JP3069477U - Hinge type heat dissipation block unit structure applied to electronic equipment - Google Patents

Abstract

(57) [Problem] To provide a hinge-type heat radiation block unit which is installed at a pivot portion between a computer such as a notebook personal computer and a display. SOLUTION: A hinge outer tube of a hinge type heat radiation block unit is provided with a split groove extending in the axial direction so that the inner diameter of the hinge outer tube can be elastically changed, and the outer diameter of the hinge inner tube is made slightly larger than the inner diameter of the hinge outer tube. The inner tube of the hinge is press-fitted into the outer tube of the hinge, the outer tube of the hinge is inserted over the outside of the inner tube of the hinge, and the inner tube of the hinge is elastically clamped. C-shaped snap ring is fitted to the hinge, and the flange and the C-shaped snap ring are used to position the hinge outer tube in the axial direction. Thus, the gap enlarged by friction caused by the relative rotation between the hinge inner tube and the hinge outer tube is removed from the hinge. Automatic compensation is provided by the inward elastic pinching of the tubes, thereby maintaining a close contact between the outer hinge tube and the inner hinge tube so as not to impair the heat transfer efficiency.

Description

[Detailed description of the invention]

[0001]

[Technical field to which the invention belongs]

 The present invention relates to a hinge type heat dissipating block unit structure applied to a kind of electronic equipment, particularly, a heat dissipating means which is attached to a pivotal part of a notebook computer or other related electronic equipment and is located on one seat. The present invention relates to a hinge type heat dissipating block unit structure applied to electronic equipment, wherein the heat amount is transmitted to heat dissipating means provided on different seats to dissipate heat, and the wear due to rotational friction does not affect the heat conducting effect.

[0002]

[Prior art]

 In general electronic equipment such as notebook computers, in order to make the body volume thinner and smaller, an aluminum plate is directly bonded to the CPU at the bottom of the keyboard to dissipate the heat of the CPU or to change the heat pipe to aluminum. The heat of the CPU is radiated by the system connected to the plate. Recently, United States Patent No. As in 5781409 and 5832987, a heat pipe is combined with a hinge-type heat-dissipating block at the connection between the computer seat (or the first seat of the electronic equipment) and the display seat (or the second seat). The amount of heat from the CPU (heating element) located in the computer seat (first seat) is transmitted to the heat-dissipating aluminum plate (heat-dissipating element) inside the display seat (second seat), and efficient space utilization and heat dissipation There is something that has achieved. As shown in FIGS. 1 and 2, the structure of such a hinge-type heat radiation block unit 1 includes a hollow hinge outer tube 10, and the inner diameter of the hinge outer tube 10 is equal in diameter back and forth along the axial direction. A heat pipe 11 is provided separately, and one end of the heat pipe 11 is connected to a heat generating element such as a CPU or a heat radiating element such as an aluminum plate, and the other end has the above-described hinge outer tube. The inner hinge tube 12 is connected to a hinge inner tube 12 having an inner diameter equal to 10, and the hinge inner tube 12 is inserted into the hinge outer tube 10 so as to be relatively rotatable. At the time of implementation, two hinge-type heat radiation block units 1 are combined and fixed to a pivotal contact portion between a computer seat (first seat) and a display seat (second seat). The heat pipe 11 is connected to a CPU (heating element), and the heat pipe 11 of another hinge type heat radiation block unit 1 is connected to an aluminum plate (heat radiation element).

[0003] However, in such a hinge type heat radiation block unit 1, the outer diameter of the hinge inner tube 12 and the inner diameter of the hinge outer tube 10 are also equal to each other, and therefore, the shaft is originally located between the two. In addition, there is a possibility of sliding in the direction, and the space between the outer wall of the hinge inner tube 12 and the inner wall of the hinge outer tube 10 is opened and closed between the computer seat (first seat) and the display seat (second seat). Because of the friction caused by the rotation due to the rotation, the inner wall of the hinge outer tube 10 and the outer wall of the hinge inner tube 12 cannot be completely adhered to each other after long-term use, and the contact area therebetween is reduced immediately. In addition, the heat conduction efficiency has been significantly reduced, which is disadvantageous for radiating the heat generated in the CPU (heating element).

