JP3054838U - Non-contact type metal surface measuring device - Google Patents

Non-contact type metal surface measuring device

Info

Publication number
JP3054838U
JP3054838U JP1998004640U JP464098U JP3054838U JP 3054838 U JP3054838 U JP 3054838U JP 1998004640 U JP1998004640 U JP 1998004640U JP 464098 U JP464098 U JP 464098U JP 3054838 U JP3054838 U JP 3054838U
Authority
JP
Japan
Prior art keywords
light
image
article
laser
light receiving
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1998004640U
Other languages
Japanese (ja)
Inventor
敏昭 青山
寿美雄 酒井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyowakiden Industry Co Ltd
Original Assignee
Kyowakiden Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyowakiden Industry Co Ltd filed Critical Kyowakiden Industry Co Ltd
Priority to JP1998004640U priority Critical patent/JP3054838U/en
Application granted granted Critical
Publication of JP3054838U publication Critical patent/JP3054838U/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Abstract

(57)【要約】 【課題】 小さな撮像装置で確実に検査レーザー光の反
射光を捕捉して反射光の状態を電気信号として出力で
き、しかも安価である非接触型金属表面検査装置を提供
する。 【解決手段】 被検査物品Bに向けて投光する半導体レ
ーザー1と、同半導体レーザーのレーザー光Lの物品表
面からの反射光Rを受光する半透明のスクリーンの受光
面2と、同受光面の受光像を撮像して画像を電気信号と
して出力するCCDカメラである撮像装置4と、同撮像
装置4の画像信号を入力して物品の表面状態を分析する
コンピュータを用いた画像分析装置5とからなる。
PROBLEM TO BE SOLVED: To provide an inexpensive non-contact metal surface inspection apparatus capable of reliably capturing reflected light of an inspection laser beam with a small imaging device and outputting the state of the reflected light as an electric signal, and being inexpensive. . SOLUTION: A semiconductor laser 1 that projects light toward an article to be inspected B, a light receiving surface 2 of a translucent screen that receives a reflected light R of a laser beam L of the semiconductor laser from the surface of the object, and the same light receiving surface An imaging device 4 that is a CCD camera that captures a received light image and outputs the image as an electric signal; and an image analysis device 5 that uses a computer that inputs the image signal of the imaging device 4 and analyzes the surface state of the article. Consists of

Description

【考案の詳細な説明】[Detailed description of the invention]

【0001】[0001]

【考案の属する技術分野】[Technical field to which the invention belongs]

本考案は、金属等の表面の傷・表面粗さ・凹凸・汚れ等を検査する非接触型金 属表面計測装置であり、特に金属の成形加工における傷の検出に有用である。 INDUSTRIAL APPLICABILITY The present invention is a non-contact metal surface measuring device for inspecting scratches, surface roughness, irregularities, dirt, and the like on the surface of a metal or the like, and is particularly useful for detecting a scratch in a metal forming process.

【0002】[0002]

【従来の技術】[Prior art]

従来の非接触型金属表面計測装置は、光を物品の表面に投光し、その表面の反 射光を受光素子(フォトカプラ)で受け、その受光位置から反射光の反射角を割 り出し、この反射角から物品の表面の状態を判断している。 しかしながら、この従来では、物品の表面状態によって、大きく反射光が拡が っていくものでは大きな受光素子(フォトカプラ)でなければ反射光を捕捉でき ないようになり、大型の受光素子(フォトカプラ)が必要となり、高価になるも のであった。 Conventional non-contact metal surface measuring devices project light onto the surface of an article, receive the reflected light from the surface with a light receiving element (photocoupler), calculate the reflection angle of the reflected light from the light receiving position, The state of the surface of the article is determined from the reflection angle. However, in this conventional method, if the reflected light spreads greatly depending on the surface condition of the article, the reflected light cannot be captured unless a large light receiving element (photocoupler) is used. ) Was required, and it was expensive.

