JP2977981B2 - Heating furnace for soldering - Google Patents
Heating furnace for solderingInfo
- Publication number
- JP2977981B2 JP2977981B2 JP3349904A JP34990491A JP2977981B2 JP 2977981 B2 JP2977981 B2 JP 2977981B2 JP 3349904 A JP3349904 A JP 3349904A JP 34990491 A JP34990491 A JP 34990491A JP 2977981 B2 JP2977981 B2 JP 2977981B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- heating furnace
- heating chamber
- soldering
- heating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Tunnel Furnaces (AREA)
- Furnace Details (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、電子部品を回路基板に
半田付けするための半田付け用加熱炉に関するものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heating furnace for soldering an electronic component to a circuit board.
【０００２】[0002]
【従来の技術】電子部品を回路基板に半田付けにより実
装する場合には、電子部品を所定の位置に搭載した回路
基板を加熱炉に通し、半田を溶融させて半田付けを行
う。この場合、加熱炉内には窒素ガスなどの不活性ガス
を充満させて、回路基板や電子部品の酸化を防止してい
る。2. Description of the Related Art When an electronic component is mounted on a circuit board by soldering, the circuit board on which the electronic component is mounted at a predetermined position is passed through a heating furnace, and the solder is melted and soldered. In this case, the heating furnace is filled with an inert gas such as nitrogen gas to prevent oxidation of the circuit board and the electronic components.
【０００３】加熱炉内に不活性ガスを充満させるには従
来、シャッターで炉内外を遮断する方式が一般的であっ
たが、この方式は作業性がわるいため、最近、図３に示
すような非接触シール方式の加熱炉が提案されている。
この加熱炉は、内部にヒーター11が設置された加熱室13
と、入口通路15と、出口通路17とを備えており、その中
を電子部品を搭載した回路基板19がチェーンコンベア21
により両側を支持された状態で走行するようになってい
る。Conventionally, in order to fill the inside of the heating furnace with the inert gas, a method of shutting off the inside and outside of the furnace with a shutter has been generally used. However, since this method has poor workability, recently, as shown in FIG. A non-contact sealing type heating furnace has been proposed.
This heating furnace has a heating chamber 13 in which a heater 11 is installed.
, An entrance passage 15, and an exit passage 17, in which a circuit board 19 on which electronic components are mounted is a chain conveyor 21.
, So that the vehicle runs with both sides supported.
【０００４】加熱室13内には酸化防止のため不活性ガス
を充満させてあり、この不活性ガスは外部からの空気の
侵入を防止するため、入口通路15および出口通路17から
常時外部に流出する状態に保たれている。しかし不活性
ガスを外部へ常時流出させることは不経済であるため、
流出量をできるだけ少なくする必要がある。このため従
来の加熱炉は入口通路15および出口通路17内の上下に、
回路基板19の走行方向に所定の間隔をおいて多数の遮蔽
板23を配置し、これによって外部に流出する不活性ガス
に抵抗を与え、不活性ガスの流出を抑制している。The heating chamber 13 is filled with an inert gas to prevent oxidation, and the inert gas constantly flows out of the inlet passage 15 and the outlet passage 17 to the outside in order to prevent intrusion of air from outside. It is kept in a state to be. However, it is uneconomical to always let the inert gas flow out to the outside,
It is necessary to minimize the outflow. For this reason, the conventional heating furnace is vertically located in the entrance passage 15 and the exit passage 17,
A large number of shielding plates 23 are arranged at predetermined intervals in the traveling direction of the circuit board 19, thereby providing resistance to the inert gas flowing out to the outside, thereby suppressing the flow of the inert gas.