[0004]

[Problems to be solved by the invention]

 The main object of the present invention is to provide a hinge type heat dissipation block unit structure applied to electronic equipment, which is provided with an axially extending split groove in a hinge outer tube of the hinge type heat dissipation block unit, The inner diameter of the hinge outer tube can be changed elastically, the outer diameter of the inner tube of the hinge is slightly larger than the inner diameter of the outer tube of the hinge, the inner tube of the hinge is pressed into the outer tube of the hinge, and the outer tube of the hinge is laid outside the inner tube of the hinge. The inner tube of the hinge is elastically clamped, and a flange is provided at one end of the inner tube of the hinge, and a C-shaped snap ring is fitted to the other end of the inner tube of the hinge. Position, and the gap expanded by the friction caused by the relative rotation between the hinge inner tube and the hinge outer tube is automatically compensated by the inward elastic pinching of the hinge outer tube. It shall be hinged radiator block unit structure applied to an electronic equipment that do not impair the heat conduction efficiency retain a tight contact state 互間.

Another object of the present invention is to provide a hinge-type heat dissipating block unit structure applied to electronic equipment, which is formed by integrally molding or screwing two hinged heat dissipating block units. And a hinge-type heat-dissipating block, and the hinge-type heat-dissipating block is applied to a pivotal portion between a computer seat and a display seat of a notebook computer, and a heat amount of a CPU in the computer seat is dissipated to the display seat aluminum Conducting heat to the board and dissipating heat or applying it to other electronic equipment, it is installed at the pivotal joint between the first seat and the second seat, and the amount of heat of the heating element in the first seat is transferred to the second seat. It shall have a hinge-type heat dissipation block unit structure applied to electronic equipment that conducts to the heat dissipation element in the body.

[0006]

[Means for Solving the Problems]

 The invention according to claim 1 is a hinge outer tube which is a hollow tube, a hinge inner tube inserted into the hinge outer tube and rotatable relative to the hinge outer tube, and one end fixed to the hinge inner tube. A hinge type heat dissipating block unit structure applied to an electronic equipment having a heat pipe connected to a heat generating element or a heat dissipating element at another end, wherein one of the heat pipes extends in the hinge outer tube along the axial direction. A split groove is provided so that the hinge outer tube elastically clamps the hinge inner tube, and positioning means are provided at two ends of the hinge inner tube so that axial sliding between the hinge outer tube and the hinge inner tube is prevented. It has a hinge-type heat dissipation block unit structure applied to electronic equipment. According to a second aspect of the present invention, a flange is formed at one end of the inner tube of the hinge, an annular groove is formed at an outer wall of the other end, a C-shaped snap ring is fixed, and the flange and the C-shaped snap ring serve as positioning means. A hinge type heat dissipating block unit structure applied to the electronic equipment according to claim 1 characterized by being composed. According to a third aspect of the present invention, there is provided a hinge type heat dissipating block unit structure applied to the electronic equipment according to the first aspect, wherein the hinge outer tube is formed by a forging method. The invention according to claim 4 is characterized in that the two hinge-type heat-dissipating block units are combined and connected to form one hinge-type heat-dissipative block, and the hinge-type heat dissipative block is a first seat body provided with heat generating means for electronic equipment. The heat pipe of one hinge type heat radiation block unit is connected to the heat generation means, and the heat pipe of the other hinge type heat radiation block unit is dissipated heat. A hinge type heat radiation block unit structure applied to the electronic equipment according to claim 1, wherein the heat radiation block unit structure is connected to the means. The invention according to claim 5 is that the electronic equipment is a notebook computer, the first seat is a computer seat, the heat generating means is a microprocessor, the second seat is a display seat, and the heat radiating means is a heat sink. Is a heat-dissipating aluminum plate or a case in the display seat, and has a hinge-type heat-dissipating block unit structure applied to the electronic equipment according to claim 4. The invention according to claim 6 is characterized in that the hinge outer tubes of the two hinge type heat dissipation block units are connected by screws or integrally formed to form one hinge type heat dissipation block. It has a hinge-type heat dissipation block unit structure applied to the electronic equipment.

