JP3051999B2 - Heat resistant release coating and method of forming the same - Google Patents
Heat resistant release coating and method of forming the sameInfo
- Publication number
- JP3051999B2 JP3051999B2 JP8536378A JP53637896A JP3051999B2 JP 3051999 B2 JP3051999 B2 JP 3051999B2 JP 8536378 A JP8536378 A JP 8536378A JP 53637896 A JP53637896 A JP 53637896A JP 3051999 B2 JP3051999 B2 JP 3051999B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- layer
- heat
- coating composition
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000576 coating method Methods 0.000 title claims description 26
- 239000011248 coating agent Substances 0.000 title claims description 25
- 238000000034 method Methods 0.000 title claims description 15
- 229920005989 resin Polymers 0.000 claims description 72
- 239000011347 resin Substances 0.000 claims description 72
- 239000008199 coating composition Substances 0.000 claims description 50
- 229920006015 heat resistant resin Polymers 0.000 claims description 25
- 239000004962 Polyamide-imide Substances 0.000 claims description 17
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 17
- 125000003118 aryl group Chemical group 0.000 claims description 17
- 229920002312 polyamide-imide Polymers 0.000 claims description 17
- 229920001721 polyimide Polymers 0.000 claims description 17
- 239000009719 polyimide resin Substances 0.000 claims description 17
- 239000010703 silicon Substances 0.000 claims description 17
- 229910052710 silicon Inorganic materials 0.000 claims description 17
- 229920002492 poly(sulfone) Polymers 0.000 claims description 16
- 239000000758 substrate Substances 0.000 claims description 15
- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 14
- 229920000069 polyphenylene sulfide Polymers 0.000 claims description 14
- 239000000203 mixture Substances 0.000 claims description 11
- 238000010304 firing Methods 0.000 claims description 9
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 6
- 229910052731 fluorine Inorganic materials 0.000 claims description 6
- 239000011737 fluorine Substances 0.000 claims description 6
- 239000001023 inorganic pigment Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 description 9
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 239000003960 organic solvent Substances 0.000 description 5
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 5
- 239000004810 polytetrafluoroethylene Substances 0.000 description 5
- 239000011734 sodium Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- -1 polyphenylene Polymers 0.000 description 4
- 238000005422 blasting Methods 0.000 description 3
- 238000010411 cooking Methods 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- 210000003298 dental enamel Anatomy 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000004615 ingredient Substances 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 229920001780 ECTFE Polymers 0.000 description 2
- 241000467686 Eschscholzia lobbii Species 0.000 description 2
- 239000002033 PVDF binder Substances 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000004040 coloring Methods 0.000 description 2
- 238000005238 degreasing Methods 0.000 description 2
- 239000002270 dispersing agent Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 description 2
- 150000003949 imides Chemical group 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000010137 moulding (plastic) Methods 0.000 description 2
- 229920002493 poly(chlorotrifluoroethylene) Polymers 0.000 description 2
- 239000005023 polychlorotrifluoroethylene (PCTFE) polymer Substances 0.000 description 2
- 229920002620 polyvinyl fluoride Polymers 0.000 description 2
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- PUZPDOWCWNUUKD-UHFFFAOYSA-M sodium fluoride Chemical compound [F-].[Na+] PUZPDOWCWNUUKD-UHFFFAOYSA-M 0.000 description 2
- VWDWKYIASSYTQR-UHFFFAOYSA-N sodium nitrate Chemical compound [Na+].[O-][N+]([O-])=O VWDWKYIASSYTQR-UHFFFAOYSA-N 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- 239000004034 viscosity adjusting agent Substances 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910001148 Al-Li alloy Inorganic materials 0.000 description 1
- 229910001018 Cast iron Inorganic materials 0.000 description 1
- 229920000298 Cellophane Polymers 0.000 description 1
- 229910018068 Li 2 O Inorganic materials 0.000 description 1
- 229910003250 Na–Li Inorganic materials 0.000 description 1
- 229910014130 Na—P Inorganic materials 0.000 description 1
- 229920012266 Poly(ether sulfone) PES Polymers 0.000 description 1
- 229920000265 Polyparaphenylene Polymers 0.000 description 1
- 229910008332 Si-Ti Inorganic materials 0.000 description 1
- 229910008423 Si—B Inorganic materials 0.000 description 1
- 229910008284 Si—F Inorganic materials 0.000 description 1
- 229910006339 Si—Pb Inorganic materials 0.000 description 1
- 229910006749 Si—Ti Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- 239000003082 abrasive agent Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910021538 borax Inorganic materials 0.000 description 1
- WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical compound [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 229910001610 cryolite Inorganic materials 0.000 description 1
- 238000009503 electrostatic coating Methods 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 239000010433 feldspar Substances 0.000 description 1
- 239000010436 fluorite Substances 0.000 description 1
- 235000013305 food Nutrition 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 239000001034 iron oxide pigment Substances 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 235000015067 sauces Nutrition 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 235000017550 sodium carbonate Nutrition 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 235000013024 sodium fluoride Nutrition 0.000 description 1
- 239000011775 sodium fluoride Substances 0.000 description 1
- 235000010344 sodium nitrate Nutrition 0.000 description 1
- 239000004317 sodium nitrate Substances 0.000 description 1
- 235000010339 sodium tetraborate Nutrition 0.000 description 1
- 239000004328 sodium tetraborate Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 230000002087 whitening effect Effects 0.000 description 1
Landscapes
- Application Of Or Painting With Fluid Materials (AREA)
Description
【発明の詳細な説明】 技術分野 本発明は、ホットプレート、フライパン、ガステーブ
ル天板のような加熱調理器具、アイロンベース、ハサ
ミ、包丁、プラスチック成形金型などに施される耐熱性
の離型性皮膜の形成方法に関する。Description: TECHNICAL FIELD The present invention relates to a heat-resistant release mold applied to a cooking utensil such as a hot plate, a frying pan, a gas table top plate, an iron base, scissors, a kitchen knife, and a plastic molding die. The present invention relates to a method for forming a conductive film.
