JP3055256U - Heat sink mounting device - Google Patents

Abstract

(57) [Problem] To provide a mounting device for mounting on a heat sink such as an IC device, wherein the mounting and dismounting of the heat sink is easier than before and the manufacturing cost can be reduced. A heat sink mounting device (1) includes an upper surface portion (1c).
And both side portions 1d and 1e. The upper surface portion 1c has slopes 1i and 1h provided with through holes 1a and 1b, and the tip portions of both side surface portions 1d and 1e have claw portions 1f and 1g protruding inward. When fixing the heat sink to the heat sink, the heat sink is pressed into contact with the upper surface part 1c, the tip of the jig is inserted into the through holes 1a and 1b, and the inclined surface is pressed, so that the claw is provided in the locking hole provided in the heat sink. Lock and secure the part. When removing the heat sink from the radiator plate, the claws 1f, 1g are removed from the locking holes of the radiator plate by pushing the inside of the side surfaces 1d, 1e through the through holes 1a, 1b.

Description

[Detailed description of the invention]

[0001]

[Technical field to which the invention belongs]

 The present invention relates to a heat sink mounting device for mounting a heat sink on a heat sink such as an integrated device (hereinafter referred to as an “IC device”).

[0002]

[Prior art]

 After attaching the heat sink to the heat sink of an IC device, if the IC device breaks down and needs to be replaced, for example, the heat sink must also be removed from the heat sink. In such a case, it is required that the work proceed quickly and easily. FIG. 4 is a perspective view showing an example of a conventional heat sink mounting device. The heat sink mounting device 10 has both side surfaces 10c and 10d formed by bending both ends of the elastic plate, and has claw portions 10g and 10h at the tips of the both side surfaces 10c and 10d. Raised portions 10e and 10f are provided at substantially the centers of both side portions 10c and 10d, respectively. The upper surface has slopes 10a and 10b.

FIG. 5 is a partial cross-sectional view showing a state in which a heat sink is attached to a heat sink by the heat sink attaching device of FIG. With the heat sink 11 held by the bottom surface of the upper surface of the heat sink mounting device, the slopes 10a and 10b are pushed by a driver or the like from the direction A in FIG. Engage. When removing the heat sink from the IC radiator plate 12, the tip of a driver or the like is hooked below the rising portions 10e and 10f from the direction B in FIG. Release the engagement of 10h and remove it.

[0004]

[Problems to be solved by the invention]

 In the above heat sink mounting device, there is a problem that the tip of the jig is easy to slip and is difficult to mount since the slope of the upper surface is pressed by a mounting jig such as a screwdriver. Also, when removing the jig, a large force was required because the tip of the jig was hooked on the rising part and pushed up. Furthermore, in the manufacturing process of the mounting device, a step of forming a rising portion is required, so that the number of manufacturing steps increases, and it is required to reduce the number of steps in order to reduce costs. SUMMARY OF THE INVENTION It is an object of the present invention to provide a heat sink mounting device for mounting to a heat sink such as an IC device, which can easily mount and remove a heat sink as compared with the conventional one and can reduce the manufacturing cost.

[0005]

[Means for Solving the Problems]

 In order to achieve the above object, a heat sink mounting device according to the present invention is a mounting device for fixing a heat sink to a heat radiating plate such as an IC device, wherein an elastic body formed by bending both end portions to form an upper surface portion and both side surface portions, The upper surface has one or more bent portions to form a slope, a through hole is formed in the upper surface not in contact with the heat sink, and a claw protruding inward at the tip of each of the side surfaces. When fixing the heat sink to the heat sink, the heat sink is pressed into contact with the upper surface, the tip of the jig is inserted into the through hole, and the slope is pressed. When the heat sink is removed from the radiator plate, the claw portion is detached from the lock hole of the radiator plate by pushing the inside of the side surface portion through the through hole. It is composed. The through hole in the upper surface is formed on a slope. The through hole may have a round shape, an oval shape, a rectangular shape, or a polygonal shape.

[0006]

[Action]

 According to the above configuration, the number of manufacturing steps is reduced, the cost is reduced, and the attachment and detachment of the heat sink is facilitated.

[0007]

[Embodiment of the invention]

 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings and the like. FIG. 1 is a perspective view showing an embodiment of a heat sink mounting apparatus according to the present invention. The heat sink mounting device 1 includes an upper surface 1c and both side surfaces 1d and 1e. The upper surface 1c is bent at the bent portions 1k and 1l to form slopes 1h and 1i. The slopes 1h and 1i are provided with round through holes 1a and 1b. Claws 1f, 1g protruding inward are provided at the tips of the side surfaces 1d, 1e. The material of the heat sink mounting device 1 is an elastic member. When the slopes 1h and 1i are pressed, the slopes 1h and 1i and the side surfaces 1d and 1e are deformed, and the claw portions 1f and 1g are engaged with the locking holes of the heat radiation plate 3. 3a and 3b (see FIG. 2).