【0003】[0003]

【考案が解決しようとする課題】[Problems to be solved by the invention]

本考案が解決しようとする課題は、従来のこれらの問題を解消し、小さな撮像 装置で確実に検査のレーザー光の反射光を捕捉して反射光の状態を電気信号とし て出力でき、しかも、安価に製作できる非接触型金属表面検査装置を提供するこ とにある。 The problem to be solved by the present invention is to solve these conventional problems and to reliably capture the reflected light of the inspection laser light with a small imaging device and output the state of the reflected light as an electric signal. An object of the present invention is to provide a non-contact metal surface inspection device that can be manufactured at low cost.

【0004】[0004]

【課題を解決するための手段】[Means for Solving the Problems]

かかる課題を解決した本考案の構成は、 1) 物品の表面に向けて投光するレーザーと、同レーザーのレーザー光の物品 表面からの反射光を受光する受光面と、同受光面の受光像を撮像して画像を電気 信号として出力する撮像装置とからなる非接触型金属表面計測装置 2) レーザーが半導体レーザーで、又受光面が背面から受光像を観察できる半 透明のスクリーンであって、しかも撮像装置がスクリーンの背面を撮像するCC Dカメラである前記1)記載の非接触型金属表面計測装置 3) 受光面の前面にレーザー光のみを透過させる干渉フィルターを設けた前記 1)又は2)記載の非接触型金属表面計測装置 4) 装置に物品の表面に沿って走行するローラーを設けた前記1)〜3)何れ か記載の非接触型金属表面計測装置 にある。 The configuration of the present invention that solves the above problems is as follows: 1) a laser that emits light toward the surface of the article, a light receiving surface that receives the laser light of the laser reflected from the surface of the article, and a light receiving image of the light receiving surface. Non-contact type metal surface measuring device consisting of an imaging device that captures an image and outputs an image as an electric signal 2) A semi-transparent screen whose laser is a semiconductor laser and whose light-receiving surface is capable of observing a light-receiving image from behind. Moreover, the non-contact type metal surface measurement device according to the above 1), wherein the imaging device is a CCD camera that captures an image of the rear surface of the screen. 3) The above 1) or 2 wherein an interference filter that transmits only laser light is provided on the front surface of the light receiving surface. 4) The non-contact metal surface measuring apparatus according to any one of 1) to 3) above, wherein the apparatus is provided with a roller that runs along the surface of the article.

【0005】[0005]

【作用】[Action]

本考案では、レーザーから投光した光は物品の表面でその表面状態(傷・粗さ ・凹凸・汚れ等)に応じて反射の具合、反射方向が異なってくるが、その反射光 は受光面で受光される。反射光の拡がりが大きい場合受光面を大きくすれば安価 に且つ確実に反射光を捕捉できる。反射光は受光面に当って物品の表面状態に応 じた光の像を作り出す。この受光面の光の像を撮像装置が撮影して電気信号に変 換し、コンピューター等によって画像処理して表面状態を解析する。又は撮像装 置の画像をディスプレイによって再生して作業者が視覚的に見て表面状態を判断 する。 又受光面の前にレ−ザ−光の波長の光のみを透過させる干渉フィルタ−を設け れば、太陽光・室内光、その他の光源からの光を遮断でき、正確なレ−ザ−反射 光のみの光の像とすることができ、正確な分析・判断が行える。 更に、装置にローラーを取付ければ物品の表面に沿って走行でき、物品の広い 表面の計測を行えるようになる。 In the present invention, the light emitted from the laser is reflected on the surface of the article according to the surface condition (scratch, roughness, unevenness, dirt, etc.) and the reflection direction is different. Is received at. If the spread of the reflected light is large, the reflected light can be reliably and inexpensively captured if the light receiving surface is enlarged. The reflected light impinges on the light receiving surface to create a light image corresponding to the surface condition of the article. The image of the light on the light receiving surface is captured by an imaging device, converted into an electric signal, and processed by a computer or the like to analyze the surface state. Alternatively, the image of the imaging device is reproduced on a display, and the operator visually judges the surface condition. If an interference filter is provided in front of the light receiving surface to transmit only light of the wavelength of laser light, sunlight, room light, and other light from other light sources can be blocked, and accurate laser reflection can be achieved. An image of only light can be obtained, and accurate analysis and judgment can be performed. Furthermore, if a roller is attached to the device, it can travel along the surface of the article, and can measure a wide surface of the article.