背景技術 フッ素樹脂の良好な離型性を利用して物体に耐汚染性
を目的とする離型性コーティングを施すことは良く知ら
れている。フッ素樹脂単独のコーティングは加熱によっ
て軟化するので、ケイ素樹脂、ポリイミド樹脂等の耐熱
性樹脂との混合物の形で使用したり、またはこれら耐熱
性樹脂のコーティングを下塗りし、その上にフッ素樹脂
コーティングを上塗りすることが行われている。しかし
ながらこれら耐熱性樹脂と組合わせた皮膜は硬度が十分
でなく傷つき易く、耐久性が十分でない。BACKGROUND ART It is well known to apply a release coating for the purpose of stain resistance to an object by utilizing the good release property of a fluororesin. Since the coating of fluororesin alone softens when heated, it can be used in the form of a mixture with a heat-resistant resin such as a silicon resin or a polyimide resin, or undercoated with a coating of these heat-resistant resins, and then a fluororesin coating is applied thereon. Overcoating has been done. However, the film combined with these heat-resistant resins has insufficient hardness, is easily damaged, and has insufficient durability.
そこで本発明は、素材にフリットと耐熱性樹脂との混
合物を皮膜形成成分とする被覆組成物を下塗りし、その
上にフッ素樹脂コーティングを施すことにより、耐久性
にすぐれた耐熱性の離型性コーティングを形成すること
に成功した。Therefore, the present invention provides an undercoating composition comprising a mixture of a frit and a heat-resistant resin as a film-forming component, and applying a fluororesin coating thereon, thereby providing a highly heat-resistant mold releasability. The coating was successfully formed.
発明の開示 本発明は、離型性コーティングを必要とする物体の表
面に、形成される耐熱性離型性皮膜に関する。該皮膜
は、 (a)被覆される素地を覆うように形成される層Aであ
って、該層Aの皮膜形成成分が20乃至95重量%のフリッ
トと、5乃至80重量%のフッ素樹脂、ケイ素樹脂、芳香
族ポリサルホン樹脂、ポリフェニレンサルファイド樹
脂、ポリアミドイミド樹脂およびポリイミド樹脂よりな
る群より選ばれる少なくとも1種の耐熱性樹脂とを含
み、 (b)該層Aの表面を覆うように形成される層Bであっ
て、該層Bの皮膜形成成分が20乃至100重量%のフッ素
樹脂と、0乃至20重量%のフリットと、0乃至80重量%
のケイ素樹脂、芳香族ポリサルホン樹脂、ポリフェニレ
ンサルファイド樹脂、ポリアミドイミド樹脂およびポリ
イミド樹脂よりなる群より選ばれる少なくとも1種の耐
熱性樹脂とを含む、 ことを特徴とする耐熱性離型性皮膜である。DISCLOSURE OF THE INVENTION The present invention relates to a heat-resistant release film formed on the surface of an object requiring a release coating. The film comprises: (a) a layer A formed so as to cover a substrate to be coated, wherein the film-forming component of the layer A is 20 to 95% by weight of a frit and 5 to 80% by weight of a fluororesin; And at least one heat-resistant resin selected from the group consisting of a silicon resin, an aromatic polysulfone resin, a polyphenylene sulfide resin, a polyamideimide resin and a polyimide resin, and (b) formed so as to cover the surface of the layer A. The layer B, wherein the film-forming component of the layer B is 20 to 100% by weight of a fluororesin, 0 to 20% by weight of a frit, and 0 to 80% by weight.
And at least one heat-resistant resin selected from the group consisting of silicon resin, aromatic polysulfone resin, polyphenylene sulfide resin, polyamideimide resin and polyimide resin.
このようにフッ素樹脂コーティングの下塗層として、
フリットと耐熱性樹脂の混合物(層A)を使用すること
により、耐熱性にすぐれ、硬質で耐久性があり、素材に
対し密着性にすぐれた離型性皮膜が得られる。Thus, as an undercoat layer of fluororesin coating,
By using a mixture of the frit and the heat-resistant resin (layer A), a release film having excellent heat resistance, being hard and durable, and having excellent adhesion to the material can be obtained.
また、該素地と該層Aとの間にフッ素樹脂、ケイ素樹
脂、芳香族ポリサルホン樹脂、ポリフェニレンサルファ
イド樹脂、ポリアミドイミド樹脂およびポリイミド樹脂
等の耐熱性樹脂よりなる群より選ばれる少なくとも一の
成分を含有するプライマー層Cを有し、及び/又は該層
Aと該層Bとの間に該群より選ばれる少なくとも一の成
分を含有するプライマー層Dを有するものとすることも
できる。Further, between the substrate and the layer A, contains at least one component selected from the group consisting of a heat-resistant resin such as a fluororesin, a silicon resin, an aromatic polysulfone resin, a polyphenylene sulfide resin, a polyamideimide resin and a polyimide resin. And / or a primer layer D containing at least one component selected from the group between the layer A and the layer B.
これらプライマー層を設けることによって、プライマ
ー層を挟んでいる両側の層、例えばプライマー層Cであ
れば素地と層A、の間の密着性を向上させることができ
る。By providing these primer layers, it is possible to improve the adhesion between the substrate and the layer A in the case of the layers on both sides sandwiching the primer layer, for example, the primer layer C.
更に本発明は、離型性コーティングを必要とする物体
の表面に、耐熱性離型性皮膜を形成する方法に関する。
該方法は、 被覆される素地表面に、 (a)皮膜形成成分の20乃至95重量%をフリットが占
め、皮膜形成成分の5乃至80重量%はフッ素樹脂、ケイ
素樹脂、芳香族ポリサルホン樹脂、ポリフェニレンサル
ファイド樹脂、ポリアミドイミド樹脂およびポリイミド
樹脂より選ばれた少なくとも1種の耐熱性樹脂である被
覆組成物Aを塗布する工程と、 (b)その上に皮膜形成成分として20乃至100重量%の
フッ素樹脂と、0乃至20重量%のフリットと、0乃至80
重量%のケイ素樹脂、芳香族ポリサルホン樹脂、ポリフ
ェニレンサルファイド樹脂、ポリアミドイミド樹脂およ
びポリイミド樹脂よりなる群より選ばれる少なくとも1
種の耐熱性樹脂とを含む被覆組成物Bを塗付する工程
と、 (c)(a)の工程と(b)の工程との間にフリットの
屈伏点以上の温度で焼成し、又は(b)の工程後にフリ
ットの屈伏点以上の温度で焼成することを特徴とする耐
熱性離型性皮膜の形成方法である。Furthermore, the present invention relates to a method for forming a heat-resistant release film on the surface of an object requiring a release coating.
