller to the rotating shaft 65 'instead of these rollers. it can.

As shown in FIGS. 4 and 5, a projecting member 70 is fixed to the second plate 42 near the base member 67. One end of a connecting rod 71 is rotatably connected to the tip of the overhang member 70, and the other end of the connecting rod 71 is rotatably connected to a rotating shaft 49 'of the motor 49 at a position 49 "offset from its center. As described above, the second plate 42 is parallel to the first plate 41 by the connecting members 43, 44, 45, and 46, and can slide back and forth. Therefore, the rotating shaft 49 'and the second plate 42 is a so-called slider
Construct a crank mechanism. Therefore, when the rotating shaft 49 'rotates by the driving of the motor 49, the second plate 42 slides reciprocally, that is, reciprocates.

Operation The operation of the polishing apparatus of the present invention will be described with reference to an example of polishing a notch of a semiconductor wafer.

The semiconductor wafer is placed on the mounting plate 16 so that its notch is on the head side, and the fixtures 16a, 16a
Fix with b. Next, the mounting table 32 is moved by rotating the ball screw 34, and the semiconductor wafer is pressed against the polishing tape T of the head 40.

When the motor 49 is driven, the second plate 42 reciprocates with respect to the first plate 41, and the polishing tape T slides reciprocally while being in contact with the semiconductor wafer. At this time,
The width of the polishing tape for polishing the notch is preferably 3.0 to 4.0 mm. Reciprocating movement, ie, oscillation every minute
It is desirable to drive the motor 49 so as to be 100 to 800 cycles.

While reciprocating the second plate,
When the motors 65 and 63 are driven, the polishing tape is supplied to the semiconductor wafer if it has tension. Therefore, the polishing tape reciprocates on the second plate, reciprocally slides with the semiconductor wafer, and its polishing force decreases,
Since a new polishing tape is supplied, a constant polishing force can be maintained. Thus, merely supplying the polishing tape by the roller wastes the polishing tape still having the polishing power, but by reciprocating the second plate as described above, the polishing tape having the further polishing power is used for polishing. And the tape can be used effectively. Further, when the polishing tape is reciprocally slid with respect to the object to be polished, desired polishing can be performed without excessively pressing the polishing tape against the object to be polished.

Further, when the motor 58 is driven to reciprocate the worm wheel shaft 57 by a predetermined angle (preferably +70 to -70), as shown in FIGS. 9 (a) to 9 (c). As shown, the head 40 reciprocates at a fixed angle about the rotation axis 56. Thereby, the upper and lower edges of the notch are polished.

Further, the motor 11 is driven to rotate the rotating shaft 1
When 1 'is rotated back and forth by a predetermined angle (preferably +60 to -60), as shown in FIGS. 10 (a) to 10 (c), the fixing plate 13 fixed to the shaft support 12 is rotated. Is a shaft support
Rotate around 12 axes. The substantially V-shaped notch of the semiconductor wafer on the mounting plate 16 is substantially on the axis of the shaft support 12, and therefore, polishing is performed along the shape of the notch.

Waste water generated by using a liquid such as water in the above polishing is collected in the enclosure 14 and discharged.

When the rotating shaft is reciprocally rotated by a predetermined angle by the motor 58 and the motor 11, and the driving of the motor is stopped when the polishing tape has reached a desired angle with respect to the object to be polished, the polishing tape is polished. Contact can be made with the body at a desired angle.

[0052]

The polishing apparatus of the present invention uses a polishing tape to polish an object to be polished, so that there is no need to use a slurry composed of abrasive grains and a solvent, and therefore, cleaning for removing residual slurry after polishing. Is unnecessary, and the treatment of the waste liquid after polishing is also unnecessary. This greatly reduces the polishing time and the polishing cost.

Further, since the polishing head of the polishing apparatus of the present invention can reciprocate the second plate with respect to the first plate, not only is a new polishing tape supplied, but also the polishing target is polished. Therefore, the polishing tape can be reciprocally slid in the feeding direction, so that the polishing can be effectively performed and the polishing tape can be effectively used.