【0006】[0006]

【考案の実施の形態】[Embodiment of the invention]

本考案のレーザーとしては、半導体レーザーが小型で安価であって好ましい。 又、受光面は反射光を受光して背面からその受光像を観察できる半透過型のスク リ−ンが背面からの撮像が行えるので撮像装置の位置が容易となる。 又、装置にローラーを設けるのが物品表面上を走行でき且つ半導体レーザーと 表面までの距離を一定に規制できるので好ましい。 更に受光面の前にレーザー光のみを透過させる光フィルタ−、干渉フィルタ− を設けるのが好ましい。 撮像装置の画像信号は、コンピュータでプログラムソフト処理して、表面の状 態を解析することが、自動検査が行え、大量生産の品質管理上好ましい。 レーザー光と物品の表面との距離は、レーザー及び検査する物品の表面状態に よって異なるが、半導体レーザーの場合10cm程が実用的である。 As the laser of the present invention, a semiconductor laser is preferable because it is small and inexpensive. In addition, since the transmissive screen which can receive the reflected light and observe the received light image from the back surface can perform the image pickup from the back surface, the position of the image pickup device becomes easy. Also, it is preferable to provide a roller in the apparatus because the apparatus can run on the surface of the article and the distance between the semiconductor laser and the surface can be regulated at a constant level. Further, it is preferable to provide an optical filter and an interference filter for transmitting only the laser light in front of the light receiving surface. It is preferable from the viewpoint of quality control of mass production that the image signal of the imaging device be processed by a computer using a software program to analyze the state of the surface so that the automatic inspection can be performed. The distance between the laser beam and the surface of the article depends on the laser and the surface condition of the article to be inspected, but about 10 cm is practical for a semiconductor laser.

【0007】[0007]

