JP3023337U - Electronic device housing structure - Google Patents

Electronic device housing structure

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Publication number
JP3023337U
JP3023337U JP1995010303U JP1030395U JP3023337U JP 3023337 U JP3023337 U JP 3023337U JP 1995010303 U JP1995010303 U JP 1995010303U JP 1030395 U JP1030395 U JP 1030395U JP 3023337 U JP3023337 U JP 3023337U
Authority
JP
Japan
Prior art keywords
electronic device
housing
substrate
bosses
heavy component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1995010303U
Other languages
Japanese (ja)
Inventor
之久 後藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aiphone Co Ltd
Original Assignee
Aiphone Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aiphone Co Ltd filed Critical Aiphone Co Ltd
Priority to JP1995010303U priority Critical patent/JP3023337U/en
Application granted granted Critical
Publication of JP3023337U publication Critical patent/JP3023337U/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Abstract

(57)【要約】 【課題】電子機器に落下衝撃などが加わっても、筐体内
の基板の破損や電子部品の脱落、破損を防止する。 【解決手段】電子部品である重量部品Pを搭載する基板
Bが内設された上筐体1および下筐体2からなる電子機
器であって、下筐体2内には基板Bが固定される4つの
凸部3、4、5、6が設けられ、そも内の2つの凸部
3、4の周囲にはそれぞれU字形のスリット7、8が穿
設され、また、上筐体1内には下筐体2を嵌合させたと
きに凸部3、4、5、6に固定される基板B上に搭載さ
れた重量部品Pに対して所定の空隙Sを有して突設され
る保護壁9が設けられている。
(57) [Abstract] [PROBLEMS] To prevent damage to a substrate in a housing and dropping or damage of electronic components even when a drop impact or the like is applied to an electronic device. An electronic device including an upper casing (1) and a lower casing (2) in which a substrate (B) mounting a heavy component (P), which is an electronic component, is provided, and the substrate (B) is fixed in the lower casing (2). Are provided with four convex portions 3, 4, 5 and 6, and U-shaped slits 7 and 8 are formed around the two convex portions 3 and 4 in the inside, respectively. When the lower housing 2 is fitted therein, the heavy component P mounted on the board B fixed to the convex portions 3, 4, 5, 6 is provided with a predetermined space S so as to project. A protective wall 9 is provided.

Description

【考案の詳細な説明】[Detailed description of the device]

【0001】[0001]

【考案の属する技術分野】[Technical field to which the device belongs]

この考案は電子機器の筐体構造に係り、特に電源トランス等の重量部品が搭載 された基板を筐体内に固定させる場合の電子機器の筐体構造に関する。 The present invention relates to a housing structure of an electronic device, and more particularly to a housing structure of an electronic device when a substrate on which heavy parts such as a power transformer are mounted is fixed in the housing.

【0002】[0002]

【従来の技術】[Prior art]

電話機、インターホン等の電子機器の筐体内には、図5(a)、(b)に示す ように、電源トランス等の重量部品Pが搭載された基板Bを固定するための重量 部品受け51が設けられている。この重量部品受け51は重量部品Pを囲繞し、 重量部品Pが搭載された基板Bをネジ等で固定するものである。このような重量 部品受け51は上筐体50内に設けられ、この上筐体50の重量部品受け51に 重量部品Pが搭載された基板Bをネジ等で固定して下筐体52に嵌合させると、 重量部品Pが搭載された基板Bは重量部品受け51に対して懸吊状態になる。 As shown in FIGS. 5A and 5B, a heavy component receiver 51 for fixing a substrate B on which a heavy component P such as a power transformer is mounted is provided in a housing of an electronic device such as a telephone and an intercom. It is provided. The heavy component receiver 51 surrounds the heavy component P, and fixes the board B on which the heavy component P is mounted with screws or the like. Such a heavy component receiver 51 is provided in the upper housing 50, and the board B on which the heavy component P is mounted is fixed to the heavy component receiver 51 of the upper housing 50 with screws or the like and fitted into the lower housing 52. When combined, the board B on which the heavy component P is mounted is suspended from the heavy component receiver 51.

