JP2982068B1 - Heat sink mounting device manufacturing method and heat sink mounting device manufactured by the manufacturing method - Google Patents

Abstract

An object of the present invention is to manufacture an inexpensive mounting bracket at low cost and to prevent waste of material. SOLUTION: A long extruded material in which a thickness direction X of a mounting device 1 is a longitudinal direction is extruded by an extrusion die, and the extruded material is sheared at a predetermined interval to produce the extruded material. The mounting device 1 to be manufactured has two legs 10 extending downward.
Then, press down the heat sink 4 from above,
The mounting claws 12 of the legs 10 are
Is fixed, thereby fixing the heat sink 4 to the semiconductor element case 3.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting device for connecting a heat sink and a semiconductor element.

[0002]

2. Description of the Related Art In a mode of connection between a heat sink and a semiconductor element, a semiconductor element is bonded to a base of the heat sink.
There are various methods such as bolting the semiconductor element to the heat sink and joining the two using a mounting tool.

One embodiment in which a heat sink and a semiconductor element are joined by a mounting tool will be described with reference to FIG. 3. A heat sink 4 is placed on the upper surface of a case 3 of a semiconductor element, and both ends of the heat sink 4 are positioned upward and horizontally. The engaging claw 52 of the mounting device 5 is fitted into the mounting hole 30 on the upper surface of the case 3 so as to be pressed down from the side.

The mounting device 5 has a unit structure including a main body 50 for fixing the heat sink 4 and a lever-shaped auxiliary portion 51 for applying a tightening force to the main body. In any of 51, the strip-shaped metal plate was blanked with a progressive die (not shown),
It is obtained by performing a pressing process (about 10 processes) such as bending, stamping, squeezing, drilling, and cutting.

[0005]

However, since the progressive die has a large number of pressing steps to be performed and includes various steps, its structure is complicated, and the manufacturing cost required for the die is large. . In particular, such mounting equipment is a small variety of semiconductor elements and heat sinks,
Given the short development cycle, it was not possible to respond flexibly in spite of the need for various shapes as much as possible.

Further, in the current manufacturing process, the manufacturing is performed while cutting the strip-shaped metal plate.
Materials were wasted for cutting and punching, and it was not possible to meet the demands for resource saving, which has been strongly screamed recently, not to mention the problem of material costs.

The present invention has been made in view of the above-mentioned problems of the prior art, and aims to provide a technique relating to a fitting which can manufacture a fitting having a free shape at low cost and can prevent waste of material. Is what you do.

[0008]

For this reason, according to the invention of the present application, the locking claws of the two legs are locked in the mounting holes of the semiconductor element case by pressing down the heat sink with the two legs extending downward. This is a method of manufacturing a mounting device for fixing a heat sink to a semiconductor element case, wherein a long extruded material in which the thickness direction of the mounting device is a longitudinal direction is extruded by an extrusion mold, and the extrusion process is performed. It is characterized in that the extruded material is produced by shearing it at predetermined intervals.

In the mounting device obtained by this method, the interval between the locking claws of the two leg portions is formed smaller than the interval between the mounting holes, and a convex portion capable of expanding the both leg portions is formed. Shape (for example, a first embodiment described later), a first unit composed of both legs, and a second unit fitted to the first unit so as to narrow both legs of the first unit.
Shape composed of a unit (for example, a second embodiment described later)
And so on. In any case, the heat sink is fixed to the semiconductor element case by holding down the heat sink with the two legs extending downward and engaging the locking claws of the two legs with the mounting holes of the semiconductor element case. A mounting device, in a thickness direction thereof (for example, a first
In the embodiment, any shape that can form a long extruded material whose longitudinal direction is the X direction in FIG. 1) is included in the range that can be manufactured by the method of the present application. In other words, the mounting device manufactured by the method of the present invention has a shape that can be extruded and can fix the heat sink. The unit used in the description of the shape simply indicates a constituent member in the present application.

As the equipment used in the manufacturing method of the present invention, an extrusion die having a predetermined shape and a shearing means are sufficient, so that the conventional equipment requires a progressive die for performing a complicated plural steps. Very low cost is sufficient. Since the manufacturing cost of the extrusion die itself is low, improvement of the shape and the like and mounting brackets having different sizes can be easily made again.