The method comprises the steps of: (a) frit occupying 20 to 95% by weight of a film-forming component, and 5 to 80% by weight of a film-forming component comprising a fluororesin, a silicon resin, an aromatic polysulfone resin, and a polyphenylene. A step of applying a coating composition A which is at least one heat-resistant resin selected from a sulfide resin, a polyamide-imide resin and a polyimide resin; and (b) 20 to 100% by weight of a fluorine resin as a film-forming component thereon. 0 to 20% by weight frit, 0 to 80
% By weight of at least one selected from the group consisting of silicon resin, aromatic polysulfone resin, polyphenylene sulfide resin, polyamideimide resin and polyimide resin.
(C) baking at a temperature equal to or higher than the yield point of the frit between the step of applying the coating composition B containing the kind of heat resistant resin, and the step of (c). This is a method for forming a heat-resistant release film, which comprises baking at a temperature equal to or higher than the yield point of the frit after the step b).
このように耐熱性離型性皮膜を形成することで、前述
の耐熱性にすぐれ、硬質で耐久性があり、素材に対し密
着性にすぐれた離型性皮膜を容易に得ることができる。By forming a heat-resistant release film in this manner, a release film having excellent heat resistance, being hard and durable, and having excellent adhesion to a material can be easily obtained.
また、該被覆組成物Aを塗布する工程の前に該素地表
面にフッ素樹脂、ケイ素樹脂、芳香族ポリサルホン樹
脂、ポリフェニレンサルファイド樹脂、ポリアミドイミ
ド樹脂およびポリイミド樹脂等の耐熱性樹脂よりなる群
より選ばれる少なくとも一の成分を含有するプライマー
層形成層Cを形成する工程を更に有し、及び/又は該被
覆組成物Aを塗布する工程の後に該被覆組成物Aと該被
覆組成物Bとの間に該群より選ばれる少なくとも一の成
分を含有するプライマー層形成層Dを形成する工程を更
に有する方法であってもよい。Further, before the step of applying the coating composition A, the surface of the substrate is selected from the group consisting of a heat-resistant resin such as a fluororesin, a silicon resin, an aromatic polysulfone resin, a polyphenylene sulfide resin, a polyamideimide resin, and a polyimide resin. Further comprising the step of forming a primer layer forming layer C containing at least one component, and / or between the coating composition A and the coating composition B after the step of applying the coating composition A The method may further include a step of forming a primer layer forming layer D containing at least one component selected from the group.
このようにプライマー層形成層を形成する工程を有す
ることで、前述のプライマー層を容易に形成することが
でき、各層間の密着性を更に向上させることができる。By including the step of forming the primer layer forming layer as described above, the above-described primer layer can be easily formed, and the adhesion between the layers can be further improved.
発明を実施するための最良の態様 本発明は、フライパン、ホットプレートなどの加熱調
理用器具、ガステーブル天板等の調理用加熱器具、アイ
ロンベース、ハサミ、包丁などの家庭用器具、プラスチ
ック成形用金型などの物品に、汚染物の粘着防止または
その除去、清掃を容易にする目的で離型性コーティング
を形成するために用いられる。対象となる物品の素材の
多くは鉄、アルミニウム、ステンレス等の金属である
が、ガラス、陶磁器、セラミックス等の非金属素材にも
適用することができる。BEST MODE FOR CARRYING OUT THE INVENTION The present invention relates to a cooking appliance such as a frying pan and a hot plate, a cooking appliance such as a gas table top plate, a household appliance such as an iron base, scissors and a kitchen knife, and a plastic molding machine. It is used for forming a releasable coating on an article such as a mold for the purpose of preventing adhesion of contaminants or facilitating removal and cleaning. Most of the materials of the target article are metals such as iron, aluminum, and stainless steel, but can be applied to nonmetal materials such as glass, ceramics, and ceramics.
素材が金属の場合、密着性を高めるためコーティング
が施される表面をあらかじめ脱脂、酸洗いおよびブラス
ト処理等により前処理しておくことが好ましい。特にブ
ラスト処理はコーティング皮膜の密着性を高めるために
有効である。研磨材としては、アルミナ系、炭化ケイ素
系など公知の研磨材が使用でき、中心線平均粗さRaが0.
5以上の表面粗さとするのが好ましい。When the material is metal, it is preferable to pre-treat the surface to be coated with degreasing, pickling, blasting or the like in order to enhance the adhesion. In particular, blasting is effective for improving the adhesion of the coating film. As the abrasive, known abrasives such as alumina-based and silicon carbide-based can be used, and the center line average roughness Ra is 0.
The surface roughness is preferably 5 or more.
層Aとして用いる被覆組成物の皮膜形成成分は、フリ
ットと耐熱性樹脂よりなる無機/有機複合材料である。The film-forming component of the coating composition used as the layer A is an inorganic / organic composite material composed of a frit and a heat-resistant resin.