【0003】 また、電源トランス等の重量部品Pが搭載された基板Bを筐体内に固定するに は、図6(a)、(b)に示すように、重量部品止め金具60を使用している。 この重量部品止め金具60は重量部品Pの形状に沿って折曲され、ネジ等で基板 Bを介して下筐体62内に突設されたボス62a、62bに固定されている。こ の状態で上筐体61が下筐体62に嵌合される。Further, in order to fix the board B on which the heavy component P such as a power transformer is mounted in the housing, a heavy component stopper 60 is used as shown in FIGS. 6A and 6B. There is. The heavy-duty fastener 60 is bent along the shape of the heavy-duty component P and is fixed to the bosses 62a and 62b projecting inside the lower housing 62 via the board B with screws or the like. In this state, the upper housing 61 is fitted in the lower housing 62.

【0004】[0004]

【考案が解決しようとする課題】[Problems to be solved by the device]

しかしながら、上述のような重量部品受け51や重量部品止め金具60による 基板Bの固定では、重量部品Pが搭載された基板Bを柔軟に固定していないので 、輸送時や使用時の落下衝撃などによって、基板Bのネジ穴部bが割れたり(図 7)、基板Bに搭載された重量部品Pが破損、脱落する(図8)虞があった。 However, in fixing the substrate B by the heavy component receiver 51 and the heavy component fastener 60 as described above, the substrate B on which the heavy component P is mounted is not flexibly fixed, so that drop impact during transportation or use may occur. As a result, the screw hole portion b of the board B may be cracked (FIG. 7), or the heavy component P mounted on the board B may be damaged or fallen off (FIG. 8).

【0005】 本考案は、このような従来の難点を解決するためになされたもので、電子機器 に落下衝撃などが加わっても、筐体内の基板の破損や電子部品の脱落、破損を防 止できる電子機器の筐体構造を提供することを目的とする。The present invention has been made in order to solve the above-mentioned conventional problems, and prevents damage to the board in the housing and dropping or damage of electronic components even when a drop impact is applied to the electronic device. An object of the present invention is to provide a housing structure of an electronic device that can be used.

【0006】[0006]

【課題を解決するための手段】[Means for Solving the Problems]

このような目的を達成する本考案の電子機器の筐体構造は、電子部品を搭載す る基板が内設された上筐体および下筐体からなる電子機器であって、下筐体内に は基板が固定されるボスが複数設けられ少なくとも1つ以上のボスの周囲にはU 字形のスリットが穿設され、上筐体内には下筐体を嵌合させたときにボスに固定 される基板上に搭載された電子部品に対して所定の空隙を有して突設される保護 壁が設けられたものである。 The electronic device casing structure of the present invention that achieves such an object is an electronic device including an upper casing and a lower casing in which a board on which electronic components are mounted is provided. A plurality of bosses to which the substrate is fixed are provided, U-shaped slits are formed around at least one boss, and the substrate is fixed to the boss when the lower casing is fitted in the upper casing. The protective wall is provided so as to protrude from the electronic component mounted above with a predetermined gap.

【0007】[0007]

【考案の実施の形態】[Embodiment of device]