In addition, since the mounting device is manufactured continuously by the step of shearing the long extruded material, there is almost no need for a cutting allowance and there is no punched portion, so that there is almost no waste of material. Becomes

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments obtained by a manufacturing method according to the present invention will be described with reference to the drawings.

FIG. 1 shows a first embodiment. The mounting bracket 1 of the present embodiment has a deformable H-shaped cross-section that can be integrally formed and includes two legs 10 extending downward and a handle portion 11 projecting upward from the two legs 10. At the front ends of the two legs 10, locking claws 12 facing inward are formed, and the interval between the claws 12 is set shorter than the interval between the mounting holes 30 into which the claws 12 are fitted. When both handle portions 10 are pushed inward, both legs 10 are expanded. Note that a small projection 13 is formed inwardly above both legs 10, and a fitting groove 14 is formed. A leaf spring 15 can be fitted into the fitting groove. The leaf spring 15 is
This is used when it is desired to apply an urging force to the closing / closing operation of the legs 10.

As shown in FIG. 1 (b), the first embodiment uses two handles 11 of the mounting bracket 1 with one hand, and from above the heat sink 4 placed on the semiconductor element case 3. ,
The two legs 10 hold down the heat sink 4 (more specifically, a part 40 of the portion that comes into contact with the case 3).
Is pressed inward to expand the legs 10, and the claws 12 thereof are engaged with the mounting holes 30 of the semiconductor element case. When the claws 12 are in the locked state, the legs 10 act in the direction of the closing / closing operation.
Is firmly fixed on the semiconductor element case 3. Therefore, the heat sink 4 pressed down by the attachment 1 is also securely fixed.

FIG. 2 shows a second embodiment. The mounting bracket 2 of the present embodiment includes a first unit 20 for holding and fixing the heat sink 4.
And a second unit for applying a holding force to the first unit 20
27 and a unit coupling structure.

The first unit 20 includes two legs 21, a lower protruding portion 22 protruding downward at the center of the leg 21, an upper protruding portion 23 formed on both ends of the lower protruding portion 22, It is formed of a fitting groove 24 formed at the starting point of the projection 23 and has an M-shaped cross-sectional shape which can be integrally molded. At the ends of the two legs 20, locking claws 25 facing inward are formed, and the distance between the claws 25 is set substantially the same as the distance between the mounting holes 30 into which the claws 25 are fitted. The lower protruding portion 22 is formed by bending the center of the leg portion 20, and the lower end thereof is provided with the heat sink 4 (more specifically, the portion 40) when the claw 25 is locked in the mounting hole 30. ) It is set at a position where it can contact the upper surface. The fitting groove
24 has a groove on the groove surface, and one of the fittings 24
In a, a small projection 26 is formed from the end of the groove, and the groove opening is smaller, and is formed in a cross section C.

The second unit 27 has a bifurcated leg.
28 and a handle portion 29 extending upward from one leg 28b. At the ends of the two legs 28, a radius is attached to the end surface so as to be freely fit in the fitting groove 24.On one leg 28a, a small fitting groove 24a with a groove opening is formed in the thickness direction (X). A constriction 30 is formed for easy fitting. The constriction 30 and the C-shaped cross section of the fitting portion 24a prevent the tip of the leg portion 28a once fitted to the fitting portion 24a from coming off therefrom due to a force acting from a direction other than the thickness direction (X). ing. The interval between the ends of the two legs 28 is set shorter than the interval between the grooves 24 into which they fit. As a result, when the ends of the two legs 28 are fitted into the grooves 28, a force inward is applied to the first unit 20, and the two legs 21 are also contracted and closed. The handle portion 29 has an upper end portion formed to be bent in a horizontal direction,
It is easy to press down.

