JP2997496B2 - Multiple processing type vacuum processing equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a multi-processing type vacuum processing apparatus, and particularly for a sample to be subjected to a plurality of processings, the apparatus itself automatically selects processing required for the sample. , A multiple processing type vacuum processing apparatus to be implemented.

[Conventional technology]

Conventional vacuum processing apparatus, for example, JP-A-63-133532, JP-A-59-76876, as described in the processing in the apparatus, the apparatus itself is not something that is recognized independently, for example, Prior to the start of the processing, the operator sets the processing contents, and the apparatus sequentially executes the processing in accordance with the set contents.

Further, for example, as described in Japanese Patent Application No. 62-324103, a dry etching method for a multilayer metal wiring film in an apparatus intended for dry etching of a multilayer wiring film is disclosed, but before and after the etching process. The pre-treatment and post-treatment necessary for the above were not considered, and no consideration was given to preventing contamination and corrosion of the sample surface and improving the productivity of the sample.

[Problems to be solved by the invention]

However, in a recent production line that requires fine processing, it is desired that an operator, as much as possible, enter the production line as much as possible and reduce particles generated by humans and the like. Further, it is desired that the sample subjected to the vacuum processing be continuously processed in the next step under a vacuum environment without being exposed to the atmosphere.

In the above-mentioned conventional technology, in selecting and performing a plurality of processing chambers, the apparatus itself does not consider means for automatically selecting and performing necessary processing. No consideration was given to the device's response. Also, in the technique of etching a multilayer metal wiring film, no consideration has been given to continuous processing while the material to be etched is kept in a vacuum environment. This is because the optimum wafer temperature for etching differs depending on the material to be etched when etching a sample having a multilayer structure in which a heterogeneous material (for example, a metal film) has a multilayer structure, which will increase more and more in the future. Between the steps without passing through the atmosphere, by performing not only the etching process but also the pre-processing and post-processing continuously,
No consideration was given to preventing contamination and corrosion of the sample and improving the productivity.

Also, Japanese Patent Application Laid-Open No. 59-76867 discloses an apparatus having different electrode temperatures. However, a treatment product (for example, a reaction product) on one electrode is changed on another electrode or
No consideration was given to preventing affecting the sample being processed on the electrode.

An object of the present invention is to continuously perform processing and prevent contamination and corrosion of the sample surface, etc., by automatically selecting and executing the processing required for the sample for a plurality of processings. In addition, the sample stage is adjusted to the optimal temperature for etching the sample to perform high-speed etching with high-precision processing (high selectivity and high anisotropy), thereby improving the productivity of the sample and obtaining the fault information. An object of the present invention is to improve the maintainability of a device by performing storage and diagnosis of a failed part.

[Means for solving the problem]

In order to automatically select and execute the necessary processing for the sample to be subjected to the above-mentioned multiple processing, the equipment itself is provided with a plurality of processing chambers with different processing and pre- and post-processing chambers. Information is read, and necessary processing is selected and executed based on the information.

As a method of selecting and executing the necessary processing, the read information is analyzed, the type of the film to be processed is determined, and the sample is automatically placed in a processing chamber suitable for the processing and processed.

In order to prevent multiple processes from affecting each other, an independent processing chamber is provided for each processing content, and in order to perform processing more effectively, a buffer chamber is provided between the processing chambers. Is provided.

In order to process the sample with high precision (high selectivity and high anisotropy) and at high speed, the temperature of the sample table in the processing chamber where the sample is placed is controlled to a temperature suitable for processing the sample. It was made.

[Action]

The process of reading the above processing information is based on the physical interface (SECS) as a communication standard in semiconductor manufacturing equipment.
I) and the communication protocol (SECS II) are defined, and can be achieved by installing the above communication means. Further, since the communication standard has become an industry standard, it can be used in various production lines. In addition, the processing information
By inputting the information before the start of the vacuum processing and accumulating the information in the apparatus, the productivity can be further improved.

When reading information added to a sample or a cassette as a method for reading the processing information, a bar code reader or an image recognition device can be used to read in a non-contact manner, which is useful for non-contamination.

With respect to a sample to be subjected to a plurality of processes according to the present invention, the device itself automatically selects a process required for the sample, and by performing the process, a plurality of processes can be continuously processed in a vacuum vessel atmosphere. It has an anticorrosion effect and can improve sample productivity. In addition, as a plurality of processes, different processes (for example, etching and ashing, etching and CV
By configuring the processing chamber having D), the function of the apparatus can be improved. Furthermore, by configuring a processing chamber that controls the sample temperature among multiple processes, high selectivity, high speed,
High anisotropy can be achieved.

〔Example〕

An embodiment of the present invention will be described below with reference to FIGS. In this embodiment, two vacuum processing chambers are arranged. However, the number of the vacuum processing chambers may be one or three or more.

