JP2972615B2 - Probe and method for observing electronic parts - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a probe and method for observing an electronic component, which contacts a terminal of the electronic component to observe an electrical state of the electronic component, and more particularly to a probe for observing an LSI.

[0002]

2. Description of the Related Art FIGS. 4 (a) and 4 (b) are a front view and a side view of a conventional probe for observing electronic parts (an IC clip for high-density mounting described in Japanese Utility Model Laid-Open No. 3-65773). is there. The probe for observing electronic components presses each of a plurality of downwardly bent contact pieces 13 disposed on both sides of the block 10 against the terminals 8 disposed on both sides of the LSI 7, and shafts at both ends of the block 10. couple as lower is pivotally secured to the 12a moves inward holds the pawl 12 in LSI7 which is more Fuzei the plate spring 12b, respectively disposed on the upper surface of the block 10 is connected to the contact piece 13 The electrical state of the LSI 7 was observed by bringing an observation clip or probe connected to the measuring instrument into contact with the terminal 11.

[0003]

The first problem is that, in the prior art, an observation clip or probe often makes erroneous contact with a terminal 11 adjacent to a terminal 11 to be observed.

The reason for this is that the terminals 11 which are the contact portions of the observation clip and the probe are arranged in a bare manner without providing a partition wall or the like, and the terminal 11 is pinched by the observation clip or the probe. This is because the user simply holds the observation probe and presses it against the terminal 11, so that the observation clip or probe may be loose.

[0005] The second problem is that accurate waveform observation may not be possible.

[0006] The reason is that the observation clip or probe is not securely fixed to the terminal 11 and may be unstable.

An object of the probe for observing electronic parts of the present invention is that even for electronic parts having terminals arranged at a narrow pitch, the probe does not erroneously come into contact with another terminal adjacent to the target measuring terminal.
An object of the present invention is to make it possible to accurately observe the electrical state of an electronic component. Another object of the present invention is to make it possible to observe a plurality of types of electronic components having different sizes of the main body with one electronic component observation probe.

[0008]

According to the present invention, there is provided a probe for observing an electronic component, comprising: a main body (1 in FIG. 1); a pair of fixed fins (6 in FIG. 2) arranged side by side on the bottom surface of the main body; A pair of fixing hooks (2 in FIG. 1) slidably attached to the main body, the ends of which are arranged to face the fixing fins and are urged to move toward the fixing fins; A contact pin (5 in FIG. 2) slidably attached to the main body and positioned between the pair of fixing fins and urged toward the tip of the fixing hook; A claw (6a in FIG. 2) having a lower portion projecting from the upper portion and an upper surface being an inclined surface is formed.

In the electronic component observing method according to the present invention, the tip of the pair of fixing hooks may be connected to one side of the electronic component such that one of the terminals arranged side by side is positioned therebetween. The pair of fixing fins is pulled by the pair of fixing fins so that a terminal to be observed that is opposed to the terminal positioned between the pair of fixing hooks of the electronic component is positioned therebetween. hooking the opposing sides to the one sides multiplied only, contacting said contact pin terminals and said observation target
It is characterized by making it.

The main body is fixed to the electronic component by fixing hooks and fixing fins. At this time, the contact pin is pressed against the terminal to be measured of the electronic component by the spring. Since the measurement terminal is isolated from the adjacent terminal by the fixed fin, there is no erroneous contact of the contact pin with a terminal other than the measurement terminal.

[0011]

Next, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a perspective view of an electronic component observation probe according to an embodiment of the present invention, and FIGS. 2A, 2B and 2C are cross-sectional views each showing a part of the electronic component observation probe of FIG. It is a top view, side sectional view, and bottom view shown in FIG.

Referring to FIGS. 1 and 2, two fixing hooks 2 are slidably attached to holes provided in the main body 1 within a predetermined range in the front-rear direction, and project outside the main body 1. The tip of the fixed hook 2 is curved downward. Further, the fixing hook 2 is urged in a direction in which the flange 2 a is pushed by the spring 3 and is pulled into the main body 1. The rear portion of the bottom surface of the main body 1 projects downward with a step, and a contact pin 5 is slidably mounted in a hole provided in the projection 1a in a predetermined range in the front-rear direction. It is urged by a spring 4 in a direction to protrude from the main body 1.

On both sides of the contact pin 5 on the bottom surface of the main body 1, fixed fins 6 connected to the protrusions 1a are formed integrally with the main body 1. Claws 6 protruding from the upper part at the lower part of the fixed fin 6
a is provided. The tip of the contact pin 5 extends outside the main body 1, but does not travel further than the end of the claw 6a. The cable 14 attached to the rear part of the main body 1 is connected to a measuring instrument (not shown), and is electrically connected to a conductor (not shown) provided in the main body 1 and in sliding contact with the contact pin 5. The main body 1 and the fixing fins 6 are formed of an insulator such as plastic, and the contact pins 5 are made of a low-resistance metal.