【実施例】【Example】

以下、本考案の実施例を図面に基づいて説明する。 図1は実施例の縦断面図である。 図2は、実施例の側面図である。 図3は、実施例の測定状態を示す説明図である。 図4は、実施例の測定状態を示す説明図である。 図5は、実施例の測定の説明図である。 図中、1は物品Bの表面Fから10cm程離した赤色の半導体レーザー、2は 半透過性で受光点が背面から観察できるスクリ−ンの受光面、3は受光面2の前 に置いた赤色のレーザー光のみを通過させる干渉フィルタ−、4は受光面2の光 の像を背面から撮影する2次元CCDカメラの撮像装置、5は同撮像装置の画像 信号をコンピュータで画像処理・分析する画像分析装置、6は装置ケーシング、 7は走行用ローラー、4は支持脚である。 又、5a〜5fは画像分析装置5の構成部分で、5aはCPU、5bは処理プ ログラムソフト及び代要データを記憶しているROM、5cはRAM、5dはデ ィスプレイ、5eはキ−ボ−ド、5fはインタ−フェ−スである。 Aは実施例の非接触型金属表面計測装置、Bは物品、Fは物品Bの表面、Dは 表面Fの傷、Gは受光面2の受光像、Rはレーザー光の反射光、Lは半導体レー ザー1のレーザー光である。 この実施例では、半導体レーザー1から赤色のレーザー光が投光され、物品B の表面Fで反射し、その反射光Rは干渉フィルタ−5を通過し広い面積の受光面 2により受光される。受光面2に映出される光の像を後方の2次元CCDカメラ の撮像装置4で撮像し、画像分析装置5へ出力される(図1,5参照)。 受光面2の受光像Gは、物品Bの表面Fに傷・汚れがなく滑らかであれば、レ ーザー光の反射光Rの反射角は一定して一直線となる。 物品Bの表面Fに傷・凹凸又は粗さがあれば反射光Rはその方向が変わって受 光面2の受光像Gは変わる。 例えば図3は、物品Bの表面Fに押し出し加工の浅い傷D(図3(a),(b )参照)が存在する場合の例で、反射光Rは表面Fの傷Dによって反射する位置 が変わり、受光面2の受光像Gは巾L1 のある薄いレンズ状となる(図3(c) 参照)。 図4は、物品Bの表面Fに押し出し加工の深い傷D(図4(a),(b)参照 )が存在する場合の例で、反射光Rの拡がりは大きく、受光面2の受光像Gは図 4(c)の如く巾L2 厚いレンズ状となる。装置はローラ7で押し出し方向の直 交する方向に走行させて、物品の巾全部を検査する。 これらの受光板2の受光像Gはスクリーンの受光面2の背後の上方に置かれた 2次元CCDカメラの撮像装置4で撮像され、電気信号として画像分析装置5へ 入力され、同画像分析装置5によって受光像の状態から、傷の有無・傷の深さと を計算する。計算と分析はROM5bに記憶された処理プログラムソフトがCP U5aで実行され、下記の計算と処理がなされる。粗さ変換値及び粗さパラメ− タとしての算術平均粗さ(Ra)、最大高さ(Ry)、十点平均粗さ(Rz)が計 算される。これらの値と実際の表面Fの状態との対応性は実験又は計算によって 予め決めていて、ROM5b内に記憶して、軽測値と照合されて表面の状態を判 定するようにしている。これらの結果は遠隔のディスプレイ5dで表示され、そ の表面状態のデータ及び評価が出力され、品質管理のデータとされる。 (1)粗さ変換値 σ の演算 受光板の受光像は輝度値として2次元CCDカメラの全画素が各々階調データ に変換する。この時の全画素の階調データの総和を S とし、縦一列(n列) 各々に足した階調データを A(1・・・n)と算出し、その最大値を δ1( 縦の比)とする。また、Sをδ1で除算した値を δw(横の比)とする。 δ1 = A(1・・・n)の最大値 δw = S / δ1 この δ1、δw の比を δ として算出する。 δ は2次元CCDカメ ラで受光した輝度分布の縦横比であり、この δ を尖鋭度と仮定する。 δ = δ1 / δw その他の演算定数として、測定分解能を j 、金属材質や表面処理材の有無 による換算定数を k とすると粗さ変換値 σ は尖鋭度にj、kを乗算して 下式で表される。 σ = δ × j × k (2)粗さパラメータの演算 代表的な粗さパラメータの算術平均粗さ(Ra)、最大高さ(Ry)、十点平 均粗さ(Rz)の演算式は任意の測定長さの範囲で算出したN個のσの値で下記 の項目から求める。 N : 測定回数(サンプリング値) σp : 最も大きいσの値 σv : 最も小さいσの値 σpi: σの全平均値からみて大きい順に5番目までの値の平均値 σvi: σの全平均値からみて小さい順に5番目までの値の平均値 Ra = (1/N)×Σ(σ) Ry = σp − σv Rz = (1/5)Σ(σpi)+(1/5)Σ(σvi) 以上、、、式により代表的な粗さパラメータに換算する事ができる。Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a longitudinal sectional view of the embodiment. FIG. 2 is a side view of the embodiment. FIG. 3 is an explanatory diagram illustrating a measurement state of the example. FIG. 4 is an explanatory diagram illustrating a measurement state in the example. FIG. 5 is an explanatory diagram of the measurement in the example. In the figure, 1 is a red semiconductor laser about 10 cm away from the surface F of the article B, 2 is a light-receiving surface of a screen which is semi-transmissive and a light-receiving point can be observed from the back, and 3 is placed in front of the light-receiving surface 2. An interference filter that allows only red laser light to pass through, 4 is an imaging device of a two-dimensional CCD camera that captures the light image of the light receiving surface 2 from the back, and 5 is a computer that processes and analyzes image signals of the imaging device. An image analysis device, 6 is a device casing, 7 is a traveling roller, and 4 is a support leg. 5a to 5f are components of the image analyzer 5, 5a is a CPU, 5b is a ROM for storing processing program software and substitute data, 5c is a RAM, 5d is a display, and 5e is a keyboard. -5d is an interface. A is a non-contact type metal surface measuring device of the embodiment, B is an article, F is a surface of the article B, D is a scratch on the surface F, G is a light receiving image of the light receiving surface 2, R is a reflected light of a laser beam, and L is a reflected light of a laser beam. This is the laser light of the semiconductor laser 1. In this embodiment, a red laser beam is emitted from the semiconductor laser 1 and reflected on the surface F of the article B, and the reflected light R passes through the interference filter 5 and is received by the light receiving surface 2 having a large area. An image of the light projected on the light receiving surface 2 is picked up by an image pickup device 4 of a rear two-dimensional CCD camera and output to an