In FIG. 1, 1 and 6 are load lock chambers, 2 is a pretreatment chamber,
5 is a post-processing chamber, and 3 and 4 are vacuum processing chambers. The load lock chambers 1 and 6 are for bringing the sample from the atmosphere to the atmosphere in the apparatus and from the atmosphere in the apparatus to the atmosphere. Each of the load lock chambers 1 and 6, the front and rear processing chambers 2,
5. The vacuum processing chambers 3 and 4 each have an independent exhaust device 11
a, 1b, 12a, 12b, 13a, 13b are provided, each chamber is partitioned by a gate valve 19, and a sample is transported between the chambers by a transport device (not shown). The pre-processing chamber 2 is a chamber for pre-cooling the sample before transporting the sample to the vacuum processing chamber 3, and the sample from the cassette 17 is set on a sample stage 24 cooled by the cooling device 22a. It is cooled in a state.

The temperature of the sample stage 25a provided in the vacuum processing chamber 3 is adjusted by a refrigerant and a heater. For this purpose, a cooling device
22b and a heating device 23a are provided. Sample table 25
A high-frequency power supply 26a is connected to a, and a plasma generator for generating plasma by a synergistic action of a microwave electric field and a magnetic field is provided above the high-frequency power supply 26a. Here, when a sample is placed on the sample table 25a by a transfer device (not shown), the sample temperature is detected, and after reaching a predetermined temperature, an etching gas is introduced from a gas supply device (not shown) into the vacuum processing chamber 3 and the plasma is used for etching. It is processed. The sample that has been processed in the vacuum processing chamber 3 is conveyed to the vacuum processing chamber 4 and is subsequently etched in the vacuum processing chamber 4. The etching process in the vacuum processing chamber 4 is the same as or different from that in the vacuum processing chamber 3. In addition to the above, the processing order is the vacuum processing chamber 3 → the vacuum processing chamber 4 repeated twice or more, the vacuum processing chamber 4 → the vacuum processing chamber 3, the vacuum processing chamber 3 → the vacuum processing chamber 4 → the vacuum processing chamber 3, and the vacuum Processing such as processing chamber 4 → vacuum processing chamber 3, vacuum processing chamber 4 → vacuum processing chamber 3 → vacuum processing chamber 4, only vacuum processing chamber 3, and only vacuum processing chamber 4 is performed. Since the sample processed in the vacuum processing chamber 3 or 4 is kept at a low temperature in the post-processing chamber 5, the post-processing chamber 5 is set on the sample table 26 provided with the heating device 23c and is returned to the atmosphere. After that, it is collected and stored in the cassette 18 in the load lock chamber 6.

FIG. 2 is an example of a block diagram of a control device 60 which reads processing information added to a sample and selects and executes processing of the sample, for example. In FIG. 2, the code input means 35
Is a device that detects processing information added to the sample, and is, for example, a barcode reader. Code input means 35
Is attached to the multiple processing type vacuum processing apparatus shown in FIG. 1, but is not shown in FIG. The code processing means 34
It converts the input processing information into numerical data,
The converted data is stored in the input data storage unit 33 as sample processing information. For example, RAM. Usually, the above information processing is performed when the sample is in the load lock chamber 1 in FIG. 1, but the information processing may be performed at any place. The processing route storage means 32 stores data in which the order of processing chambers performed in the apparatus is compared with the processing information of the sample, and is, for example, a ROM. The sample processing means 31 stores a procedure for controlling the processing of the sample in the apparatus, and actually controls the exhaust and the process together with the movement of the sample.

The central processing unit 30 controls the above units 31 to 34 as a whole, and is, for example, an MPU.

FIG. 3 is an example of a block diagram of a control device 61 that inputs processing information from a higher-level controller and uses the information to select and execute processing of a sample. In FIG. 3, the signal processing means 36 communicates with the host controller, inputs processing information of the sample from the host controller, and stores it in the input data storage means 33. The signal processing means 36 includes a transmission processing unit and a reception processing unit, and usually performs serial transmission, and is, for example, an RS-232c board. Other control means are the same as in FIG.

FIG. 4 shows a control device for inputting processing information from the manual input means 37 and selecting and executing sample processing using the data.
FIG. 62 is a block diagram of 62. In FIG. 4, data input from manual input means 37 (for example, a keyboard) is read by input processing means 38 and stored in input data storage means 33. Other control means are the same as in FIG.

 FIG. 5 shows an example of the processing in this embodiment.

In FIG. 5, a process A is a flow chart in the case where a sample is processed in both of the vacuum processing chambers 3 and 4 in FIG.
FIG. 4 is a flowchart in a case where a sample is processed only in the vacuum processing chamber 4. The above flow chart is an example of a plurality of processes, and the process sequence in which the processes in the pre-processing chamber 2, the vacuum processing chambers 3, 4, and the post-processing chamber 5 are discarded, and the processes are performed a plurality of times. There is a flow for processing.