以下、本考案による電子機器の筐体構造の実施の一形態について図面を参照し て説明する。 電話機、インターホン等の電子機器の筐体は、図1(a)、(b)に示すよう に、上筐体1と下筐体2とからなり、下筐体2内には電源トランス等の電子部品 である重量部品Pが搭載された基板Bをネジ等で固定するために4つのボス3、 4、5、6が設けられ、その内の2つのボス3、4の周囲にはそれぞれU字形の スリット7、8が穿設されている。このU字形のスリット7、8により、ボス3 、4をある程度撓ませることができる。なお、U字形のスリット7、8により、 ボス3、4をある程度撓ませることができるのは、下筐体2にABS樹脂などの 熱可塑性樹脂が用いられているからである。 An embodiment of a housing structure of an electronic device according to the present invention will be described below with reference to the drawings. As shown in FIGS. 1 (a) and 1 (b), a housing of an electronic device such as a telephone or an intercom is composed of an upper housing 1 and a lower housing 2. Inside the lower housing 2, a power transformer, etc. Four bosses 3, 4, 5 and 6 are provided to fix the board B on which the heavy component P, which is an electronic component, is mounted with screws or the like, and U are provided around the two bosses 3 and 4, respectively. V-shaped slits 7 and 8 are provided. The U-shaped slits 7 and 8 allow the bosses 3 and 4 to bend to some extent. The U-shaped slits 7 and 8 allow the bosses 3 and 4 to be bent to some extent because the lower housing 2 is made of a thermoplastic resin such as ABS resin.

【0008】 また、上筐体1内には下筐体2を嵌合させたときにボス3、4、5、6に固定 される基板B上に搭載された電子部品Pに対して所定の空隙Sを有して突設され る保護壁9が設けられている。この保護壁9は下筐体2に基板Bを介して固定さ れた重量部品Pの上部4側面を保持可能な突設部9aが4箇所に形成され、また 、重量部品Pの上面から所定の空隙Sを有して各突設部9a間に連設されたリブ 9bが形成されている。なお、保護壁9の長さ、幅等の大きさは重量部品Pの大 きさ等に依存して決定される。さらに、上筐体1は、下筐体2と同様にABS樹 脂などの熱可塑性樹脂が用いられる。In addition, the electronic component P mounted on the substrate B fixed to the bosses 3, 4, 5, 6 when the lower casing 2 is fitted in the upper casing 1 is predetermined. A protective wall 9 having a space S is provided so as to project. The protective wall 9 is formed with four protruding portions 9a capable of holding the upper four side surfaces of the heavy component P fixed to the lower housing 2 via the substrate B, and is provided at a predetermined position from the upper surface of the heavy component P. The ribs 9b are formed continuously between the protruding portions 9a with the spaces S. The length and width of the protective wall 9 are determined depending on the size of the heavy weight component P and the like. Further, as in the lower casing 2, the upper casing 1 is made of a thermoplastic resin such as ABS resin.

【0009】 このような下筐体2のボス3、4、5、6に重量部品Pを搭載する基板Bをネ ジ等で固定させ、この重量部品Pを搭載する基板Bが固定された下筐体2に、保 護壁9が設けられた上筐体1を嵌合させることにより、重量部品Pを搭載する基 板Bは下筐体2、上筐体1間に柔軟に保持される。 この重量部品Pが筐体内に組み込まれた電子機器に落下などの衝撃的荷重が加 わると、図2に示すように、U字形のスリット7、8を穿設したボス3、4が柔 軟に撓み、且つ重量部品P自体は保護壁9の4つの突設部9aおよびリブ9bに よって保持されるので、重量部品Pを搭載する基板Bには落下などの衝撃的荷重 が直接加わらなくなる。これにより、基板Bの破損や重量部品Pの脱落、破損を 防ぐことができる。The board B on which the heavy component P is mounted is fixed to the bosses 3, 4, 5, 6 of the lower housing 2 with a screw or the like, and the board B on which the heavy component P is mounted is fixed to the boss 3. By fitting the upper casing 1 provided with the protective wall 9 to the casing 2, the base plate B on which the heavy component P is mounted is flexibly held between the lower casing 2 and the upper casing 1. When an impulsive load such as a drop is applied to an electronic device in which the heavy component P is incorporated in the housing, the bosses 3 and 4 having the U-shaped slits 7 and 8 are softened as shown in FIG. Since the weight component P itself is held by the four protruding portions 9a and the ribs 9b of the protective wall 9, the substrate B on which the weight component P is mounted is not directly subjected to an impact load such as a drop. As a result, it is possible to prevent breakage of the board B and dropout and breakage of the heavy weight component P.

