JP3057131B2 - Semiconductor power converter - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a semiconductor power converter, and more particularly, to a semiconductor power converter in which a plurality of units are connected to a common power supply.

[0002]

2. Description of the Related Art In an inverter in which a plurality of inverter units are connected to a common DC power supply, an arbitrary inverter unit is disconnected from the common power supply and then connected again to operate a load. Each inverter unit is provided with an initial charging circuit for a filter capacitor.

FIG. 9 is a cross-sectional view showing a state where an initial charging circuit is incorporated in an inverter unit 1 of a conventional inverter. In FIG. 9, a pair of contacts 7 is provided at the rear end of the inverter unit 1 housed in the box 3 so as to be able to be pulled out.
A, 7B are protruded rearward, and these contacts 7A, 7B
Are connected to DC common power supply buses 4A and 4B, which are arranged inside the box 3 in a vertically and parallel manner.

On the other hand, inside the inverter unit 1,
The inverter unit 12 including a plurality of switching elements whose details are omitted is housed therein, and the contacts 7 A and 7B are connected to the inverter unit 12.
(Not shown). The contact 7A is connected to the positive input terminal of the inverter 12 via the contactor 20 and a current limiting resistor 10 connected in parallel to the contactor 20, and the contact 7B is connected to the inverter 12 , And a filter capacitor 11 is connected in parallel between these input terminals. The output line on the AC side is connected to a connector (not shown) provided on the right side of the inverter unit 1.

In the inverter unit 1 configured as described above, when the inverter unit 1 is connected to the common power supply buses 4A and 4B, the contactor 20 is connected in advance.
Are connected in an open state, the inverter section 12 is energized through the current limiting resistor 10, the filter capacitor 11 is charged, and then the contactor 20 is turned on.

[0006]

However, in the inverter unit 1 configured as described above, the contactor 20
Therefore, the outer shape and weight of the inverter unit 1 increase, so that the outer shape of the box 3 also increases, and the installation area increases. for that reason,
If the contactor 20 is omitted, when the inverter unit 1 is connected to the common power supply buses 4A, 4B via the contacts 7A, 7B, the filter capacitor 11 is damaged by the current flowing into the filter capacitor 11. .

Therefore, when the inverter unit 1 is connected, a method of temporarily stopping a power supply device (not shown) connected to the common power supply buses 4A and 4B and gradually increasing the voltage may be considered. The load on the inverter units housed above and below must also be temporarily stopped. A method of gradually increasing the voltage inside each inverter unit 1 may be considered. However, this not only increases the outer shape of each inverter unit but also complicates the configuration.

SUMMARY OF THE INVENTION An object of the present invention is to provide a semiconductor power converter capable of connecting / disconnecting any semiconductor unit to / from a common power supply without increasing the outer shape and without stopping loads on adjacent semiconductor units. It is.

[0009]

Means for Solving the Problems The first aspect of the present invention, first juxtaposed first to second bus bars, first of toward and away from the plurality of semiconductor units via the second contact It is connected to a current limiting device between the single square of the first contact <br/> the semiconductor unit of the terminal, in the semiconductor power converting apparatus capacitor is connected between the single way and the other side of terminals of the semiconductor unit, the first Busbar
Juxtaposed the third bus connected to a third contact which opposed the third busbar is connected towards pieces of the semiconductor units of terminal
The provided wider than the gap between the third contact and the gap first and third bus, the first and second contacts, the second bus
The first and second contacts of the semiconductor unit are the first and second contacts.
In the charging position in contact with the second bus, the semiconductor unit
A lock mechanism for preventing the movement of the lock .

[0010] The invention according to claim 2 is provided side by side.
First, first, current-limiting element is connected between pieces square of the first contactor and the semiconductor unit of the terminal of the second contacts toward and away from the plurality of semiconductor units via the second bus and, a semiconductor power converting apparatus is single way and the capacitor between the other side of the terminal connected to the semiconductor unit, pieces of terminals of the semiconductor units
And the gap between the first common bus and the first common bus is
Third contact wider than the gap between the armature and the first and second busbars
The first and second semiconductor units are opposed to the first bus bar.
At the charging position where the contact of the contactor contacts the first and second buses.
And a locking mechanism for preventing movement of the semiconductor unit is provided .

