JP3073936B2 - connector - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to PGA (Pin).
Grid Array type IC package and MCM (M
The present invention relates to a connector for connecting a low-profile package such as a multi chip module on a substrate.

[0002]

FIG. 9 is a longitudinal sectional view of a conventional connector.

The connector includes a fixed contact (socket contact) 510 connected to the printed circuit board 600 by soldering, a base insulator 520 through which the fixed contact 510 is inserted, and a fixed contact 5.
10 is provided with a cover insulator 530 in which a pin insertion hole 531 for guiding the pin 710 of the PGA type IC package 700 is formed.

[0004] This connector is used as follows.

[0005] The fixed contact 510 inserted in the base insulator 520 is connected to the printed circuit board 600 by soldering, the pins 710 of the IC package 700 are inserted into the pin insertion holes 531 of the cover insulator 530, and then the horizontal sides of the cover insulator 530. Apply directional force to move. The IC package 700 moves with the movement of the cover insulator 530, and the pins 710 move.
Are fitted to the fixed contacts 510.

[0006]

However, in the conventional connector, all pins 7 of the PGA type IC package 700 are not provided.
10 are simultaneously fitted to the fixed contacts 510,
When the number of pins 710 is large, cover insulator 5
There is a problem that a considerable force is required to move the 30.

Further, once the fixed contacts 510 are soldered to the printed circuit board 600, the fixed contacts 510
Since the soldered portion is blocked by the base insulator 520, there is a problem that it is difficult to visually inspect the soldered portion of the fixed contact 510.

The present invention has been made in view of such circumstances, and a problem thereof is that the pin and the socket contact of the pin stand package can be separated with a small force, and a visual inspection of the soldered portion is possible. Is to provide a connector.

[0009]

According to a first aspect of the present invention, there is provided a connector comprising: a first contact connected to a printed circuit board; and a first insulator through which the first contact is inserted. And a second insulator having a plurality of pin insertion holes formed in the first contact for guiding a plurality of pins of a pin stand package, the connector being rotatably attached to the first insulator. A second contact that can be fitted / removed with respect to the pin and the first contact that are in contact with each other, and that is relatively movable with respect to the first insulator and the second insulator, A third insulator for applying a rotational force to the second contact, wherein the third insulator is constituted by a plurality of insulators, and Wherein the Shureta are each independently movable.

At the time of fitting, the pins of the pin stand package come into contact with the first contact, and this pin and the first contact are sandwiched by the second contact. By moving each of the plurality of third insulators individually from this state, the pins and the first contacts are connected to the third insulator.
Is separated from the second contact for each insulator.

According to a second aspect of the present invention, in the connector of the first aspect, the connection between the first contact and the printed circuit board is performed by soldering.

Since the connection between the first contact and the printed circuit board is performed by soldering, the connection state between the first contact and the printed circuit board can be visually inspected.

[0013]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a longitudinal sectional view showing a fitted state of a connector according to an embodiment of the present invention, FIG. 2 is a sectional view taken along the line II-II of FIG. 1, and FIG. 3 is a line III-III of FIG. Sectional view along
FIG. 4 is a longitudinal sectional view showing a detached state of the connector according to the embodiment of the present invention.

The connector includes a base insulator (first insulator) 20, a fixed contact (first contact) 10, a drive insulator (third insulator) 40, a movable contact (second contact) 50, , A cover insulator (second insulator) 30. Drive insulator 4
0 is relatively movable with respect to the base insulator 20 and the cover insulator 30.

Insertion hole 20a of base insulator 20
The fixed contact 10 is inserted through the fixed contact 1.
0 is connected to the printed circuit board 60 by soldering.
An elongated hole 11 is formed at the center of the fixed contact 10, and the fixed contact 10 bends when subjected to a force in a lateral direction (the left-right direction in FIG. 2).

A movable contact 50 is disposed in the drive insulator 40, and a spring portion 52 is formed at one end of the movable contact 50.

A circular portion 51 is provided at the other end of the movable contact 50.
Is formed, and the circular portion 51 is formed on the base insulator 2.
0 is rotatably supported by a concave portion 21 formed on the upper surface.

The cover insulator 30 is formed with a plurality of pin insertion holes 31 for guiding a plurality of pins 71 erected on a PGA type IC package (pin standing package) 70 mounting an IC chip to the fixed contacts 10. I have. The pin insertion hole 31 has an inner diameter larger than the outer diameter of the pin 71, and has a tapered surface 31a that extends from the intermediate portion toward the upper surface of the cover insulator 30.

The cover insulator 30 is provided with a preload pin 32 having substantially the same outer diameter as the pin 71. The preload pin 32 is provided with one spring portion 52 and the other spring portion when the pin 71 is not inserted. Part 52
Is widened to reduce the force when the pin 71 is fitted.

P inserted from the direction shown by arrow a in FIG.
The pins 71 of the GA type IC package 70 come into contact with the fixed contacts 10, and the pins 71 and the fixed contacts 10 are clamped by the spring portions 52 of the movable contacts 50 as shown in FIG. At this time, the horizontal portion 52a of the spring portion 52
Is inserted into a notch 41 formed in the drive insulator 40.