Further, the polishing head of the polishing apparatus of the present invention comprises:
Since the angle of the polishing tape with respect to the object to be polished can be set arbitrarily, the polishing tape can be brought into contact with the object to be polished at any angle.

Furthermore, since the polishing head of the polishing apparatus of the present invention can be reciprocated, it can be polished along the shape of the object to be polished, particularly along its edge.

Further, by incorporating a polishing body supporting and rotating mechanism into the polishing apparatus of the present invention, it is possible to polish the semiconductor wafer along the notch shape.

[Brief description of the drawings]

FIG. 1 shows a front view of a polishing apparatus of the present invention.

FIG. 2 is a plan view of the polishing apparatus of the present invention, with a portion cut away.

FIG. 3 shows a side view of the polishing apparatus of the present invention, with a portion cut away.

FIG. 4 shows a front view of a polishing head of the polishing apparatus of the present invention.

FIG. 5 shows a first example of a polishing head of the polishing apparatus of the present invention.
Figure 4 shows a front view of the plate.

FIG. 6 shows a rear view of a polishing head of the polishing apparatus of the present invention.

FIG. 7 shows a plan view of a polishing head of the polishing apparatus of the present invention.

FIG. 8 shows a side view of a polishing head of the polishing apparatus of the present invention.

FIG. 9 shows a state in which the polishing head of the polishing apparatus of the present invention is rotated by a predetermined angle.

FIG. 10 shows a state in which a rotation support device incorporated in the polishing apparatus of the present invention is rotated by a predetermined angle.

[Explanation of symbols]

 40 Polishing head 41 First plate 42 Second plate 49 'Rotary shaft 62 Supply roller 63' Rotary shaft 66 Roller

Continuation of front page (58) Field surveyed (Int. Cl. ⁷ , DB name) B24B 9/00 B24B 21/00

Claims (6)

(57) [Claims] 1. A polishing apparatus using a polishing tape, comprising: (a) a rotating shaft of a first rotating means, which is perpendicular to an axis of the rotating shaft;
A first plate attached to the first plate, and (b) second rotating means attached to the first plate
And (c)On the first plateParallel to, and
It is possible to reciprocate vertically in the direction of the axis.
A second plate attached thereto; (d) including the second platesurfaceParallel to one end
The other end is rotatably connected to the second plate, and the other end is
A connecting rod connected to the rotation shaft of the second rotating means,
Whether the other end is the rotation center of the rotation shaft of the second rotation means
Connecting rod that is rotatably connected to a position away from
(E) provided on the second plate, wherein a polishing tape is hung.
And at least two rollers, wherein the first rotating means rotates, the first and second rollers
The plate rotates about said axis,As a result,
The contact angle between the polishing tape and the object to be polished changes,  When the second rotating means rotates, the connecting rod
The second plate reciprocates in the vertical direction.
A polishing apparatus, characterized in that: 2. The polishing apparatus according to claim 1, wherein the polishing tape is in contact with the object to be polished on the axis. 3. The polishing apparatus according to claim 2, wherein said first rotating means rotates a rotating shaft of said first rotating means to a predetermined angle, or reciprocates for a predetermined angle. A polishing apparatus, wherein the polishing apparatus is a motor to be driven. 4. The polishing apparatus according to claim 2, wherein the second rotating means is a motor, and the second plate is driven by the motor to move the second plate through the connecting rod in the vertical direction. Wherein the polishing tape reciprocates and slides back and forth with the contact angle being constant with respect to the object to be polished. 5. The polishing apparatus according to claim 3, wherein one of the rollers is a polishing tape supply roller. 6. The polishing apparatus according to claim 1, wherein the object to be polished is a semiconductor wafer having a notch, and the polishing object is supported in a plane including the semiconductor wafer centered on the notch. A polishing apparatus having a rotating support device.