JP3049927B2 - Substrate heating device for thin film formation - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a method for heating a flat substrate such as a semiconductor wafer in a vacuum vessel to a predetermined temperature and forming an amorphous film, a polycrystalline film or a single crystal on the substrate by a gas phase reaction. The present invention relates to a thin-film-forming substrate heating device used for forming or the like.

[0002]

2. Description of the Related Art This type of substrate heating method includes heating directly by heat radiation from a strip-shaped, linear or coil-shaped resistance material for electric heating which is arranged in one plane and forms a heating surface in a plane. A heating element body with a built-in heating element containing a heating element and a heating surface that is formed in a flat shape is brought into contact with the substrate for heat conduction heating, induction heating using high frequency, or a halogen lamp, etc. Or heating by infrared rays.

[0003] Among such heating methods, in a method of directly heating by heat radiation from a strip-shaped, linear, or coil-shaped resistance material for electric heating, for example, tantalum (Fe-20) used for high-temperature heating is used as a resistance material. % Cr-5
% Co alloy) or molybdenum or tungsten, which is particularly suitable for high-temperature use in a non-oxidizing atmosphere such as vacuum. However, in a vacuum, the vapor pressure of these metals increases, so that high-temperature heating (for example, (500 ° C. for the heating element and 1200 ° C. or more for the resistive material for electric heating), the resistive material and the impurities contained in the resistive material are easily turned into vapor, which impairs the quality of the formed film on the substrate. Further, as shown in FIG. 10 (see Japanese Utility Model Application No. 60-187968), in order to make the surface distribution of the substrate temperature uniform, a box-shaped reflector surrounding the periphery of the substrate and having an inner wall surface formed on a reflection surface (see FIG. 10). 10 of 34)
In this case, the reflecting surface is contaminated by the vaporized resistance material or impurities contained in the resistance material, and the function of the reflector is reduced, so that a uniform temperature distribution cannot be obtained.

In addition, a method using heat conduction heating, in which a resistance material for electric heating is embedded in a heat insulating material, and a metal material is cast in a plane on the surface of the heat insulating material and brought into contact with a cast-type heating element having a heating surface. In general, a nichrome wire (Ni-Cr alloy wire or Ni-Cr-Fe alloy wire) or a tantalum wire is used as a resistance material embedded in the heat insulating material. Disconnection occurs due to the difference in thermal expansion with the material. Aluminum or brass casting is usually used as a metal material for forming the heating surface, but these metals have a high vapor pressure even in the atmosphere,
In a vacuum, the vapor pressure is further increased, and as described above, the constituent metals and impurities are easily vaporized, resulting in a significant impairment of the quality of the formed film on the substrate.

On the other hand, in the induction heating method using high frequency,
The heating body becomes large and expensive. In addition, the infrared lamp heater is mainly of a straight tube type using a linear quartz glass tube for the lamp body, and generally has a structure in which ten or more tubes are arranged in a plane to obtain a high temperature. There are many lead wires for power supply, and it takes time to process and assemble terminals for connecting to the terminals of the lamp. Another problem is that the substrate is usually circular, whereas a conventional infrared lamp heater of this type is of a straight tube type, and the heating surface is square or rectangular. The generated heat is wasted heat, which is inefficient in heating the circular substrate. In addition, from the viewpoint of the structure, the square has a corner portion, which results in a large shape.

Further, the uniformity of the substrate surface required to obtain a uniform formed film on the substrate surface, that is, the temperature difference between the central portion and the peripheral portion of the substrate is determined by contact heating when the substrate is heated to 500 ° C. Or 10-30 ° C in induction heating,
Usually it is close to 30 ° C. In the case of contact heating, a small value on the order of 10 ° C. is limited to the case where conditions such as the thermal conductivity of the metal forming the heating surface and the area of the heating surface with respect to the substrate are particularly favorable. In the case of infrared radiation heating, the ratio of the temperature difference between the central portion and the peripheral portion of the substrate and the heating temperature, that is, the non-uniformity can be reduced to about 5%. The same components as the generated film adhere to the reflector surface that reflects light toward the substrate, making it difficult to efficiently form a reproducible film quality on the substrate. The maintenance to remove, including the parts, becomes complicated. In addition, since the heater section is in a vacuum, a power supply terminal is required for the vacuum container, and a general commercial voltage cannot be used to prevent vacuum discharge, and the transformer is used after being transformed to a low voltage such as 60 V by a transformer. . For this reason, there is a problem that the required space of the device is increased by these facilities and a problem that the price of the device is increased.

