JP2936531B2 - Placement device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

TECHNICAL FIELD The present invention relates to an arrangement device,
More specifically, the present invention relates to an arrangement apparatus suitable for use in designing a printed circuit board layout.

[0002]

2. Description of the Related Art Conventionally, when designing the layout of a printed circuit board, in order to perform the layout design, component connection information indicating a net as a connection relationship between components based on circuit diagram information and component placement conditions are shown. The design rule information is obtained, and based on the part connection information and the design rule information,
Using an automatic placement device or an interactive placement device, the layout was designed by arranging components by automatic placement or interactive placement in consideration of the outer shape of the printed circuit board.

When arranging such components, the number of nets coming out of each component and the pattern width when wiring a pattern with conductive foils based on the nets are required in order to facilitate the work of the subsequent wiring process. In consideration of the minimum inter-foil value, the intervals between the components are determined and the components are arranged.

[0004]

By the way, among the components arranged on a printed circuit board, a bundled wire (a "bundled wire" is a group of a plurality of nets or wirings connecting a pair of components. It means that they are almost parallel and do not intersect.)
Unlike other components, the memory components that can be connected with each other can be wired even if the interval between the components is small.

For this reason, in a conventional automatic placement apparatus or interactive placement apparatus, information indicating whether or not a component to be placed on a printed circuit board is a memory component is operated at the time of creating a circuit diagram or before placing a component. By manually adding the components and arranging the components while referring to them, when arranging the memory components, the space between the components is narrowed to reduce the arrangement space.

However, in the conventional automatic placement apparatus and the conventional interactive placement apparatus, the operation for inputting information indicating that the operator is a memory component is complicated, and the operability is poor. When there is a lot of information, there is a possibility that an input error occurs.

When a component is placed on a printed circuit board, a bypass capacitor is placed near the memory component in order to prevent heat generation of the memory component. However, such a bypass capacitor is not specified on a circuit diagram. In many cases, the work of manually arranging the bypass capacitors after arranging the components has been performed (see processing procedure A in FIG. 9).

However, if the bypass capacitors are manually placed after the components are placed, there is a problem that the operations are complicated and the operability is inferior, for example, it is necessary to perform operations such as moving the components placed first.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned various problems of the prior art, and a purpose thereof is to allow an operator to input information indicating a memory component. Eliminating the need to collect memory components when arranging the components to form blocks, allowing them to be arranged with a smaller spacing between them, improving operability when arranging memory components. In addition, another object of the present invention is to provide an arrangement device that prevents occurrence of an input error or the like of information indicating a memory component.

It is another object of the present invention to provide an arrangement device in which the bypass capacitors are automatically arranged appropriately when arranging the memory components, thereby improving the operability in arranging the bypass capacitors. Things.

[0011]

In order to achieve the above object, a wiring device according to the present invention is made by paying attention to the point that memory components are connected by bundled wires.

That is, the wiring apparatus according to the present invention includes component shape information storing the shape of each component, component connection information storing a connection relationship between components, and design rule information storing component placement conditions. The arrangement device for arranging the components based on the component connection information has a memory recognizing means for recognizing the bundle from the component connection information and creating a block using the components connected by the bundle as a memory component. The blocks are arranged as a memory component group.

Further, the arrangement apparatus according to the present invention includes component shape information storing the shape of each component, component connection information storing a connection relationship between components, and design rule information storing component placement conditions. In the placement apparatus for placing components based on the component, a bypass capacitor is assigned to a memory component in the component to be placed, and a bypass capacitor assignment / integration means for generating a virtual component integrating the memory component and the bypass capacitor is provided. Then, a virtual component in which the memory component and the bypass capacitor are integrated is arranged.