【0010】 なお、本実施の一形態においては、4つのボス3、4、5、6の内の2つのボ ス3、4の周囲にそれぞれU字形のスリット7、8を穿設していたが、これに限 らず、重量部品Pの基板B上の配置によっては図3に示すように下筐体10に設 けられた4つのボス11、12、13、14の内の1つのボス12の周囲にU字 形のスリット15を穿設してもよく、また、図4に示すように下筐体20に設け られた4つのボス21、22、23、24すべての周囲にU字形のスリット25 、26、27、28を穿設してもよい。In this embodiment, the U-shaped slits 7 and 8 are formed around the two bosses 3 and 4 of the four bosses 3, 4, 5 and 6, respectively. However, not limited to this, depending on the arrangement of the heavy component P on the substrate B, one of the four bosses 11, 12, 13, 14 provided on the lower housing 10 as shown in FIG. A U-shaped slit 15 may be formed around 12 and a U-shape may be formed around all four bosses 21, 22, 23, 24 provided on the lower housing 20 as shown in FIG. The slits 25, 26, 27 and 28 may be formed.

【0011】 また、電源トランス等の重量部品が搭載された基板を固定させる下筐体のボス は4つに限らず、幾つでもよい。Further, the number of bosses of the lower housing for fixing the substrate on which heavy components such as a power transformer are mounted is not limited to four, and any number may be used.

【0012】[0012]

【考案の効果】[Effect of device]

以上、説明したように、本考案の電子機器の筐体構造によれば、電子部品を搭 載する基板が内設された上筐体および下筐体からなる電子機器であって、下筐体 内には基板が固定されるボスが複数設けられ少なくとも1つ以上のボスの周囲に はU字形のスリットが穿設され、上筐体内には下筐体を嵌合させたときにボスに 固定される基板上に搭載された電子部品に対して所定の空隙を有して突設される 保護壁が設けられているので、電子機器に落下衝撃などが加わっても、筐体内の 基板の破損や電子部品の脱落、破損を防止することができる。また、電子部品を 搭載する基板を筐体内に固定するにあたり、重量部品止め金具が不要となる。 As described above, according to the housing structure of the electronic device of the present invention, the electronic device includes the upper housing and the lower housing in which the board on which the electronic component is mounted is provided. There are multiple bosses to fix the board inside, and U-shaped slits are drilled around at least one boss, and fixed to the boss when the lower case is fitted in the upper case. The electronic components mounted on the printed circuit board have a protective wall that projects from the circuit board with a certain gap, so even if the electronic device is dropped or impacted, the circuit board inside the chassis will be damaged. It is possible to prevent the electronic parts from falling off and being damaged. Further, when fixing the board on which the electronic component is mounted in the housing, the heavy component fastener is not necessary.

【図面の簡単な説明】[Brief description of drawings]

【図1】本考案の電子機器の筐体構造の実施の一形態を
示す図で、(a)は断面図、(b)は下筐体の斜視図。
1A and 1B are views showing an embodiment of a housing structure of an electronic device according to the present invention, in which FIG. 1A is a sectional view and FIG. 1B is a perspective view of a lower housing.

【図2】図1に示す電子機器の筐体に落下などの衝撃的
荷重な荷重が加わった場合の説明図。
FIG. 2 is an explanatory diagram when a shocking load such as a drop is applied to the housing of the electronic device shown in FIG.

【図3】本考案の電子機器の筐体構造の実施の他の形態
を示す説明図。
FIG. 3 is an explanatory view showing another embodiment of the housing structure of the electronic device of the invention.

【図4】本考案の電子機器の筐体構造の実施の他の形態
を示す説明図。
FIG. 4 is an explanatory view showing another embodiment of the housing structure of the electronic device of the invention.

