JP3018239U - Slitting machine for sheet-fed corrugated board - Google Patents

Abstract

(57) [Summary] [Purpose] The objective is to prevent the cut from being deformed, crushed, or showing crow marks when the single-wafer ball is cut. [Structure] A guide plate having a guide groove is provided at a tangential position of a rotary blade, and a pair of upper and lower carry-in rollers and a pair of upper and lower carry-out rollers are provided in front of and behind the rotary blade. -The rotational speed of the rotary blade is controlled by at least about twice the rotational speed of the la.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to an improvement in a slitter for a single-wafer stage ball for cutting a single-wafer stage ball that is advancing in parallel with a traveling direction by a rotary blade.

In particular, the present invention relates to an improvement in a slitter that finishes a cut end beautifully when cutting a single-wafer stage ball that is in progress with a rotary blade that rotates at high speed.

[0003]

[Prior art]

 As a conventional example of this type, the invention described in Japanese Patent Application Laid-Open No. 5-38771 is known. In this example, a guide plate for supporting the endless core raw paper continuously fed from the core raw paper hook is provided, and the guide plate is provided with a guide groove parallel to the traveling direction of the step ball. , A pair of rotary blades are provided above and below the guide plate.

Then, the core raw paper is continuously fed at the boundary between the pair of upper and lower rotary blades, and the speed of the rotary blade is rotated at a speed about twice the traveling speed of the core raw paper to cut the core raw paper. Is what you are trying to do.

Although the above-mentioned conventional example has an advantage in cutting endless core raw paper which is continuously supplied, it can be applied to cut a single-wafer step ball as in the present invention. Absent. When continuously feeding the core raw paper between the pair of upper and lower rotary blades, even if the rotary blade is in the same direction as the moving direction of the core raw paper, the moving speed of the core raw paper is doubled with respect to the speed of the rotary blade. By controlling the speed to a moderate speed, the core raw paper is endless, so that it is possible to cut without following the rotational stress of the rotary blade and proceeding to the advancing method at high speed.

However, unlike the case of cutting the endless core raw paper of the conventional example, which is the subject of the present invention, when cutting the sheet-fed ball, the advancing speed of the step ball is set to the speed of the rotary blade. Unlike the conventional endless core raw paper, the corrugated ball that is about to be cut even if it is controlled about twice as much as that of the conventional example is a single-wafer corrugated paper, and therefore follows the rotational stress of the rotary blade. There is a definite problem that the blade advances in the rotating direction of the rotary blade without being cut by the rotary blade, and there is a problem that the conventional example cannot be directly adopted for the cutting of this kind of single-wafer stage ball. Therefore, it is impossible to obtain a beautiful cut.

[0007]

[Problems to be solved by the device]

 Therefore, this invention is intended to solve the above-mentioned problems of the conventional example, and the cut edge of the single-wafer step ball may be deformed, crushed, or the footprint of a crow may appear. In addition, the purpose is to obtain a slitter that does not impair the strength of the step ball.

[0008]

[Means for Solving the Problems]

 A slitter for a step ball having a first rotary blade of the present invention has a rotatable rotary blade mounted on a rotary shaft around an axis of the rotary shaft, and the rotary blade is rotated at a tangential position of the rotary blade. A guide plate for the step ball, which is provided with a guide groove for the rotary blade in one direction, is provided. A pair of upper and lower steps for controlling the step ball is provided at the tangential position of the rotary blade before and after the rotary blade in the rotating direction. And a pair of upper and lower carry-out rollers are respectively provided.

A slitter for a step ball having a second rotary blade of the present invention is a slitter for a step ball having a first rotary blade, in which a blade is provided at a side end of a guide groove. It is provided.

A slitter for a step ball having a third rotary blade according to the present invention is a slitter for a step ball having a first rotary blade, which is used for controlling a step ball up and down. The vertical interval between the pair of loading rollers and the pair of upper and lower loading rollers is provided so as to be adjustable.

According to a fourth aspect of the present invention, there is provided a slitter for a stepping ball having a rotary blade, wherein the rotary speed of the rotary blade is equal to that of the stepping ball in the slitter for a stepping ball having the first rotary blade. -Roll control is performed at a speed at least twice as high as the rotational speed of the pair of upper and lower loading rollers and the pair of upper and lower loading rollers.

[0012]

[Action]

 While rotating the rotary blade, adjust the vertical gap between the pair of upper and lower carry-in rollers and the carry-out roller in accordance with the wall thickness of the corrugated ball, and then rotate to move between the carry-in rollers. Insert a single-wafer step ball. In this case, the rotational speed of the rotary blade is controlled to be at least twice the rotational speed of the carry-in roller and the carry-out roller.

Thus, the single-wafer stage balls inserted between the carry-in rollers are controlled by the rotational stress of the carry-in rollers and the carry-out rollers, and do not proceed uncut and move in the stage balls. When the brake is applied to the blade, its speed of rotation corresponds to the speed of rotation of the rotary blade.

Therefore, the rotation of the rotary blade reliably cuts the single-wafer step ball at the position of the guide groove provided in the guide plate, and the guide roller is guided by the carry-in roller and the carry-out roller. Are discharged in the direction of rotation. Further, when the guide groove is provided with a blade, the cutting function is more effectively achieved.

[0015]

【Example】

 FIG. 1 is a side view of an embodiment of the present invention, FIG. 2 is a front view thereof, and FIG. 3 is a schematic plan view.