Further, the placement apparatus according to the present invention includes component shape information storing the shape of each component, component connection information storing a connection relationship between components, and design rule information storing component placement conditions. Based on the arrangement device for arranging the parts, a memory recognizing means for recognizing a bundle from the part connection information and creating a block using the parts connected by the bundle as a memory part, and a block created by the memory recognizing means. A bypass capacitor allocating and integrating means for allocating a bypass capacitor to a component to be configured and generating a virtual component in which the component and the bypass capacitor are integrated, and disposing a virtual component in which the component and the bypass capacitor are integrated; It is like that.

[0015]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of an arrangement according to the present invention;

FIG. 1 is a block diagram showing one embodiment of an arrangement apparatus according to the present invention. This block diagram schematically shows the contents of processing performed by the arrangement device 10.

The placement apparatus 10 is incorporated in a printed circuit board design apparatus as one system constituting a printed circuit board design apparatus, for example, a CAD system supported by a computer, and its operation is controlled by a computer. It is something to be done.

The storage means 12 of the placement apparatus 10 reads placement-related information from the layout design database 14 (the placement-related information is composed of component connection information, component shape information, and design rule information). It is.

Here, the layout design database 14
As described above, the placement-related information read from the storage means 12 into the storage means 12 is composed of the component connection information, the component shape information, and the design rule information. Will be described.

The component connection information is information indicating a connection relationship between components, that is, information indicating a net. Under a signal name (net name) for specifying the net, the component of the component connected by the net is connected. A name and a connection terminal name indicating a terminal serving as a connection terminal of the component are stored.

The part shape information is based on a part name for specifying the part indicated by the information, and arrangement information indicating whether or not the part is arranged, and a block described later is formed by the part. For obtaining the block information indicating whether or not the component is in contact, the overall shape information indicating the overall shape of the component, the terminal information indicating the center coordinates (terminal coordinates) of the terminal of the component, and the coordinate values of the component and the terminal. Reference coordinates serving as references are stored.

The overall shape information and terminal information are configured as follows. That is, overall shape information = constituent point coordinates (x1, y1), (x2, y
2),..., Terminal information = terminal coordinates (TX1, TY1), and the coordinate values of these constituent point coordinates and terminal coordinates are represented by relative values to the coordinate values of the reference coordinates.

The design rule information stores a circuit symbol to be used under the name of a bypass capacitor component for specifying the bypass capacitor, and also stores the total number of bypass capacitors arranged on the printed circuit board.

Then, based on the component connection information and the component shape information read into the storage means 12, the memory recognizing means 16 refers to the flowchart and determines the memory components from the components arranged on the printed circuit board in accordance with the criterion in the processing described later. The determined components are detected, and the detected components are collected to determine whether a block can be formed. If a block can be formed, a process of collecting the components and forming a block is performed.

The blocks thus formed are stored in the component shape information as block information.

The bypass capacitor allocating and integrating means 18 appropriately allocates a bypass capacitor to the block of the component formed by the memory recognizing means 16 on the basis of the component shape information and the design rule information having the block information, and virtually assigns the bypass capacitor. Performs processing to integrate them as parts.

When a bypass capacitor is appropriately allocated to a block of parts and integrated as a virtual part, information indicating the virtual part is added to the part shape information and stored.

Then, based on the component shape information, component connection information and design rule information whose storage contents have been updated in this way, components are arranged on the printed circuit board by the component arranging means 20. The state is displayed on the screen of a display device (not shown) composed of a CRT or the like.

Next, the processing in the arrangement device 10 will be described in detail with reference to the flowcharts shown in FIG.

FIG. 2 shows the main processing of the arrangement apparatus 10.
In this main routine, power is first turned on to start the system (step S202), and data from the layout design database (layout DB) 14 is stored in the storage unit 12, ie, component connection information. The placement related information including the component shape information and the design rule information is read (step S204).

Then, based on the component connection information and the component shape information read into the storage means 12, the memory recognition process shown in the flowchart of FIG. 3 is performed as a subroutine of the main routine (step S20).
6) If a block can be formed, the parts are collected to form a block. At this time, the block formed in step S206 is stored as block information in the component shape information, and a process of updating the storage content of the component shape information is performed.

