JP3077375B2 - Light source device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light source device using a semiconductor laser, and more particularly, to a light source device capable of adjusting an optical axis and a focal length between a semiconductor laser and a collimating lens.

[0002]

2. Description of the Related Art In a certain type of image forming apparatus such as a printer or a copying machine, an electrostatic latent image is formed by raster-scanning an image on a photosensitive member using a laser beam.
In such an apparatus, a laser beam emitted from a semiconductor laser is generally shaped and incident on a deflecting unit such as a polygon mirror.

FIG. 14 shows an outline of a laser printer as an example of an image forming apparatus using such a semiconductor laser as an output source of a laser beam. The laser printer 11 includes a printer controller 12 represented by a workstation or a computer and a cable 13.
, And is supplied with image data and prints out the image.

Many laser printers 11 include a photosensitive drum 15 that rotates at a constant speed. Around the photoreceptor drum 15, a charging corotron 16 for uniformly charging the drum surface, a developing device 17 for developing the electrostatic latent image, and a toner image obtained by the development are recorded on a recording paper 18. Transfer corotron 19 for transfer, and discharge corotron 2 for removing electricity from the drum surface after transfer
1 and a cleaning device 22 for removing toner remaining on the drum surface. The semiconductor laser control device 24 performs on / off control (modulation) of the semiconductor laser 25 according to image data. A laser beam 26 output from a semiconductor laser 25 enters a polygon mirror 28 via a shaping optical system 27 composed of a lens or the like, is reflected there, and forms an image on the photosensitive drum 15 via an imaging optical system 29. It is designed to image.

Since the polygon mirror 28 is rotated at a high speed by the polygon mirror driving motor 31, the laser beam reflected from the polygon mirror 28 is deflected, and scans the drum surface between the charge corotron 16 and the developing device 17 line by line. Will be. As a result, the photosensitive drum 1
On the surface of No. 5, an electrostatic latent image corresponding to the image data is formed, and this is developed by the developing device 17.

The semiconductor laser controller 24 is controlled by a device controller 33 for controlling the entire laser printer 11. The paper feed system of the laser printer 11 is also subjected to the same control. That is, the recording paper 18 stored in the cassette tray 35 is
The sheets are sent out one by one and travel along the path shown by the dotted line. Then, first, the photosensitive drum 15 and the transfer corotron 1
9, the toner image is transferred, and passes through a fixing device 37 composed of a pair of rolls to fix the toner by heat or pressure. The recorded recording paper thus obtained is discharged from the discharge roll 38 and discharged into the discharge tray 39.

FIG. 15 specifically shows an optical system of such an apparatus. The same parts as those in FIG. 14 are denoted by the same reference numerals, and description thereof will be omitted as appropriate. In this device, the semiconductor laser 25 is controlled to be turned on / off in accordance with an image signal by a modulation means (not shown). The laser beam as a divergent light beam emitted from the semiconductor laser 25 is converted into a substantially parallel light beam by the collimator lens 41 and shaped by the aperture stop 42. The light source device to which the present invention is applied is a semiconductor laser 25.
And a collimating lens 41. The laser beam that has been shaped by the aperture stop 42 passes through a cylindrical lens 43 and passes through a first plane mirror 44.
After being reflected by the polygon mirror 28, the light enters the polygon mirror 28. The polygon mirror 28 is rotated at a constant angular velocity in the direction of the arrow, and repeatedly deflects the laser beam in correspondence with each line of the image signal.

The deflected laser beam is applied to an fθ lens system 4
5 and 2nd plane mirror 46, cylindrical mirror 47
Then, an image is formed on the photosensitive drum 15 via the dustproof window 48. Here, the fθ lens system 45 includes a first lens 45 ₁ and a second lens 45 ₂ .
Further, the dust-proof window 48 is required by storing parts other than the replaceable photosensitive drum 15 in one sealed housing (not shown), and the laser beam is transmitted from this housing. It is composed of a transparent glass plate for guiding to the photoconductor drum 15. Dustproof window 4
8 is 5 with respect to the plane formed by the deflected laser beam.
By tilting the laser beam by 6 degrees or more, multiple interference of the laser beam in the window can be prevented.

