JP2938100B2 - Molding method for thick molded products - Google Patents
Molding method for thick molded productsInfo
- Publication number
- JP2938100B2 JP2938100B2 JP27668389A JP27668389A JP2938100B2 JP 2938100 B2 JP2938100 B2 JP 2938100B2 JP 27668389 A JP27668389 A JP 27668389A JP 27668389 A JP27668389 A JP 27668389A JP 2938100 B2 JP2938100 B2 JP 2938100B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- cavity
- volume
- molded product
- movable piece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims description 7
- 238000000465 moulding Methods 0.000 title description 13
- 229920005989 resin Polymers 0.000 claims description 48
- 239000011347 resin Substances 0.000 claims description 48
- 229920000106 Liquid crystal polymer Polymers 0.000 claims description 6
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 claims description 6
- 238000002347 injection Methods 0.000 description 17
- 239000007924 injection Substances 0.000 description 17
- 238000002844 melting Methods 0.000 description 5
- 230000008018 melting Effects 0.000 description 5
- FJKROLUGYXJWQN-UHFFFAOYSA-N 4-hydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 4
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000001746 injection moulding Methods 0.000 description 3
- UJUWWKHUFOKVEN-UHFFFAOYSA-N 3-hydroxy-2-(2-hydroxyphenyl)benzoic acid Chemical compound OC(=O)C1=CC=CC(O)=C1C1=CC=CC=C1O UJUWWKHUFOKVEN-UHFFFAOYSA-N 0.000 description 2
- 229940090248 4-hydroxybenzoic acid Drugs 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 229920001897 terpolymer Polymers 0.000 description 2
- VCUFZILGIRCDQQ-KRWDZBQOSA-N N-[[(5S)-2-oxo-3-(2-oxo-3H-1,3-benzoxazol-6-yl)-1,3-oxazolidin-5-yl]methyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C1O[C@H](CN1C1=CC2=C(NC(O2)=O)C=C1)CNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F VCUFZILGIRCDQQ-KRWDZBQOSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000113 differential scanning calorimetry Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
- B29C45/56—Means for plasticising or homogenising the moulding material or forcing it into the mould using mould parts movable during or after injection, e.g. injection-compression moulding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
- B29C45/56—Means for plasticising or homogenising the moulding material or forcing it into the mould using mould parts movable during or after injection, e.g. injection-compression moulding
- B29C2045/5695—Means for plasticising or homogenising the moulding material or forcing it into the mould using mould parts movable during or after injection, e.g. injection-compression moulding using a movable mould part for continuously increasing the volume of the mould cavity to its final dimension during the whole injection step
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
- B29K2105/0079—Liquid crystals
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Description
【発明の詳細な説明】 ［産業上の利用分野］ 本発明は、射出成形により厚肉の成形品を成形する方
法に関するものである。Description: FIELD OF THE INVENTION The present invention relates to a method for molding a thick molded product by injection molding.
［従来の技術］ 熱可塑性樹脂を射出成形により成形する場合、成形品
が厚肉であると、ジェッティング現象が発生し易い。こ
れは溶融樹脂が狭いキャビティゲートを通って広いキャ
ビティ空間に棒状に噴出し、キャビティ壁面に触れずに
折り込まれるように重なり合いながら充填する現象であ
り、その重なりがそのままフローマーク（蛇行のマーク
や流れ模様）となって、成形品に残る不良現象である。
この不良現象は、溶融樹脂が棒状に噴出することなく、
キャビティ壁面に沿って順次充填されるような条件を設
定すれば解決し得るものであることから、従来では次の
ような手段を講じてジェッティング現象を防止してい
る。[Related Art] When a thermoplastic resin is molded by injection molding, if the molded product is thick, a jetting phenomenon is likely to occur. This is a phenomenon in which the molten resin is ejected into a wide cavity space through a narrow cavity gate in the form of a rod, and is filled while overlapping so as to be folded without touching the cavity wall surface. This is a defective phenomenon that remains as a pattern in the molded product.