image analyzer 5 (see FIGS. 1 and 5). If the light-receiving image G of the light-receiving surface 2 is smooth without any damage or dirt on the surface F of the article B, the reflection angle of the reflected light R of the laser light is constant and straight. If the surface F of the article B has flaws, irregularities, or roughness, the direction of the reflected light R changes and the light receiving image G on the light receiving surface 2 changes. For example, FIG. 3 shows an example in which there is a shallow extruded scratch D (see FIGS. 3 (a) and 3 (b)) on the surface F of the article B, and the reflected light R is reflected by the scratch F on the surface F. changes, receiving image G of the light receiving surface 2 is a thin lenticular with a width L 1 (see Figure 3 (c)). FIG. 4 shows an example in which a deep flaw D (see FIGS. 4 (a) and 4 (b)) of the extrusion process exists on the surface F of the article B. The spread of the reflected light R is large, and the light receiving image of the light receiving surface 2 is obtained. G has a lens shape having a width L 2 thick as shown in FIG. The apparatus is driven by rollers 7 in a direction orthogonal to the extrusion direction to inspect the entire width of the article. The light-receiving images G of these light-receiving plates 2 are picked up by an image pickup device 4 of a two-dimensional CCD camera placed above the light-receiving surface 2 of the screen and input to the image analysis device 5 as electric signals. From 5, the presence or absence of a flaw and the depth of the flaw are calculated from the state of the received light image. The calculation and analysis are executed by the CPU 5a by the processing program software stored in the ROM 5b, and the following calculation and processing are performed. The arithmetic average roughness (Ra), maximum height (Ry), and ten-point average roughness (Rz) are calculated as the roughness conversion value and the roughness parameter. The correspondence between these values and the actual state of the surface F is determined in advance by experiment or calculation, and is stored in the ROM 5b and collated with the light measurement value to determine the state of the surface. These results are displayed on the remote display 5d, and the data and evaluation of the surface state are output to be used as quality control data. (1) Calculation of roughness conversion value σ The light receiving image of the light receiving plate is converted into gradation data by each pixel of the two-dimensional CCD camera as a luminance value. The total sum of the gradation data of all pixels at this time is S, the gradation data added to each of the vertical columns (n columns) is calculated as A (1... N), and the maximum value is δ1 (vertical ratio ). The value obtained by dividing S by δ1 is defined as δw (horizontal ratio). δ1 = A (1... n) maximum value δw = S / δ1 The ratio between δ1 and δw is calculated as δ. δ is the aspect ratio of the luminance distribution received by the two-dimensional CCD camera, and δ is assumed to be sharpness. δ = δ1 / δw As other operation constants, if the measurement resolution is j and the conversion constant depending on the presence or absence of metal material or surface treatment material is k, the roughness conversion value σ is obtained by multiplying the sharpness by j and k and expressed. σ = δ × j × k (2) Calculation of roughness parameter The arithmetic expressions of the arithmetic average roughness (Ra), maximum height (Ry), and ten-point average roughness (Rz) of typical roughness parameters are as follows. It is obtained from the following items using N σ values calculated within the range of an arbitrary measurement length. N: Number of measurements (sampling value) σp: Largest σ value σv: Smallest σ value σpi: Average value of up to the fifth value from the total average value of σ σvi: Total value of σ Average value of up to the fifth value in ascending order Ra = (1 / N) × Σ (σ) Ry = σp−σv Rz = (1/5) Σ (σpi) + (1/5) Σ (σvi) ,, Can be converted to typical roughness parameters.