FIGS. 3A and 3B show the operation of bringing the electronic component observation probe shown in FIGS. 1 and 2 into contact with the terminal 8 of the LSI 7. FIGS. 3A and 3B show the fixing hook 2 and the main body of the LSI 7, respectively. 3 (c) and 3 (d) are a side view showing a state where the contact pins 5 are in contact with the LSI terminals 8 and a bottom view omitting the mounting board 9, respectively.

Referring to FIG. 3, an LS of a dual in-line package mounted on a substrate 9 while holding the main body 1 with a finger.
The fixing hook 2 is hooked on the main body of the LSI 7 so as to sandwich the terminal facing the LSI terminal 8 to be observed I7. The main body 1 is retracted by pulling the main body 1 and the LSI terminal 8 to be observed is pinched by the fixed fins 6 so that the main body 1
Position the body 1 with respect to SI7 and release the body 1 from the finger. At this time, a force acts between the fixing hook 2 and the fixing fins 6 in the direction of tightening the main body of the LSI 7 by the spring 4, and the main body 1 is fixed. Moreover, the lower sides of both sides of the LSI 7 main body are pushed upward by the tip of the curved portion of the fixing hook 2 and the inclined surface of the claw 6a, and the upper surface of the LSI 7 main body is brought into close contact with the lower surface of the main body 1,
The relative position of the main body 1 with respect to the LSI 7 does not vary. At the same time, the contact pin 5 is pressed against the LSI terminal 8 by the spring 4.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In a probe for observing electronic parts according to a first embodiment of the present invention, a force for urging a fixing hook 2 by a spring 3 and a force for urging a contact pin 5 by a spring 4 are shown in FIG. Are 1 to 2 kg.

In the probe for observing electronic parts according to the second embodiment of the present invention, the force for urging the fixing hook 2 by the spring 3 in the state shown in FIG. The urging force is 1.0 kg.

The present invention can be carried out even when the lower end of the fixing fin does not protrude in a claw shape and the end is straight, or when the tip of the fixing hook is not curved but simply bent in an L shape. . However, in such a case, it is better to lightly press the main body of the electronic component observation probe against the electronic component when attaching the electronic component observation probe to the electronic component.

[0020]

The first effect is that the contact pins do not make erroneous contact with terminals other than the terminals to be observed of the electronic component.

The reason is that the terminal to be observed is separated from other adjacent terminals by the fixed fin.

The second effect is that accurate measurement can be performed.

The reason is that the fixing hook and the fixing fin can fix the main body to the electronic component without shaking, and the contact pin can be pressed against the LSI terminal to be observed with an appropriate pressure.

[Brief description of the drawings]

FIG. 1 is a perspective view of an electronic component observation probe according to an embodiment of the present invention.

2 (a) is a plan view showing a cross section of a part of the electronic component observation probe shown in FIG. 1. FIG. FIG. 2B is a side sectional view of the electronic component observation probe shown in FIG. 1. FIG. 2C is a bottom view of the electronic component observation probe shown in FIG. 1.

FIG. 3A is a plan view showing a state in which a fixing hook 2 of the electronic component observation probe shown in FIG. FIG. 3B is a side view of FIG. (C) The contact pin 5 of the electronic component observation probe shown in FIG.
FIG. 3 is a side view of a state in which the terminal of FIG. FIG. 3D is a bottom view of FIG.

FIG. 4 (a) is a front view of a conventional electronic component observation probe. (B) It is a side view of FIG. 4 (a).

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Main body 2 Fixing hook 3 Spring 4 Spring 5 Contact pin 6 Fixing fin 6a Claw 7 LSI 8 LSI terminal 6 Mounting board 10 Block 11 Terminal 12 Claw 13 Contact piece

──────────────────────────────────────────────────続 き Continued on front page (58) Field surveyed (Int.Cl. ⁶ , DB name) G01R 1/073 G01R 31/26

Claims (3)

(57) [Claims] 1. A main body, a pair of fixed fins juxtaposed on a bottom surface of the main body, and a tip slidably mounted on the main body and opposed to the fixed fins, moving toward the fixed fins. A pair of fixing hooks urged so as to make contact with the front end of the fixing hook slidably attached to the main body with the tip located between the pair of fixing fins. A probe for observing electronic parts, comprising a pin. 2. The electronic component observation probe according to claim 1, wherein a lower portion of the fixed fin projects from an upper portion and a claw having an inclined surface on an upper side is formed. 3. An end of the pair of fixing hooks is hooked on the side of the electronic component so that one of the terminals arranged in parallel on one side of the electronic component is positioned therebetween. The one side where the pair of fixing fins is hooked on the pair of fixing hooks so that the terminal to be observed is opposed to the terminal positioned between the pair of fixing hooks. 3. The electronic component observing method using the electronic component observing probe according to claim 1, wherein the contact pin is brought into contact with the terminal to be observed, by hooking on a side opposite to.