[0011]

According to the first aspect of the present invention, when the semiconductor unit is inserted, the first and second contacts are brought into contact with the first and second contacts before the third contact comes into contact with the first bus bar. And the capacitor is charged by the voltage applied from the first and second buses via the current limiting element ,
After the lock mechanism is unlocked, the second and third contacts
1, completely connected to the second bus bar .

Further, in the invention according to claim 2,
When the semiconductor unit is inserted, the first and second contacts come into contact with the first and second buses before the third contact comes into contact with the third bus bar, and the capacitor is connected to the first and second bus bars. together when charged by a voltage applied through the second bus the current limiting element
Meanwhile, the first, second and third contacts are unlocked by the locking mechanism.
After that, it is completely connected to the first and second busbars .

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the semiconductor power converter of the present invention will be described below with reference to the drawings. 1 is a perspective view showing a semiconductor power converter of the present invention, FIG. 2 is a partially enlarged detailed perspective view of FIG. 1, and FIG. 3 is an exploded perspective view of FIG.

In FIG. 1, inside a box 3 constituting a semiconductor power conversion device, slide rails 2, which are not shown in detail on the left and right sides, are provided vertically at equal intervals in six stages .
An inverter unit 1 described later with reference to FIGS. 2 and 3 is mounted on these slide rails 2 and can be pulled out forward and backward.

At the rear of the inverter unit 1, a contact 7C of the same product as the contacts 7A, 7B is protruded to the right of the contacts 7A, 7B protruded as in the prior art. . Of these, the contacts 7A and 7B are directly connected to the input terminal of an inverter unit (not shown) of the inverter unit 1 as shown in FIGS. 5, 6 and 7 described later, and the contact 7C is connected to a current limiter (not shown). Connected to the positive input terminal via a resistor.

Further, common power supply buses 4A and 4B are vertically provided at the rear of the box 3 as in the prior art. Of these, the common power supply bus 4A is a partial cross section of the box 3 described later. 4, FIG. 5, FIG. 6, and FIG. 7, it is located slightly behind the common power supply bus 4B, and also on the right side of the common power supply bus 4A in FIG. As shown,
A third common power supply bus 4C is provided at the same position in the front-rear direction as the common power supply bus 4B, and the common power supply bus 4C is connected to the common power supply bus 4A.

2 and 3, strip-shaped support plates 5A and 5B are provided on the left and right sides of the upper surface of the inverter unit 1 so as to protrude therefrom. Similarly, strip-shaped front edge plates 6A and 6B are also protruded from the left and right ends of the front surface of the inverter unit 1. Of these, a rectangular guide hole 8 is formed in the front edge plate 6B.
A and 8B are formed vertically.

At the rear of the right side surface of the inverter unit 1, a rectangular thick plate support seat 17 is welded.
Is formed with a female screw hole 17a at the center thereof. Support seat
Below pin 17, pin 14 is located on the right side of inverter unit 1.
Are protruding.

[0019] the outer surface of the support seat 17, portions are overlapped after the out lever 9 provided on the right side of the inverter unit 1 via a distance piece 15 of the annular welded to the front end of the loading and unloading lever 9 The L-shaped handle 9a is attached to the front edge plate 6
As shown in FIG. 2, the guide hole 8A formed in the upper part of B penetrates and projects forward.

[0020] The part after the out lever 9, the pin holes 9b
There are formed, on the outer surface of the pin hole 9b, section after disconnection position releasing lever 13 is superimposed over the distance piece 15, a handle 13a which is welded to the front end of the disconnected position releasing lever 13, the front edge plate 6B, it protrudes forward through a guide hole 8B formed in the lower part of 6B.