The spot of the laser beam generated on the photoreceptor drum 15 by the image formation moves at substantially constant speed in the drum axial direction (main scanning direction) as shown by an arrow 49 on the drum surface by the action of the fθ lens system 45. I do. After the scanning for one line is performed in this manner, the scanning for the next one line is performed by the deflection of the laser beam by the next surface of the polygon mirror 28. The same applies hereinafter.

[0010] In order to set an initial position at which an image is recorded on these lines when such scanning is performed, the optical scanning device is provided with an SOS (Start of Sca).
n) The sensor 51 is arranged. The laser beam reflected by the third plane mirror 52 is incident on the SOS sensor 51 via the fθ lens system 45, and the modulation of the image signal for each line is performed at a point in time after a lapse of a predetermined time. It is getting started.

Incidentally, the light source device including the semiconductor laser 25 and the collimating lens 41 basically requires the following two adjustments.

(I) Adjustment of the optical axis: This is an adjustment for making the laser beam output from the semiconductor laser 25 coincide with the optical axis of the collimator lens 41.

(Ii) Adjustment of focal length: semiconductor laser 2
Laser beam output from 5 is collimated lens 41
Is to adjust the distance between them so that the light becomes parallel light.

FIG. 16 shows the technical contents disclosed in Japanese Patent Application Laid-Open No. Sho 62-205305. In this light source device, the collimator lens 41 is attached to one end of a unit main body (not shown). Laser diode 62
Is mounted on the laser diode holding section 63.
The laser diode holding section 63 is arranged to be swingable with respect to the unit body. When an adjustment screw (not shown) is rotated, the laser diode holding portion 63 is bent in a direction away from the collimating lens 41 as shown by a solid line. As a result, the laser diode 62 moves in the direction of the optical axis 64 by ΔX, and the focal length is adjusted.

FIG. 17 is a diagram corresponding to FIG.
1 shows the technical contents disclosed in Japanese Patent Application Publication No. 1207. In this prior art, the semiconductor laser 25 is fixed, and the collimating lens 41 is a cylindrical lens holder 6 that allows a laser beam emitted from the semiconductor laser 25 to pass therethrough.
5 so as to be able to move forward and backward. After the positioning of the collimating lens 41 with respect to the semiconductor laser 25, the positioning of the collimating lens 41 with respect to the semiconductor laser 25 is completed by injecting an adhesive from the adhesive flowing groove 66 and fixing the collimating lens 41 in the lens holder 65. I do.

[0016]

In the technique shown in FIG. 16, the distance between the laser diode 62 and the collimating lens 41 is adjusted by bending the laser diode holding portion 63. For this reason, when the distance adjustment of ΔX is performed, the laser diode 62 itself is aligned with the optical axis 64 by ΔZ
Only in the main scanning direction.
Moreover, the laser diode 62 and the collimating lens 41
Since the optical axis of the collimator lens is displaced, the beam emission direction from the collimating lens is also inclined from the optical axis 64 with the deflection of the laser diode holding unit 63. There is also a problem that the bias is generated and the magnification is not equal between the left and right sides of the image (both ends of the scanning line).

In the technique shown in FIG. 17, even when the collimating lens 41 is positioned in the lens holder 65, a displacement occurs due to shrinkage when the adhesive is injected and fixed, thereby adjusting the focus. There was a problem that madness occurred.

Further, generally, in the conventional light source device as described above, if the optical axis is adjusted, the gap between the semiconductor laser and the collimating lens is deviated. If this distance is adjusted, the optical axis is deviated. As described above, there is a problem that mutual inconsistency occurs and it takes a long time for adjustment. Further, even if the adjustment is completed, if the temperature of the image forming apparatus rises, a shift may occur in the optical axis direction, which may adversely affect the image quality.

An object of the present invention is to provide a light source device that can easily make a laser beam emitted from a semiconductor laser coincide with the optical axis of a collimator lens.

Another object of the present invention is to provide a light source device capable of easily adjusting a laser beam output from a semiconductor laser to coincide with an optical axis of a collimating lens and adjusting a distance between the semiconductor laser and the collimating lens. To provide.