In the description of the present embodiment, the case where the cooling / heating device is used has been described.
The sample may be processed in a state where the heating device is not used. Conversely, when the sample is heated and processed, only the heating device may be used to heat and control the temperature.

FIG. 6 shows an apparatus in which a self-diagnosis function for judging whether or not to perform an etching process based on an input signal input from a detecting means is added to a control device for selecting and executing a sample process shown in FIGS. 2 to 4. FIG. 63 is a block diagram of 63. In FIG. 6, the detecting means 43 is for detecting ON-OFF of a device for controlling conveyance and exhaust not shown in FIG. 1, and is, for example, a limit switch or a photoelectric switch.

The detection signal input means 42 is for inputting the ON-OFF signal from the detection means 43, and can recognize the operation state of the device attached to the device. For example, a Di substrate. The reference value storage means 39 stores a combination of signals indicating a normal operation state of equipment in the apparatus necessary for performing the etching process. As an example, the main valve O
N, arm origin ON, etc., for example, stored in ROM. The abnormality detection processing means 40, after turning on the power of the device,
After the apparatus is initialized, the input signal of the detection signal input means 42 is compared with a combination of signals stored in the reference value storage means 39, and a procedure for determining whether or not the etching processing is possible is stored and processed. For example, it is stored in a ROM. The abnormality output unit 41 is a unit that outputs a result of determining whether the etching process is possible. For example,
It is a screen display substrate. The abnormality display means 44 is the abnormality output means 41
Displays information output by, for example, CR
T. With the above configuration, it is possible to recognize whether the devices in the device are in a state sufficient for performing the etching process after the device is initialized after the power is turned on. Accordingly, it is possible to prevent a problem that the etching process is performed in a state where the apparatus is insufficient, and as a result, the apparatus is stopped during the etching processing and the sample cannot be used.

FIG. 7 shows a control device 60 to 62 for selecting / executing the processing of the sample shown in FIGS. 2 to 4, and adding a means for accumulating the failure information generated in the device and reading it out as necessary. FIG. 6 is a block diagram of the device 64 shown in FIG. In FIG. 7, the information storage means 47
Performs processing for storing information on failures occurring in the device and the attachments. For example, FDD (Floppy Disk Drive)
r). The information output unit 49 stores and accumulates information processed by the information storage unit 47. For example, an FD (Fl
oppy Disk). Transfer the information to portable media (e.g.,
If the information is stored in the FD, the medium can be extracted from the main unit and the information can be read by a reading device provided separately from the main unit, so that the maintainability of the device is further improved. The display means 45 displays information accumulated in the information output means 49, and is, for example, a CRT. The operating means 48
This is for inputting a command to request the display means 45 to display the information stored in the information output means 49, and is, for example, a keyboard. The operation input means 46 receives a display request from the operation means 48 and performs processing for displaying failure information on the display means 45. With the above configuration,
The display unit 45 displays the failure information generated in the device as necessary.
Alternatively, the information can be read by another reading device using the information output means 49.

Further, the failure part diagnosis means 50 diagnoses a failure part or a failure part in the apparatus using the failure information input to the information storage means 478, and displays it on the display means 45 as necessary. The means 50 is connected to the central processing means 30 and the display means 4 in FIG.
5. By adding to the operation input means 46 and the information storage means 47, it is possible to diagnose a failure in the apparatus, to pursue the cause early after the failure occurs, and to reduce the downtime.

What satisfies the following is naturally included in the scope of the present invention.

(1) The gas is turned into plasma with other energies such as glow discharge, magnetron discharge, microwave discharge, and photoexcitation,
A sample that uses the gas plasma to perform processing such as etching and film formation (CVD, sputtering).

(2) For example, plasma etching processing, plasma CVD
A combination of processing, sputtering, etc.

(3) Vacuum processing of a sample without using plasma such as molecular beam epitaxy technology.

(4) A device that reads information given to a cassette in which a sample is stored, and selects and executes processing of the sample.

〔The invention's effect〕

According to the present invention, the type of sample processing, the order of sample processing, and the like can be freely selected, and the sample can be processed in the present apparatus without intervening in the atmosphere even when the sample extends over multiple steps. There is an effect that adhesion of contaminants can be minimized and the number of processing steps can be reduced.

In vacuum processing the sample, vacuum processing of the sample is started when the device is inadequate, and the problem that the sample cannot be used due to a problem such as a stop of the device during the processing can be prevented beforehand. Performance can be improved.

In addition, since the failure information is stored in the apparatus and the information can be taken out to the outside, the maintenance time of the apparatus can be grasped in advance, and the operation rate of the apparatus and the maintainability can be improved.