FIG. 2 is a partial cross-sectional view for explaining a method of mounting the heat sink mounting device of FIG. Engagement holes 3a, 3b for engaging the claws 1f, 1g of the heat sink mounting device 1 are provided on the heat sink 3 of the IC device. The heat sink 2 is mounted at a predetermined position on the heat radiating plate 3, and the heat sink surface is held from above by pressing the heat sink surface with the bottom surface of the upper surface 1 c. Then, the claw portions 1f and 1g of the heat sink mounting device 1 are positioned in the engagement holes 3a and 3b, and the tip of a jig 4 such as a driver is inserted into the through hole 1b. Since the tip 5b of the jig 4 has a conical shape and the bottom diameter of the cone is larger than that of the through holes 1a and 1b, it does not penetrate and stops in the middle of the cone. When the driver 4 is pressed downward as shown by the arrow 5, the projection 1g-1 of the claw 1g slides on the inner wall of the locking hole 3b, penetrates the locking hole 3b, and locks on the back surface of the heat sink 3. I do.

FIG. 3 is a partial cross-sectional view for explaining a method of removing the heat sink mounting device of FIG. Using a jig 6 in which the outer diameter of the tip 6a is smaller than the diameter of the through holes 1a, 1b, the jig 6 is first inserted into one of the through holes 1b, hits the inner surface of the side surface 1e, and is pushed in the direction of arrow 7. The side surface portion 1e bends outward and the claw portion 1g comes off the locking hole 3b, so that the side surface portion 1e can be removed from the locking hole 3b by lifting it upward. Similarly, the tip 6a of the jig 4 can be inserted into and removed from the through hole 1a. If the removal of one side also removes the other, the removal work will end at that point.

In the above embodiment, the through hole has an example of a round shape. However, the shape may be another shape, and may be an ellipse, a polygon such as an ellipse or a square.

[0011]

[Effect of the invention]

 As described above, according to the present invention, the tip of the jig such as a screwdriver does not slip when the heat sink is attached, and the tip can be securely held in the through hole, so that the heat sink can be easily attached to the heat sink. Can be. If it becomes necessary to remove the heat sink, it can be easily removed with a small force by inserting the tip of a screwdriver or the like into the through hole and pressing the side part outward. In the manufacturing process, there is no extra bending step of the rising portion as compared with the conventional method, and the manufacturing cost is reduced.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an embodiment of a heat sink mounting device according to the present invention.

FIG. 2 is a partial cross-sectional view for explaining a method of mounting the heat sink mounting device of FIG. 1;

FIG. 3 is a partial cross-sectional view for explaining a method of removing the heat sink mounting device of FIG. 1;

FIG. 4 is a perspective view showing an example of a conventional heat sink mounting device.

FIG. 5 is a partial cross-sectional view showing a state where a heat sink is attached to a heat sink by the heat sink attaching device of FIG. 4;

[Explanation of symbols]

 1, 10 heat sink mounting device 1a, 1b through hole 1c top surface 1d, 1e side surface 1f, 1g claw portion 1i, 1h inclined surface 2, 11 heat sink 3, 12 heat sink 3a of IC device , 3b ... locking holes 4, 6 ... jigs such as screwdrivers 5 ... arrows 12a, 12b ... fitting holes

Claims (3)

[Utility model registration claims] 1. A mounting device for fixing a heat sink to a heat sink such as an IC device, wherein the elastic member is formed by bending both ends and having an upper surface portion and both side surface portions, wherein the upper surface portion has one or more bent portions. When forming a slope and forming a through hole in the upper surface portion that does not contact the heat sink, and having a claw portion projecting inward at the tip of the both side surface portions, when fixing the heat sink to the heat sink, A heat sink is pressed into contact with the upper surface, the tip of a jig is inserted into the through hole, and a slope is pressed to lock the claw portion in a locking hole provided in the heat sink. The heat sink mounting device is characterized in that the claw portion is detached from the locking hole of the heat sink by pushing the inside of the side portion through the through hole when removing. 2. The heat sink mounting device according to claim 1, wherein the through hole in the upper surface is formed on a slope. 3. The heat sink mounting apparatus according to claim 1, wherein said through hole has a round shape, an elliptical shape, a rectangular shape, or a polygonal shape.