A pin hole is provided at the rear end of the disconnection position release lever 13.
13b, the disconnector position release lever 13 and the insertion / removal lever 9 are provided with pin holes 9b, 13b formed at the rear ends thereof.
The shaft portion is inserted into the spacing pieces 15 on both sides of these, and the external thread portion at the tip is supported by the stepped pin 16 with a head screwed into the female screw hole 17a.

A small-diameter through-hole 9c is provided in the middle of the loading / unloading lever 9, and a small-diameter through-hole 13c is also provided in the middle of the disconnecting position release lever 13. The front end of the return spring 24 is locked in these through holes 9c and 13c, and the rear end of the return spring 24 is locked to the pin 14. Handle 9a of access lever 9 and handle 13a of disconnection position release lever 13
Is pressed against the lower ends of the guide holes 8A and 8B by the return force of the return spring 24.

At the front end of the lower surface of the loading / unloading lever 9, a groove 9 is provided.
d and 9e are formed in this order, and a groove 13d is also formed at the front end of the lower surface of the disconnection position release lever 13 so as to be located slightly behind the groove 9d when viewed from the right side. Box 3 shown in FIG.
The contacts 7A, 7B, 7 projecting from the rear of the inverter unit 1 inserted into the box 3
At the disconnection position where all of C are opposed to each other with a predetermined gap in front of the aforementioned common power supply buses 4A, 4B, 4C erected behind these contacts 7A, 7B, 7C,
An L-shaped lock plate 18 which is loosely fitted to the groove 13d of the disconnection position release lever 13 as described later is fixed.

Next, the operation of the semiconductor power converter having the inverter unit 1 will be described. FIG.
Fig. 3A is a diagram illustrating the state in which the inverter unit 1 is pulled out to a maintenance and inspection position in front of the box body 3 for maintenance and inspection, and is positioned by a stopper (not shown). In addition, the loading / unloading lever 9 and the disconnection position release lever 13 actually overlap as viewed from the right side as described above with reference to FIGS.

When the inverter unit 1 at the maintenance position is inserted, first, the lower portion of the slope behind the groove 13d of the disconnection position release lever 13 comes into contact with the upper surface of the lock plate 18 and slides. Further, the inverter unit 1 is inserted, and contacts 7B and 7C protruding rearward of the inverter unit 1 are provided.
When the gap between the rear common power supply buses 4B and 4C reaches a disconnection position at a predetermined distance determined by the voltage of the common power supply bus, the disconnection position is released as shown in the disconnection position (b) of FIG. The upper part of the lock plate 18 is loosely fitted in the groove 13d of the lever 13, and the inverter unit 1 stops.

When the inverter unit 1 at this disconnection position is further inserted, the handle 13a of the disconnection position release lever 13
Is lifted upward, the upper surface of the handle 13a is brought into contact with the upper end surface of the guide hole 8B to disengage the groove 13d from the lock plate 18, and the inverter unit 1 is inserted. Then, the lock plate 18 is inserted into the groove 9d formed at the lower end of the loading / unloading lever 9.
As shown in the initial charging position (c) of FIG. 4 , the loose fitting is performed, and the inverter unit 1 stops. As shown in FIG. 6, the tips of the contacts 7B and 7C are slightly fitted to the front ends of the common power supply buses 4B and 4C behind the contacts 7B and 7C, and a voltage is applied to the filter capacitor 11. This filter capacitor 11 is charged.

When the inverter unit 1 is further inserted and moved to the operating position shown in FIG.
The handle 9a of the handle 9a at the initial charging position (c) is lifted, and the upper surface of the handle 9a is brought into contact with the upper end face of the guide hole 8A to engage the groove 9d of the handle 9 with the lock plate 18. Remove and insert the inverter unit 1. Then, the contacts 7A, 7B, 7C are completely inserted into the common power supply buses 4A, 4B, 4C at predetermined contact pressures, respectively, as shown in FIG. 7, and as shown in the operation position (d) of FIG.
The upper portion of the lock plate 18 is loosely fitted in the groove 9e of the access lever 9, and the inverter unit 1 is locked. As a result, a switching element (not shown) incorporated in the inverter unit 12 of the inverter unit 1 is ignited, and the contact 7
A predetermined DC power is supplied from the common power supply buses 7A and 7B via A and 7B, and AC power is supplied to a load (not shown).