[0021]

In [Summary of invention of claim 1, wherein includes a collimating lens unit fixing the (b) a collimating lens to a predetermined position, (b) of the collimator lens optical
The laser beam is collimated in the axial direction.
A semiconductor laser emitting in the direction of the lens, and the semiconductor laser
The half that adjustably positions the user in a plane perpendicular to the optical axis
Positioning and fixing the semiconductor laser mounting member and the semiconductor laser
Moving distance in the direction parallel to the optical axis of the collimating lens
Holder given a reaction force proportional to the separation and coaxial with the optical axis
This holding part is positioned in the direction of the optical axis against the reaction force.
And a semiconductor laser unit provided with an adjusting screw for moving the light source device by an amount corresponding to the distance .

That is, according to the first aspect of the present invention, the light source device comprises a collimating lens unit and a semiconductor laser unit, and the semiconductor laser unit is moved in a plane perpendicular to the optical axis with respect to the collimating lens unit to which the collimating lens is fixed. It is mounted movably so that the laser beam coincides with the optical axis of the collimating lens. Also, the semiconductor laser unit
A semiconductor laser that emits the beam in the direction of the collimating lens
And a semiconductor laser that holds the semiconductor laser and moves in the direction parallel to the optical axis.
The holding part is given a reaction force proportional to the
This holding part is collimated against the above-mentioned force
Adjustment screw to move the lens by the desired amount in the direction of the
Between the collimating lens and the semiconductor laser
The distance can be adjusted.

According to the second aspect of the present invention, there is provided:
Collimating lens unit with lens fixed in place
And (b) freely movable in the optical axis direction of the collimating lens
Disposed laser beam emitted toward collimating lens
And a semiconductor laser perpendicular to the optical axis.
Semiconductor laser mounting member that can be adjusted in the plane
And a holder for positioning and fixing the semiconductor laser, and this holder
A fixed part with the holding part fixed via an elastic body, and this fixed part
Fixed adjustment screw holding member, and adjustment screw holding member
At the position facing the rear of the semiconductor laser at
The rear part is moved in the direction of the optical axis by the amount of screw extension.
A semiconductor laser unit with an adjusting screw and a light source
The device is equipped.

That is, in the invention according to claim 2, the light source device is provided.
The collimating lens unit and the semiconductor laser unit
Collimator lens with fixed collimating lens
Laser unit perpendicular to optical axis
It is decided to mount it freely in the plane of
Match the laser beam to the optical axis of the mate lens
It was done. In addition, the semiconductor laser unit, Leh
A semiconductor laser that emits in the direction of the collimating lens Zabimu, a holding portion which holds the semiconductor laser, a fixed portion of the retention <br/> lifting unit is fixed through an elastic body, which is fixed to the fixed part an adjusting screw holding member, and to and a this mounted at a position facing the rear of the semiconductor laser in the adjustment screw holding member adjustment screw for moving the rear only in the optical axis direction feed amount of the screw, as well collimated The distance between the lens and the semiconductor laser can be adjusted.

[0025]

According to the third aspect of the present invention, the holding portion, the fixing portion, and the elastic member are formed of the same metal plate, and the elastic member is provided with a notch axially symmetric with respect to the optical axis in the metal plate. It is an area that can be deformed.

[0027]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in detail below with reference to embodiments.

FIG. 2 shows a main part of an image forming apparatus employing a light source device according to one embodiment of the present invention. In this figure, the same parts as those in FIG. 15 and the like are denoted by the same reference numerals, and description thereof will be omitted as appropriate. In this image forming apparatus, various optical components such as the cylindrical lens 43 and the photosensitive drum 15 are accommodated in a plastic main body chassis 71. Further, the light source device 72 is mounted on a side wall of the main body chassis 71, and a semiconductor laser and a collimating lens are arranged therein.