ここでいうフリットとは一般にケイ石、ケイ砂、長
石、ほう砂、ソーダ灰、チリ硝石、ほたる石、氷硝石、
けいふっ化ソーダなどの調合材料を粉砕し混合した後、
溶融を行い、これを急冷し粉砕したものである。また鋼
板用ほうろうフリット、鋳鉄用ほうろうフリット、アル
ミニウムほうろう用フリット、グレーズ用フリットなど
とよばれているものである。また成分的な例としてはSi
−Al−Li系、Si−B−Na系、Si−B−Na−Ba系、Si−B
−K系、Si−B−Na−Ca系、Si−Ca−Zn系、Si−B−Zn
系、Si−Ca−Zn−Na系、Si−B−Na−Li系、Si−B−Pb
系、Si−B−Zn−Pb系、Si−Ca−Pb−Na系、Si−B−Ca
−Pb系、Si−Pb系、Si−B−Na−Pb系、Si−B−Zr系、
Si−B−Sn系、Si−B−Mn系、Si−Al−B系、Si−Ca−
K系、B−Ca−Zn系、Al−Na−P系、Li−Al−P系、B
−Si−Ti系、B−Si−Ti−Pb系、Al−Na−P−K−Si
系、Al−Na−P−F系、Al−Na−K−Zn−Pb系、Al−Na
−K−Li−P−F系、Al−B−Na−K−Li−P−Si系、
Al−B−Na−K−Li−P−Si−F系フリットなどが挙げ
られる。The frit mentioned here is generally silica stone, silica sand, feldspar, borax, soda ash, Chile saltpeter, fluorite, cryolite,
After crushing and mixing the preparation materials such as sodium fluoride,
It is melted, quenched and pulverized. Also, they are called enamel frit for steel plate, enamel frit for cast iron, frit for aluminum enamel, frit for glaze, and the like. In addition, as a component example, Si
-Al-Li, Si-B-Na, Si-B-Na-Ba, Si-B
-K system, Si-B-Na-Ca system, Si-Ca-Zn system, Si-B-Zn
System, Si-Ca-Zn-Na system, Si-B-Na-Li system, Si-B-Pb
System, Si-B-Zn-Pb system, Si-Ca-Pb-Na system, Si-B-Ca
-Pb system, Si-Pb system, Si-B-Na-Pb system, Si-B-Zr system,
Si-B-Sn, Si-B-Mn, Si-Al-B, Si-Ca-
K system, B-Ca-Zn system, Al-Na-P system, Li-Al-P system, B
-Si-Ti, B-Si-Ti-Pb, Al-Na-P-K-Si
System, Al-Na-PF system, Al-Na-K-Zn-Pb system, Al-Na
-K-Li-PF system, Al-B-Na-K-Li-P-Si system,
Al-B-Na-K-Li-P-Si-F type frit and the like can be mentioned.
しかしながらフリットは耐熱性樹脂と組合せて用いら
れるのであまり高い屈伏点のものは好ましくなく、その
屈伏点が、使用する耐熱性樹脂の皮膜形成温度以上では
あるが500℃以下であることが望ましい。また、調理し
ようとする食品に直接接触するフライパン、ホットプレ
ート等に使用する場合には、Pb等の有害重金属を含まな
いフリットが好ましい。However, since the frit is used in combination with the heat-resistant resin, it is not preferable that the frit has a very high yield point. The yield point is preferably higher than the film forming temperature of the heat-resistant resin to be used but lower than 500 ° C. In addition, when used in frying pans, hot plates, and the like that come into direct contact with food to be cooked, frits that do not contain harmful heavy metals such as Pb are preferable.
耐熱性樹脂としては、フッ素樹脂、ケイ素樹脂、芳香
族ポリサルホン樹脂、ポリフェニレンサルファイド樹
脂、ポリアミドイミド樹脂およびポリイミド樹脂が単独
でもしくは複数で混合して用いられる。フッ素樹脂とし
ては、ポリテトラフルオロエチレン(PTFE)、テトラフ
ルオロエチレン−ヘキサフルオロプロピレン共重合体
(FEP)、テトラフルオロエチレン−パーフルオロアル
キルビニルエーテル共重合体(PFA)、テトラフルオロ
エチレン−エチレン共重合体(ETFE)、ポリクロロトリ
フルオロエチレン(PCTFE)、クロロトリフルオロエチ
レン−エチレン共重合体(ECTFE)、ポリフッ化ビニリ
デン(PVdF)、ポリフッ化ビニル(PVF)、フッ化ビニ
リデン−ヘキサフルオロプロピレン共重合体(VdF−HF
P)を単独または混合して用いるのがよい。ホットプレ
ート、フライパン、ガステーブル天板などの用途にはそ
の使用温度から見てPTFE,PFAおよびFEPが好ましく、さ
らにその中でも皮膜形成性と密着性の観点からPFA,FEP
単独か、またはこれらとPTEEとの混合物が好ましい。As the heat-resistant resin, a fluororesin, a silicon resin, an aromatic polysulfone resin, a polyphenylene sulfide resin, a polyamideimide resin, and a polyimide resin are used alone or in combination. Examples of the fluororesin include polytetrafluoroethylene (PTFE), tetrafluoroethylene-hexafluoropropylene copolymer (FEP), tetrafluoroethylene-perfluoroalkylvinyl ether copolymer (PFA), and tetrafluoroethylene-ethylene copolymer (ETFE), polychlorotrifluoroethylene (PCTFE), chlorotrifluoroethylene-ethylene copolymer (ECTFE), polyvinylidene fluoride (PVdF), polyvinyl fluoride (PVF), vinylidene fluoride-hexafluoropropylene copolymer (VdF-HF
P) may be used alone or as a mixture. For applications such as hot plates, frying pans and gas table tops, PTFE, PFA and FEP are preferred in view of their operating temperatures, and among them, PFA and FEP are preferred from the viewpoint of film forming properties and adhesion.
Preference is given to single or mixtures of these with PTEE.
ケイ素樹脂は、メチル基およびフェニル基を有するシ
リコーン樹脂、ポリボロシロキサン、ポリチタノカルボ
シラン、アルキルアルコキシシラン重合体が好適に用い
られる。As the silicon resin, a silicone resin having a methyl group and a phenyl group, a polyborosiloxane, a polytitanocarbosilane, and an alkylalkoxysilane polymer are preferably used.
芳香族ポリサルホン樹脂は、ポリアリールサルホン、
芳香族系のポリエーテルサルホン(PES)が用いられ
る。ポリアミドイミド樹脂およびポリイミド樹脂は、い
ずれもイミド環形成前の前駆体の形で使用し、焼成時イ
ミド環へ閉環させる方法などが使われる。The aromatic polysulfone resin is polyarylsulfone,
Aromatic polyethersulfone (PES) is used. The polyamideimide resin and the polyimide resin are both used in the form of a precursor before the formation of an imide ring, and a method of closing the imide ring during firing is used.
