JP3068437B2 - High-speed plating nozzle with ejection and suction functions - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high-speed plating nozzle having an ejection and suction function.

[0002]

2. Description of the Related Art Generally, as a method of increasing a plating speed,
First, increase the metal concentration of the plating solution to increase the ion movement speed, or increase the temperature of the plating solution to increase the chemical reaction, and further, stir the cathode surface to make the diffusion layer thinner. A method can be considered.

Conventionally, there has been known a method of stirring a cathode surface by moving a cathode and using various means in order to perform high-speed plating. As the combination means,
A plating solution is ejected from a nozzle by using an air-agitation stronger than usual, agitating the entire plating solution with a propeller, using a low frequency vibration, using an ultrasonic wave, or using a pump circulation. And so on. However, in the case of the above-mentioned air-stirring, the current density does not increase so much, and the current density is limited to 2 to 3 times the normal plating speed, and it is very difficult to make the plating thickness uniform. Was. Next, the method in which the whole plating solution is stirred by the propeller is difficult to uniformly stir the product, and is not used at present. In the case of using the low-frequency vibration, the degree of increase in the speed was low, and the plating speed could be increased only as high as that of the air. In addition, those using ultrasonic waves are hardly used at present because the surface of the material is easily roughened and the frequency to be used differs depending on the type of plating solution.

For this reason, in recent years, nozzles are arranged at predetermined intervals in a pipe (3) as shown in FIG. 10, and a plating solution from a pump (7) flows upward from each nozzle as shown by an arrow in the figure. The plating liquid ejected to the bottom of the plating tank (5) passes through a discharge valve (6) and is recovered by a pump (7).

[0005]

However, in the apparatus in which the plating solution is ejected from the nozzle utilizing the pump circulation, the plating solution ejected from the nozzle has a pressure at a portion corresponding to the product (4). As a result, the jetting pressure difference of the plating solution and the flow velocity difference are large in the portion to be plated. As a result, a uniform flow rate could not be obtained on the surface of the product (4), and it was difficult to obtain a uniform plating thickness (41) as shown by a black portion in FIG. For this reason, it can be used for partial plating as shown in FIG. 10, but it has not reached the practical technical level of a product having a large sheet-like area, for example, plating and hoop plating of printed circuit boards. It is. Also, since the electrodes and nozzle arrangements are different for each product, and it is difficult to exchange those sets, it becomes a dedicated device such as a lead frame only for the product, which is expensive. Was. Further, there is a problem that a plating film having many pinholes (holes after degassing) is easily formed by hydrogen gas generated from the cathode surface. In addition, since the material of the nozzle is made of insoluble metal such as platinum, the nozzle wears out when used for a long period of time and must be replaced, which increases the replacement cost.

SUMMARY OF THE INVENTION An object of the present invention is to provide a high-speed plating nozzle having a function of jetting and sucking, which makes it possible to make the plating thickness constant and to cope with a product having a high speed and a large area. It is in.

[0007]

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problem. That is, in order to keep the plating thickness constant, a hollow taper is provided with a taper portion for diffusion at one end. The structure comprises a nozzle body with a fixed head, and an outer cylinder provided on the outer periphery of the nozzle body and capable of adjusting the diffusion and flow rate of the plating solution. In addition, in order to increase the plating speed, a structure in which the diffusion layer is kept thin and the difference in pressure and flow velocity is reduced by making the circulation state in which suction is performed simultaneously with the injection of the plating solution, that is, the nozzle body A taper portion for diffusion is provided on the outer periphery of the head provided at the tip of the nozzle, and a suction hole for liquid recovery is provided inside the tip side of the nozzle body, and the plating solution sucked therefrom is discharged from the rear. A discharge port is formed in the hollow shaft, and a discharge hole is provided in an outer cylindrical body disposed on the outer periphery of the hollow shaft. In addition, wide
In order to make it possible to electrodeposit a plating film on a product having a large area , a large number of nozzles capable of keeping the plating thickness constant may be arranged.

[0008]

Next, the method of using the product of the present invention will be described. First, the rear wall screw portion (15) of the nozzle body (1) is inserted into the ejection hole (22) of the outer cylindrical body (2), and the partition wall screw portion (14) and the rear wall screw portion ( 15) is put out of the outer cylinder (2) (see FIGS. 1, 3 and 4). Next, when installing the product of the present invention, the partition wall (3) shown in FIG.
The nozzle body (1) is attached to the pipe (3) by screwing the thread part (14) for the partition wall to (2) and the screw part (15) for the rear wall to the rear wall (33). At this time, a screw part (21) for a front wall is screwed into a front wall (31) of the pipe (3), and the outer cylinder (2) is also attached to the pipe (3) at the same time. Then, the outer cylinder (2) is rotated or the nozzle body (1) is rotated to form a tapered portion (12a) of the head (12) and a chamfer (23) having the same angle as the tapered portion (12a). Is adjusted to correspond to the flow rate. At this time, as shown in FIG. 5, in the case where the nozzle body (1) and the outer cylinder (2) are integrated, the operation of adjusting the flow rate is omitted. In addition, the nozzle body (1) shown in FIG.
Is connected to the supply side connection (1c) to the supply side of the pipe (3) and to the discharge side connection (1d) to the discharge side.
Good to let. Thereafter, a pipe (3) in which a large number of the nozzle bodies (1) and the outer cylinder (2) are incorporated is disposed.
Is placed in the plating tank (5), and the product (4) is set (see FIG. 8).