As another major problem, the temperature of the terminal portion and the reflector of the infrared lamp heater installed in a vacuum rises with time, and the terminal portion of the infrared lamp heater may be damaged if it exceeds 350 ° C.
In the reflector, there is a fear that the surface heated to a high temperature evaporates and the reflectance decreases. In order to prevent evaporation of the reflector surface, when introducing a cooling pipe for cooling the reflector into a vacuum, a device that moves the heating source in a vacuum does not have a reliable pipe member in terms of vacuum leakage. ,
There is a problem that it is difficult to cool the reflector. If cooling is not possible, heating cannot be performed for a long time, and a desired film cannot be obtained. In the conventional method, the heating time at the time of heating at 600 ° C. is at most 30 to 40 minutes. For this reason, the distance to a plasma source or the like cannot be changed by moving the substrate, and there has been a problem that it is difficult to set optimum film forming conditions.

In order to solve this problem, the present inventor has stated that
Japanese Patent Application No. 2-316425 proposes the following device configuration. (1) The device is formed into a circular flat infrared lamp heater in which a plurality of ring-shaped infrared lamps having different diameters are concentrically arranged in one plane, and a cylindrical shape having one open end and a bottom surface at the other end. A reflector in which the infrared lamp heater is housed coaxially, a reflector having an entire inner surface of a cylinder formed on a reflecting surface, and a ring formed radially inward on an open end side end surface of the reflector which is formed as a cylindrical container which houses the reflector coaxially. A convex projection is formed and an opening inside the ring-shaped projection is hermetically closed by a quartz glass plate for transmitting light, and the other end face is provided with a power supply wiring for supplying a heating current to the infrared lamp heater. , An opening through which a cooling pipe through which a cooling medium for cooling the reflector passes, and an internal space between both end surfaces communicating with the atmosphere through the opening, and outside the quartz glass plate A main body of the apparatus is formed using a heater container having a support portion for supporting the substrate to be heated in parallel with the quartz glass plate, and the main body of the apparatus holds the substrate in a vacuum and extends in the axial direction of the heater container. Try to move.

(2) As a more specific configuration of this configuration, the heater container has a peripheral wall that substantially surrounds the outer peripheral surface of the cylindrical reflector peripheral wall and supports the quartz glass plate on the outer peripheral edge side so that it cannot escape. A cylindrical shield ring formed integrally with one end face of the peripheral wall and having the other end open, an opening through which a power supply wiring and a cooling pipe pass, and an infrared lamp heater and a reflector together with the shield ring. Is formed using a cover bracket which forms a space for accommodating the heater container, the heater main body, the infrared lamp heater, the reflector, and the tubular body, which are formed upright at the opening of the cover bracket. A hollow mount formed with a power transmission unit for guiding the power supply wiring and the cooling pipe into the heater container and moving the heater container in the axial direction; And a base plate for supporting an infrared lamp inside the reflector in contact with the outer surface of the bottom surface of the cylindrical reflector.

(3) A cylindrical reflector is provided inside the peripheral wall,
A cooling medium for cooling the peripheral wall is formed in a cylindrical cavity that moves in the circumferential direction, and a cooling medium flow path for cooling the bottom surface is formed on an outer surface of the bottom surface in contact with the base plate, and The shield ring has, inside the peripheral wall, a cylindrical cavity in which a cooling medium for cooling the peripheral wall and the ring-shaped protrusion on the peripheral wall end surface supporting the quartz glass plate moves in the circumferential direction. Shall be.

