JP3050659B2 - Spiral forming method of coated filament - Google Patents

Spiral forming method of coated filament

Info

Publication number
JP3050659B2
JP3050659B2 JP3226594A JP22659491A JP3050659B2 JP 3050659 B2 JP3050659 B2 JP 3050659B2 JP 3226594 A JP3226594 A JP 3226594A JP 22659491 A JP22659491 A JP 22659491A JP 3050659 B2 JP3050659 B2 JP 3050659B2
Authority
JP
Japan
Prior art keywords
spiral
core wire
coated
wire
spiral shape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP3226594A
Other languages
Japanese (ja)
Other versions
JPH0547243A (en
Inventor
武男 宗像
哲 岡田
恒夫 青井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
THE FURUKAW ELECTRIC CO., LTD.
Original Assignee
THE FURUKAW ELECTRIC CO., LTD.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by THE FURUKAW ELECTRIC CO., LTD. filed Critical THE FURUKAW ELECTRIC CO., LTD.
Priority to JP3226594A priority Critical patent/JP3050659B2/en
Publication of JPH0547243A publication Critical patent/JPH0547243A/en
Application granted granted Critical
Publication of JP3050659B2 publication Critical patent/JP3050659B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Wire Processing (AREA)
  • Processes Specially Adapted For Manufacturing Cables (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明は、金属などの芯線材に高
分子ポリマーを押出被覆してなる被覆線条体のスパイラ
ル成形方法に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for spirally forming a coated linear body obtained by extruding a high-molecular polymer onto a core material such as metal.

【0002】[0002]

【従来技術】従来、単一の金属線等の芯線材をスパイラ
ル状に成形するには、棒状体の外周に所定のピッチで螺
旋溝を彫込んだスパイラル成形金型に芯線材を強制的に
押し込み、該芯線材に塑性変形を与えて芯線材をスパイ
ラル状に成形していた。
2. Description of the Related Art Conventionally, in order to form a core wire such as a single metal wire into a spiral shape, the core wire is forcibly applied to a spiral forming die in which spiral grooves are engraved at a predetermined pitch on the outer periphery of a rod. When the core wire is pressed, plastic deformation is applied to the core wire to form the core wire into a spiral shape.

【0003】[0003]

【発明が解決しようとする課題】しかしながら従来の芯
線材のスパイラル成形方法は、芯線材が単一の金属線で
ある場合は何ら問題がないが、従来の方法で芯線材の外
周に高分子ポリマーを被覆した被覆線条体をスパイラル
状に成形すると、芯線材と被覆材の機械的強度が大きく
異なる為、所望のスパイラル状に成形する事が困難であ
った。
However, the conventional spiral forming method of a core wire has no problem when the core wire is a single metal wire. When the coated wire body coated with is formed into a spiral shape, it is difficult to form into a desired spiral shape because the mechanical strength of the core wire material and the coating material greatly differ.

【0004】すなわち、従来の方法で芯線材の外周に高
分子ポリマーを被覆した被覆線条体をスパイラル状に成
形しようとすると、 被覆線条体を金型に強制的に押し込むための、押し込
み用送りローラによって、軟質な被覆材が変形、損傷す
る、 スパイラル成形金型で所定のピッチに成形しようとし
ても芯線材の外周に被覆材が存在するため、芯線材に十
分な塑性変形を付与することができず、所定の寸法に成
形ができない、 という問題があった。
[0004] That is, when it is attempted to form a spirally coated sheathed wire in which the outer periphery of a core wire is coated with a high-molecular polymer by a conventional method, a pushing wire for forcibly pushing the sheathed wire into a mold is used. The soft covering material is deformed and damaged by the feed roller.Because the covering material exists on the outer periphery of the core wire even if the spiral molding die is used to form it at a predetermined pitch, sufficient plastic deformation should be applied to the core wire. Therefore, there was a problem that molding to a predetermined size was impossible.

【0005】[0005]

【発明の目的】本発明は上記問題点に鑑みてなされたも
ので、芯線材の外周に高分子ポリマーを被覆した被覆線
条体を容易にスパイラル状に成形できる被覆線条体のス
パイラル成形方法を提供することを目的とする。
DISCLOSURE OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and a method for spirally forming a coated wire having a core wire coated with a high-molecular polymer in a spiral shape. The purpose is to provide.

【0006】[0006]

【課題を解決するための手段】前記目的を達成するため
本発明は、芯線材をスパイラル金型でスパイラル状に成
形する第1の工程と、該第1の工程に引き続いて前記芯
線材に押出機で高分子ポリマーを押出被覆する第2の工
程とからなることを特徴とするものである。
In order to achieve the above object, the present invention provides a first step of forming a core wire into a spiral shape using a spiral mold, and extruding the core wire following the first step. And a second step of extruding and coating a high-molecular polymer with a machine .