【０００５】[0005]
【発明が解決しようとする課題】しかしこのような構造
では、回路基板を投入しない状態では加熱室内の酸素濃
度を比較的低く、かつ安定に保持できるのであるが、回
路基板を次々に投入すると、加熱室内の酸素濃度が大幅
に変動するという問題のあることが判明した。ちなみに
回路基板を投入しないときは加熱室内の酸素濃度は約20
ppm程度であるが、回路基板を投入すると加熱室内の酸
素濃度は数1000 ppm以下の範囲で大きく変動してしまう
のである。However, in such a structure, the oxygen concentration in the heating chamber can be kept relatively low and stable without the circuit board being loaded. However, when the circuit boards are loaded one after another, It has been found that there is a problem that the oxygen concentration in the heating chamber fluctuates greatly. By the way, when the circuit board is not loaded, the oxygen concentration in the heating chamber is about 20
Although it is on the order of ppm, the oxygen concentration in the heating chamber fluctuates greatly within a range of several thousand ppm or less when the circuit board is loaded.
【０００６】この原因を究明したところ、例えば図４に
示すように回路基板19が出口通路17を通過するときには
（入口通路15を通過するときも同様）遮蔽板23の間の隙
間が回路基板19によって上下に仕切られるため、炉内の
暖かいガスは回路基板19の上側を通って外部に出て行
き、回路基板19の下側ではこれとは反対に外気が炉内に
吸い込まれる現象が起きていることが分かった。この外
気の吸い込みのため炉内の酸素濃度の大幅に変動するわ
けである。As a result of investigating the cause, for example, as shown in FIG. 4, when the circuit board 19 passes through the outlet passage 17 (also when passing through the entrance passage 15), the gap between the shielding plates 23 is reduced. The warm gas in the furnace passes through the upper side of the circuit board 19 and goes out to the outside, and on the lower side of the circuit board 19, the outside air is sucked into the furnace in reverse. I knew it was there. Due to the intake of the outside air, the oxygen concentration in the furnace fluctuates greatly.
【０００７】[0007]
【課題を解決するための手段】本発明は、上記のような
課題を解決した半田付け用加熱炉を提供するもので、そ
の構成は、電子部品を搭載した回路基板を加熱して両者
を半田付けする加熱室と、加熱室に前記回路基板を導入
する入口通路と、加熱室から前記回路基板を導出する出
口通路とを備え、入口通路および出口通路内の上下に
は、前記回路基板の走行方向に所定の間隔をおいて加熱
室内の不活性ガスが炉外に流出するのを抑制する多数の
遮蔽板を配置してなる半田付け用加熱炉において、入口
通路および出口通路の少なくとも一方の、少なくとも下
側に配置された遮蔽板の先端に、遮蔽板の断面がＴ形と
なるように水平板部を設けたことを特徴とする。SUMMARY OF THE INVENTION The present invention provides a heating furnace for soldering which solves the above-mentioned problems. The heating furnace is configured to heat a circuit board on which electronic components are mounted and to solder them together. A heating chamber, an inlet passage for introducing the circuit board into the heating chamber, and an outlet passage for leading the circuit board out of the heating chamber. In a heating furnace for soldering, in which a number of shielding plates are arranged to prevent the inert gas in the heating chamber from flowing out of the furnace at predetermined intervals in the direction, at least one of the inlet passage and the outlet passage, A horizontal plate portion is provided at least at the end of the shield plate arranged on the lower side so that the cross section of the shield plate is T-shaped.
【０００８】[0008]
【作用】このようにすると回路基板の下側から炉内に吸
い込まれる空気が、遮蔽板の先端に設けられた水平板部
により、遮蔽板と遮蔽板の間の空間に巻き込まれて滞留
するようになり、加熱室まで侵入する空気はごく僅かと
なり、加熱室内の酸素濃度を低く保つことが可能とな
る。In this manner, the air sucked into the furnace from below the circuit board is trapped and retained in the space between the shield plates by the horizontal plate portion provided at the tip of the shield plate. In addition, the amount of air entering the heating chamber is very small, and the oxygen concentration in the heating chamber can be kept low.