(4) A plurality of grooves extending radially from the center of the bottom surface of the cylindrical reflector, and a plurality of grooves formed in an arc shape near the periphery of the surface are formed at both ends of the arc. Two adjacent grooves are paired with each other and formed in a circumferential groove to which respective peripheral edges of the surfaces are connected, and the cooling medium introduced into the center of the surface is formed in the arc shape. The groove may be led out from the center of the groove, or the flow path on the outer surface of the bottom surface of the cylindrical reflector may be formed in a plurality of grooves extending radially from the center of the surface, and formed in an arc shape near the periphery of the surface. Two grooves adjacent to each other in the plurality of grooves are paired at both ends of the circular arc, and a circumferential groove in which the respective surface peripheral edge portions are connected to each other. It is formed by a single groove extending radially inward from the center of the arc-shaped groove and introduced into the center of the surface. The cooling medium is led out from the center end of the surface of the groove that extends radially inward from the center of the arc-shaped groove.

(5) The infrared lamp heater is supported on the inside of the reflector by the base plate. A plurality of ring-shaped infrared lamps having different diameters constituting the infrared lamp heater each form a ring-shaped tube in an endless complete circle. A pair of terminals provided on the tube portion are formed in a bar shape, respectively, and are erected perpendicularly to the surface of the ring at positions on the ring opposed to each other across the center of the ring.
The operation is performed by penetrating the hole in the bottom surface of the reflector and the hole in the base plate at a position where the pair of terminals is shifted in the circumferential direction between the respective infrared lamps and anchoring the holes in the base plate.

FIGS. 3 to 9 show an example of the substrate heating apparatus having the above-described configuration. FIG. 3 shows the overall configuration of the substrate heating apparatus. The right half is a cross section of a vacuum vessel in which the substrate on which a film is to be formed is located. The left half is a cylindrical reflector 3 and a shield ring 4 for viewing an infrared lamp heater. , Base plate 2, cover bracket 7, hollow mount 8 and the like are shown in cross section.

Four ring-shaped infrared lamps 1a (FIG. 4) each having a tube portion formed of a quartz glass tube are arranged concentrically in one plane, and the ring surface is located at a position on the ring opposed to the center of the ring. A pair of rod-shaped terminals, which are vertically arranged on the base plate, are passed through holes formed in the bottom surface of the cylindrical reflector 3 (FIG. 3) and the base plate 2 contacting the top surface of the bottom surface. Hang pin 2 in the hole
0, and the circular flat infrared lamp heater 1 is supported inside the reflector 3.

The reflector 3 is made of aluminum or the like, and has a structure in which the entire inner surface is polished to a mirror surface or gold-plated to reflect infrared rays efficiently to increase heating efficiency. The bottom surface of the reflector 3 is surface-bonded to the base plate 2, and an O-ring is inserted around the hole through which the rod-shaped terminal of the infrared lamp (hereinafter also referred to as a lamp) 1a penetrates and on the peripheral side of the bonding surface (FIG. 6). The cooling medium, here water, introduced into the formed flow path is prevented from leaking out of the joint surface. In addition, a cylindrical cavity (hereinafter referred to as a water jacket) 15 is provided inside the peripheral wall of the reflector 3 as a space for cooling water to flow in and cool the peripheral wall. The structure is such that the peripheral wall is cooled by absorption.