FIG. 3 is a plan view of the light source device as viewed from the outside of the main body chassis. The main body chassis 71 shown in FIG.
Is provided with an LD mounting member 81 for fixing the semiconductor laser via a collimating lens unit not shown in this figure. An adjusting screw holding member 82 is fixed to both ends of the LD mounting member 81 by adjusting screw holding member fixing screws 83 and 84. An adjusting screw 86 is attached to the center of the adjusting screw holding member 82, and by adjusting the adjusting screw 86, the LD mounting member 8 is adjusted.
The semiconductor laser 25 (not shown) disposed between the first LD (laser diode) holding portion 87 and the adjusting screw holding member 82 is moved forward and backward in a direction perpendicular to the plane of the drawing.

FIG. 1 shows a state in which the light source device is cut in the direction GG in FIG. The light source device 72 includes a collimating lens unit 91 fixed to the main body chassis 71 shown in FIG. 2, and the collimating lens 41 is fixed here. The semiconductor laser 25 is mounted on a deformed portion 87 that forms a part of the LD mounting member 81.
The semiconductor laser 25 is positioned by an LD positioning member 93. A terminal 95 of the semiconductor laser 25 electrically connected to the signal cable 94 is connected to a spacing member 96.
This keeps an interval between the adjusting screw 86 and the electrical insulation. When the adjusting screw 86 is moved forward and backward, the LD holding portion 87 on which the semiconductor laser 25 is mounted moves forward and backward in the optical axis direction via the spacing member 96, and the distance between the semiconductor laser 25 and the collimating lens 41 is adjusted.

FIG. 4 is a view for explaining an operation of attaching the light source device to the main body chassis. Main body chassis 7
1 is provided with a recess for fitting a collimating lens unit 91, and two positioning pins 102 and 103 project point-symmetrically with respect to the optical axis 101. The collimating lens unit 91 includes a substantially rectangular flat plate portion 10.
4, LD unit mounting posts 105 having the same height and standing at respective corners on one diagonal of the flat plate;
106. The flat plate portion 104 has a positioning hole 1 into which the positioning pins 102 and 103 are fitted.
08, 109 are drilled and these positioning holes 10
The collimator lens 41 is arranged in advance so that the optical axis 101 is located at the midpoint of the straight line connecting the centers of the lines 8 and 109.
The collimating lens unit 91 includes a positioning pin 10
2 and 103 are fitted into the corresponding positioning holes 108 and 109, and the collimating lens holding portion fixing screws 111 and 1 are inserted.
12 fixes it to the main body chassis 71.

The upper surfaces of the two LD unit mounting columns 105 and 106 of the collimating lens unit constitute an LD unit mounting surface, and screw holes are respectively threaded. In these two places, the LD mounting member 81 constituting a part of the LD unit 107 is provided with the LD unit fixing screws 114 and 1.
15 temporarily fixed. The LD unit fixing screws 114 and 115 are completely fixed after the adjustment of the optical axis 101 is completed as described later. The LD unit 107 is composed of components from an LD mounting member 81 to an adjusting screw holding member 82 and an adjusting screw 86 attached to the adjusting screw holding member 82.

FIG. 5 shows the planar structure of the LD mounting member. The LD mounting member 81 has two holes 121,
The LD unit fixing screws 114, 1 shown in FIG.
15, the collimating lens unit 91
4 includes a fixing portion 123 for fixing the same, an LD holding portion 87, and an elongated plate-shaped deforming portion 124 for connecting them. The LD mounting member 81 is composed of one SU
S (stainless steel) is cut out into a predetermined shape, and two portions close to the deformed portion 124 are folded back at a fixed width. The deforming part 124 is provided between the LD holding part 87 and the fixing part 123 so that the cut 12 is symmetrical with the optical axis 101.
5, 126 are provided.
The substantially rectangular LD holding portion 87 is held at two points on a diagonal line, and is deformed by pressing the adjustment screw 86 (FIG. 4) to move the LD holding portion 87 in parallel with the direction of the optical axis 101 (FIG. 4). It has become.