被覆組成物Aは、その皮膜形成成分のうち20〜95重量
%はフリットが占め、5〜80重量%を耐熱性樹脂が占め
るように配合される。フリットは皮膜へ硬度および耐久
性を付与し、耐熱性樹脂は耐衝撃性および上塗りフッ素
樹脂皮膜との密着性を付与し、かつ素材と離型性皮膜の
熱膨張係数の差によるひずみを吸収する役目を果たす。
上の配合比率はこれらの性能のバランスを考慮して決定
されたものである。The coating composition A is blended so that the frit accounts for 20 to 95% by weight of the film forming component and the heat resistant resin accounts for 5 to 80% by weight. The frit gives hardness and durability to the film, and the heat-resistant resin gives impact resistance and adhesion to the overcoated fluororesin film, and absorbs the strain due to the difference in thermal expansion coefficient between the material and the release film. Play a role.
The above compounding ratio is determined in consideration of the balance between these properties.
被覆組成物Aは、100重量%までの着色用無機顔料を
含むことができる。その例は、弁柄などの酸化鉄顔料、
二酸化チタン、カーボンブラックなどである。また作業
性をよくするため分散剤、粘度調整剤、レベリング剤な
どの慣用の添加剤を含んでいてもよい。Coating composition A can contain up to 100% by weight of a coloring inorganic pigment. Examples are iron oxide pigments, such as red petals,
Titanium dioxide, carbon black and the like. Further, in order to improve workability, a conventional additive such as a dispersant, a viscosity modifier, and a leveling agent may be contained.
また、素地と層Aとの間にプライマー層Cを、及び/
又は層Aと層Bとの間にプライマー層Dを設けてよい。
これらプライマー層を設けることによって、該プライマ
ー層を挟んでいる両側の層、例えばプライマー層Cであ
れば素地と層A、の間の密着性を向上させることができ
る。A primer layer C between the substrate and the layer A;
Alternatively, a primer layer D may be provided between the layer A and the layer B.
By providing these primer layers, it is possible to improve the adhesion between the substrate and the layer A in the case of the layers on both sides sandwiching the primer layer, for example, the primer layer C.
このプライマー層はフッ素樹脂、ケイ素樹脂、芳香族
ポリサルホン樹脂、ポリフェニレンサルファイド樹脂、
ポリアミドイミド樹脂およびポリイミド樹脂等の耐熱性
樹脂よりなる群より選ばれる少なくとも一の成分から形
成することができる。This primer layer is made of fluorine resin, silicon resin, aromatic polysulfone resin, polyphenylene sulfide resin,
It can be formed from at least one component selected from the group consisting of heat-resistant resins such as polyamide-imide resins and polyimide resins.
被覆組成物Bとしては、皮膜形成成分中にフリットを
0〜20重量%含むフッ素樹脂離型コーティング組成物を
用いる。使用するフッ素樹脂は被覆組成物Aについて述
べたフッ素樹脂と同じでよい。層B用の被覆組成物Bの
皮膜形成成分はフッ素樹脂単独(100重量%)でもよい
が、十分な離型性が得られる限り被覆組成物Aに使用し
得る他の耐熱性樹脂、すなわちケイ素樹脂、芳香族ポリ
サルホン樹脂、ポリフェニレンサルファイド樹脂、ポリ
アミドイミド樹脂およびポリイミド樹脂の1種または2
種以上の混合物であってもよい。しかしながらフッ素樹
脂を少なくとも20重量%含まない限り満足な離型性は得
られないであろう。As the coating composition B, a fluororesin release coating composition containing 0 to 20% by weight of a frit in a film forming component is used. The fluororesin used may be the same as the fluororesin described for the coating composition A. The film-forming component of the coating composition B for the layer B may be a fluororesin alone (100% by weight), but other heat-resistant resins that can be used for the coating composition A, as long as sufficient release properties are obtained, that is, silicon One or two of resin, aromatic polysulfone resin, polyphenylene sulfide resin, polyamideimide resin and polyimide resin
It may be a mixture of more than one species. However, satisfactory release properties will not be obtained unless it contains at least 20% by weight of fluororesin.
被覆組成物Bも皮膜形成成分の100重量%までの着色
用無機顔料を含むことができる。また、分散剤、粘度調
整剤、レベリング剤などの慣用の添加剤を含むことがで
きる。The coating composition B can also contain up to 100% by weight of the film-forming component of a coloring inorganic pigment. Further, conventional additives such as a dispersant, a viscosity modifier and a leveling agent can be contained.
皮膜の形成は、脱脂、ブラスト処理等によってあらか
じめ前処理した素材表面に、水または有機溶剤に分散も
しくは懸濁した被覆組成物Aを仕上り膜厚が5〜200μ
mになるように塗装し、その上に同様に水または有機溶
剤に分散もしくは懸濁した被覆組成物Bを仕上り膜厚が
2〜100μmになるように塗装し、フリットの屈伏点以
上の温度へ加熱し、焼成することによって行われる。The coating is formed by coating the coating composition A dispersed or suspended in water or an organic solvent on the surface of the material pre-treated by degreasing, blasting, etc., and having a thickness of 5 to 200 μm.
m, and then the coating composition B dispersed or suspended in water or an organic solvent is applied thereon so that the finished film thickness is 2 to 100 μm, and the temperature is increased to a temperature equal to or higher than the yield point of the frit. It is performed by heating and firing.
被覆組成物Aを塗装する前に、水又は有機溶剤に分散
又は懸濁したプライマー層形成層を仕上がり膜厚が2乃
至100μmになるように塗装することができる。同様
に、被覆組成物Bを塗装する前に、プライマー層形成層
を仕上がり膜厚が2乃至100μmになるように塗装する
ことができる。Before applying the coating composition A, a primer layer forming layer dispersed or suspended in water or an organic solvent can be applied so as to have a finished film thickness of 2 to 100 μm. Similarly, before coating the coating composition B, the primer layer forming layer can be coated so that the finished film thickness is 2 to 100 μm.