In order to keep the infrared lamp heater 1 in the atmosphere, the infrared lamp heater 1 is fitted with the peripheral wall of the reflector 3 so as to substantially surround the reflector peripheral wall and radially inward of the end face portion.
Ring-shaped convex portion 4 for airtightly supporting quartz glass plate 5
The shield ring 4 in which the a is formed constitutes a part of the heater container 23 that accommodates the infrared lamp heater 1 and the reflector 3, and together with the cover bracket 7, the cooling water pipe 1.
7 and a power supply wiring 18 to the infrared lamp heater 1 are formed. A cylindrical water jacket 16 is also formed inside the peripheral wall of the shield ring 4, and as a flow path configuration for sending cooling water to the water jacket 16 and moving it in the circumferential direction, the heat of the reflector 3 is also absorbed by this peripheral wall. I have to. Water is supplied to the water jacket 16 from the cooling water inlet 2 a of the base plate 2, as shown in FIG. 8, through the peripheral wall of the reflector 3. An O-ring is provided on each member joining surface or contact surface around the flow passage from the cooling water inlet 2a to the water jacket 16 to prevent leakage of the cooling water from the flow passage. The heat carried away by the water sent into the water jacket 16 is transferred to the peripheral wall of the shield ring 4 via the peripheral wall of the reflector 3 and the quartz glass plate 5.
, The heat that has reached the convex portion 4a on the end face of the shield ring, the heat absorbed by the quartz glass plate 5 itself, and the heat received by the transfer ring 6 on which the substrate to be heated is placed. The portion 4a is formed integrally with the peripheral wall of the shield ring, is effectively cooled, and can maintain airtightness of the quartz glass plate 5 for a long time without any trouble.

The transfer ring 6 supports the substrate by means of a separately provided substrate transfer device or the like and maintains a constant distance from the lamp heater 1 to assist stable heating. Delivery ring 6
Is usually made of a high melting point insulator such as quartz glass. The cooling water pipe 17 and the power supply wiring 1 are provided on the upper surface of the cover
8 is guided through the vacuum flange 10 so as to be coaxial with the opening 7a, and is integrated with the outer peripheral surface of the hollow mount 8 so as to be integrated with the opening 7a. Drive screw 1 to pipe 8a
1 is formed. The rotational driving force of the motor 14 is transmitted to the driving screw 11 via a reduction mechanism composed of a combination of gears, and the rotational driving force is converted into a vertical driving force by the driving screw 11, and the infrared lamp heater 1, The heater container 23 containing the reflector 3 and the like is moved in the axial direction. Vertical guidance during movement is performed using a linear guide 13 fixed to the pipe 8a. Also,
Airtightness between the hollow mount 8 and the vacuum flange 10 is provided by a metal bellows 12. Although not detailed here,
A plasma generating container 22 is fixed to the vacuum container 9, and a raw material gas is introduced from the outside into the plasma generating container 22 to be turned into plasma, and a substrate is irradiated with a plasma beam to form a film. Since the plasma intensity, the plasma density, and the like differ depending on the distance from the plasma generation container 22, the apparatus main body constituting the moving unit of the heating apparatus is moved to a position where optimal film forming conditions can be obtained, so that a high quality film having desired characteristics can be obtained. Obtainable.

A power supply line 18 introduced into the heater container through the hollow mount 8 is connected to a power supply portion 19 formed by a plurality of ring-shaped infrared lamp terminal pairs. Although not shown here, it is connected to a one-touch joint provided on the base plate 2. As shown in a plan view in FIG. 4, the infrared lamp heater is formed by fitting a generally circular substrate to be heated and forming a plurality of ring-shaped infrared lamp tubes constituting the lamp heater into an endless complete circle. In order to efficiently irradiate the substrate with infrared light, the output capacity of each lamp is determined by the distance from each lamp to the substrate to be heated and the lamp so that the amount of heat is evenly distributed to the substrate to be heated. The distance between each ring and the distance from the lamp to the reflector is taken into account in consideration of the simulation. Naturally, the output capacity increases as the lamps move outward, and in this embodiment, the rated voltage of the inner two lamps is 160 V and the outer two lamps are 240 V out of the four lamps.
The lamp heater is configured to have a high voltage of V. As a result, the current flowing through the lamp heater 1 can be reduced to 12 A or less, and the temperature of the power supply unit 19 can be kept low to improve the life of the heater. The rated voltage of the lamp is 1
The high voltage of 60V, 240V, etc. was achieved because, unlike power supply to a vacuum, there was no abnormal discharge between terminals or between a terminal and a ground potential member in the air, and a high voltage could be applied. It is.