That is, in step S206, the processing to be realized by the memory recognition means 16 is performed.

When the memory recognition process in step S206 is completed, the main shape is read based on the component shape information (the storage content is updated in step S206) and the design rule information.
As a sub-routine of the routine, the bypass capacitor allocation integration process shown in the flowchart of FIG. 7 is performed (step S208), and a bypass capacitor is appropriately allocated to a block of components and integrated as a virtual component. In step S208, when a bypass capacitor is appropriately allocated to a block of parts and integrated as a virtual part, information indicating the virtual part is added to the part shape information and stored, and the storage content of the part shape information is updated. I do.

That is, in step S208, the processing to be realized by the bypass capacitor allocation integrating means 18 is performed.

When the processing for integrating the bypass capacitors in step S208 is completed, the storing means 12
Based on the component connection information, the component shape information (the storage content has been updated in step S208), and the design rule information, which have been read into the device, the components are arranged on the printed circuit board by a known technique realized by the component placement means 20. Are arranged and displayed on the screen of the display device (step S
210).

When the process of step S210 is completed, the process proceeds to step S212, in which the component shape information whose storage contents have been updated in this main routine is written into the layout design database 14 (step S214), and the storage contents of the layout design database 14 are stored. Update and exit the main routine.

Next, the memory recognition processing shown in the flowchart of FIG. 3 as a subroutine of the main routine will be described in detail with reference to the flowchart of FIG.

In the memory recognition process, first, in step S302, a process of sorting components to be arranged on a printed circuit board using two keys is performed. That is,
Sorting is performed with the first key as the number of terminals and the second key as the component shape.

Upon completion of the process in step S302, the flow advances to step S304 to create a block with a component having the number of terminals equal to or greater than T_MAX as one block. Note that T_M
AX may be a fixed value preset in the system, or may be arbitrarily set by the user.

In step S304, a block is created by setting a component having the number of terminals equal to or greater than T_MAX as one block. In the following processing, only a component having a large number of terminals is to be processed, and a component having a small number of terminals is determined as follows. This is to exclude the processing target. The reason is that the memory component generally has a large number of terminals. In this step S304, only the memory component is selected as a processing target as much as possible to form one block.
It is intended to improve processing efficiency. Therefore, T
It is preferable that the value of _MAX be set to a somewhat large value.

When the process of step S304 is completed, the process proceeds to step S306, where "1" is set to the process variable I, and preparations are made for performing a loop process from step S308 onward from the first component sorted in step S302.

When the process of step S306 is completed, the process proceeds to step S308, where the processing variable I is set to the number of terminals T_M.
It is determined whether the value is smaller than a value obtained by subtracting “1” from the number of components of AX or more.

If the decision result in the step S308 is affirmative (yes)
s), that is, if the processing variable I is smaller than the value obtained by subtracting “1” from the number of components whose number of terminals is equal to or greater than T_MAX, the process proceeds to step S310, and the I-th component is selected as a processing target.

Upon completion of the process in step S310, the process advances to step S312 to set a value obtained by adding "1" to the processing variable I as a processing variable J.

Upon completion of the process in step S312, the flow advances to step S314 to set the processing variable J to the number of terminals T_M
It is determined whether or not the number is smaller than AX.

If the decision result in the step S314 is affirmative, that is, if the processing variable J is smaller than the number of components whose number of terminals is equal to or greater than T_MAX, the process proceeds to a step S316, where the process variable J is set as a processing target to be paired with the I-th component. Select the J-th part.

Upon completion of the process in step S316, the flow advances to step S318 to set the corresponding rate to 50%. Here, the hit rate is a criterion for judging whether or not the I-th part and the J-th part to be processed correspond to the memory parts. Is more likely to be determined.

Upon completion of the process in step S318, the flow advances to step S320 to determine whether or not the number of terminals differs between the I-th component and the J-th component to be processed.