【0007】[0007]

【作用】このように、まず第1の工程で芯線材をスパイ
ラル金型でスパイラル状に成形すると、芯線材を容易に
スパイラル状に成形することができる。次に第2の工程
でスパイラル状に成形した芯線材に押出機で高分子ポリ
マーを押出被覆するので、被覆層も簡単に形成すること
ができる。
As described above, when the core wire is formed into a spiral shape in the first step by using a spiral mold, the core wire can be easily formed into a spiral shape. Next, since the high-molecular polymer is extrusion-coated with the extruder on the core wire formed into a spiral shape in the second step, the coating layer can be easily formed.

【0008】[0008]

【実施例】以下、本発明の実施例を図を参照して詳細に
説明する。図1は本発明方法によって得られた、被覆線
条体の一例を示す断面図であり、この被覆線条体Aは、
アルミ合金、鋼、アルミ鋼クラッド材等からなる芯線材
1の外周にナイロン、ポリカーボネイトその他の高分子
絶縁材料からなる絶縁層2と、上記高分子絶縁材料にカ
ーボンを混入して半導電性とした半導電層3とからなる
被覆層4を形成したものである。この被覆線条体Aは図
2に示すように、架空送電線B等の外周に巻き付けて風
騒音を防止するために使用するものである。巻き付け方
は半導電層3が架空送電線Bと接するように巻き付け
る。このように巻き付けると被覆線条体Aと架空送電線
Bとの間でコロナが生じるのを防止できる。
DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 1 is a cross-sectional view showing an example of a coated striated body obtained by the method of the present invention.
A core wire 1 made of aluminum alloy, steel, aluminum steel clad material, or the like, an insulating layer 2 made of nylon, polycarbonate, or another polymer insulating material on the outer periphery of the core wire 1 and carbon mixed into the polymer insulating material to be semiconductive. A coating layer 4 comprising a semiconductive layer 3 is formed. As shown in FIG. 2, the covered wire A is wound around the outer circumference of an overhead power transmission line B or the like to prevent wind noise. The winding method is such that the semiconductive layer 3 is in contact with the overhead power transmission line B. When wound in this way, it is possible to prevent corona from being generated between the covered wire body A and the overhead power transmission line B.

【0009】次に上記のような被覆線条体Aの成形方法
について説明する。まず、芯線材1をスパイラル状に成
形する。芯線材1をスパイラル状に成形するには、図3
および図4のような装置を使用する。この装置10は、
入口口金11が固定された入口壁12と、出口口金13
が固定された出口壁14とを有する主台15と、この主
台15に回転自在に支持された複数対の送給ローラー1
6と、出口壁14に一端部が接して配置されたスパイラ
ル成形金型17とを備えている。入口口金11、複数対
の送給ローラー16および出口口金13は直線状に配置
されている。また複数対の送給ローラー16は図示しな
い駆動源によって駆動される。さらに、スパイラル成形
金型17にはカバー18が被せてある。
Next, a method of forming the above-described coated filament A will be described. First, the core wire 1 is formed into a spiral shape. To form the core wire 1 into a spiral shape, FIG.
And an apparatus as shown in FIG. This device 10
An inlet wall 12 to which an inlet base 11 is fixed, and an outlet base 13
And a plurality of pairs of feed rollers 1 rotatably supported by the base 15.
6 and a spiral molding die 17 arranged at one end with the outlet wall 14. The inlet base 11, a plurality of pairs of feed rollers 16 and the outlet base 13 are arranged linearly. The plural pairs of feed rollers 16 are driven by a drive source (not shown). Further, the spiral molding die 17 is covered with a cover 18.

【0010】上記装置で芯線材1をスパイラル状に成形
するには、入口口金11に挿入した芯線材1を、複数対
の送給ローラー16および出口口金13と通して、スパ
イラル成形金型17内に送り込む。スパイラル成形金型
17内に送り込まれた芯線材1はスパイラル成形金型1
7に成形されたスパイラル溝19を通過することにより
塑性変成を受けてスパイラル状に成形される。なお、ス
パイラル成形金型17に成形されたスパイラル溝19の
ピッチや方向等を変えることにより各種のスパイラル形
状を成形できる。
In order to form the core wire 1 into a spiral shape using the above-described apparatus, the core wire 1 inserted into the inlet mouthpiece 11 is passed through a plurality of pairs of feed rollers 16 and outlet mouthpieces 13 to form a spiral mold 17. Send to The core wire 1 sent into the spiral forming die 17 is a spiral forming die 1
7 is plastically transformed by passing through the spiral groove 19 formed in 7 to be formed into a spiral shape. Various spiral shapes can be formed by changing the pitch, direction, and the like of the spiral groove 19 formed in the spiral forming die 17.