The cooling structure of each part of the apparatus main body is as follows. As shown in FIG. 6, on the upper surface of the reflector 3 showing a cross section along the line GG in FIG. 3, four grooves 3a extending radially from the center of the upper surface, and the tips of the four grooves are respectively provided. A total of eight grooves 3b that are branched into two and extend almost radially, and an arc-shaped groove 3c in which two of the eight grooves are paired and the peripheral end is connected to both ends, Groove 3
A straight groove 3d extending radially inward from the center of c is formed, and the base plate 2 is joined to this upper surface, whereby each groove forms a conduit through which cooling water passes. In this example, the water introduced into the central portion E through the water supply pipe in the cooling water pipe 17 flows through the grooves 3a, 3b, 3c, and 3d in order, and is drawn out from the outlet point F through the drain pipe. Is done. Sealing is performed using an O-ring so that water does not leak outside from the joint surface between the reflector 3 and the base plate 2.

As shown in FIG. 5, two water supply ports A and C are provided on the upper surface of the base plate 2 for the water jackets 15 and 16 inside the reflector peripheral wall and the shield ring peripheral wall, respectively. As shown in FIG. 8, the water flowing from the water supply port A penetrates the peripheral wall of the reflector 3 and flows into the water jacket 16 of the shield ring.
Spill out of. As shown in FIG. 9, the water flowing from the water supply port C is directly supplied to the water jacket 1 of the reflector 3.
5 and out of the drain port D. FIG. 7 is a flow chart showing a connection state between the cooling pipe and the cooling medium flow path in the apparatus.
With this flow path configuration, 300 ° C. or lower can be secured in the high-temperature portion of the reflector.

[0021]

The substrate heating apparatus constructed as described above still has the following problems. That is, since the infrared lamp heater is placed in a stationary atmosphere, the temperature of the infrared lamp heater itself rises greatly, and if a large-capacity lamp is used to heat the substrate to a higher temperature, the lamp is further heated. The lamp is damaged or the life is shortened.

Further, since the terminal of the infrared lamp is a power supply structure in which a high melting point metal such as a molybdenum rod and a foil pass through the quartz glass, if the temperature rises excessively, thermal expansion of the quartz glass and the molybdenum occurs. The difference causes cracks in the quartz glass, resulting in damage to the heater wires (eg, tungsten wires) of the lamp body connected to the molybdenum. For this reason, it is necessary to maintain the temperature of the power supply unit at 350 ° C. or lower. However, in natural cooling in the atmosphere, the current that can be maintained at this temperature or lower cannot be increased, and the lamp heater body has a current carrying capacity. Nevertheless, there is a problem that this capacity cannot be utilized.

Further, in the reflector in the above-described apparatus configuration, the reflected light from the inner surface of the reflector, particularly the cylindrical surface near the same plane as the infrared lamp heater irradiates the infrared lamp and the terminal to heat the infrared lamp and the terminal. However, the capacity of the infrared lamp heater cannot be increased. An object of the present invention is to provide a configuration of a substrate heating device capable of effectively reducing the temperature of an infrared lamp and its terminals as compared with the above configuration.

[0024]