【0008】[0008]

【考案の効果】[Effect of the invention]

以上の様に、本考案によれば物品の表面状態を投光したレーザー光を受光面で 一度受光し、それを撮像装置で画像入力することで反射光の拡がりがあっても安 価な受光面のみを広くするのみで対応できるので、確実に反射光を捕捉して表面 状態を検査できる。又広い受光範囲の大型の撮像装置を必要としないので、装置 コストは安価にできる。ローラーで物品を走行できるものでは巾広い物品の表面 状態を検査できる。更に、干渉フィルターを取付けたものではレーザー光のみを 受光面に受光させることで、室内の照明光・太陽光によって受光像が不鮮明とな ったり、不確実になることもない。 As described above, according to the present invention, the laser light that illuminates the surface state of the article is received once on the light receiving surface, and the image is input by the image pickup device, so that even if the reflected light spreads, it is inexpensive to receive. Since it is possible to cope only by enlarging the surface, it is possible to reliably capture the reflected light and inspect the surface condition. In addition, since a large-sized image pickup device having a wide light receiving range is not required, the device cost can be reduced. If the goods can be run with rollers, the surface condition of wide goods can be inspected. Further, in the case where the interference filter is attached, only the laser beam is received on the light receiving surface, so that the received light image is not blurred or uncertain due to indoor illumination light and sunlight.

【図面の簡単な説明】[Brief description of the drawings]

【図1】実施例の縦断面図である。FIG. 1 is a longitudinal sectional view of an embodiment.

【図2】実施例の側面図である。FIG. 2 is a side view of the embodiment.

【図3】実施例の測定状態を示す説明図である。FIG. 3 is an explanatory diagram showing a measurement state in the example.

【図4】実施例の測定状態を示す説明図である。FIG. 4 is an explanatory diagram showing a measurement state in the example.

【図5】実施例の測定の説明図である。FIG. 5 is an explanatory diagram of measurement in an example.

【符号の説明】[Explanation of symbols]

1 半導体レーザー 2 受光面 3 干渉フィルター 4 撮像装置 5 画像分析装置 5a CPU 5b ROM 5c RAM 5d ディスプレイ 5e キーボード 5f インターフェース 6 装置ケーシング 7 ローラ 8 欠番 9 支持脚 A 非接触型金属表面計測装置 B 物品 F 表面 D 傷 G 受光像 R 反射光 L レーザー光 DESCRIPTION OF SYMBOLS 1 Semiconductor laser 2 Light-receiving surface 3 Interference filter 4 Imaging device 5 Image analysis device 5a CPU 5b ROM 5c RAM 5d Display 5e Keyboard 5f Interface 6 Device casing 7 Roller 8 Missing number 9 Support leg A Non-contact type metal surface measuring device B Article F Surface D Scratched G Received image R Reflected light L Laser light

Claims (4)

