JP2994817B2 - Integrated circuit device and method of manufacturing the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an integrated circuit device.

[0002]

2. Description of the Related Art It is assumed that a liquid crystal driver having 80 outputs is required. In this case, the mask of the liquid crystal driver is designed, and as shown in FIG. 3A, a chip 11 of an 80 output liquid crystal driver is formed on the semiconductor wafer 10 by using the photolithography technique. The liquid crystal driver chip 11 has 80 output terminals (O1 to O80) and four input terminals (I1 to I80) as shown in FIG.
4). After completion of the wafer process, dicing is performed for each chip. Dicing chips 11
Are enclosed in the package 12 one by one as shown in FIG. 1C to form an 80-output liquid crystal driver, which can be supplied to the user.

[0003]

Normally, as described above, for example, a liquid crystal driver with 80 outputs is supplied as requested by the user, but when the user requests a liquid crystal driver with another number of outputs. According to this method, it is necessary to newly design a mask. In other words, a new LCD driver was developed according to the number of outputs desired by the user.
Prototypes, evaluations, and production were required, and even if only the number of outputs was different, efficiency was low in both development and production. It is an object of the present invention to solve such a problem and to provide an integrated circuit device which has good development efficiency and is easy to manage in terms of production.

[0004]

In order to achieve the above object, an integrated circuit device according to the present invention comprises n (n) adjacent integrated circuit chips for driving a liquid crystal having m output terminals on the same semiconductor wafer. Is an integer of 2 or more) using only the input terminals that can be shared by using the multi-layer wiring technique, and is regarded as one integrated circuit chip and has m × n output terminals.
× a liquid crystal driving integrated circuit chip for n outputs, the m × n
LCD drive integrated circuit chip for output in a single package
It is characterized by comprising Type. The manufacturing method includes the steps of forming a plurality of liquid crystal driving integrated circuit chips having m output terminals on a semiconductor wafer, and n adjacent liquid crystal driving integrated circuit chips (n). (n is an integer of 2 or more) each of which connects only the input terminals that can be shared by the multi-layer wiring, and a unit of the mxn output liquid crystal driving integrated circuit chip having the connected mxn output terminals. Dicing the semiconductor wafer, and performing the individual liquid crystal driving integrated circuit chip dicing.
And encapsulating the package in a package.

[0005]

In this way, for an integrated circuit device requiring a small change in specifications, for example, simply increasing the number of outputs, the development period and the period until sample shipment can be shortened. That is, it is possible to shorten the period from receiving an order to shipping and to simplify inventory management.

[0006]

Embodiments of the present invention will be described below with reference to the drawings.
explain. FIG. 1 shows two 80-output liquid crystal driver chips.
An example in which a liquid crystal driver chip having 160 outputs is manufactured by using a single chip will be described. FIG. 3A shows a wafer 10 on which an 80-output liquid crystal driver 11 similar to that of FIG. 3A is formed. Two adjacent chips 11 are regarded as one chip 20 and are combined. Bonding remains in the state of wafer 10
This is performed by a multi-layer wiring technique using a metal wiring 21 such as aluminum used in a normal integrated circuit device. Here, input terminals (I1 to I4) that can be shared are respectively wired. When the necessary connections are completed, dicing is performed for each chip 20 (FIG. 1B), and then the package
22 (FIG. 1 (c)). In this way, a 160-output liquid crystal driver having four input terminals and 160 output terminals is obtained.

Similarly, if a liquid crystal driver with 240 outputs is desired, three chips adjacent to the liquid crystal driver with 80 outputs may be connected by multilayer wiring. That is, when there is a conventionally developed and manufactured 80-output liquid crystal driver, a liquid crystal driver having an output of an integral multiple of 80 such as 80 × n can be easily formed by combining n 80-output liquid crystal drivers. Is obtained. Further, here, the description has been made of the liquid crystal driver of 80 outputs, but if there is a liquid crystal driver of m outputs, the liquid crystal driver of m × n output can be obtained by the method described above, If the driver chip is simplified, a liquid crystal driver having an output number that is an integral multiple of that can be easily obtained, so that a liquid crystal driver having an arbitrary number of outputs can be supplied to some extent.

FIG. 2 shows a flowchart of a simple process according to the present invention. The standard for LCD driver is 8
It is assumed that the output is 0. When the process starts in step # 100, a wafer process for an 80 output liquid crystal driver is performed in step # 105. Up to this point, the manufacturing process is the same as that of a normal 80-output liquid crystal driver. In step # 110, it is checked whether the requested liquid crystal driver has 80 outputs. 80
If so, the process proceeds to step # 145. 8 in step # 110
If the output is not 0, it is checked in step # 115 whether the output is 160. If 160 outputs are required, step
At # 120, a multi-layer wiring process for 160 outputs, that is, coupling of two chips using the multi-layer wiring technology as shown in FIG. 1 is performed, and the process proceeds to step # 145. Similarly, in step # 125, it is checked whether 240 outputs are requested, and in step # 135, xx outputs (320 outputs, 400 outputs,...) Of an integral multiple of 80 are requested. ), The respective chips are combined in Steps # 130 and # 140, and the process proceeds to Step # 145. Steps
In the assembly process of # 145, dicing and encapsulation in a package are performed according to the size of each output chip. Thereafter, a shipping test is performed in the test process of step # 150, and the product is shipped in step # 155, and
Ends the process.

[0009]

[0010]

As described above, according to the present invention,
For example, when a change such as an increase in the number of outputs of a liquid crystal driver that has been conventionally manufactured is requested, it is possible to manufacture using an existing liquid crystal driver. The period can be shortened. Also, in terms of process, if we proceed and wait until the wafer process for the chip with the basic output number is completed, after receiving the order, we will use multilayer wiring if necessary for the LCD driver with the output number that matches the user's request. By performing the assembling process after performing, the period until shipping becomes very short. In addition, there is an advantage that simplification can be achieved in terms of inventory management in production.

[Brief description of the drawings]

FIG. 1 is a diagram illustrating a method for manufacturing a 160-output liquid crystal driver embodying the present invention.

FIG. 2 is a view showing a flowchart of steps for carrying out the present invention.

FIG. 3 is a diagram showing a method for manufacturing a conventional 80-output liquid crystal driver.

[Explanation of symbols]

 10 Semiconductor wafer 11 80-output LCD driver chip 12 80-output package 20 160-output LCD driver chip 21 Metal wiring 22 160-output package

Claims (2)

(57) [Claims] 1. An input terminal which can share adjacent n (n is an integer of 2 or more) adjacent liquid crystal driving integrated circuit chips having m output terminals on the same semiconductor wafer by using a multilayer wiring technique. And a liquid crystal driving integrated circuit chip for m × n output having m × n output terminals, which is regarded as one integrated circuit chip, and a liquid crystal driver for m × n output.
An integrated circuit device comprising a moving integrated circuit chip encapsulated in a single package . 2. A process for forming a plurality of liquid crystal driving integrated circuit chips having m output terminals on a semiconductor wafer, and n adjacent liquid crystal driving integrated circuit chips (where n is 2).
As a unit comprising the steps of: connecting each only input terminals, the m × n liquid crystal driving integrated circuit chip for output with the connection have been the m × n output terminals which can be shared by more than an integer) by the multilayer wiring, the A method of manufacturing an integrated circuit device, comprising: dicing a semiconductor wafer; and encapsulating each of the diced individual liquid crystal driving integrated circuit chips in a package.