If the result of the determination in step S320 is affirmative, that is, if the number of terminals differs between the I-th component and the J-th component to be processed, the flow advances to step S322 to set the corresponding rate to 60%. That is, in general, when the number of terminals is different between the two components, the number of terminals is often not a memory component, so that the corresponding rate is increased from 50% to 60%.

When the process in step S322 is completed, the flow advances to step S324. Step S32
If the determination result of 0 is negative, that is, if the number of terminals is the same between the I-th component and the J-th component to be processed, the components are often memory components. Jump to step S324 and proceed.

In step S324, it is determined whether or not the component shapes of the I-th component and the J-th component to be processed are different.

If the result of the determination in step S324 is affirmative, that is, if the component shapes of the I-th component and the J-th component to be processed are different, the flow proceeds to step S326, and the corresponding rate is set to 70%. That is, when the component shape is generally different between the two components, the component is often not a memory component, so the corresponding rate is increased from 60% to 70%.

When the process of step S326 is completed, the process proceeds to step S328, where the process for processing the net between the two parts shown in the flowchart of FIG. 4 is performed as a subroutine of the memory recognition process routine. A process is performed to determine whether the target I and J components are memory components, and if it is determined that the I and J components are memory components, Are combined to form one block of parts.

If the result of the determination in step S324 is negative, that is, if the I- and J-th components to be processed have the same component shape, they are often memory components. The process jumps to step S328 without changing the rate, and performs the processing of step S328 described above.

Upon completion of the process in step S328, the process proceeds to step S330, in which the process variable J is incremented by "1", returns to step S314, and repeats the subsequent processes.

If the result of the determination in step S314 is negative (no), that is, if the processing variable J has a value equal to or greater than the number of parts, the process proceeds to step S332, where the processing variable I is incremented by "1". Returning to S308, the subsequent processing is repeated.

If the result of the determination in step S308 is negative, that is, if the processing variable I is equal to or greater than the value obtained by subtracting "1" from the number of parts, this memory recognition process is terminated and the process returns to the main routine. I do.

Next, a subroutine of the memory recognition processing routine shown in the flowchart of FIG.
The processing of the net between the components will be described in detail with reference to the flowchart of FIG.

In the processing of the net between the two parts, first, in step S402, the J to be processed is processed.
The number of terminals of the component is substituted for the processing variable K.

Upon completion of the process in step S402, the flow advances to step S404 to substitute "0" for the processing variable II and the processing variable C.

When the processing of step S404 is completed, the process proceeds to step S406, and it is determined whether or not the processing variable II is smaller than the processing variable K.

If the decision result in the step S406 is affirmative, that is, if the processing variable II is smaller than the processing variable K, the flow advances to a step S408 to search for a signal of the II-th terminal, and there is a terminal of the I-th part. Check whether or not. That is, it is determined whether or not the terminal of the J-th component and the terminal of the I-th component are connected by the net.

When the processing in step S408 is completed, the flow advances to step S410, and the I-th part of the J-th component is
It is determined whether the I-th terminal is connected to only one terminal of the I-th component.

If the decision result in the step S410 is affirmative, that is, if the II-th terminal of the J-th component is connected to only one terminal of the I-th component by the net,
Proceeding to step S412, the arrangement angle of the I-th component is 0
Degrees, 90 degrees, 180 degrees or 270 degrees.

Here, the component arrangement angle is 0 degree or 1 degree.
The case of 80 degrees means that the part is X-shaped as shown in FIG.
It means that the terminal extends in the axial direction and the terminals are also arranged horizontally in the X-axis direction.

Also, the component arrangement angle is 90 degrees or 2 degrees.
The case of 70 degrees means that the component is Y as shown in FIG.
It means that the terminal extends in the axial direction and the terminals are also arranged perpendicular to the Y-axis direction.