This failure phenomenon is that the molten resin does not
The jetting phenomenon can be solved by setting conditions such that the filling is performed sequentially along the cavity wall surface. Therefore, the following measures have been conventionally taken to prevent the jetting phenomenon.
キャビティゲートの断面積を大きく設定する。 Set the cross-sectional area of the cavity gate large.
ピンなどの障害物をキャビティゲートに臨まして置
く。An obstacle such as a pin is placed facing the cavity gate.
溶融樹脂の射出速度または温度を調節する。 Adjust the injection speed or temperature of the molten resin.
キャビティゲートの位置を変更する。 Change the position of the cavity gate.
［発明が解決しようとする課題］ しかしながら、上記手段はDSC（Differetial Scannin
g Calorimetr示差熱走査熱量測定）の溶融ピークより10
℃以上高い温度で、せん断速度で1000sec-1のとき、L/D
が20のダイスを用いて測定したダイスウエル比が1.2以
上のポリオレフィン等の樹脂を用いて厚肉の成形品を成
形する場合には概ね良好な結果を得るが、ダイスウエル
比が1.2未満の小さな液晶ポリマーによる樹脂を用いて
の厚肉成形では、充分な効果が得られないのが実状であ
る。[Problems to be Solved by the Invention] However, the above-mentioned means is a DSC (Differetial Scannin).
g 10 from the melting peak of Calorimetr differential scanning calorimetry
L / D when temperature is higher than ℃ and shear rate is 1000sec -1
When a thick molded product is molded using a resin such as polyolefin having a die swell ratio of 1.2 or more measured using a dice of 20, generally good results are obtained, but a small liquid crystal polymer having a die swell ratio of less than 1.2 In fact, a sufficient effect cannot be obtained by thick-wall molding using a resin according to the above.
本発明は、上記問題に鑑みて考えられたものであっ
て、その目的は、きわめて簡単な手段により、ダイスウ
エル比が1.2未満の液晶ポリマーであっても、ジェッテ
ィングが原因とされるフローマークの発生のない厚肉成
形品を、容易に射出成形することができる新たな成形方
法を提供することにある。The present invention has been conceived in view of the above problems, and has as its object, by extremely simple means, even a liquid crystal polymer having a die swell ratio of less than 1.2, the flow mark of which is caused by jetting. It is an object of the present invention to provide a new molding method capable of easily injection-molding a thick molded product having no occurrence.
［課題を解決するための手段］ 上記目的による本発明の特徴は、キャビディゲートに
対して進退移動する可動片により、キャビティ容積を任
意に可変できる金型を用いて、ダイスウエル比が1.2未
満の液晶ポリマーによる樹脂を厚肉成形品を成形するに
あたり、予めキャビティ容積を小さく設定し、樹脂をキ
ャビティ内壁面に沿って順次充填し、その後、そのキャ
ビティに樹脂を密に充填しつつ上記可動片を樹脂圧によ
り後退させてキャビティ容積を増大させ、その容積が成
形すべき厚肉成形品の体積に対応したときに、上記可動
片を停止して容積の増大を阻止し、更に充填を樹脂が冷
却固化するまで行って、ジェッティングの発生を抑制す
ることによりフローマークの発生のない厚肉成形品を成
形することにある。[Means for Solving the Problems] The feature of the present invention according to the above-mentioned object is that a movable piece that moves forward and backward with respect to a cabidigate is used to mold a cavity whose volume can be arbitrarily changed, and a die well ratio of less than 1.2 In forming a thick molded article of a resin made of a liquid crystal polymer, the cavity volume is set to be small in advance, the resin is sequentially filled along the inner wall surface of the cavity, and then the movable piece is densely filled with the resin in the cavity. The cavity volume is increased by retreating with the resin pressure, and when the volume corresponds to the volume of the thick molded product to be molded, the movable piece is stopped to prevent the volume from increasing, and the resin is further cooled by filling. An object of the present invention is to form a thick molded product free from flow marks by suppressing the occurrence of jetting until the solidification is performed.