According to the present invention, there is provided a circular flat infrared lamp heater in which a plurality of ring-shaped infrared lamps having different diameters are arranged concentrically in one plane. One end is open and the other end is formed in a cylindrical shape having a bottom surface. The infrared lamp heater is housed near the bottom surface, and the entire inner surface of the cylinder is formed as a reflection surface. A reflector provided with a through-hole for projecting while maintaining a gap, and a cylindrical container formed coaxially to accommodate the reflector, and the open end face side of the reflector is hermetically closed by a quartz glass plate for transmitting light, and When the end face of the cable passes through a power supply wiring for supplying a heating current to the infrared lamp heater and a cooling pipe through which a cooling medium for cooling the reflector passes. A substrate heating apparatus further comprising a heater container having an opening for communicating an internal space between both end surfaces to the atmosphere, and heating a substrate such as a semiconductor wafer in a vacuum to vapor-grow a thin film on the substrate. A hole constituting a cooling gas flow path is formed in the thickness of the peripheral wall of the cylindrical reflector from the outer surface of the bottom surface to the vicinity of the open end surface of the cylinder in the axial direction. A jet nozzle that opens inward is formed, and the cooling gas is sent into the inside of the cylindrical reflector through the axial hole and the jet nozzle. Provide an air supply manifold with an ejection nozzle that ejects cooling gas by blowing cooling gas to the terminal of the infrared lamp, or form the reflecting surface of the cylindrical reflector with the bottom surface of the cylinder And the flat reflecting portion that,
It comprises a cylindrical reflector on the open end surface side of the cylinder, perpendicular to the bottom surface, and a truncated cone-shaped inclined surface reflector between the planar reflector and the cylindrical reflector.

[0025]

As described above, a hole constituting the flow path of the cooling gas is formed in the thickness of the peripheral wall of the cylindrical reflector from the outer surface of the bottom surface to the vicinity of the open end surface of the cylinder in the axial direction. To form an ejection nozzle that opens to the inside of the cylinder, and feeds the cooling gas into the inside of the cylindrical reflector through the axial hole and the ejection nozzle. An air supply manifold equipped with an ejection nozzle for ejecting cooling gas toward the infrared lamp terminal is provided, and when the cooling gas is blown to the infrared lamp terminal, the space on the infrared lamp heater side in the heater container (hereinafter referred to as the heater section) Area) and the opening side space (hereinafter referred to as the power supply area) are ventilated by the cooling gas. In the heater area, the infrared lamp heater body and the power supply area In this case, an excessive rise in temperature of the terminals constituting the power supply section of the infrared lamp heater can be effectively suppressed. This makes it more difficult for the infrared lamp heater main body to be damaged in the heater section area, or it is possible to further suppress the reduction in life. In addition, the current that can pass through the terminal of the infrared lamp increases, and the infrared lamp capacity can be fully used.

Further, the reflecting surface of the cylindrical reflector is formed by a flat reflecting portion formed by the bottom surface of the cylinder and an opening end surface side of the cylinder.
When configured with a cylindrical reflecting portion perpendicular to the bottom surface and a truncated cone-shaped reflecting portion between the flat reflecting portion and the cylindrical reflecting portion, an infrared lamp heater forming a flat light source is directed in this flat direction. The reflected infrared light is reflected toward the substrate by the inclined surface reflecting portion, and the ordinary cylindrical reflecting surface repeatedly and irregularly reflects near the light source plane many times to heat the lamp heater, so that the lamp capacity cannot be sufficiently increased. In addition, the heating temperature of the substrate can be further increased by compensating for the drawback that the heating efficiency of the substrate is reduced. can do.

[0027]

FIG. 1 shows an embodiment of a substrate heating apparatus body according to the present invention. In the thickness of the peripheral wall 67 of the reflector 3, a communication hole 60 running in the axial direction on the outside of the water jacket 15 for sending cooling gas into the heater area 51 b formed by the reflector 3 and the quartz glass plate 5. The reflector 3 is bored from the upper surface to the vicinity of the open end surface, and a jet nozzle 61 is provided at the end of the reflector 3. Further, a through hole 69 is formed in the base plate 2 at the same position as the communication hole 60 in the reflector peripheral wall, and a cooling gas supply port 65 is attached to this hole. In this embodiment, the communication hole 60 and the ejection nozzle 61 are formed at four locations on the peripheral wall in the circumferential direction. Further, in order to cool the terminal 21a constituting a power supply unit to the infrared lamp heater main body, four air supply manifolds 62 are provided on the upper surface of the base plate 2, FIG.
Are provided corresponding to the infrared lamp arrangement. The air supply manifold 62 has ejection nozzles 63 in two directions, and ejects cooling gas toward the terminal 21a. The flow of the cooling gas will be described. When a cooling gas such as N ₂ gas is introduced from the cooling gas supply port 65, the cooling gas passes through the communication hole 60 and is ejected from the ejection nozzle 61 into the heater area 51 b. This gas is a quartz glass plate 5 and an infrared lamp
The surface of FIG. 4 (1a) is cooled and flows through the gap of the terminal hole 64 to the atmosphere side. At this time, at the same time, the terminal 21
a is also cooled. Further, the cooling gas introduced into the air supply manifold 62 directly cools the terminal 21a and flows out to the atmosphere.

