JP3049788B2 - Slit framing device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a slit frame apparatus for slitting an element plate in a film capacitor manufacturing process.

[0002]

2. Description of the Related Art In recent years, as electronic components such as film capacitors have been downsized, their manufacturing techniques have become an important issue.

[0003] A conventional slit framing apparatus will be described below with reference to FIGS.

FIG. 4 is a cross-sectional view of an element plate, which is formed on a surface of a film 11 by processing an aluminum deposition portion 12 with a pulse oscillation laser beam to a margin width of 0.03 to 0.09 mm. The element plate is obtained by alternately shifting the margin-processed films by 0.9 mm for each sheet. The slitting position of this element plate with a cutter is about 2.6 at the midpoint 15 of the distance 0.9 mm between the odd-numbered margin 13 and the even-numbered margin 14 from above.
By slitting at a pitch of mm, a large number of slits can be formed from one element plate. The dimensions shown in FIGS. 4 and 5 are different depending on the type of the element plate.

FIG. 6 is a plan view of a main portion of a conventional slit frame apparatus. As shown in the figure, a detector 19 for detecting each margin formed on the element plate 17 is substantially fixed to the element plate 17 with the element plate 17 pressed against the front face 16 fixed by the chuck portion 18. By arranging along the center line, the distances Y _{1 to} Y _N from the cutter line 20 to the center of each margin are obtained, and the chuck portion 18 is moved in parallel with the front face 16 based on the data of Y ₁ to Y _N. , Element plate 17
Slit.

[0006]

In such a conventional slit framing apparatus, it is necessary that the cutter line 20 and each margin on the element plate 17 be parallel while the element plate 17 is gripped. When the plate 17 is gripped by the chuck portion 18, there is also a curvature of a margin due to expansion and contraction of the film,
All the margins on the element plate 17 are
It is mechanically difficult to grasp the slit so as to be parallel to the slit, and there is a problem that the slit position accuracy cannot be sufficiently obtained.

An object of the present invention is to solve the above-mentioned problem, and to provide a slit framing apparatus for accurately setting each margin on an element plate in parallel with a cutter line and slitting the same.

[0008]

SUMMARY OF THE INVENTION In order to achieve the above object, the present invention is to hold a device plate of a film capacitor,
Move to the cutter line position for lit processing
Chuck, on the element plate, perpendicular to the direction of its movement
The position of the margin that is formed and
Two detectors that detect two points along the margin;
Of the margin obtained from each of the two detectors
The difference between the two position data along the moving direction and the two
The two detections calculated from the distance data between the detectors.
Data on the angle between the reference line connecting the output device and the margin
Angle correction motor for rotating the chuck based on
And the margin is set to the reference line and a curve parallel to the reference line.
Angle corrected to a positional relationship parallel to the
It is characterized in that the element plate is slit.

[0009]

According to the present invention, in the above configuration, the position of each margin is detected by two detectors, and the margin is adjusted so as to be parallel to the cutter line and slitted.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the element plate slitting method of the present invention will be described below with reference to FIGS.

In FIG. 1, a chuck 1 holds an element plate 2. Mounting As a reference line 4 connecting the detector 3 by two CCD camera is parallel to the cutter line 5, measured in advance the distance L ₁ between the cutter line 5 and the reference line 4. The distance L ₂ between the _two detectors 3
Is also measured in advance.

[0012] The cutter grip the element plate 2 at the chuck section 1
The detector is moved toward the position of the line 5, and is sequentially detected by the two detectors 3 from the margin 6 near the reference line 4.
, The distances to the margin 6 along the moving direction of the element plate 2 are measured. If there is a difference between the measurement data obtained by the two detectors 3, the angle of the chuck 1 is corrected by θ. The correction amount is calculated based on the two measurement data Y ₁ and Y ₂ and the distance L ₂ between the detectors, and the obtained correction amount is transmitted to the sequencer, and θ correction is performed based on the correction amount. The measurement is performed again in a state where the margin 6 and the reference line 4 are parallel to each other, and after obtaining the positional information of all the margins 6 on the element plate 2, the slit operation is started. Similarly to the measurement, the slit is sequentially slit from the margin 6 closer to the cutter line 5. Therefore, since the angle correction and the movement correction are performed based on the position information of each margin 6, it is possible to slit at an accurate position.

FIG. 2 is a view showing a chuck portion of the slit frame assembly apparatus, wherein 2 is an element plate, 7 is a chuck cylinder, 8 is an angle correcting motor, 9 is its speed reducer, and 10 is a moving motor.

FIG. 3 is a control block diagram, wherein M ₁ is a moving motor, and M ₂ is an angle correcting motor.

[0015]

As is apparent from the above description of the embodiment, the present invention detects the position of each margin by using two detectors and corrects the direction of each margin on the element plate by rotating each time.
Since the slit from the parallel to the train wheel setting against the cutter line Te, etc. to the curvature of the margin due to expansion and contraction of the film
All margins on the element plate are
When it is difficult to hold the element plate so that it is parallel
Also, the slit position accuracy can be improved.

[Brief description of the drawings]

FIG. 1 is a plan view of a main part of a slit frame apparatus according to an embodiment of the present invention.

FIG. 2 is a side view of the same chuck unit.

FIG. 3 is a block diagram of the same.

FIG. 4 is a cross-sectional view of a conventional element plate.

FIG. 5 is a plan view of the same element plate.

FIG. 6 is a plan view of a main part of the slit frame apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Chuck part 2 Element plate 3 Detector 4 Margin 6 Cutter line

Claims (1)

(57) [Claims] 1. An element plate of a film capacitor is gripped,
Move to the cutter line position for slitting
And a chuck that is perpendicular to the direction of movement of the chuck on the element plate.
Position of the margin formed as a reference for slit processing
Detectors for detecting two points along the margin
And the merges respectively obtained from the two detectors
The difference between the two position data along the moving direction of the
Calculated from the distance data between the two detectors
Of the angle between the reference line connecting the detectors and the margin
Angle correction model for rotating the chuck based on
Data, and the margin is parallel to the reference line and the reference line.
Angle correction to parallel positional relationship with
A slit frame apparatus, wherein the element plate is slit .