[0007]

[Embodiment of the invention]

 FIGS. 3 to 5 show a preferred embodiment of a hinge type heat radiation block unit applied to the electronic equipment of the present invention. The hinge-type heat-dissipating block unit 2 provided by the present invention includes a hollow hinge outer tube 20 and a hinge inner tube 22 inserted into the hinge outer tube 20 and one end of a heat pipe 21 having an axis fixed thereto. The hinge outer tube 20 and the hinge inner tube 22 are made of a material having good heat conductivity. Among these, the hinge outer tube 20 is a hollow tube body manufactured by a forging method, the inner diameter of which is equal, and one split groove 200 is provided in the hinge outer tube 20 along the axial direction. The inner diameter of the tube 20 can be elastically changed. The outer diameter of the inner hinge tube 22 is larger than the inner diameter of the outer hinge tube 20, and the inner hinge tube 22 is press-fitted into the outer hinge tube 20 so that the inner hinge tube 20 elastically clamps the inner hinge tube 22. Since the outer diameter of the outer tube 22 is larger than the inner diameter of the outer tube 20, the degree of tension is appropriately formed after the combination of the inner tube 22 and the outer tube 20. When the two rotate relative to each other, a constant frictional force is generated. . A flange 220 is formed at one end of the inner hinge tube 22, and one annular groove 221 is provided on an outer wall of another end of the inner hinge tube 22, and one C-shaped snap ring 222 is fixed. The flange 220 and the C-shaped snap ring 222 oppose both ends of the hinge outer tube 20, and the flange 220 and the C-shaped snap ring 222 serve as positioning means to provide a function of positioning the hinge outer tube 20 in the axial direction. Thus, axial sliding between the hinge outer tube 20 and the hinge inner tube 22 is prevented, and the hinge outer tube 20 is prevented from falling off.

With the above structure, the hinge type heat radiation block unit shown in FIGS. 4 and 5 is completed. Accordingly, when the outer wall of the hinge inner tube 22 and the inner wall of the hinge outer tube 20 are frictionally worn due to continuous relative rotation and a gap is generated therebetween, the hinge outer tube 20 elastically holds the outer wall of the hinge inner tube 22. Therefore, even if the inner diameter of the hinge outer tube 20 is worn due to the mutual friction between the inner wall of the hinge outer tube 20 and the inner wall of the hinge inner tube 22, the function of the inward elastic elastic clamping of the hinge outer tube 20 causes the hinge outer tube 20 to move. It gradually contracts and automatically compensates for the gap created by friction. As a result, the inner wall of the hinge outer tube 20 maintains a permanent close contact with the outer wall of the hinge inner tube 22, the contact area between the hinge inner tube 22 and the hinge outer tube 20 is maximized, and the most stable heat is obtained. The heat dissipation effect can be secured by maintaining the conduction path and heat conduction efficiency.

Two hinge type heat radiation block units 2 can be connected and combined to be used as one hinge type heat radiation block. According to the method, one connecting portion 201 is provided for each of the hinge outer tubes 20 of the two hinge type heat radiation block units 2 and the two connecting portions 201 are connected by screws 202 (see FIGS. 6 and 7). Either the two hinge-type heat radiation block units 2 may be integrally connected, or the hinge outer tubes 20 of the two hinge-type heat radiation block units 2 may be integrally formed, or another connection method may be employed. The hinged heat dissipation block thus formed is applied to related electronic equipment. The electronic equipment includes a first seat and a second seat pivotally connected to each other, wherein the first seat is provided with a heat generating element, the second seat is provided with a heat radiating element, and the hinge type heat radiating element is provided. The block is installed at a pivotal portion between the first seat and the second seat, and the heat pipe 22 of one hinge type heat radiation block unit 2 is connected to the heat generating element, and the other hinge type heat radiation block unit 2 The heat pipe 21 is connected to the heat radiating element. One application embodiment of the electronic equipment is a notebook computer shown in FIG. 8, that is, a hinge-type heat-dissipating block is attached to a pivotal portion between the computer seat 30 and the display seat 31 of the notebook computer 3, of which The other end of the heat pipe 21 of one hinge type heat radiation block unit 2 is connected to the heat radiation aluminum plate or the inner wall of the case in the display seat 31, and the heat pipe 21 of the other hinge type heat radiation block unit 2 is a computer seat. The waste heat generated by the operation of the microprocessor 300 is quickly and effectively transmitted through the two heat pipes 21 and the two hinge-type heat radiation block units 2 and is connected to the microprocessor 300 portion of the display seat 31. Conducted to the heat dissipating aluminum plate or the inner wall of the case to improve space utilization and heat dissipation efficiency. To achieve.