【０００９】[0009]
【実施例】以下、本発明の実施例を図面を参照して詳細
に説明する。図１は本発明の一実施例に係る半田付け用
加熱炉を示す。図１において先に説明した図３の加熱炉
と同一部分には同一符号が付してある。この加熱炉が図
３の加熱炉と異なるところは、入口通路15および出口通
路17内に配置された遮蔽板23の先端に、遮蔽板の断面が
Ｔ形となるように水平板部25を設けたことである。Embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 1 shows a heating furnace for soldering according to one embodiment of the present invention. In FIG. 1, the same parts as those of the heating furnace of FIG. 3 described above are denoted by the same reference numerals. This heating furnace differs from the heating furnace of FIG. 3 in that a horizontal plate portion 25 is provided at the tip of a shielding plate 23 disposed in the entrance passage 15 and the exit passage 17 so that the shielding plate has a T-shaped cross section. That is.
【００１０】このような水平板部25を設けると、図４に
示すように回路基板19の下側から炉内に吸い込まれる空
気が、遮蔽板23と遮蔽板23の間の空間に巻き込まれて滞
留するようになるため、加熱室13まで空気が侵入し難く
なり、加熱室13内の酸素濃度を低く保つことができる。
また回路基板19の上側でも加熱された不活性ガスの巻き
込みが起こりやすくなるため、不活性ガスの流出量を少
なくできる。When such a horizontal plate portion 25 is provided, as shown in FIG. 4, air sucked into the furnace from below the circuit board 19 is caught in the space between the shield plates 23. Since the air stays, it is difficult for air to enter the heating chamber 13 and the oxygen concentration in the heating chamber 13 can be kept low.
Also, the heated inert gas is likely to be entrained on the upper side of the circuit board 19, so that the outflow of the inert gas can be reduced.
【００１１】図１の加熱炉で実験したところでは、窒素
ガス流量220 リットル／分、チェーンコンベア速度0.9
ｍ／分、回路基板サイズ250mm×250mm 、回路基板投入
枚数50枚、回路基板投入タクト30秒とした場合、加熱室
13内の酸素濃度は14.0〜19.3ppmの範囲で安定すること
が分かった。Experiments with the heating furnace shown in FIG. 1 showed that the nitrogen gas flow rate was 220 liters / minute and the chain conveyor speed was 0.9.
m / min, circuit board size 250mm x 250mm, circuit board loading 50 sheets, circuit board loading tact 30 seconds, heating chamber
It was found that the oxygen concentration in 13 was stable in the range of 14.0 to 19.3 ppm.
【００１２】なお、水平板部25は図示のように遮蔽板１
枚おきに設けることが最も効果的である。これは、すべ
ての遮蔽板23に水平板部25を設けると、かえってガスの
巻き込みが生じ難くなり、また遮蔽板２枚おき又は３枚
おきに水平板部を設けると水平板部が少な過ぎてガスの
巻き込み作用が小さくなるからである。The horizontal plate 25 is provided with a shielding plate 1 as shown in FIG.
It is most effective to provide every other sheet. This is because, when the horizontal plate portions 25 are provided on all of the shield plates 23, the entrainment of gas is rather unlikely to occur, and when the horizontal plate portions are provided every two or three shield plates, the horizontal plate portions are too small. This is because the gas entrainment effect is reduced.
【００１３】また、断面Ｔ形の遮蔽板は、垂直な遮蔽板
23の先端に水平板部25を溶接すること等により構成でき
るが、断面Ｌ形の遮蔽板を背中合せに組み合わせて構成
することも可能である。The shielding plate having a T-shaped cross section is a vertical shielding plate.
The horizontal plate 25 can be welded to the tip of the nozzle 23 or the like, but it is also possible to combine the shield plates having the L-shaped cross section back to back.