また成形品としてはキャビティゲートの断面積よりも
大きな底面積を有する棒状体、あるいは肉厚（5mm以
上）の板体等が対象となる。Further, as the molded product, a rod-shaped body having a bottom area larger than the cross-sectional area of the cavity gate, a plate body having a thickness (5 mm or more), or the like is a target.
［作 用］ 成形すべき厚肉成形品の体積に達するまで樹脂を密に
充填し、成形すべき厚肉成形品の体積に達した後は、キ
ャビティを減少させることなく樹脂をさらに充填するこ
とにより樹脂を密にする。[Operation] The resin is densely filled until the volume of the thick molded product to be molded is reached, and after reaching the volume of the thick molded product to be molded, the resin is further filled without reducing the cavity. To make the resin denser.
［実施例］ 以下、本発明の第１の実施例を第１図を参照しながら
説明する。Hereinafter, a first embodiment of the present invention will be described with reference to FIG.
図中１は金型であり、この金型１は固定型２と可動型
３とを有している。In the figure, reference numeral 1 denotes a mold. The mold 1 has a fixed mold 2 and a movable mold 3.
この金型１は、パーティングラインを境にして、上部
のゲート４とともに固定型２と可動型３とにわたり設け
られたキャビティ５を有している。またゲート４には固
定型２に設けたスプルー６が側方から接続されている。
このスプルー６には射出装置（射出手段）11が接続され
ている。The mold 1 has a cavity 5 provided over a fixed mold 2 and a movable mold 3 together with an upper gate 4 with a parting line as a boundary. A sprue 6 provided on the fixed mold 2 is connected to the gate 4 from the side.
An injection device (injection means) 11 is connected to the sprue 6.
上記キャビティ５の内部には、キャビティ容積を可変
するたとえば金属板からなる可動片７が、ゲート４に対
し進退自在に嵌装されている。また、キャビティ５の内
部には、キャビティ容積が成形すべき厚肉成形品の体積
に対応したとき可動片７を停止させるストッパ（停止手
段）15が設けられている。７にはパーティングラインの
延長線上に配設したエアーシリンダ（背圧付与手段）８
のピストンロッド９が連結されている。A movable piece 7 made of, for example, a metal plate and having a variable cavity volume is fitted inside the cavity 5 so as to be able to advance and retreat with respect to the gate 4. A stopper (stop means) 15 for stopping the movable piece 7 when the cavity volume corresponds to the volume of the thick molded product to be molded is provided inside the cavity 5. 7 is an air cylinder (back pressure applying means) disposed on an extension of the parting line.
Are connected.
このエアーシリンダ８には、これにエアーを供給する
ためのエアー供給装置（エアー供給手段）12が接続され
ている。このエアー供給装置12によるエアー供給圧は制
御装置（制御手段）13によって制御されるようになって
いる。また、エアーシリンダ８にはピストンロッド９の
位置を検出するためのロッド位置検出装置14が接続され
ている。このロッド位置検出装置14による検出結果は制
御装置13に供給される。なお、この制御装置13は、射出
装置11の制御も行なうようになっている。An air supply device (air supply means) 12 for supplying air to the air cylinder 8 is connected to the air cylinder 8. The air supply pressure of the air supply device 12 is controlled by a control device (control means) 13. Further, a rod position detecting device 14 for detecting the position of the piston rod 9 is connected to the air cylinder 8. The detection result by the rod position detecting device 14 is supplied to the control device 13. The control device 13 also controls the injection device 11.
しかして、エアーシリンダ８のピストンロッド９を伸
長すると、可動片７がキャビティ５の内部をゲート４に
対し前進して、キャビティ５を小さく仕切り、キャビテ
ィ容積を減少する。Thus, when the piston rod 9 of the air cylinder 8 is extended, the movable piece 7 advances inside the cavity 5 with respect to the gate 4, partitions the cavity 5 into small pieces, and reduces the cavity volume.
