JP3047136U - Vacuum laminating equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an upper plate and a lower plate so as to be close to and apart from each other, wherein a hot plate attached to the upper plate and a film member attached to the lower plate, and between the hot plate and the film member In a vacuum laminating apparatus having a vacuum chamber formed by a frame provided in the apparatus, a long lead wire connecting the hot plate and a power supply unit for directly heating the hot plate and generating resistance heat causes power loss. Not only is it large, but also an obstacle when moving the upper plate, impairing workability. The power supply unit is fixed to an upper surface of the upper plate.

Description

[Detailed description of the invention]

[0001]

[Technical field to which the invention belongs]

 The present invention relates to a vacuum laminating apparatus for laminating molding materials by heating and pressing them in a vacuum atmosphere.

[0002]

[Prior art]

 In the conventional laminating apparatus, the power supply unit was housed inside the gantry.

[0003]

[Problems to be solved by the invention]

 For this reason, thick wiring from the transformer in the power supply section to the moving hot plate must be extended for a long time.If the power loss due to the electrical resistance of the wiring is large and the hot plate cannot be sufficiently heated, Wiring was an obstacle to the molding operation.

[0004]

[Means for Solving the Problems]

 Therefore, a power supply unit for directly heating the heating plate to generate resistance heat is fixedly provided on the upper surface of the upper plate.

[0005]

[Embodiment of the invention]

 Embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is a side view of a vacuum laminating apparatus embodying the present invention, FIG. 2 is a cross-sectional view schematically showing a main part thereof, and FIG. 3 controls heating of a hot plate 4 attached to an upper plate 10. It is a conceptual circuit diagram for the. In the drawings, the same reference numerals indicate the same members.

In FIG. 1, reference numeral 11 denotes a lower plate, which can be moved up and down by a pressing cylinder 18 fixed to a gantry 17, and comes close to and away from the upper plate 10 a. The upper plate 10a can be moved to the right. The moving end of the upper plate 10a is hooked on the fulcrum 21 and the hook 23, and is rotated about the fulcrum 21 as shown in FIG. Can be When the upper plate 10 is located above the lower plate 11 (10a), the engaging projections 20 provided on both side surfaces of the upper plate 10 engage with the engaging concave portions (not shown) provided on the inner side surface of the gantry 17, and are pressed. Under the force of the cylinder, the upper plate 10 and the lower plate 11 are pressed together.

FIG. 2 is a sectional view schematically showing members constituting a vacuum chamber 9 which is a main part of the present vacuum laminating apparatus. A heating plate 4 is attached to the lower surface of the upper plate 10a (10) via an insulator such as a rubber film. The hot plate 4 is a thin metal plate, and in the embodiment, is a stainless plate (710 mm × 640 mm) having a thickness of 1 mm. The conducting wire 3 connected to both ends of the rectangular heating plate 4 by bolts is wired to a power supply unit 8 including the transformer 2 and the like. On the other hand, on the upper surface of the lower plate 11, a film body 13 made of silicon rubber or the like having excellent heat resistance, flexibility and elasticity is provided. A frame 12 is provided on the film body 13. The lower plate 11 is close to the upper plate 10, and the frame 12 is pinched and pressed to form the hot plate 4, the frame 12 and The vacuum chamber 9 formed by the film body 13 and the pressurized chamber 24 formed by the film body 13 and the lower plate 11 become airtight.

A suction hole 15 for evacuating the vacuum chamber 9 is formed in a side surface of the frame 12 and communicates with a vacuum pump (not shown). At a substantially central portion of the lower plate 11, a suction / pressurizing hole 16 for degassing or pressurizing the pressurizing chamber 24 is formed so as to selectively communicate with a vacuum pump or a compressor (not shown). I have to.

As a molding procedure, a molding material 14 to be laminated or bonded is placed on the film body 13, the upper plate and the lower plate are pressed, the vacuum chamber 9 and the pressure chamber 24 are evacuated, and The pressure chamber 24 is switched to pressurization by compressed air to pressurize the molding material 14. FIG. 2 shows this pressurized state. Reference numeral 22 denotes a mirror plate, which is placed between the film body 13 and the molding material 14 if necessary when the surface of the molding material 14 needs to be smooth. Further, the pressing force of the pressing cylinder 18 must be larger than the force obtained by multiplying the compressed air pressure of the pressurizing chamber 24 by the effective area of the film 13.

FIG. 3 is a conceptual circuit diagram for controlling the heating of the hot plate 4 attached to the upper plate 10. Reference numeral 1 denotes an AC power source, which is preferably a commercial frequency single-phase 200V. Reference numeral 2 denotes a transformer whose specifications in the embodiment are a primary voltage of 180 V, a secondary voltage of 3.5 V, and a secondary current of 4500 A. Reference numeral 7 denotes a voltage regulator, which controls the phase of the thyristor based on the signal from the temperature regulator 6 to regulate the voltage supplied to the transformer 2. The power supply unit 8 fixed to the upper surface of the upper plate 10 is generally only the transformer 2, but may include the voltage regulator 7 and / or the temperature regulator 6. The temperature controller 6 has a temperature setting device for the heating plate 4, receives a temperature signal from the thermocouple 5 provided on the heating plate 4, and performs a feedback operation so that the temperature signal becomes equal to the temperature set by the setting device. The resulting control signal is output to voltage regulator 7.

Although the secondary side of the transformer 2 is connected to the hot plate 4 through the conductor 3, this current is extremely large at a maximum of 4500 A as described above, so that the conductor 3 must be as short as possible. The power loss due to the electrical resistance in the portion becomes large, and power is not effectively supplied to the hot plate 4. In this regard, the method of the present invention is extremely effective because the conductor 3 can be minimized. The conductor 3 extends a copper bar as a secondary winding of the transformer 2, and the connection distance to the end of the hot plate 4 is the same at any part of the end.

[0012]

[Effect of the invention]

 As described above, electric power can be effectively supplied to the hot plate 4 and the upper plate 10 can be moved without making the conductive wire 3 flexible, so that the forming operation becomes extremely easy.

[Brief description of the drawings]

FIG. 1 is a side view of a vacuum laminating apparatus embodying the present invention.

FIG. 2 is a cross-sectional view schematically showing a main part of the present invention.

FIG. 3 is a conceptual circuit diagram for controlling heating of the hot plate 4 attached to the upper plate 10.

[Explanation of symbols]

 1 交流 AC power supply 2 ‥‥‥ Transformer 3 導 Conductor 4 ‥‥‥ Hot plate 5 ‥‥‥ Thermocouple 6 ‥‥‥ Temperature regulator 7 ‥‥‥ Voltage regulator 8 ‥‥‥ Power supply unit 9 ‥‥‥ Vacuum chamber 10 ‥‥ Upper plate 11 ‥‥ Lower plate 12 枠 Frame 13 ‥‥ Film 14 ‥‥ Molding material 15 ‥‥ Suction hole 16 ‥‥ Suction / pressing hole 17 架 Mounting base 18 台Compression cylinder 19 回 転 Rotary cylinder 20 ‥‥ Engagement protrusion 21 ‥‥ Support point 22 ‥‥ Mirror plate 23 ‥‥ Hook 24 ‥‥ Pressurizing chamber

Claims (1)

[Utility model registration claims] An upper plate and a lower plate are arranged so as to approach and separate from each other, and a hot plate provided on the upper plate and a film body provided on the lower plate, and a frame provided between the hot plate and the film body A vacuum laminating apparatus having a vacuum chamber formed by a body, wherein a power supply section for directly energizing the hot plate to generate resistance heat is fixed to an upper surface of the upper plate.