【００１４】[0014]
【発明の効果】以上説明したように本発明によれば、回
路基板の下側から炉内に侵入しようとする空気が、遮蔽
板の先端に設けた水平板部により、遮蔽板と遮蔽板の間
の空間に巻き込まれて滞留し、加熱室まで侵入し難くな
るため、加熱室内の酸素濃度を低く、かつ安定に保持す
ることができる。したがって回路基板と電子部品の半田
付けを酸化による不良を発生させることなく良好に行う
ことができる。As described above, according to the present invention, the air that is about to enter the furnace from the lower side of the circuit board is moved between the shield plates by the horizontal plate portion provided at the tip of the shield plate. Since the air is trapped and stays in the space and hardly penetrates into the heating chamber, the oxygen concentration in the heating chamber can be kept low and stable. Therefore, the circuit board and the electronic component can be satisfactorily soldered without causing a defect due to oxidation.
【図１】 図１は本発明の一実施例に係る半田付け用加
熱炉を示す断面図。FIG. 1 is a sectional view showing a heating furnace for soldering according to an embodiment of the present invention.
【図２】 図１の加熱炉の作用を要部を拡大して示す説
明図。FIG. 2 is an explanatory view showing an operation of the heating furnace of FIG.
【図３】 従来の半田付け用加熱炉を示す断面図。FIG. 3 is a cross-sectional view showing a conventional heating furnace for soldering.
【図４】 図３の加熱炉の問題点を要部を拡大して示す
説明図。 11：ヒーター 13：加熱室 15：入口通路 17：出口通
路 19：電子部品を搭載した回路基板 21：チェー
ンコンベア 23：遮蔽板 25：水平板
部FIG. 4 is an explanatory view showing a problem of the heating furnace of FIG. 11: Heater 13: Heating room 15: Inlet passage 17: Outlet passage 19: Circuit board with electronic components 21: Chain conveyor 23: Shield plate 25: Horizontal plate
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平３−80291（ＪＰ，Ａ) 実公 平３−22709（ＪＰ，Ｙ２) (58)調査した分野(Int.Cl.6，ＤＢ名) F27D 7/06 B23K 1/008 F27B 9/00 - 9/40 ────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-3-80291 (JP, A) JP-A-3-22709 (JP, Y2) (58) Fields investigated (Int. Cl. 6 , DB name) F27D 7/06 B23K 1/008 F27B 9/00-9/40
Claims (2)
者を半田付けする加熱室と、加熱室に前記回路基板を導
入する入口通路と、加熱室から前記回路基板を導出する
出口通路とを備え、入口通路および出口通路内の上下に
は、前記回路基板の走行方向に所定の間隔をおいて加熱
室内の不活性ガスが炉外に流出するのを抑制する多数の
遮蔽板を配置してなる半田付け用加熱炉において、入口
通路および出口通路の少なくとも一方の、少なくとも下
側に配置された遮蔽板の先端に、遮蔽板の断面がＴ形と
なるように水平板部を設けたことを特徴とする半田付け
用加熱炉。1. A heating chamber for heating a circuit board on which electronic components are mounted and soldering them together, an inlet passage for introducing the circuit board into the heating chamber, and an outlet passage for leading the circuit board out of the heating chamber. A number of shielding plates are arranged above and below the entrance passage and the exit passage at predetermined intervals in the traveling direction of the circuit board to suppress the inactive gas in the heating chamber from flowing out of the furnace. In the heating furnace for soldering, a horizontal plate portion is provided at at least one of an inlet passage and an outlet passage at a tip of a shield plate arranged at least on a lower side so that a cross section of the shield plate is T-shaped. A heating furnace for soldering.