A rotary blade 12 is mounted on the rotary shaft 10 so as to be rotatable in the circumferential direction of the axis of the rotary shaft 10. Specifically, the fixing ring 22 is mounted on the rotating shaft 10 so as to be slidable in the axial direction of the rotating shaft 10, and although not shown, one side surface of the fixing ring 22 has a plurality of screw holes into which the bolts 24 are inserted. It is provided individually.

Although not shown, the rotary blade 12 is in contact with one side surface of the fixed ring 22, and a bolt is inserted into a bolt insertion hole formed corresponding to the screw hole provided in the fixed ring 22. The rotary blade 12 is attached to the rotary shaft 10 via the fixed ring 22 by inserting the bolt 24 into the screw hole of the fixed ring 22.

In other words, the rotation direction of the rotary blade 12 is tangential to the rotary blade 12. In other words, when the rotary blade 12 cuts the single wafer stage ball W in the traveling direction of the single wafer stage ball W, the rotary blade is cut. A guide plate 16 having a guide groove 14 for guiding 12 is provided.

In this case, although not essential, by providing the blades 26 at both ends or one end of the guide groove 14, the cutting function of the step ball W is further improved in cooperation with the rotary blade 12. Consideration is also given to this.

The width of the guide groove 14 of the guide plate 16 varies depending on the wall thickness of the blade edge of each type of the rotary blade 12 that is adopted corresponding to each wall thickness of the single-wafer step ball W. However, a width of about 2 mm is generally suitable.

As long as the above-mentioned configuration is adopted, the single-wafer step ball W cannot be cut yet. Therefore, in this invention, as is clear by referring to FIG. 1 and FIG. 3, the loading roller 18 and the unloading roller 20 are provided at the tangential position of the rotary blade 12 before and after the rotary blade 12. They are provided one by one on the top and bottom.

The diameter of the carry-in roller 18 and the carry-out roller 20 is preferably 100 mm when the diameter of the rotary blade 10 is 300 mmm. In the case of this example, it is preferable to control the rotation speed of the rotary blade 12 to about three times the rotation speed of the carry-in roller 18 and the carry-out roller 20. Thus, when the step ball W is cut, the step ball W does not proceed without being cut, and the step ball W is subjected to a certain amount of break to ensure the cutting of the rotary blade 12. You can

The inventor does not intend to limit the diameters of the rotary blade 12, the loading roller 18, and the unloading roller 20 to different sizes as described above. We also plan to make both diameters the same. In this case, the rotation speeds of the carry-in roller and the carry-out roller may be reduced to about one third of the rotation speed of the rotary blade 12. What is necessary is that the rotational speed of the rotary blade 12 is higher than the rotational speeds of the carry-in roller and the carry-out roller, and preferably twice or more.

The vertical gap between the carry-in roller 18 and the carry-out roller 20 is cut by an appropriate gap adjusting mechanism such as a guide guide piece or a guide rail. It is designed so that the spacing can be freely adjusted according to the wall thickness of the ball.

[0025]

[Effect of device]

 Since the present invention has the above-mentioned configuration, it has the following advantages. (1) Since a pair of upper and lower carry-in rollers and a pair of upper and lower carry-out rollers for controlling the step ball and a pair of upper and lower carry-out rollers are provided in front of and behind the rotary blade, the single-wafer step ball is carried in the carry-in roller. -Since the guide can be controlled by the la and the unloading roller, not only can the cut be made reliably, but the cut will not be deformed, crushed, or the crow's foot marks will appear. It can be done without compromising strength. (2) Since the guide groove is provided with a blade, the cutting function can be further improved in combination with the rotary blade. (3) Since the upper and lower gaps between the pair of upper and lower carry-in rollers and the pair of upper and lower carry-out rollers for controlling the step ball can be freely adjusted, the wall thickness of the step ball can be changed. Correspondence can be made and cutting can be improved. (4) By controlling the rotation speed of the rotary blade to be at least twice as high as the rotation speed of the pair of upper and lower loading rollers and the pair of upper and lower loading rollers for controlling the step ball. It is possible to surely cut the ball in a preferable state.

[Brief description of drawings]

FIG. 1 is a side view of an embodiment of the present invention.

FIG. 2 is a front view of this device.

FIG. 3 is a schematic plan view of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 rotary shaft 12 rotary blade 14 guide groove 16 guide plate 18 carry-in roller for controlling 18-step ball 20 carry-out roller for controlling 20-step ball 26 blade

Claims (4)

[Scope of utility model registration request] 1. A slitter for a step ball having a rotary blade.
In the rotary shaft 10, a rotary blade 12 which is rotatable around the axis of the rotary shaft 10 is attached, and a guide groove 14 for the rotary blade 12 is provided at a tangential position of the rotary blade 12 in the rotational direction of the rotary blade 12. Guide plate 16 for ball
And a pair of upper and lower loading rollers 18 for controlling the step ball at the tangential position of the rotary blade 12 before and after the rotary blade 12 in the rotation direction.
And a pair of upper and lower carry-out rollers 20, respectively. A slitter for a single-wafer stage ball. 2. The slitter for a single-wafer step ball according to claim 1, wherein a blade 26 is provided at a side end of the guide groove 14. 3. A pair of upper and lower loading rolls for controlling a step ball.
2. The slitter for a single-wafer stage ball according to claim 1, wherein the vertical gap between the roller 18 and the pair of upper and lower carry-out rollers 20 is adjustable. 4. A pair of upper and lower carry-in rollers 18 and a pair of upper and lower carry-out rollers for controlling a step ball in which the rotating speed of the rotary blade 12 is variable.
The slitter for a single-wafer stage ball according to claim 1, wherein the slitter is controlled to rotate at least twice as fast as the rotating speed of the rotor 20.