【実用新案登録請求の範囲】[Utility model registration claims] 【請求項1】 物品の表面に向けて投光するレーザー
と、同レーザーのレーザー光の物品表面からの反射光を
受光する受光面と、同受光面の受光像を撮像して画像を
電気信号として出力する撮像装置とからなる非接触型金
属表面計測装置。
1. A laser for projecting light toward a surface of an article, a light receiving surface for receiving a reflected light of the laser light of the laser from the article surface, and a light receiving image of the light receiving surface being picked up and an image is formed by an electric signal. A non-contact type metal surface measuring device comprising an image pickup device that outputs an image as an image.
【請求項2】 レーザーが半導体レーザーで、又受光面
が背面から受光像を観察できる半透明のスクリーンであ
って、しかも撮像装置がスクリーンの背面を撮像するC
CDカメラである請求項1記載の非接触型金属表面計測
装置。
2. A semi-transparent screen in which a laser is a semiconductor laser and a light receiving surface is capable of observing a received image from the back, and an image pickup device captures an image of the back of the screen.
The non-contact type metal surface measuring device according to claim 1, which is a CD camera.
【請求項3】 受光面の前面にレーザー光のみを透過さ
せる干渉フィルターを設けた請求項1又は2記載の非接
触型金属表面計測装置。
3. The non-contact type metal surface measuring apparatus according to claim 1, wherein an interference filter for transmitting only laser light is provided on a front surface of the light receiving surface.
【請求項4】 装置に物品の表面に沿って走行するロー
ラーを設けた請求項1〜3何れか記載の非接触型金属表
面計測装置。
4. The non-contact type metal surface measuring device according to claim 1, wherein the device is provided with a roller running along the surface of the article.
JP1998004640U 1998-06-10 1998-06-10 Non-contact type metal surface measuring device Expired - Lifetime JP3054838U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1998004640U JP3054838U (en) 1998-06-10 1998-06-10 Non-contact type metal surface measuring device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1998004640U JP3054838U (en) 1998-06-10 1998-06-10 Non-contact type metal surface measuring device

Publications (1)

Publication Number Publication Date
JP3054838U true JP3054838U (en) 1998-12-18

Family

ID=43188867

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1998004640U Expired - Lifetime JP3054838U (en) 1998-06-10 1998-06-10 Non-contact type metal surface measuring device

Country Status (1)

Country Link
JP (1) JP3054838U (en)

Similar Documents

Publication Publication Date Title
US8736688B2 (en) Method and device for analyzing the optical quality of a transparent substrate
JP6394514B2 (en) Surface defect detection method, surface defect detection apparatus, and steel material manufacturing method
US20060203229A1 (en) Method and apparatus for inspecting defect in surface of metal roll
JP2012215486A (en) Surface property measuring apparatus and comprehensive evaluation method for surface property
EP0483362B1 (en) System for measuring length of sheet
JP2006010392A (en) Through hole measuring system, method, and through hole measuring program
JP2013213733A (en) Apparatus and method for inspecting object to be inspected
JP2009168454A (en) Surface flaw inspection device and surface flaw inspection method
CN214097211U (en) Transparent plate glass's defect detecting device
JP2019056671A (en) Wall surface damage inspection device
CN110402386A (en) Cylinder surface examining device and cylinder surface inspecting method
JP3054838U (en) Non-contact type metal surface measuring device
TW201617605A (en) Defect inspection method and apparatus thereof
JP4108829B2 (en) Thickness defect inspection apparatus and inspection method thereof
KR20140012250A (en) Apparatus and method for measuring the defect of glass substrate
JP2015200544A (en) Surface irregularity inspection device and surface irregularity inspection method
US20230138331A1 (en) Motion in images used in a visual inspection process
CN116997927A (en) Curved substrate bubble detection method and detection system
JP2001280939A (en) Method of evaluating abnormal condition of object surface
JPH10115514A (en) Method and apparatus for inspection of surface smoothness
CN104713887A (en) Planar flaw detecting method
JP2003057189A (en) Apparatus for inspecting hole-like defect in metal strip
JP2965370B2 (en) Defect detection device
TWM457889U (en) Panel defect detection device
TWI658266B (en) Method and system for evaluating quality of surface of work roll

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term