そこでエアーシリンダ８による前進位置の可動片７の
支持力（背圧）を、溶融樹脂の噴出力には打勝つが、密
に充填した後の樹脂圧には負けて、可動片７が後退する
ように制御装置13によりエアー供給装置12のエアー圧を
設定したのち、そこに狭く区画されたキャビティ５に射
出装置11によって溶融樹脂を射出充填すると、ゲート４
からの溶融樹脂はキャビティ内壁面に沿って順次充填し
て行く。Therefore, the support force (back pressure) of the movable piece 7 at the advanced position by the air cylinder 8 overcomes the ejection power of the molten resin, but loses the resin pressure after densely filling, and the movable piece 7 retreats. After setting the air pressure of the air supply device 12 by the control device 13 as described above, the injection device 11 injects and fills the molten resin into the cavity 5 narrowly defined therein.
The melted resin is sequentially filled along the inner wall surface of the cavity.
上記キャビティ４が樹脂により一杯になると、射出圧
力、即ち上記支持力よりも高い樹脂圧が可動片７に作用
して、可動片７は充填量に等しくゲート４に対し後退移
動してキャビティ容積を増大して行く。When the cavity 4 is filled with resin, an injection pressure, that is, a resin pressure higher than the supporting force acts on the movable piece 7, and the movable piece 7 moves backward with respect to the gate 4 by an amount equal to the filling amount to reduce the cavity volume. It increases.
可動片７がキャビティ容積が形成すべき厚肉成形品の
体積に対応する所定の位置に達すると、可動片７はスト
ッパ15によって衝止される。可動片７がストッパ15の位
置に達したことはロッド位置検出装置14によって検出さ
れ、その検出結果は制御装置13に供給される。制御装置
13は、この検出結果に基づいて射出装置11による射出を
所定時間続行させる、すなわち溶融樹脂の充填を成形品
が冷却固化するまで行なう。When the movable piece 7 reaches a predetermined position corresponding to the volume of the thick molded product whose cavity volume is to be formed, the movable piece 7 is stopped by the stopper 15. The fact that the movable piece 7 has reached the position of the stopper 15 is detected by the rod position detecting device 14, and the detection result is supplied to the control device 13. Control device
In step 13, the injection by the injection device 11 is continued for a predetermined time based on the detection result, that is, the filling of the molten resin is performed until the molded article is cooled and solidified.
以上の成形方法によれば、成形に用いられた樹脂が、
DSCの溶融ピークより10℃以上高い温度で、せん断速度1
000sec-1のとき、L/Dが20のダイスを用いて測定したダ
イスウエル比が1.2未満の液晶ポリマーであっても、ジ
ェッティングの発生の抑制により、フローマークの発生
のない厚肉成形品が容易に成形可能となり、また成形品
としてキャビティゲートの断面積より大きな底面積を有
する棒状体、厚肉（5mm以上）の板等をも成形すること
ができる。According to the above molding method, the resin used for molding is
A shear rate of 1 at a temperature higher than the melting peak of DSC by at least 10 ° C.
At 000 sec -1 , even with a liquid crystal polymer having a die-well ratio of less than 1.2 as measured using a die with an L / D of 20, a thick molded product free of flow marks due to suppression of jetting can be produced. It can be easily molded, and a molded product such as a rod-shaped body having a bottom area larger than the cross-sectional area of the cavity gate, a thick (5 mm or more) plate, or the like can be molded.
次に、本発明の第２の実施例を第２図を参照しながら
説明する。Next, a second embodiment of the present invention will be described with reference to FIG.
この実施例では、金型21は、固定型22および可動型23
を有している。固定型22内には、射出装置11からの樹脂
を導入するためのスプール26が設けられている。可動型
23には、パーティング面に、上記スプルー26からの樹脂
を一旦溜める樹脂溜り26a、この樹脂溜り26aに接続され
た、フィルムゲートからなるゲート24、およびこのゲー
ト24を介して樹脂を導入されるキャビティ25が設けられ
ている。なお、その他の構成は上記第１の実施例と同様
ある。このような構成においても上記実施例同様の効果
を得ることができる。In this embodiment, the mold 21 includes a fixed mold 22 and a movable mold 23.
have. A spool 26 for introducing resin from the injection device 11 is provided in the fixed mold 22. Movable type
In the part 23, a resin pool 26a for temporarily storing the resin from the sprue 26 on the parting surface, a gate 24 composed of a film gate connected to the resin pool 26a, and a resin are introduced through the gate 24. A cavity 25 is provided. The other configuration is the same as that of the first embodiment. Even in such a configuration, the same effect as in the above embodiment can be obtained.