素地と被覆組成物Aとの間にプライマー層形成層Cを
設けることによって、素地と被覆組成物Aとの間の密着
性を向上させることができ、また、被覆組成物Aと被覆
組成物Bとの間にプライマー層Dを設けることによっ
て、被覆組成物Aと被覆組成物Bとの間の密着性を向上
させることができる。これによって、それぞれの被覆組
成物から焼成によって形成されるそれぞれの層同志の密
着性を向上させる。これは、予め焼成された被覆組成物
Aに対する場合であっても、被覆組成物Bの密着性を飛
躍的に向上させることができる。By providing the primer layer forming layer C between the substrate and the coating composition A, the adhesion between the substrate and the coating composition A can be improved, and the coating composition A and the coating composition B can be improved. The adhesion between the coating composition A and the coating composition B can be improved by providing the primer layer D between the two. Thereby, the adhesion between the respective layers formed by firing from the respective coating compositions is improved. This can dramatically improve the adhesion of the coating composition B even when the coating composition A is fired in advance.
塗装は静電塗装機、エヤースプレーガン等を用いて行
うことができる。また水や有機溶剤を使用することなく
粉体塗装を行ってもよい。The coating can be performed using an electrostatic coating machine, an air spray gun or the like. Powder coating may be performed without using water or an organic solvent.
加熱焼成は、全ての塗装が終了してから同時に行って
も、また各々の塗装毎に行ってもよい。また、各々の塗
装毎には低温で乾燥し、全ての塗装が終了してからフリ
ットの屈伏点以上の温度へと加熱し、焼成してもよい。The heating and firing may be performed simultaneously after all the coatings are completed, or may be performed for each coating. Alternatively, each coating may be dried at a low temperature, heated to a temperature equal to or higher than the yield point of the frit after all coating is completed, and fired.
また例えば、被覆組成物Aを塗布し、フリットの屈伏
点以上の温度で焼成した後、プライマー層形成層Dを塗
装し、80℃で10分間乾燥してから被覆組成物Bを塗装
し、焼成することもできる。被覆組成物Bの焼成温度
は、フッソ樹脂等の溶融温度以上であればよい。Further, for example, after coating the coating composition A and firing at a temperature equal to or higher than the yield point of the frit, the primer layer forming layer D is applied, dried at 80 ° C. for 10 minutes, and then the coating composition B is applied and fired. You can also. The sintering temperature of the coating composition B may be at least the melting temperature of the fluorine resin or the like.
しかしながら、層間の密着性を確保し、かつ焼成に要
する熱エネルギーを節約するために各層全てを同時に焼
成するのが好ましい場合が多い。However, it is often preferable to fire all of the layers at the same time in order to ensure adhesion between the layers and save thermal energy required for firing.
実施例1〜5および比較例 フリットの調製 成 分 重量% Li2O 5.0 Na2O 10.0 K2O 10.0 Al2O3 30.0 P2O5 35.0 F2 10.0 上記成分を粉砕して混合した後、溶融し、急冷して粉
砕し、フリットを調製した。After mixing by grinding prepared Ingredient wt% Li 2 O 5.0 Na 2 O 10.0 K 2 O 10.0 Al 2 O 3 30.0 P 2 O 5 35.0 F 2 10.0 The above ingredients of Examples 1 to 5 and Comparative Examples frit, Melted, quenched and pulverized to prepare a frit.
被覆組成物 下記配合により、原料をボールミルに入れ、粉砕して
被覆組成物を調製した。Coating composition According to the following formulation, the raw materials were put into a ball mill and pulverized to prepare a coating composition.
被覆組成物B 成 分 実施例1 実施例2 PTFE 100.0 90.0 フリット 0.0 10.0 カーボンブラック 3.0 3.0 界面活性剤 5.0 5.0 溶剤 100.0 100.0 単位:〔重量部〕 プライマー 〔組 成〕 ポリアミドイミド樹脂 50.0 PTFE樹脂 50.0 界面活性剤 5.01 有機溶剤 100.0 単位:〔重量部〕 上の配合により、原料をボールミルに入れ、粉砕して
プライマー層形成層の原料を調製した。 Coating composition B Ingredient Example 1 Example 2 PTFE 100.0 90.0 frit 0.0 10.0 Carbon black 3.0 3.0 surfactant 5.0 5.0 solvent 100.0 100.0 Unit: [parts by weight] primer [pairs formed] polyamideimide resin 50.0 PTFE resin 50.0 surfactant Agent 5.01 Organic solvent 100.0 Unit: [parts by weight] With the above composition, the raw materials were put into a ball mill and pulverized to prepare the raw materials for the primer layer forming layer.
塗板の作成 実施例1乃至6及び比較例1は、標準的なステンレス
鋼板(SUS−304)を溶融アルミナ質研磨材によりRa0.8
になるまでブラスト処理し、これに各被覆組成物Aを仕
上り膜厚約50μmになるようにエアースプレー塗装し、
80℃で10分間乾燥後、それぞれ被膜組成物Aの上に被膜
組成物Bを仕上り膜厚約20μmになるようにエアースプ
レー塗装し、最後に500℃で10分間焼成した。Preparation of Coated Plates In Examples 1 to 6 and Comparative Example 1, a standard stainless steel plate (SUS-304) was prepared by using a molten alumina abrasive to raise Ra0.8.
Blast treatment, and air-spray coating each coating composition A to a finished film thickness of about 50 μm,
After drying at 80 ° C. for 10 minutes, the coating composition B was applied on the coating composition A by air spray coating so as to have a finished film thickness of about 20 μm, and finally baked at 500 ° C. for 10 minutes.
実施例7は素材表面にプライマー層Cが仕上がり膜厚
約10μmになるようにエアースプレー塗装し、80℃で10
分間乾燥後に被膜組成物Aを塗装し、500℃で10分間焼
成した。この上に再度プライマー層Dの形成層を塗装
し、80℃で10分間乾燥後に被膜組成物Bを塗装し、380
℃で焼成した。In Example 7, the surface of the material was air-sprayed so that the primer layer C had a finished film thickness of about 10 μm.
After drying for minutes, the coating composition A was applied and baked at 500 ° C. for 10 minutes. On top of this, a primer layer D-forming layer was applied again, dried at 80 ° C. for 10 minutes, and then coated with coating composition B.
Fired at ℃.
実施例8と比較例2はプライマー層C又はDの有無を
除いては実施例7と同じである。Example 8 and Comparative Example 2 are the same as Example 7 except for the presence or absence of the primer layer C or D.
実施例9は被膜組成物Aの焼成を行っていないことを
除いて比較例2と同じである。Example 9 is the same as Comparative Example 2 except that the coating composition A was not fired.