[0010]

[Effect of the invention]

 Taken together, the hinged heat-dissipating block unit structure applied to the electronic equipment provided by the present invention surely solves the usage disadvantage of the traditional structure with respect to the heat transfer efficiency and provides a substantial functional improvement. It has been achieved, and its practicality and inventive step are clear, and the structure of the present invention has not been disclosed yet, and it satisfies the demand for novelty. Note that any modification or modification of details that can be made based on the present invention and that can achieve the same effect as the present invention belongs to the claims of the present invention.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view of a traditional hinge type heat dissipation block unit.

FIG. 2 is a cross-sectional view after a combination of a traditional hinge type heat radiation block unit.

FIG. 3 is an exploded perspective view of the hinge type heat radiation block unit of the present invention.

FIG. 4 is a perspective view of the hinge type heat radiation block unit of the present invention.

FIG. 5 is a cross-sectional view of the hinge type heat radiation block unit of the present invention.

FIG. 6 is a perspective view showing a state in which two hinge-type heat dissipating block units of the present invention are combined into one hinge-type heat dissipating block;

FIG. 7 is a cross-sectional view of the hinge type heat dissipation block of FIG.

8 is a perspective view showing an operation state of the hinge type heat radiation block of FIG. 6 applied to a notebook computer.

[Explanation of symbols]

REFERENCE SIGNS LIST 1 hinge type heat dissipation block unit 10 hinge outer tube 11 heat pipe 12 hinge inner tube 2 hinge type heat dissipation block unit 20 hinge outer tube 200 split groove 201 connecting portion 202 screw 21 heat pipe 22 hinge inner tube 220 flange 221 annular groove 222 C-shaped Snap ring 3 Notebook computer 30 Computer seat 300 Microprocessor 31 Display seat

Claims (6)

[Utility model registration claims] 1. A hinge outer tube which is a hollow tube, a hinge inner tube inserted into the hinge outer tube and rotatable with respect to the hinge outer tube, and one end fixed to the hinge inner tube. In a hinge type heat dissipation block unit structure applied to an electronic equipment having a heat element or a heat pipe connected to a heat dissipation element, one hinge groove is provided in the hinge outer tube along the axial direction. The hinged outer tube elastically clamps the hinged inner tube, and positioning means are provided at two ends of the hinged inner tube so that axial sliding between the hinged outer tube and the hinged inner tube is prevented. The hinge type heat dissipation block unit structure applied to electronic equipment. 2. A flange is formed at one end of the inner tube of the hinge, and an annular groove is formed at an outer wall of the other end to fix a C-shaped snap ring, and the flange and the C-shaped snap ring constitute positioning means. 2. The method according to claim 1, wherein
3. A hinge type heat radiation block unit structure applied to the electronic equipment described in 1. above. 3. The hinge type heat dissipating block unit structure according to claim 1, wherein the outer hinge tube is formed by forging. 4. The hinge type heat dissipating block unit may be combined and connected to form one hinge type heat dissipating block, wherein the hinge type heat dissipating block is connected to a first seat having heat generating means of an electronic equipment and a heat dissipating unit. The heat pipe of one hinge type heat radiation block unit is connected to the heat generation means, and the heat pipe of another hinge type heat radiation block unit is connected to the heat radiation means. The hinge-type heat radiation block unit structure applied to the electronic equipment according to claim 1, wherein: 5. The electronic equipment is a notebook computer,
The first seat is a computer seat, the heat generating means is a microprocessor, the second seat is a display seat, and the heat radiating means is a heat radiating aluminum plate or a case in the display seat. A hinge type heat radiation block unit structure applied to the electronic equipment according to claim 4. 6. The electronic equipment according to claim 4, wherein the hinge outer tubes of the two hinge type heat radiation block units are connected by screws or integrally formed to form one hinge type heat radiation block. Hinge type heat dissipation block unit structure applied to.