When the drive insulator 40 is moved rightward from the fitted state shown in FIG.
Since 2a abuts against the inner wall surface 41a of the notch 41, the movable contact 50 tilts rightward about the rotation center O of the circular portion 51 while deforming the fixed contact 10, and fits with the preload pin 32.

In this state, as shown in FIG. 4, since the pin 71 comes off the movable contact 50, the PGA type I
The C package 70 can be easily pulled out in the direction shown by the arrow b.

FIG. 5 is a view showing a state where the fixed contacts are attached to the printed circuit board by soldering.

In this embodiment, a movable contact 50 having a pin 71 pinching function is provided separately from the fixed contact 10.
Is provided, the fixed contact 10 is connected to the printed circuit board 60.
After the soldering, the fixed contact 10 can be formed in a simple shape so that the fixed contact 10 can be removed from the base insulator 20.

After the base insulator 20 is inserted, the connector is fixed to the printed circuit board 60 with screws or the like (not shown).

FIG. 6 is a partially cutaway view illustrating the drive mechanism of the drive insulator, FIG. 7 is a view as viewed from the direction indicated by the arrow A in FIG. 6, and FIG.
FIG.

The drive insulators 40 are composed of a plurality of units, and each of the drive insulators 40 can be driven independently.

Each drive insulator 40 is provided with a drive mechanism 80 for relatively moving the drive insulator 40 between the base insulator 20 and the cover insulator 30.

The cover insulator 30 is divided into a plurality of blocks, and the drive insulator 40 is provided for each block.
Is attached.

The drive mechanism 80 includes the drive insulator 40
And an eccentric cam 83 that engages with the concave portion 81. The eccentric cam 83 is provided on a shaft 82 rotatably supported by the base insulator 20. The drive insulator 40 is urged rightward in FIG. 6 by a leaf spring (not shown) or the like.

By rotating the cam 83 using a lever (not shown) having a tip shape fitted into the groove 82a of the shaft 82, the drive insulator 40 is turned against the spring force of the leaf spring in FIG. The movable contact 50 can be moved to the left or in the pressing direction of the spring force of the leaf spring (to the right in FIG. 6). The operation of this lever is performed for the number of blocks.

According to this embodiment, the pins 71 of the PGA type IC package 70 having a large number of pins are engaged or disengaged from the fixed contacts 10 for each block, so that all the pins 71 are engaged and disengaged at once. The pin 71 can be fitted / removed with a smaller operation force than in the case.

Further, after the fixed contacts 10 are accurately mounted on the printed circuit board by, for example, a mounter device and soldered by passing through a reflow furnace, before the base insulator 20 is inserted into the fixed contacts 10, the printed circuit board is A visual inspection can be performed on the soldering state of the fixed contact 10 from directly above or obliquely above.

[0035]

As described above, according to the connector of the first aspect of the present invention, the pins of a pin stand package having a plurality of pins are brought into contact with or separated from the first contacts for each block to open and close. Therefore, the pins can be opened and closed with a smaller force than when the pins are opened and closed once for all the blocks.

According to the connector of the second aspect of the present invention, after the first contact is soldered to the printed circuit board, the first contact is attached to the connector by passing the first insulator through the first insulator. Before that, the soldered portion can be visually inspected from directly above or obliquely above.

[Brief description of the drawings]

FIG. 1 is a longitudinal sectional view showing a closed state of a connector according to an embodiment of the present invention.

FIG. 2 is a sectional view taken along the line II-II in FIG.

FIG. 3 is a sectional view taken along the line III-III in FIG. 1;

FIG. 4 is a longitudinal sectional view showing an open state of the connector according to the embodiment of the present invention.

FIG. 5 is a diagram showing a state where the fixed contacts are attached to a printed circuit board by soldering.

FIG. 6 is a partially cutaway view illustrating a drive mechanism of the drive insulator.

FIG. 7 is a view taken in the direction of the arrow A in FIG. 6;

FIG. 8 is a view as seen from the arrow B in FIG. 6;

FIG. 9 is a longitudinal sectional view of a conventional connector.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Fixed contact (1st contact) 20 Base insulator (1st insulator) 30 Cover insulator (2nd insulator) 31 Pin insertion hole 40 Drive insulator (3rd insulator) 50 Movable contact (2nd contact) 60 Printed circuit board 61 Soldering 70 PGA type IC package (pin package) 71 pin

Continuation of front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H01R 33/00-33/975

Claims (2)

(57) [Claims] 1. A first contact connected to a printed circuit board, a first insulator through which the first contact is inserted, and a plurality of pins for guiding a plurality of pins of a pin stand package to the first contact. A connector provided with a second insulator having a pin insertion hole, the connector being rotatably attached to the first insulator,
A second contact that can be fitted / removed with respect to the pin and the first contact that are in contact with each other, and that is relatively movable with respect to the first insulator and the second insulator, A third insulator that applies a rotating power to the second contact, wherein the third insulator is composed of a plurality of insulators, and the third insulators are independently movable. 2. The connector according to claim 1, wherein the connection between the first contact and the printed circuit board is performed by soldering.