When the inverter unit 1 in the operating position is pulled out to the maintenance / inspection position via the disconnection position, the above-described operation is performed in reverse, but the drawer of the inverter unit 1 is L-shaped welded to the front end of the access lever 9. With the handle 9a.

Therefore, in the semiconductor power conversion device having the inverter unit 1 thus configured, when the inverter unit 1 is inserted, the inverter unit 1 is stopped once at the disconnection position, and at the charging position, the transfer lever 9 and the lock plate 18 are connected. After being further stopped by the engagement, it is inserted into the operation position and connected to the power source, so that the filter capacitor 11 can be prevented from being damaged. Therefore, any inverter unit stored in the box 3 can be pulled out.

The insertion / removal lever 9, the disconnection position release lever 13, the return spring 24, and the lock plate 18 for locking the respective insertion positions are used to connect the inverter unit 1 to the slide rail 2.
Can be accommodated in the lower part of the support plate 5B so that it is not necessary to increase the outer shape of the inverter unit 1 and also because the contactor is not mounted unlike the conventional inverter unit. Small type
The weight can also be reduced.

FIG. 8 is a diagram showing another embodiment of the semiconductor power converter of the present invention, and corresponds to FIG. In FIG. 8, a guide plate 24 protrudes from the inside of the right side surface of the box 3, and a female screw is formed on the guide plate 24 in the front-rear direction.

On the other hand, a support 21 protrudes from the front end of the right side surface of the inverter unit 1.
Is pierced and fixed. A hexagon socket head cap screw 19 having a nominal diameter of 16 is screwed into the nut 21a from the front.

In a semiconductor power converter incorporating the inverter unit 1 configured as described above, FIG.
When the inverter unit 1 at the maintenance inspection position (a) is inserted, the front end of the hexagon socket head cap screw 19 is formed on the guide plate 24 just before the disconnection position (b) and fits into the screw hole. One side of the handle for insertion and removal is fitted to the head of the hexagon socket head cap screw 19, and the handle 13a of the disconnection position release lever 13 is lifted with the left hand to rotate the handle to the right. Then, the tip of the hexagon socket head bolt 19 is the guide plate
Since it is formed in 24, it is screwed into the screw hole and a hexagon socket head bolt
The inverter unit moves backward together with 19, and stops at the initial charging position shown in FIG.

At the time of insertion from the initial charging position to the operation position, the handle of the insertion / exit lever 9 is lifted and the handle for insertion / exit is rotated to the right, so that the hexagon socket head cap screw 19 is screwed into the guide plate 24. The inverter unit 1 is inserted, and the contacts 7A, 7B, 7C are completely connected to the common power supply buses 4A, 4B, 4C at a predetermined contact pressure.

In this case, when the contacts 7A, 7B, 7C are inserted into the common power supply buses 4A, 4B, 4C when the contacts 7A, 7B, 7C are inserted from the initial charging position to the operating position, a sudden increase in insertion resistance is prevented. , Can be easily fitted.

In the above-described embodiment, only the common power supply bus 4A of the common power supply buses 4A, 4B, and 4C is positioned rearward to delay the time of contact with the contact 7A. The power supply bus 4A may also be located at the same position as the other common power supply buses 4B and 4C, and the contact portion of the contact 7A may be located forward instead.

5, FIG. 6, and FIG. 7, FIG.
The common power supply bus 4C is omitted, the common power supply bus 4A is set to the same position as the common power supply bus 4B, and the contact 7
A is shortened (or contacts 7B and 7C are extended), and contact 7
By providing C at the top or bottom of the contact 7A (that is, in the direction perpendicular to the paper surface in FIGS. 5 to 7), the timing of connection between the contact 7A and the other contacts 7B and 7C may be changed. In this case, two common power supply buses can be used as in the conventional case.