【図5】従来の電子機器の筐体構造を示す図で、(a)
は斜視図、(b)は断面図。
FIG. 5 is a view showing a housing structure of a conventional electronic device, FIG.
Is a perspective view and (b) is a sectional view.

【図6】従来の電子機器の筐体構造を示す図で、(a)
は斜視図、(b)は断面図。
FIG. 6 is a diagram showing a housing structure of a conventional electronic device, FIG.
Is a perspective view and (b) is a sectional view.

【図7】従来の電子機器の筐体構造による弊害を示す説
明図。
FIG. 7 is an explanatory diagram showing an adverse effect of a conventional electronic device casing structure.

【図8】従来の電子機器の筐体構造による弊害を示す説
明図。
FIG. 8 is an explanatory diagram showing an adverse effect of a conventional electronic device casing structure.

【符号の説明】[Explanation of symbols]

1…上筐体 2…下筐体 3、4、5、6…ボス 7、8…U字形のスリット 9…保護壁 P…重量部品(電子部品) B…基板 S…空隙 DESCRIPTION OF SYMBOLS 1 ... Upper housing 2 ... Lower housing 3, 4, 5, 6 ... Boss 7, 8 ... U-shaped slit 9 ... Protective wall P ... Heavy component (electronic component) B ... Substrate S ... Void

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 【請求項1】電子部品を搭載する基板が内設された上筐
体および下筐体からなる電子機器であって、前記下筐体
内には前記基板が固定されるボスが複数設けられ少なく
とも1つ以上の前記ボスの周囲にはU字形のスリットが
穿設され、前記上筐体内には前記下筐体を嵌合させたと
きに前記ボスに固定される前記基板上に搭載された前記
電子部品に対して所定の空隙を有して突設される保護壁
が設けられたことを特徴とする電子機器の筐体構造。
1. An electronic device comprising an upper casing and a lower casing having a substrate on which electronic components are mounted, wherein a plurality of bosses for fixing the substrate are provided in the lower casing. A U-shaped slit is formed around one or more of the bosses, and the electrons mounted on the substrate are fixed to the bosses when the lower case is fitted in the upper case. A housing structure for an electronic device, wherein a protective wall is provided so as to project from a component with a predetermined gap.
JP1995010303U 1995-09-29 1995-09-29 Electronic device housing structure Expired - Lifetime JP3023337U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1995010303U JP3023337U (en) 1995-09-29 1995-09-29 Electronic device housing structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1995010303U JP3023337U (en) 1995-09-29 1995-09-29 Electronic device housing structure

Publications (1)

Publication Number Publication Date
JP3023337U true JP3023337U (en) 1996-04-16

Family

ID=43158609

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1995010303U Expired - Lifetime JP3023337U (en) 1995-09-29 1995-09-29 Electronic device housing structure

Country Status (1)

Country Link
JP (1) JP3023337U (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001345565A (en) * 2000-06-01 2001-12-14 Fujitsu Ltd Electronic equipment and buffer member for containing unit toward electronic equipment
JP2012195003A (en) * 2012-07-05 2012-10-11 Toshiba Corp Electronic apparatus
US8830670B2 (en) 2010-11-29 2014-09-09 Kabushiki Kaisha Toshiba Electronic device having mounting structure for hard disk drive
JP2018029682A (en) * 2016-08-23 2018-03-01 竹内工業株式会社 Stick-shaped cosmetic storage container

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001345565A (en) * 2000-06-01 2001-12-14 Fujitsu Ltd Electronic equipment and buffer member for containing unit toward electronic equipment
US8830670B2 (en) 2010-11-29 2014-09-09 Kabushiki Kaisha Toshiba Electronic device having mounting structure for hard disk drive
JP2012195003A (en) * 2012-07-05 2012-10-11 Toshiba Corp Electronic apparatus
JP2018029682A (en) * 2016-08-23 2018-03-01 竹内工業株式会社 Stick-shaped cosmetic storage container

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