As shown in FIG. 2B, the method of using the second embodiment is as follows. First, the tip of the leg 28a on the side where the constriction 30 of the second unit is located is fitted to the fitting portion 24a of the first unit 20. Thickness direction (X)
And the first unit 20 and the second unit 27 are connected to each other. In the coupled state, the first heat sink 4 mounted on the semiconductor element case 3 is viewed from above.
While holding down the heat sink 4 (more specifically, the portion 40) with both legs 21 of the unit 20, the semiconductor element case 3
The claw 25 of the first unit 20 is locked in the mounting hole 30 of. At this time, the lower protruding portion 22 of the first unit 20 contacts the upper surface of the heat sink 4 (more specifically, the portion 40). Next, the second
Push down on the handle 29 of the unit 27 and move its leg 28b
The distal end is fitted on the fitting portion 24b of the first unit 20 while sliding on the outer surface of the upper convex portion 23 of the first unit 20. Due to this fitting, the lower projection 22 of the first unit 20 becomes a fulcrum, and both legs 21 of the first unit 20 are contracted while flexing,
The attachment 2 is firmly fixed on the semiconductor element case 3 as in the first embodiment. Therefore, the heat sink 4 pressed down by the mounting fixture 2 is also securely fixed. In the present embodiment, since the first unit 20 bends with the lower convex portion 22 serving as a contact fulcrum, deformation in the closing direction due to long-term use can be effectively prevented, and durability is improved. Has become.

The mounting device 1 of the first embodiment and the first unit 20 and the second unit 27 of the second embodiment are also formed by molding a long extruded material whose thickness direction (X) is the longitudinal direction. It has an integral shape that can be made. Therefore, its production only needs to be continuously sheared at a predetermined thickness after forming such an elongated extruded material. For this reason, as an equipment for manufacturing these embodiments, an extrusion die having a contoured shape and shearing means are sufficient. In addition, since the fittings 1 and 2 can be manufactured continuously by the step of shearing the long extruded material, the cutting allowance is almost unnecessary, and the material is hardly wasted. Therefore, it can be seen that even when the shape or the like is improved or the design is changed to a mounting tool having a different shape, it can be performed extremely easily due to the low cost of the mold.

[0020]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Comparing the manufacturing costs of the conventional mounting tool 5 shown in FIG. 3 with the mounting tools 1 and 2 of this embodiment shown in FIGS. (About 10
In the case of step (2), it is extremely expensive at about 2.2 million yen, but the extrusion dies required for the fittings 1 and 2 in FIGS. This also indicates that the manufacturing cost of this embodiment is extremely low as compared with the manufacturing of the conventional mounting fixture.

[0021]

As described above, according to the manufacturing method of the present invention, the equipment required for manufacturing can be inexpensive as compared with the conventional one, and a mounting instrument having a free shape can be obtained at low cost. Further, since there is almost no waste of the material, the cost can be reduced from that point, and the resources can be effectively used.

[Brief description of the drawings]

FIG. 1 shows a first embodiment, in which (a) is a structural explanatory view of a mounting tool, and (b) is a use state diagram of the mounting tool.

FIGS. 2A and 2B show a second embodiment, wherein FIG. 2A is a structural explanatory view of a mounting device, and FIG.

3A and 3B show a conventional mounting device, wherein FIG. 3A is a structural explanatory view of the mounting device, and FIG.

[Explanation of symbols]

 1,2 Mounting device 3 Semiconductor element case 4 Heat sink X Thickness direction

Claims (4)

(57) [Claims] 1. A heat sink is fixed to a semiconductor element case by holding down a heat sink with both leg parts extending downward and engaging a locking claw of both leg parts with a mounting hole of the semiconductor element case. A method of manufacturing a mounting device, wherein a long extruded material whose thickness direction is a longitudinal direction is extruded with an extrusion die, and the extruded material is sheared at predetermined intervals to be manufactured. A method of manufacturing a mounting device for a heat sink. 2. The mounting device has a shape in which the distance between the locking claws of both legs is narrower than the distance between the mounting holes, and a handle is formed that can expand both legs. The method for manufacturing a fixture for a heat sink according to claim 1, wherein: 3. The mounting device comprises a first unit having both legs, and a second unit fitted to the first unit so as to narrow both legs of the first unit. 2. The method for manufacturing a heat sink mounting device according to claim 1, wherein an extruded material is formed by using an extrusion die, and the extruded material is sheared at a predetermined interval so that the thickness direction is the longitudinal direction. Method. 4. A mounting device for a heat sink obtained by the manufacturing method according to claim 3, wherein the first unit has, at a central portion between both legs, a convex portion which can be brought into contact with the heat sink when the heat sink is pressed down. A mounting device for a heat sink, characterized in that the mounting device has a shape which is made to have a curved shape.