なお、上記実施例では、可動片７の材質を金属板とし
たが、本発明はこれに限定されることはなく、例えばセ
ラミック等でもよく、要するに、溶融樹脂の熱により溶
けたり、膨張または変形したりしない材料であればよ
く、合成樹脂等でも可能である。In the above embodiment, the material of the movable piece 7 is a metal plate. However, the present invention is not limited to this. For example, it may be a ceramic or the like. Any material can be used as long as it does not do so, and a synthetic resin or the like can be used.
また、上記実施例では、背圧付与手段をエアーシリン
ダ８およびエアー供給装置12で構成したが、本発明はこ
れに限定されることはなく、例えばスプリング、油圧シ
リンダ、電磁石等でもよく、また、可動片とキャビティ
内面との摺動抵抗を利用してもよく、要するに、溶融樹
脂の樹脂圧に対し抵抗して溶融樹脂の噴出を押えながら
キャビティ容積を増大させるように可動片を樹脂圧で後
退させるものであればよい。Further, in the above embodiment, the back pressure applying means is constituted by the air cylinder 8 and the air supply device 12, but the present invention is not limited to this. For example, a spring, a hydraulic cylinder, an electromagnet or the like may be used. The sliding resistance between the movable piece and the inner surface of the cavity may be used. In short, the movable piece is retracted by the resin pressure so as to increase the cavity volume while resisting the resin pressure of the molten resin and suppressing the ejection of the molten resin. What is necessary is just to make it.
また、停止手段をストッパとしたが、これに限定する
ことはなく、例えばシリンダの圧力を樹脂圧にバランス
させるようにしてもよい。Further, although the stopping means is a stopper, the invention is not limited to this. For example, the cylinder pressure may be balanced with the resin pressure.
さらに、金型１としては、溶融温度の低い樹脂を成形
する場合は樹脂を冷却固化させるための冷却路を内設し
たものを用い、溶融温度の高い樹脂を成形する場合は樹
脂の射出時に金型を加温しておくためのカートリッジヒ
ータを内設したものを用いる。なお、後者の場合の樹脂
の冷却固化は自然冷却により行う。Further, as the mold 1, when molding a resin having a low melting temperature, a mold having a cooling passage for cooling and solidifying the resin is used. A heater having a cartridge heater for heating the mold is used. In the latter case, the resin is cooled and solidified by natural cooling.
次に、上記実施例をさらに具体的に説明する。 Next, the above embodiment will be described more specifically.
実施例１ 第１図の成形装置を用い、DSCの溶融ピークより10℃
以上高い温度で、せん断速度1000sec-1のときL/Dが20の
ダイスを用いて測定したダイスウエル比が1.2未満の樹
脂としてパラヒドロキシ安息香酸、ビフェノール、テレ
フタル酸の三元共重合体である液晶ポリマーのグラスフ
ァイバー40％入りグレードの“ザイダーFC−110"（商品
名、米国アモコパーフオーマンスプロダクツ社製、ダイ
スウエル比0.9）を使用して、直径10mm×長さ100mmの丸
棒をゲート径2.5mmで作製したところ、ジェッテング等
のない丸棒を容易に成形することができた。Example 1 10 ° C. from the melting peak of DSC using the molding apparatus shown in FIG.
At a higher temperature, the liquid crystal is a terpolymer of parahydroxybenzoic acid, biphenol, and terephthalic acid as a resin having a die swell ratio of less than 1.2 when the L / D is measured using a die with a shear rate of 1000 sec -1 and a shear rate of 20. Using "Zyder FC-110" (trade name, manufactured by Amoco Permanence Products of the United States, die swell ratio: 0.9) containing 40% polymer glass fiber, a round bar with a diameter of 10 mm and a length of 100 mm is used for a gate diameter of 2.5. When manufactured in mm, a round bar without jetting or the like could be easily formed.