Returning to FIG. 4, the description will be continued. The laser diode 25 is sandwiched between the laser diode 25 and the LD positioning member 93 with the terminal 95 protruding from the LD suppressing member 131. Then, with the light emitting portion inserted into the hole through which the optical axis 101 of the LD holding portion 87 passes, the LD holding member fixing screw 13 is inserted.
By 2 and 133, it is fixed to the LD holding portion 87 together with the LD suppressing member 131. In this state, soldering is performed between the end of the signal cable 94 and the terminal 95 of the light emitting laser diode, and the spacing member 96 is disposed thereon. The spacing member 96 is provided with the spacing member fixing screw 1 from the LD holding portion 87 side.
35 and 136. Thereafter, the adjustment screw holding member 82 is fixed on the LD holding portion 87 by the adjustment screw holding member fixing screws 83 and 84 so as to straddle the spacing member 96. The adjustment screw 86 is located on the optical axis 101 in this state.

FIG. 6 is for explaining the state of optical axis adjustment in such a light source device. After attaching the light source device 72 to the main body chassis 71 as described above,
First, the LD unit 107 is moved in the main scanning direction or the sub-scanning direction with respect to the collimating lens unit 91 to which the collimating lens 41 is attached, and the semiconductor laser 25 is moved.
The laser beam emitted from the optical axis 101 exactly coincides with the optical axis 101. Such adjustment is performed within the range between the outer diameter of the LD unit fixing screws 114 and 115 in the fixing portion 123 and the mounting holes 141 and 142 through which these screws are inserted.

FIG. 6 shows the amount of movement of the light spot on the adjustment target when the semiconductor laser 25 moves in the main scanning direction by this adjustment. That is, the distance between the semiconductor laser 25 and the collimator lens 41 and L _1, the distance to the collimator lens 41 adjusts the target L
_In the case of ₂ , the semiconductor laser 25 moves ΔΔ in the main scanning direction.
₁ moves, the amount of movement of the light spot on the adjustment target Δ ₂
Can be expressed by the following equation (1).

[0037]

(Equation 1)

Therefore, for example, a jig for detecting the laser beam is set at the position of the adjustment target, and the LD is set.
If the position of the semiconductor laser 25 is adjusted by moving the mounting member 81 in the main scanning direction or the sub scanning direction, and the LD unit fixing screws 114 and 115 are tightened with the laser beam connecting a light spot to a desired position, Good.

FIG. 7 is for explaining the adjustment of the distance between the semiconductor laser and the collimating lens. If the semiconductor laser 25 is set at a desired position with respect to the collimator lens 41, the laser beam emitted from the point 151 passes through the collimator lens 41 and becomes parallel light as shown by a solid line. The shaped beam forms an image on the scan plane.

On the other hand, if the semiconductor laser 25 is brought closer to the collimator lens 41, for example, a laser beam is emitted from the point 152 shown in the figure. In this case, since the distance between the semiconductor laser 25 and the collimating lens 41 is reduced, the divergent light of the laser beam reaches the scanning surface through the fθ lens system or the like as indicated by the dotted line, and the diameter of the laser beam decreases. This causes a problem that the diameter becomes larger than a desired diameter and the image becomes unclear.

FIG. 8 illustrates the phenomenon when the semiconductor laser is too far away from the collimating lens. In this figure, a solid line represents a state where light spots are ideally connected to the photosensitive drum 15. In this case, the laser beam output from the semiconductor laser 25 passes through the collimator lens 41 having the focal length f ₁ and becomes parallel light, and the first lens 45 ₁ and the second lens 4 shown in FIG.
5 through the ₂ f [theta] lens system 45 comprising a photosensitive drum 15
Converges on top. On the other hand, when the emission point of the semiconductor laser 25 moves away from the collimator lens 41 by Δ _{3 in the} figure, the distance Δ ₄ from the photosensitive drum 15 as shown by the dotted line.
The point 155 which is closer to the semiconductor laser 25 only becomes the image forming point of the optical image. The distance delta ₄ can be expressed by the following equation (2).

[0042]

(Equation 2)

In this example, after point 155, the laser beam will diverge again, resulting in a similarly blurred image.

If the semiconductor laser 25 is not accurately positioned at the position corresponding to the focal point of the collimator lens 41, the laser beam becomes thicker in any case, and the image is blurred. Therefore, adjustment of the amount by which the semiconductor laser 25 moves back and forth in the direction of the optical axis 101 is performed. For this adjustment, a jig is similarly arranged at the position where the photosensitive drum 15 is arranged, and the adjustment screw 86 shown in FIG. 4 is rotated to complete the adjustment at a position corresponding to the scanning surface.