【0011】次に第2の工程である被覆工程について述
べる。スパイラル金型17の先に押出機21および22
のクロスヘッド23を配置し、スパイラル状に成形され
た芯線材1を該クロスヘッド23に導きそこを通過させ
る。クロスヘッド23には押出機21および22から、
絶縁被覆材と半導電性被覆材とが供給され、図1に示し
たように芯線材1の表面に絶縁層2と半導電層3の被覆
層4が形成される。
Next, the coating step which is the second step will be described. Extruders 21 and 22 are provided before the spiral mold 17.
Is arranged, and the core wire 1 formed in a spiral shape is guided to the crosshead 23 and passed therethrough. The crosshead 23 has extruders 21 and 22
The insulating coating material and the semiconductive coating material are supplied, and the insulating layer 2 and the coating layer 4 of the semiconductive layer 3 are formed on the surface of the core wire 1 as shown in FIG.

【0012】被覆層4の形成直後は高熱でありそのまま
放置すると熱変形しやすいので、被覆直後の位置に冷却
槽24を配置して被覆層4を冷却する。なお、図示して
いないが、冷却槽24の先には計尺切断装置を配置し
て、長尺なスパイラル状線条体を一定長毎に切断して、
一定長のスパイラル線を連続的に製造できるようにして
ある。
Immediately after the formation of the coating layer 4, the coating layer 4 is cooled by arranging a cooling tank 24 at a position immediately after the coating, since the temperature is high and the heat is easily deformed if left as it is. Although not shown, a measuring and cutting device is arranged at the end of the cooling tank 24 to cut the long spiral striated body into fixed lengths.
A fixed length spiral wire can be manufactured continuously.

【0013】[0013]

【発明の効果】以上説明したように本発明によれば、第
1の工程で芯線材のみをスパイラル状に成形するので、
芯線材の成形を容易に行うことができる。また、第2工
程で高分子ポリマーを押出被覆するので、簡単に被覆層
を形成することができる。したがって、スパイラル状の
被覆線条体を安価にかつ均一に製造できる。
As described above, according to the present invention, only the core wire is formed into a spiral shape in the first step.
The core wire can be easily formed. In addition, since the high-molecular polymer is extrusion-coated in the second step, a coating layer can be easily formed. Therefore, the spiral-shaped coated filament can be manufactured uniformly at low cost.

【0014】[0014]

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明方法で成形されたスパイラル状線条体の
断面図。
FIG. 1 is a cross-sectional view of a spiral striated body formed by the method of the present invention.

【図2】本発明方法で成形されたスパイラル状線条体の
使用状態の正面図。
FIG. 2 is a front view of the spiral striated body formed by the method of the present invention in use.

【図3】本発明方法で使用する装置の正面図。FIG. 3 is a front view of an apparatus used in the method of the present invention.

【図4】本発明方法で使用する装置の側面図。FIG. 4 is a side view of an apparatus used in the method of the present invention.

【符号の説明】[Explanation of symbols]

A:被覆線条体 1:芯線材 4:被覆層 11:入口口金 13:出口口金 15:主台 16:複数対の送給ローラー 17:スパイラル成形金型 19:スパイラル溝 21、22:押出機 23:クロスヘッド 24:冷却槽 A: Coated wire 1: Core wire 4: Coated layer 11: Inlet mouthpiece 13: Outlet mouthpiece 15: Main base 16: Plural pairs of feed rollers 17: Spiral molding die 19: Spiral groove 21, 22: Extruder 23: Cross head 24: Cooling tank

───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平2−207935(JP,A) 特開 平4−253536(JP,A) 実開 平2−57223(JP,U) (58)調査した分野(Int.Cl.7,DB名) H01B 13/00 - 13/32 ────────────────────────────────────────────────── ─── Continuation of front page (56) References JP-A-2-207935 (JP, A) JP-A-4-253536 (JP, A) JP-A-2-57223 (JP, U) (58) Survey Field (Int.Cl. 7 , DB name) H01B 13/00-13/32

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 芯線材をスパイラル金型でスパイラル状
に成形する第1の工程と、該第1の工程に引き続いて前
記芯線材に押出機で高分子ポリマーを押出被覆する第2
の工程とからなる被覆線条体のスパイラル成形方法。
1. A first step of forming a core wire into a spiral shape with a spiral mold, and a second step of extruding and coating a high-molecular polymer on the core wire with an extruder following the first step.
Spiral forming method of the coated filamentary body, comprising the steps of:
JP3226594A 1991-08-12 1991-08-12 Spiral forming method of coated filament Expired - Lifetime JP3050659B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3226594A JP3050659B2 (en) 1991-08-12 1991-08-12 Spiral forming method of coated filament

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3226594A JP3050659B2 (en) 1991-08-12 1991-08-12 Spiral forming method of coated filament

Publications (2)

Publication Number Publication Date
JPH0547243A JPH0547243A (en) 1993-02-26
JP3050659B2 true JP3050659B2 (en) 2000-06-12

Family

ID=16847636

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3226594A Expired - Lifetime JP3050659B2 (en) 1991-08-12 1991-08-12 Spiral forming method of coated filament

Country Status (1)

Country Link
JP (1) JP3050659B2 (en)

Also Published As

Publication number Publication date
JPH0547243A (en) 1993-02-26

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