FIG. 2 is a plan view of the power supply area 51a. The air supply manifolds 62 are provided at four locations and cool the terminals 21a facing each other. Next, the structure of the reflecting surface of the cylindrical reflector will be described. The reflecting surface includes a flat reflecting portion 71 formed by the bottom surface of the reflector cylinder, a cylindrical reflecting portion 72 on the open end side of the cylinder, perpendicular to the bottom surface, and a truncated cone-shaped reflecting portion between the two reflecting portions 71, 72. 70, and the angle of the inclined surface is an angle inclined by 15 to 45 ° with respect to the axis. Due to this inclination, infrared light traveling from the infrared lamp heater parallel to the bottom surface of the reflector is also reflected toward the substrate 31. Also, reflected light that irradiates the terminal of the infrared lamp is reduced.

[0029]

According to the present invention, since the substrate heating apparatus for forming a thin film is configured as described above, the following effects can be obtained. In the apparatus according to the first aspect, the infrared lamp heater main body and its terminals are effectively cooled as compared with the case of natural cooling in the atmosphere, and the infrared lamp is less likely to be damaged or shortened in life. As the current that can pass through the terminals increases due to the cooling, the capacity of the infrared lamp can be fully used, and the possible substrate heating temperature increases.

In the apparatus according to the second aspect, the infrared light from the infrared lamp heater, which is parallel to the bottom surface of the reflector cylinder, is reflected toward the substrate by the inclined surface reflection portion, and the bottom surface and the cylindrical portion alone constitute a total reflection surface. As compared with the case, the heating of the infrared lamp and the terminal is reduced, the lamp capacity can be increased, and the heating efficiency of the substrate can be increased. With this reflecting surface structure, the maximum substrate heating temperature when the reflecting surface is constituted by only the bottom surface and the cylindrical surface is approximately 870 ° C. to 1000 ° C.
I was able to do above.

[Brief description of the drawings]

FIG. 1 is a longitudinal sectional view showing a configuration of a thin film forming substrate heating apparatus main body according to an embodiment of the present invention.

2 is a top view of a base plate showing an arrangement state of an air supply manifold for cooling an infrared lamp terminal in the substrate heating apparatus main body shown in FIG. 1;

FIG. 3 is a longitudinal sectional view showing a configuration of a substrate heating apparatus proposed earlier by the present inventors.

FIG. 4 is a plan view showing a configuration example of an infrared lamp heater targeted by the present invention.

FIG. 5 is a top view of a base plate in which the infrared lamp heater is moored in a suspended state inside a cylindrical reflector in the substrate heating apparatus of FIGS. 1 and 3;

FIG. 6 is a plan view showing a flow path of cooling water formed on an outer surface of a bottom surface of the reflector for cooling the reflector in the substrate heating apparatus of FIGS. 1 and 3;

FIG. 7 is a flow chart showing a connection state between a cooling water pipe for cooling the reflector and a cooling water flow path in the apparatus main body in the substrate heating apparatus of FIGS. 1 and 3;

FIG. 8 is a cross-sectional view of a main part showing a flow path of cooling water flowing into a water jacket of a shield ring in the substrate heating apparatus of FIGS. 1 and 3;

FIG. 9 is a cross-sectional view of a main part showing a flow path of a cooling medium flowing into a water jacket of a reflector in the substrate heating apparatus of FIGS. 1 and 3;