Further, in the above-described embodiment, the description has been made of an example in which the common power supply buses 4A, 4B, and 4C having the same length are provided between the upper part and the lower part of the box body 3. Only the portion where the child 7A fits may be connected and fixed to the common power supply bus 7C with a U-shaped connection conductor, or vice versa. Further, the common power supply buses 4A and 4C may be formed as an integral product bent in a U-shape.

In the above embodiment, the unit housed in the box 3 so as to be able to be pulled out is described as an inverter unit.
The present invention can be applied to any semiconductor power conversion device in which a unit to be connected / disconnected to a common power supply bus in the box is housed so as to be able to be pulled out.

[0040]

As described above, according to the present invention, it is possible to obtain a semiconductor power converter capable of connecting / disconnecting any semiconductor unit without increasing the external shape and without stopping the load on the adjacent semiconductor unit. it can.

[Brief description of the drawings]

FIG. 1 is a perspective view showing one embodiment of a semiconductor power conversion device of the present invention.

FIG. 2 is a partially enlarged detailed view showing one embodiment of the semiconductor power conversion device of the present invention.

FIG. 3 is a partially exploded perspective view showing one embodiment of the semiconductor power conversion device of the present invention.

FIG. 4 is a right side view showing the operation of the semiconductor power conversion device of the present invention.

FIG. 5 is a partial cross-sectional view showing an operation of the semiconductor power conversion device according to the present invention which is different from that of FIG. 4;

FIG. 6 is a partial cross-sectional view showing an operation of the semiconductor power conversion device according to the present invention, which is different from FIGS. 4 and 5;

FIG. 7 is a partial cross-sectional view of the semiconductor power conversion device according to the present invention, showing an operation different from those in FIGS. 4, 5, and 6;

FIG. 8 is a right side view showing another embodiment of the semiconductor power conversion device of the present invention.

FIG. 9 is a cross-sectional view showing a conventional semiconductor power converter.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Inverter unit, 2 ... Slide rail, 3 ... Box, 4A, 4B, 4C ... Common power supply bus, 5A, 5B ... Support plate, 6A, 6B ... Front edge plate, 7A, 7B, 7C ... Contact, 8A , 8B: guide hole, 9: access lever, 10: current limiting resistor, 11: filter capacitor, 12: inverter part, 13: disconnection position release lever, 14: pin, 15: spacing piece,
16 ... stepped pin with head, 17 ... support seat, 18 ... lock plate.

Claims (2)

(57) [Claims] The semiconductor device according to claim 1, wherein said first contact and a plurality of semiconductor units are connected to and separated from said juxtaposed first and second bus bars via first and second contacts. a unit connected to current limiting element between the pieces square of terminals of the semiconductor power converting apparatus capacitor is connected between the single way <br/> other side of the semiconductor unit of the terminal, connected to said first bus bar A third bus
And set, which is connected towards pieces of terminals of the semiconductor units
A third contact opposite to the third bus bar is provided.
Wherein the gap between the the contactor third bus first, the second contact elements first, wider than the gap between the second bus, before
The first and second contacts of the semiconductor unit are
1, at the charging position in contact with the second bus,
A semiconductor power conversion device comprising a lock mechanism for preventing movement of a body unit . 2. A first juxtaposed first to the second bus, the semiconductor and the first contact before <br/> Symbol of toward and away from the plurality of semiconductor units via the second contact current limiting element is connected between the single square units terminals, the semiconductor power converting apparatus capacitor is connected between the single way <br/> other side of terminals of said semiconductor units, one of terminals of the semiconductor units Connected to
The gap between the first bus and the first and second contacts is
A third contact that is wider than the gap between the first and second busbars
Opposite to the first bus, and
The first and second contacts are in contact with the first and second busbars.
Preventing movement of the semiconductor unit in the electrical position
A semiconductor power conversion device comprising a locking mechanism .