このとき樹脂温度390℃、金型温度150℃、射出圧力12
00Kgf/cm2、射出速度は中速であった。At this time, resin temperature 390 ° C, mold temperature 150 ° C, injection pressure 12
00Kgf / cm 2 , the injection speed was medium.
また成形した丸棒の曲げ強度さは1270Kgf/cm2であっ
た。The bending strength of the formed round bar was 1270 kgf / cm 2 .
実施例２ 第２図の成形装置を用い、DSCの溶融ピークより10℃
以上高い温度で、せん断速度1000sec-1のときL/Dが20の
ダイスを用いて測定したダイスウエル比が1.2未満の樹
脂としてパラヒドロキシ安息香酸、ビフェノール、テレ
フタル酸の三元共重合体である液晶ポリマーのグラスフ
ァイバー40％入りグレードの“ザイダーFC−110"（商品
名、米国アモコパーフオーマンスプロダクツ社製、ダイ
スウエル比0.9）を使用して、縦100mm×横100mm×厚さ1
0mmの平板を成形したところ、ジェッテング等のない平
板を容易に成形することができた。Example 2 10 ° C. from the melting peak of DSC using the molding apparatus shown in FIG.
At a higher temperature, the liquid crystal is a terpolymer of parahydroxybenzoic acid, biphenol, and terephthalic acid as a resin having a die swell ratio of less than 1.2 when the L / D is measured using a die with a shear rate of 1000 sec -1 and a shear rate of 20. Using "Zyder FC-110" (trade name, manufactured by Amoco Permanence Products, Inc., die-swell ratio of 0.9, U.S.A.) with 40% polymer glass fiber, 100 mm long x 100 mm wide x 1 thick
When a flat plate of 0 mm was formed, a flat plate without jetting or the like could be easily formed.
このとき樹脂温度390℃、金型温度150℃、射出圧力12
00Kgf/cm2、射出速度は中速であった。At this time, resin temperature 390 ° C, mold temperature 150 ° C, injection pressure 12
00Kgf / cm 2 , the injection speed was medium.
比較例１ 第１図の成形装置を用い、部材の位置をゲートから最
も遠いところに設定し、他の条件は上記実施例１と同様
にして、同一樹脂による丸棒の成形を行なった。その結
果、成形品にジェッテングが発生した。このジェッテン
グは金型温度、樹脂温度、射出速度等をどのように調整
してもなくすことができなかった。またこの丸棒の曲げ
強さも950Kgf/cm2にとどまった。Comparative Example 1 Using the molding apparatus shown in FIG. 1, the position of the member was set farthest from the gate, and the other conditions were the same as in Example 1 above, and a round bar was molded with the same resin. As a result, jetting occurred in the molded product. This jetting could not be eliminated no matter how the mold temperature, the resin temperature, the injection speed, etc. were adjusted. The bending strength of this round bar was only 950 kgf / cm 2 .
比較例２ 第２図の金型装置を用い、部材の位置をゲートから最
も遠いところに設定し、他の条件は上記実施例２と同様
にして、同一樹脂による平板の成形を行なった。その結
果、成形品にジェッテングが発生した。このジェッテン
グは金型温度、樹脂温度、射出速度等をどのように調整
してもなくすことができなかった。Comparative Example 2 Using the mold apparatus shown in FIG. 2, the position of the member was set farthest from the gate, and the other conditions were the same as in Example 2 above, and a flat plate was formed using the same resin. As a result, jetting occurred in the molded product. This jetting could not be eliminated no matter how the mold temperature, the resin temperature, the injection speed, etc. were adjusted.
［発明の効果］ 上述のように、本発明によれば、溶融樹脂の噴出が押
さえられることから、ダイスウエル比が1.2未満の小さ
な液晶ポリマーであっても、ジェッティングの発生が抑
制されて、フローマークの発生のない厚肉成形品の成形
が容易に可能となる。[Effects of the Invention] As described above, according to the present invention, since jetting of the molten resin is suppressed, even if the liquid crystal polymer has a small die swell ratio of less than 1.2, the occurrence of jetting is suppressed, and the flow rate is reduced. It is possible to easily form a thick molded product without the occurrence of marks.