10A and 10B are diagrams illustrating a configuration example of a conventional substrate heating apparatus, wherein FIG. 10A is a plan view and FIG. 10B is a side cross-sectional view.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Infrared lamp heater 1a Infrared lamp 2 Base plate 3 Reflector 3a groove 3b groove 3c groove 3d groove 4 Shield ring 5 Quartz glass plate 6 Delivery ring (support part) 7 Cover bracket 7a Opening 8 Hollow mount 11 Drive screw (power transmission part) 13 Linear guide 15 Water jacket (hollow) 15 Water jacket (hollow) 17 Cooling water pipe (cooling pipe) 18 Power supply wiring 19 Power supply section 20 Hang pin 21a Terminal 23 Heater container 31 Substrate 61 Jet nozzle 62 Air supply manifold 63 Jet nozzle 65 Cooling gas Air supply port 67 Communication hole (hole) 69 Through-hole 70 Inclined surface reflector 71 Planar reflector 72 Cylindrical reflector

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int. Cl. ⁷ , DB name) H01L 21/205 C23C 16/46

Claims (2)

(57) [Claims] A circular flat infrared lamp heater in which a plurality of ring-shaped infrared lamps having different diameters are concentrically arranged in one plane, and a cylindrical shape having one end opened and a bottom surface at the other end. A reflector having a through hole that accommodates the infrared lamp heater near the bottom surface, the entire inner surface of the cylinder is formed on a reflection surface, and the bottom surface has a through-hole for projecting a rod-shaped terminal of each infrared lamp outwardly from the bottom surface with a gap therebetween; A power supply line formed as a cylindrical container that accommodates the reflector coaxially, the open end face of the reflector being airtightly closed by a quartz glass plate for transmitting light, and the other end face supplying a heating current to the infrared lamp heater. And a heater that has an opening that passes through a cooling pipe through which a cooling medium that cools the reflector passes and that allows the internal space between both end faces to communicate with the atmosphere. A substrate heating apparatus for heating a substrate such as a semiconductor wafer in a vacuum to vapor-grow a thin film on the substrate in a thickness direction of the peripheral wall of the cylindrical reflector from the outer surface of the bottom surface in the axial direction. While drilling a hole that constitutes the flow path of the cooling gas up to near the open end face of the cylinder,
An ejection nozzle connected to the tip of the hole and opening to the inside of the cylinder is formed, and the cooling gas is fed into the inside of the cylindrical reflector through the axial hole and the ejection nozzle. A substrate heating apparatus for forming a thin film, wherein an air supply manifold having a jet nozzle for jetting a cooling gas toward a terminal of an infrared lamp is provided in a side space, and a cooling gas is blown to a terminal of the infrared lamp. . 2. A circular flat infrared lamp heater in which a plurality of ring-shaped infrared lamps each having a different diameter are arranged concentrically in one plane, and a cylindrical shape having one end opened and a bottom surface at the other end. A reflector having a through hole that accommodates the infrared lamp heater near the bottom surface, the entire inner surface of the cylinder is formed on a reflection surface, and the bottom surface has a through-hole for projecting a rod-shaped terminal of each infrared lamp outwardly from the bottom surface with a gap therebetween; A power supply line formed as a cylindrical container that accommodates the reflector coaxially, the open end face of the reflector being airtightly closed by a quartz glass plate for transmitting light, and the other end face supplying a heating current to the infrared lamp heater. And a heater that has an opening that passes through a cooling pipe through which a cooling medium that cools the reflector passes and that allows the internal space between both end faces to communicate with the atmosphere. In a substrate heating apparatus for heating a substrate such as a semiconductor wafer in a vacuum and vapor-growing a thin film on the substrate, the reflecting surface of the cylindrical reflector has a flat reflecting portion formed by the bottom surface of the cylinder. A thin film forming substrate heating means, comprising: a cylindrical reflecting portion on the open end surface side of the cylinder, perpendicular to the bottom surface; and a truncated cone-shaped inclined surface reflecting portion between the planar reflecting portion and the cylindrical reflecting portion. apparatus.