When plating the product (4) using the product of the present invention, first, when the pump (7) is driven, the front wall (31) of the pipe (3) is separated from the front wall (31) as shown by the arrow in FIG. Wall (32)
The plating solution flows into the gap, and the gap between the right end of the outer cylinder (2) and the spline (13) or the gap between the outer periphery of the hollow shaft (11) and the ejection hole (22) of the outer cylinder (2). Through the head (1
Chamfer (23) of taper part (12a) and ejection hole (22) of 2)
The plating solution is ejected from the gap toward the product (4). At this time, the plating solution is ejected in a state of being diffused without being ejected straight from the nozzle as in the related art. Thereafter, the plating solution strikes the surface of the product (4). Then, the suction force of the pump (7) is changed to the suction hole (12b) for liquid recovery.
Therefore, the plating solution forms a plating film along the surface of the product (4) while forming a plating film along the suction hole (12).
It is sucked into b). The sucked plating solution passes through the inside of the hollow shaft (11) and is discharged from the outlet (16). Thereafter, the material discharged from the discharge port (16) flows into the gap between the partition wall (32) and the rear wall (33) and is collected.

As described above, since the product of the present invention has a structure in which the plating solution has an outlet and an inlet with one nozzle, the plating solution is in a circulating state in which the plating solution is sprayed and sucked at the plating portion, and the pressure is increased. However, the diffusion layer can be kept thin, and the pressure difference is small and the difference in flow velocity is reduced. As a result, unlike a conventional nozzle which only sprays, there is no place where ions are hard to be electrodeposited due to a high pressure, and the electrode becomes extremely easily electrodeposited.
Almost constant plating thickness (41) as shown in the black part of the figure
Is formed. Also, hydrogen gas generated from the cathode surface is forcibly sucked and removed from the suction hole (12b) for liquid recovery, so that a plating film with few pinholes is formed.

The plating solution that has flowed into the gap between the inner partition wall (32) and the rear wall (33) and is collected is sucked by a pump (7). Then, the plating solution is again supplied to the right end of the outer cylinder (2) disposed in the pipe (3) and continues to circulate. In the case where the nozzle shown in FIG. 6 is used, the plating solution is first ejected from the supply side connecting portion (1c) through the nozzle body (1) through the ejection port (1a). The diffused plating solution is sucked through the suction port (1b), further passes through the inside of the nozzle body (1), is discharged from the discharge side connection portion (1d) to the discharge side of the pipe (3), and circulates. . At this time, by providing the suction port (1b) so as to protrude from the ejection port (1a), the recovery of the plating solution can be more reliably performed.

[0012]

Embodiments of the present invention will be described below with reference to the drawings. (1) is a nozzle body formed of a synthetic resin,
The nozzle body (1) has a spline (13) for liquid introduction.
A hollow shaft (11) having an
The head (12) fixed to one end of the hollow shaft (1)
There is a screw part (15) for the rear wall and a screw part (14) for the partition wall provided at the outer circumference of the other end and at the inner outer circumference located at a predetermined distance therefrom. A suction hole (12b) for liquid recovery is provided inside, and a taper portion (12a) for diffusion is provided on the outer periphery thereof (see FIG. 2).
Also, the rear wall screw portion (15) and the partition wall screw portion (14)
A discharge port (16) is provided in the middle of. (2) is an outer cylindrical body made of a synthetic resin. The outer cylindrical body (2) has a front wall screw portion (21) at one end of the outer periphery and the taper inside the other end. Chamfer (23) with same angle as part (12a)
An ejection hole (22) having a hole is provided. The outer cylinder (2) is arranged on the outer periphery of the nozzle body (1). Examples of the synthetic resin material for the nozzle body (1) and the outer cylinder (2) include hard vinyl chloride, heat-resistant vinyl chloride, polypropylene, polyethylene, nylon, polyacetal, acrylic, and Teflon. Engineering plastics are used, but are not limited thereto, and may be other materials used for conventional nozzles. The spline (13) may be removed and omitted as shown in FIG. 4. Alternatively, as shown in FIG. 5, the nozzle body (1) and the outer cylinder (2) may be integrally formed. Is also good.