平板部を有する遮蔽板と、先端に水平板部を有しない遮
蔽板とが回路基板の走行方向に交互に配置されているこ
とを特徴とするもの。2. The heating furnace according to claim 1, wherein a shielding plate having a horizontal plate portion at a tip and a shielding plate having no horizontal plate portion at a tip are alternately arranged in the traveling direction of the circuit board. That are characterized by
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3349904A JP2977981B2 (en) | 1991-12-10 | 1991-12-10 | Heating furnace for soldering |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3349904A JP2977981B2 (en) | 1991-12-10 | 1991-12-10 | Heating furnace for soldering |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05157462A JPH05157462A (en) | 1993-06-22 |
| JP2977981B2 true JP2977981B2 (en) | 1999-11-15 |
Family
ID=18406897
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3349904A Expired - Fee Related JP2977981B2 (en) | 1991-12-10 | 1991-12-10 | Heating furnace for soldering |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2977981B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6195105B2 (en) * | 2013-04-26 | 2017-09-13 | 東海高熱工業株式会社 | Continuous firing furnace |
-
1991
- 1991-12-10 JP JP3349904A patent/JP2977981B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH05157462A (en) | 1993-06-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5338008A (en) | Solder reflow furnace | |
| JP4319646B2 (en) | Reflow furnace | |
| EP0696240B1 (en) | Process and apparatus for the wave soldering of circuit boards | |
| JP3638415B2 (en) | Gas atmosphere soldering equipment | |
| US5230460A (en) | High volume convection preheater for wave soldering | |
| JPH05185208A (en) | Device inactivating the welding bath of wave welder | |
| US5411200A (en) | Process and apparatus for the wave soldering of circuit boards | |
| JP2977981B2 (en) | Heating furnace for soldering | |
| JP2009260097A (en) | Facility for modifying into nitrogen reflow furnace | |
| JP4795916B2 (en) | Heating device | |
| JP3179833B2 (en) | Reflow equipment | |
| JP3108523B2 (en) | Heating furnace for soldering | |
| JP3404768B2 (en) | Reflow equipment | |
| JPH07231160A (en) | Reflow soldering device | |
| EP0471619B1 (en) | Solder reflow furnace | |
| JP2871950B2 (en) | Heating furnace for soldering | |
| JP3008061B2 (en) | Apparatus and method for suppressing convection in solder bath in low oxygen atmosphere | |
| JP2847020B2 (en) | Reflow soldering equipment | |
| JP2587884B2 (en) | Inert gas atmosphere soldering equipment | |
| JP2584411Y2 (en) | Reflow furnace | |
| JP2771931B2 (en) | Reflow soldering equipment | |
| JP3106744B2 (en) | Chisso reflow device | |
| JP3406005B2 (en) | Reflow device and reflow method | |
| JP2915633B2 (en) | Heating furnace for soldering | |
| JPH06164129A (en) | Reflow equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20070910 Year of fee payment: 8 |
|
| S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313113 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20070910 Year of fee payment: 8 |
|
| R360 | Written notification for declining of transfer of rights |
Free format text: JAPANESE INTERMEDIATE CODE: R360 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080910 Year of fee payment: 9 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080910 Year of fee payment: 9 |
|
| R370 | Written measure of declining of transfer procedure |
Free format text: JAPANESE INTERMEDIATE CODE: R370 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080910 Year of fee payment: 9 |
|
| S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313113 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080910 Year of fee payment: 9 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090910 Year of fee payment: 10 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090910 Year of fee payment: 10 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090910 Year of fee payment: 10 |
|
| S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313111 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090910 Year of fee payment: 10 |
|
| R360 | Written notification for declining of transfer of rights |
Free format text: JAPANESE INTERMEDIATE CODE: R360 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090910 Year of fee payment: 10 |
|
| R370 | Written measure of declining of transfer procedure |
Free format text: JAPANESE INTERMEDIATE CODE: R370 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090910 Year of fee payment: 10 |
|
| S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313111 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100910 Year of fee payment: 11 |
|
| S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313111 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100910 Year of fee payment: 11 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100910 Year of fee payment: 11 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110910 Year of fee payment: 12 |
|
| LAPS | Cancellation because of no payment of annual fees |