Modification

FIGS. 9 to 13 correspond to FIG.
14 shows various modified examples of the D mounting member 81. L
The D mounting member 81 can change the shape of the cut in various ways. As described above, in the embodiment and these modifications, the LD holding unit 87 and the fixing unit 123 are integrally formed of the same metal plate, but the present invention is not limited to this.

In the embodiment and the modified examples described above, the deformed portion 124 of the LD mounting member 81 is axially symmetrical. Therefore, even if the deformed portion expands due to a rise in the temperature of the light source device, the displacement in the optical axis direction does not change. There is no inconvenience such that the light amount distribution is not biased and the left and right magnifications of the image are different.

[0048]

As described above, according to the first aspect of the present invention, the collimating lens is fixed and the mounting position of the semiconductor laser movably arranged in the optical axis direction is adjusted. did. Therefore, if the distance between the collimator lens and the semiconductor laser is adjusted after the optical axes are matched,
Further, it is not necessary to adjust the optical axis, and the time required for the adjustment can be reduced. Also, even if the temperature of the light source device rises, the semiconductor laser does not deviate from the optical axis,
The characteristics of the optical system can be stabilized.

Further, since the semiconductor laser unit is mounted so as to be movable only in the main scanning direction and the sub-scanning direction with respect to the collimating lens unit, the optical axis can be adjusted by adjusting the distance between the semiconductor laser and the collimating lens. It can be performed independently, and there is also an effect that a bias in the light amount distribution and a difference in right and left magnification of an image do not occur.

Further, since the positioning of the semiconductor laser housed in the semiconductor laser unit in the optical axis direction is performed by rotating the adjusting screw, the diameter and the adjustment of the laser beam can be changed and adjusted at any time by a simple operation. In addition, the laser beam does not deviate from the optical axis. Moreover, there is an advantage that the fixing operation using an adhesive or the like, which has been conventionally performed, for adjusting the interval is not required, and the operation is made more efficient.

According to the second aspect of the present invention, the collimator
The lens side is fixed, and the lens is movable in the optical axis direction.
Adjust the mounting position of the placed semiconductor laser.
Was. For this reason, after collimating the optical axis,
By adjusting the distance between the laser and the semiconductor laser, the optical axis can be further adjusted.
This eliminates the need to perform
Can be. Also, even if the temperature of the light source device rises,
The laser does not deviate from the optical axis, reducing the characteristics of the optical system.
Can be specified. Furthermore, the collimating lens unit
The semiconductor laser unit in the main scanning direction and
We decided to mount it so that it could be moved only in the scanning direction.
Therefore, adjust the optical axis using a semiconductor laser and a collimating lens.
Can be performed independently of the interval adjustment of the
Also, there is an effect that a difference between right and left magnifications of an image does not occur. Further, according to the second aspect of the present invention, since the elastic body is arranged between the holding portion for holding the semiconductor laser and the fixing portion, these are formed by processing a single metal plate, for example. In this case, the cost of the light source device can be reduced. According to the second aspect of the present invention, the semiconductor laser unit is disposed toward the outside of the apparatus (the side opposite to the direction in which the laser beam reaches) with respect to the collimating lens unit, and an adjusting screw is further provided on the rear side of the semiconductor laser. The arrangement allows not only easy adjustment of the optical system, but also design of the temperature compensation structure without being restricted by design restrictions such as the focal length of the lens.
That is, since the degree of freedom in selecting the shape of various parts is large,
The combination of the length and the coefficient of linear expansion can be optimally performed, and a light source device that is stable against temperature changes can be realized.

[0052]

[0053]

Further, according to the third aspect of the present invention, the holding portion constitutes a fixed part and an elastic body of the same metal plate, of which the elastic body is cut axisymmetric with respect to the optical axis in the metal plate The holding portion can be moved back and forth without being shifted from the optical axis because the region is provided so as to be deformable in the optical axis direction. In addition, since these three parts are formed on the same metal plate, there is also an effect that the manufacture of parts becomes easy.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of a light source device according to an embodiment of the present invention, taken along a line GG in FIG.