FIG. 6 shows another embodiment of the present invention.
Description will be made based on this. (1) is a nozzle body formed of a synthetic resin in the shape of a box, and a nozzle (1a) at the tip of the nozzle body (1) through which a plating solution supplied from a pump (7) is blown out. And a suction port (1b) for collecting a plating solution spouted from the spout (1a), and a rear part of the nozzle body (1) is connected to a supply side of a pipe (3). Supply side connection (1c) and piping (3) for
And a discharge-side connecting portion (1d) for connecting to the discharge side of each of them. The jet port (1a) and the supply-side connection section (1c) communicate with each other, and the suction port (1b) and the discharge-side connection section (1d) communicate with each other. Note that the arrangement of the ejection port (1a) and the suction port (1b) is not limited to the paired structure shown in FIG. ) May have a structure in which a large number of small-diameter jet ports (1a) are arranged.

[0014]

The present invention having the above-described structure has the following effects.

A nozzle body (1) in which a head (12) having a taper portion (12a) for diffusion is fixed to one end of a hollow shaft (11) as described in claim 1, and the nozzle body (1). The plating speed can be increased by providing an outer cylinder (2) which is provided on the outer periphery of (2) and in which the plating solution can be diffused and the flow rate can be adjusted.
In addition, a substantially constant plating thickness (41) can be obtained. Further, the hydrogen gas generated from the cathode surface is quickly removed, and a plating film with less pinholes is obtained, thereby improving the corrosion resistance. Further, the product of the present invention may have the minimum capacity of the pump (7), and the running cost can be reduced. Further, by arranging a large number of nozzles of the present invention, it is possible to perform plating even on a product having a large area, which is conventionally difficult. Further, since the product of the present invention has an outlet and an inlet for the plating solution with one nozzle, the structure is simpler than that of a conventional plating apparatus.

By integrally molding the nozzle body (1) and the outer cylinder (2) as in claim 2, mass production can be made easily with synthetic resin, mounting work is simple, and manufacturing cost is low. Becomes

By removing the spline (13) of the nozzle body (1), the manufacturing cost can be reduced. The product of the present invention can be used for applications other than high-speed plating, such as those involving electrolysis, for example, alumite treatment, electrolytic polishing, or etching, and is extremely effective.

[0018]

[Brief description of the drawings]

FIG. 1 is a perspective view showing an embodiment of the present invention.

FIG. 2 is a perspective view of the disassembled part of the present invention.

FIG. 3 is an explanatory view showing a cross section of a product of the present invention.

FIG. 4 is an explanatory view showing a cross section in which a spline implemented in the present invention is omitted.

FIG. 5 is an explanatory diagram showing a cross section in which the nozzle body and the outer cylinder of the present embodiment are integrated.

FIG. 6 is a perspective view showing another embodiment of the present invention.

FIG. 7 is an explanatory view showing a state of jetting a plating solution and a state of a plating thickness according to the product of the present invention.

FIG. 8 is an explanatory diagram showing a use state of the present invention.

FIG. 9 is an explanatory view showing a state of a plating solution jetting state and a plating thickness state of a conventional product.

FIG. 10 is an explanatory diagram showing a use state of a conventional product.

[Explanation of symbols]

 1 Nozzle body 1a Spout port 1b Suction port 11 Hollow shaft 12 Head 12a Taper section 12b Suction hole for liquid recovery 13 Spline 14 Thread for partition wall 15 Thread for rear wall 16 Outlet 2 Outer cylinder 21 Screw part for front wall 22 Hole for ejection 23 Chamfer 7 Pump

Claims (3)

(57) [Claims] 1. A) A hollow shaft (11) provided with a liquid introduction spline (13) at an intermediate portion of the outer periphery has a suction hole (12b) for recovering a liquid inside and has a spline (13b) at the outer periphery. A head (12) having a tapered portion (12a) for diffusion is fixed, and a screw portion (1) for a rear wall is attached to the other end of the outer periphery of the hollow shaft (11).
5), a partition wall screw portion (14) is provided at an inner peripheral position at a predetermined distance from the rear wall screw portion (15), and a discharge port (16) is formed at an intermediate position. That the nozzle body (1) is formed. B) A front wall screw portion (21) is provided at one end of the outer periphery, and a jet hole (22) having a chamfer (23) is provided inside the other end to form a rectifying outer cylinder (2). That it was formed. C) The nozzle body (1) is inserted from the chamfer (23) side of the outer cylindrical body (2) and incorporated so that the flow rate can be adjusted. A high-speed plating nozzle having a jetting and sucking function, characterized in that it is configured as described above. 2. The high-speed plating nozzle having an ejection and suction function according to claim 1, wherein the nozzle body (1) and the outer cylinder (2) are integrally formed. 3. The high-speed plating nozzle having an ejection and suction function according to claim 1, wherein the spline (13) is removed from the nozzle body (1).