第１図は、本発明の厚肉成形品の成形方法の第１実施例
に用いられる成形装置の略示断面図、第２図は、同上の
第２実施例に用いられる成形装置の略示断面図である。 １……金型、４……ゲート ５……キャビティ、７……可動片 ８……背圧付与手段（エアーシリンダ） 11……射出手段（射出装置） 12……背圧付与手段（エアー供給装置） 13……制御手段（制御装置） 15……停止手段（ストッパ） 25……キャビティ、21……金型 24……ゲートFIG. 1 is a schematic sectional view of a molding apparatus used in a first embodiment of the method for molding a thick molded product of the present invention, and FIG. 2 is a schematic diagram of a molding apparatus used in a second embodiment of the same. It is sectional drawing. 1 mold 4 gate 5 cavity 7 movable piece 8 back pressure applying means (air cylinder) 11 injection means (injection device) 12 back pressure applying means (air supply Device) 13 Control means (control device) 15 Stop means (stopper) 25 Cavity 21 Mold 24 Gate
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.6，ＤＢ名) B29C 45/46 - 45/57 B29C 45/76 - 45/77 B29C 45/26 ──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int. Cl. 6 , DB name) B29C 45/46-45/57 B29C 45/76-45/77 B29C 45/26
Claims (1)
動片により、キャビティ容積を任意に可変できる金型を
用いて、ダイスウエル比が1.2未満の液晶ポリマーによ
る樹脂を厚肉成形品を成形するにあたり、予めキャビテ
ィ容積を小さく設定し、樹脂をキャビティ内壁面に沿っ
て順次充填し、その後、そのキャビティに樹脂を密に充
填しつつ上記可動片を樹脂圧により後退させてキャビテ
ィ容積を増大させ、その容積が成形すべき厚肉成形品の
体積に対応したときに、上記可動片を停止して容積の増
大を阻止し、更に充填を樹脂が冷却固化するまで行っ
て、ジェッティングの発生を抑制することによりフロー
マークの発生のない厚肉成形品を成形することを特徴と
する厚肉成形品の成形方法。In forming a thick molded product of a liquid crystal polymer resin having a die swell ratio of less than 1.2 using a mold capable of arbitrarily changing a cavity volume by a movable piece that moves forward and backward with respect to a cavity gate. The cavity volume is set small in advance, and the resin is sequentially filled along the inner wall surface of the cavity. Thereafter, the movable piece is retracted by resin pressure while densely filling the cavity with the resin, thereby increasing the cavity volume. When the volume corresponds to the volume of the thick molded product to be molded, the movable piece is stopped to prevent the volume from increasing, and further filling is performed until the resin is cooled and solidified, thereby suppressing the occurrence of jetting. A method for forming a thick molded product, wherein a thick molded product having no flow mark is formed by the method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27668389A JP2938100B2 (en) | 1989-10-24 | 1989-10-24 | Molding method for thick molded products |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27668389A JP2938100B2 (en) | 1989-10-24 | 1989-10-24 | Molding method for thick molded products |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03138122A JPH03138122A (en) | 1991-06-12 |
| JP2938100B2 true JP2938100B2 (en) | 1999-08-23 |
Family
ID=17572868
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27668389A Expired - Fee Related JP2938100B2 (en) | 1989-10-24 | 1989-10-24 | Molding method for thick molded products |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2938100B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3610748B2 (en) * | 1997-11-14 | 2005-01-19 | 株式会社カネカ | Magnet roll mold |
| FR2812581B1 (en) * | 2000-08-04 | 2003-06-20 | Mecaverin Soc | INJECTION MOLDING MACHINE AND USE OF SUCH A MACHINE |
| CN103085242A (en) * | 2011-10-31 | 2013-05-08 | 上海雷博司电气股份有限公司 | Injection device |
-
1989
- 1989-10-24 JP JP27668389A patent/JP2938100B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03138122A (en) | 1991-06-12 |
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