FIG. 2 is a perspective view showing a main part of an optical system to which a light source device is attached in the embodiment.

FIG. 3 is a plan view of the light source device of the present embodiment as viewed from the outside of a main body chassis.

FIG. 4 is an exploded perspective view showing a state in which the light source device of the present embodiment is mounted on a main body chassis.

FIG. 5 is a plan view of an LD mounting member in the present embodiment.

FIG. 6 is an explanatory diagram illustrating the principle of optical axis adjustment in the light source device according to the present embodiment.

FIG. 7 is an explanatory diagram showing the principle of adjusting the distance between the semiconductor laser and the collimating lens in the present embodiment.

FIG. 8 is an explanatory diagram showing a phenomenon when the semiconductor laser is too far from the collimating lens in the present embodiment.

FIG. 9 is a plan view showing a first modification of the LD mounting member.

FIG. 10 is a plan view showing a second modification of the LD mounting member.

FIG. 11 is a plan view showing a third modification of the LD mounting member.

FIG. 12 is a plan view showing a fourth modification of the LD mounting member.

FIG. 13 is a plan view showing a fifth modification of the LD mounting member.

FIG. 14 is a schematic configuration diagram illustrating an example of an image forming apparatus using a semiconductor laser as an output source of a laser beam.

FIG. 15 is a perspective view more specifically showing an optical system of the device shown in FIG.

FIG. 16 is an explanatory diagram showing a technical content disclosed in Japanese Patent Application Laid-Open No. 62-205305.

FIG. 17 is a sectional view showing the technical contents disclosed in Japanese Utility Model Laid-Open No. 59-151207.

[Explanation of symbols]

15 photoconductor drum, 25 semiconductor laser, 41 collimating lens, 71 body chassis, 72 light source device,
81: LD mounting member, 82: adjustment screw holding member, 83,
84: adjusting screw holding member fixing screw, 86: adjusting screw, 8
7 LD holding unit 91 Collimating lens unit 9
6 ... spacing member, 101 ... optical axis, 102, 103 ... positioning pin, 105, 106 ... LD unit mounting column, 107
... LD unit, 114, 115 ... LD unit fixing screw, 123 ... fixing part, 124 ... deformation part, 125, 126
… Cut

Claims (3)

(57) [Claims] 1. A collimating lens unit having a collimating lens fixed at a predetermined position, and a collimating lens unit movably arranged in an optical axis direction of the collimating lens.
Semiconductor that emits laser beam in the direction of the collimating lens
Body laser and this semiconductor laser in a plane perpendicular to the optical axis.
A semiconductor laser mounting member for adjusting the position within the semiconductor laser;
Positioning and fixing the semiconductor laser and the collimation
Is proportional to the distance traveled in the direction parallel to the optical axis of the lens.
A holding section to which a force is applied, and which is arranged coaxially with the optical axis.
The holding portion is moved by a predetermined amount in the direction of the optical axis against the reaction force.
A light source device comprising: a semiconductor laser unit having an adjusting screw for moving the semiconductor laser. 2. A collimating lens is fixed at a predetermined position.
A collimating lens unit, and a movable unit arranged in the optical axis direction of the collimating lens.
Semiconductor that emits laser beam in the direction of the collimating lens
Body laser and this semiconductor laser in a plane perpendicular to the optical axis.
A semiconductor laser mounting member for adjusting the position within the semiconductor laser;
A holder for positioning and fixing the semiconductor laser;
A fixed part with the holding part fixed via an elastic body, and this fixed part
Fixed adjustment screw holding member, and adjustment screw holding member
At a position facing the rear of the semiconductor laser at
The rear part is attached in the direction of the optical axis by the amount of screw extension.
Laser unit with adjustment screw for moving to
A light source device comprising: 3. The holding part, the fixing part and the elastic body are the same.
The elastic body is composed of a metal plate
In the direction of the optical axis with an axially symmetrical cut
3. The light source device according to claim 2, comprising a shapeable region .