得られた各皮膜についてその性能を評価し、以下の成
績を得た。The performance of each of the obtained films was evaluated, and the following results were obtained.
試験条件 硬度:鉛筆硬度 非粘着性:砂糖、ソース(1:1)の混合物を滴下し、250
℃1Hr加熱する。ハガレやこびり付きのないこと。Test conditions Hardness: Pencil hardness Non-stickiness: Drop a mixture of sugar and sauce (1: 1), 250
Heat at ℃ 1Hr. No peeling or sticking.
コインスクラッチ:100円硬貨で10回擦り、素地に達する
傷のないこと。Coin Scratch: Rub 10 times with a 100 yen coin and have no scratches reaching the substrate.
密着性:クロスカットを入れ、セロテープ剥離を10回行
い、剥離のないこと。Adhesion: Make a cross cut, peel off cellophane tape 10 times, and do not peel.
沸水性:90℃以上の沸水中に2Hr浸け、皮膜にフクレ、白
化のないこと。Boiling water: Immerse in boiling water of 90 ° C or more for 2 hours, and there is no blistering or whitening on the film.
耐熱性:250℃で100時間加熱後、密着性を調べる。Heat resistance: After heating at 250 ° C for 100 hours, the adhesion is examined.
○:合格 ×:不合格 ○: passed ×: failed
Claims (12)
って、該層Aの皮膜形成成分が20乃至95重量%のフリッ
トと、5乃至80重量%のフッ素樹脂、ケイ素樹脂、芳香
族ポリサルホン樹脂、ポリフェニレンサルファイド樹
脂、ポリアミドイミド樹脂およびポリイミド樹脂よりな
る群より選ばれる少なくとも1種の耐熱性樹脂とを含
み、 (b)該層Aの表面を覆うように形成される層Bであっ
て、該層Bの皮膜形成成分が20乃至100重量%のフッ素
樹脂と、0乃至20重量%のフリットと、0乃至80重量%
のケイ素樹脂、芳香族ポリサルホン樹脂、ポリフェニレ
ンサルファイド樹脂、ポリアミドイミド樹脂およびポリ
イミド樹脂よりなる群より選ばれる少なくとも1種の耐
熱性樹脂とを含む、 ことを特徴とする耐熱性離型性皮膜。1. A heat-resistant release coating, comprising: (a) a layer A formed so as to cover a substrate to be coated, wherein the film-forming component of the layer A has a frit content of 20 to 95% by weight. And at least one heat-resistant resin selected from the group consisting of 5 to 80% by weight of a fluororesin, a silicon resin, an aromatic polysulfone resin, a polyphenylene sulfide resin, a polyamideimide resin, and a polyimide resin. A layer B formed so as to cover the surface of the layer A, wherein a film-forming component of the layer B is 20 to 100% by weight of a fluororesin, 0 to 20% by weight of a frit, and 0 to 80% by weight.
And at least one heat-resistant resin selected from the group consisting of a silicon resin, an aromatic polysulfone resin, a polyphenylene sulfide resin, a polyamideimide resin and a polyimide resin.
素樹脂、芳香族ポリサルホン樹脂、ポリフェニレンサル
ファイド樹脂、ポリアミドイミド樹脂およびポリイミド
樹脂等の耐熱性樹脂よりなる群より選ばれる少なくとも
一の成分を含有するプライマー層Cを有し、及び/又は
該層Aと該層Bとの間に該群より選ばれる少なくとも一
の成分を含有するプライマー層Dを有するものである、
請求項1に記載の耐熱性離型性皮膜。2. At least one member selected from the group consisting of a heat-resistant resin such as a fluorine resin, a silicon resin, an aromatic polysulfone resin, a polyphenylene sulfide resin, a polyamideimide resin and a polyimide resin between the substrate and the layer A. A primer layer C containing a component, and / or a primer layer D containing at least one component selected from the group between the layer A and the layer B,
The heat-resistant release coating according to claim 1.
のである、請求項1又は2に記載の耐熱性離型性皮膜。3. The heat-resistant release coating according to claim 1, wherein the surface of the substrate is blast-treated.
皮膜形成成分に対して2〜100重量%の無機顔料を含ん
でいるものである、請求項1乃至3のいずれかに記載の
耐熱性離型性皮膜。4. The method according to claim 1, wherein at least one of the layers A or B comprises
The heat-resistant release film according to any one of claims 1 to 3, wherein the heat-resistant release film contains 2 to 100% by weight of an inorganic pigment based on the film-forming component.
の屈伏点が500℃以下である請求項1乃至4のいずれか
に記載の耐熱性離型性皮膜。5. The heat-resistant release coating according to claim 1, wherein the frit contains no lead, and the frit has a yield point of 500 ° C. or less.
つ該層Bの膜厚が2乃至100μmである請求項1乃至5
のいずれかに記載の耐熱性離型性皮膜。6. The layer A has a thickness of 5 to 200 μm, and the layer B has a thickness of 2 to 100 μm.
A heat-resistant release film according to any one of the above.
め、皮膜形成成分の5乃至80重量%はフッ素樹脂、ケイ
素樹脂、芳香族ポリサルホン樹脂、ポリフェニレンサル
ファイド樹脂、ポリアミドイミド樹脂およびポリイミド
樹脂より選ばれた少なくとも1種の耐熱性樹脂である被
覆組成物Aを塗布する工程と、 (b)その上に皮膜形成成分として20乃至100重量%の
フッ素樹脂と、0乃至20重量%のフリットと、0乃至80
重量%のケイ素樹脂、芳香族ポリサルホン樹脂、ポリフ
ェニレンサルファイド樹脂、ポリアミドイミド樹脂およ
びポリイミド樹脂よりなる群より選ばれる少なくとも1
種の耐熱性樹脂とを含む被覆組成物Bを塗付する工程
と、 (c)(a)の工程と(b)の工程との間にフリットの
屈伏点以上の温度で焼成し、又は(b)の工程後にフリ
ットの屈伏点以上の温度で焼成することを特徴とする耐
熱性離型性皮膜の形成方法。7. The surface of a substrate to be coated, comprising: (a) a frit occupying 20 to 95% by weight of a film-forming component, and 5 to 80% by weight of a film-forming component comprising a fluororesin, a silicon resin, an aromatic polysulfone resin, Applying a coating composition A which is at least one heat-resistant resin selected from a polyphenylene sulfide resin, a polyamideimide resin and a polyimide resin; and (b) 20 to 100% by weight of fluorine as a film-forming component thereon. Resin, 0 to 20 wt% frit, 0 to 80
% By weight of at least one selected from the group consisting of silicon resin, aromatic polysulfone resin, polyphenylene sulfide resin, polyamideimide resin and polyimide resin.