Further, by performing the failure diagnosis, it is possible to reduce the downtime of the apparatus.

[Brief description of the drawings]

FIG. 1 is an apparatus configuration diagram of a multiple processing type vacuum processing apparatus according to one embodiment of the present invention, FIGS. 2 to 4, FIG. 6, and FIG. The figure is a flow chart of processing a sample in the apparatus of FIG. 1,6 ... Load lock chamber, 2 ... Pre-processing chamber, 3,4 ... Vacuum processing chamber, 5 ... Post-processing chamber, 11a to 13a, 11b to 13b
…… Exhaust device, 17,18 …… Cassette, 22a to 22c ……
Cooling devices, 23a to 23c ... Heating devices, 24, 25a, 25b, 26
... sample stage, 30 ... central processing means, 31 ... sample processing means, 32 ... processing route storage means, 33 ... input data storage means, 34 ... code processing means, 35 ... code input means,
36 ... signal processing means, 37 ... manual input means, 38 ... input processing means, 39 ... reference value storage means, 40 ... abnormality detection processing means, 41 ... abnormality output means, 42 ... detection signal input means,
43 detection means 44 abnormality display means 45 display means 46 operation input means 47 information storage means 48
Operating means, 49 ... Information output means, 50 ... Failure site diagnosis means, 60 to 64 ... Control device

Continued on the front page (51) Int.Cl. ⁷ Identification code FI H01L 21/3065 H01L 21/302 B 21/68 G06F 15/21 R (72) Inventor Atsushi Ito 794, Higashi-Toyoi, Kazamatsu-shi, Yamaguchi Pref. Inside Hitachi Kasado Factory (72) Inventor Tsunehiko Tsune 794 Kazato Higashi Toyoi, Kudamatsu City, Yamaguchi Prefecture Inside Hitachi Kasaido Factory (72) Inventor Naoyuki Tamura 794 Higashi Toyoi, Kudamatsu City, Yamaguchi Prefecture Hitachi Kasado Engineering (56) References JP-A-64-21926 (JP, A) JP-A-63-28047 (JP, A) JP-A-62-162450 (JP, A) JP-A-1-183345 (JP, A A) (58) Field surveyed (Int. Cl. ⁷ , DB name) B01J 3/00 H01L 21/302 H01L 21/68 C23C 14/56 C23C 14/54

Claims (10)

(57) [Claims] An apparatus for processing a sample under vacuum,
A plurality of processing chambers for processing the sample, and means for recognizing the processing content of the sample, and automatically selecting a processing order of the processing chamber based on the recognition and performing the processing of the sample. A multi-processing type vacuum processing apparatus characterized by the above-mentioned. 2. A multiple processing type vacuum processing apparatus, comprising: means for pre-processing the sample before processing the sample according to claim 1. 3. A multiple processing type vacuum processing apparatus comprising: means for performing post-processing on the sample after processing the sample according to claim 1. 4. A multiple processing type vacuum processing apparatus according to claim 1, wherein said means for recognizing the processing content of said sample has means for reading processing information added to said sample. 5. A multiple processing type vacuum processing apparatus according to claim 1, wherein said means for recognizing the processing content of said sample has means for reading processing information added to a cassette containing said sample. 6. A multiple processing type vacuum processing apparatus according to claim 1, wherein the means for recognizing the processing content of the sample has means for reading processing information input from an information processing apparatus outside the apparatus. 7. The information processing apparatus according to claim 6, wherein the information is at least one of a transport device and a host controller, and the processing information is at least one of the transport device and the host controller.
Multiple processing type vacuum processing equipment input from one. 8. An apparatus according to claim 4, wherein said processing information is at least one of recipe data, process data, and a lot recognition code. 9. The apparatus according to claim 1, wherein an etching processing chamber for performing an etching process on the sample using plasma, a sample stage on which the sample is installed, and the etching process. A multi-processing vacuum processing apparatus comprising: means for introducing an etching gas into a chamber; means for evacuating the etching chamber; means for converting the introduced gas into plasma; and detection means for detecting an operation state of each part. . 10. The apparatus according to claim 1, which is required for detecting the operation state of each section, detecting signal inputting means for inputting a signal from the detecting means, and performing processing of the sample. Reference value storage means for storing a combination of various input signals, and abnormality detection processing means for comparing the input signal and the combination of input signals stored in the reference value storage means to detect the presence or absence of an abnormality, An abnormality output unit that outputs an abnormality of the device; and an abnormality display unit. After power-on of the device, initialization of the device is performed, and an input signal from the detection unit stores the reference value storage unit. A multi-processing type vacuum processing apparatus having a self-diagnosis function of comparing with a combination of input signals stored in the apparatus and determining whether or not processing is possible based on the result.