(C) baking at a temperature equal to or higher than the yield point of the frit between the step of applying the coating composition B containing the kind of heat resistant resin, and the step of (c). A method for forming a heat-resistant releasable film, characterized by firing after the step b) at a temperature not lower than the yield point of the frit.
地表面にフッ素樹脂、ケイ素樹脂、芳香族ポリサルホン
樹脂、ポリフェニレンサルファイド樹脂、ポリアミドイ
ミド樹脂およびポリイミド樹脂等の耐熱性樹脂よりなる
群より選ばれる少なくとも一の成分を含有するプライマ
ー層形成層Cを形成する工程を更に有し、及び/又は該
被覆組成物Aを塗布する工程の後に該被覆組成物Aと該
被覆組成物Bとの間に該群より選ばれる少なくとも一の
成分を含有するプライマー層形成層Dを形成する工程を
更に有するものである、請求項7に記載の方法。8. A group consisting of a heat-resistant resin such as a fluorine resin, a silicon resin, an aromatic polysulfone resin, a polyphenylene sulfide resin, a polyamide imide resin and a polyimide resin on the surface of the substrate before the step of applying the coating composition A. Further comprising a step of forming a primer layer forming layer C containing at least one component selected from the group consisting of: and / or after the step of applying the coating composition A, the coating composition A and the coating composition B The method according to claim 7, further comprising a step of forming a primer layer forming layer D containing at least one component selected from the group during the above.
層の厚みが5〜200μmであり、焼成後に被覆組成物B
によって形成される層の厚みが2〜100μmである請求
項7又は8に記載の方法。9. The thickness of the layer formed by the coating composition A after firing is 5 to 200 μm, and the coating composition B after firing.
The method according to claim 7, wherein the layer formed by the method has a thickness of 2 to 100 μm.
求項7乃至9のいずれかに記載の方法。10. The method according to claim 7, wherein said substrate surface is blasted.
トの屈伏点が500℃以下である請求項7乃至10のいずれ
かに記載の方法。11. The method according to claim 7, wherein the frit contains no lead and has a yield point of 500 ° C. or less.
ち少なくとも一の組成物が、皮膜形成成分に対して2〜
100重量%の無機顔料を含んでいるものである請求項7
乃至11のいずれかに記載の方法。12. The coating composition A or at least one of the coating compositions B may be used in an amount of from 2 to
8. A composition containing 100% by weight of an inorganic pigment.
12. The method according to any one of claims 1 to 11.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8536378A JP3051999B2 (en) | 1995-06-01 | 1996-05-30 | Heat resistant release coating and method of forming the same |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7-158673 | 1995-06-01 | ||
JP15867395 | 1995-06-01 | ||
JP8536378A JP3051999B2 (en) | 1995-06-01 | 1996-05-30 | Heat resistant release coating and method of forming the same |
PCT/JP1996/001477 WO1996038236A1 (en) | 1995-06-01 | 1996-05-30 | Heat-resistant releasable film and process for forming the film |
Publications (1)
Publication Number | Publication Date |
---|---|
JP3051999B2 true JP3051999B2 (en) | 2000-06-12 |
Family
ID=26485711
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8536378A Expired - Fee Related JP3051999B2 (en) | 1995-06-01 | 1996-05-30 | Heat resistant release coating and method of forming the same |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3051999B2 (en) |
-
1996
- 1996-05-30 JP JP8536378A patent/JP3051999B2/en not_active Expired - Fee Related
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6896934B2 (en) | Hybrid coating compositions | |
US6638600B2 (en) | Ceramic substrate for nonstick coating | |
TWI537345B (en) | Ceramic paints and protective coatings | |
US20110308989A1 (en) | Composite cookware comprising a vitreous protective coating | |
AU2007322080A1 (en) | Glass articles with adhesion and stain resistant non-stick coatings | |
EP1539379B1 (en) | Multilayer non-stick coating | |
WO2019230249A1 (en) | Cooking apparatus | |
DK2515729T3 (en) | KITCHEN EQUIPMENT INCLUDING AN EXTERNAL NONSTICK COATING INCLUDING AN EXTERNAL BASE DECORATION AND PROCEDURE FOR ITS MANUFACTURING | |
WO1981002161A1 (en) | Composition for coating fluoroplastics | |
KR100290801B1 (en) | Heat-resistant film and its formation method | |
CN114981374B (en) | Heat resistant coating composition | |
JP3051999B2 (en) | Heat resistant release coating and method of forming the same | |
JPS61205638A (en) | Composite body and manufacture | |
KR101805736B1 (en) | Surface Coating Method Having Improved Durability with Flouride Resin | |
JPH058347A (en) | Heat-resistant precoated metal sheet | |
CN118401155A (en) | Formulation of a polymeric underlayer based on a resin (PEEK, PES, PAI, PBI, etc.) with high thermomechanical properties for enhancing the mechanical properties, in particular the heat resistance, of fluorinated coatings | |
JPH02228485A (en) | Production of enameled cooker | |
CN118414386A (en) | Method for coating a polymeric substrate for enhancing the mechanical, in particular heat resistance, of fluorinated coatings | |
KR100244392B1 (en) | Kitchen porcelain products and the manufacture method thereof | |
JPS6231626B2 (en) | ||
JPS6377979A (en) | Composition | |
JPH0698103B2 (en) | Heating cooker | |
JPH05140770A (en) | Heat resistant enamel coated member |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090407 Year of fee payment: 9 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090407 Year of fee payment: 9 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100407 Year of fee payment: 10 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100407 Year of fee payment: 10 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110407 Year of fee payment: 11 |
|
LAPS | Cancellation because of no payment of annual fees |