Then, the result of the determination in step S412 is
If the arrangement angle of the I-th component is 0 degree or 180 degrees, the process proceeds to step S414, and the X coordinate of the terminal of the I-th component connected to the II-th terminal of the J-th component by the net is calculated as follows. It is stored in a working area (not shown) of the storage means 12 or the like.

On the other hand, the result of the determination in step S 412 is
If the arrangement angle of the I-th component is 90 degrees or 270 degrees, the process proceeds to step S416, where J is set by the net.
The Y coordinate of the terminal of the I-th component connected to the II-th terminal of the second component is stored in a working area of the storage unit 12 or the like.

When the processing in step S414 or S416 is completed, the flow advances to step S418, and the processing variable C is incremented by "1". Therefore,
The processing variable C indicates the number of terminals to which the terminal and the net with the I-th component are connected among the terminals of the J-th component.

Upon completion of the process in step S418, the process proceeds to step S420, II is incremented by "1", the process returns to step S406, and the subsequent processes are repeated.

If the result of the determination in step S410 is negative, that is, if the II-th terminal of the J-th component is not connected to the terminal of the I-th component by the net, Is connected to a plurality of terminals of the I-th component (generally, when the II-th terminal of the J-th component is connected to a plurality of terminals of the I-th component, the terminal is not a memory component). In many cases, the process jumps to step S420 without performing the process of incrementing the processing variable C representing the number of nets connecting the J-th component and the I-th component. Do.

If the result of the determination in step S406 is negative, that is, if the processing variable II is equal to or greater than K, the flow advances to step S422 to calculate "C / K × 100 <applicable rate".

That is, a process of comparing the ratio of the terminal connected to the I-th component among the terminals of the J-th component with the corresponding ratio is performed.

If the result of the determination in step S422 is affirmative, that is, if “C / K × 100” is less than the applicable rate, it is determined that the I-th component and the J-th component are not memory components, The processing returns to the memory recognition processing routine without performing the subsequent processing.

On the other hand, if the decision result in the step S422 is negative, that is, if “C / K × 100” is equal to or more than the applicable rate, the process proceeds to a step S424.

In step S424, step S4
14 or the difference between the coordinate values stored in step S416 is set to a predetermined value ε (ε may be set to an appropriate value in advance, or the operator may set an arbitrary value. You can count:
The processing variable C is updated with the count value. That is, here, a process of counting the number of bundled wires in the net connecting the I-th component and the J-th component is performed.

Specifically, for example, as shown in FIG.
It is assumed that the terminal of component 1 and the terminal of component 2 are connected by a net. Then, the X coordinate of the part 1 (0.4)
Are connected to the X coordinate (0.5) terminal of the component 2 by a net, and the X coordinate (0.5) terminal of the component 1 and the X coordinate (0.6) terminal of the component 2 are connected to the net. The terminal of the component 1 at the X coordinate (0.6) and the terminal of the component 2 at the X coordinate (0.7) are connected by a net, and the terminal of the component 1 at the X coordinate (0.7) is connected to the component. It is assumed that the terminal of the X coordinate (0.8) of No. 2 is connected to the net.

The difference between the coordinates of the terminal of the component 1 and the terminal of the component 2 connected by the net as described above is counted as a bundle when the difference is ε.

As the procedure, the coordinate values of the component 1 are set to relative coordinates based on the minimum value of the component 1. Next, the coordinate values of the component 2 are set to relative coordinates based on the minimum value of the component 2. Then, when the difference between the corresponding relative coordinates connected by the net is equal to or smaller than ε, it is counted as matching the bundle standard.

Therefore, in the example shown in FIG. 6, if “ε = 0.2”, for example, the terminal of the component 1 and the component 2
The net connecting to the terminal is determined to be a bundle,
If “ε = 0.01”, it is determined that the net connecting the terminal of the component 1 and the terminal of the component 2 is not a bundle.

When the processing in step S424 is completed, the flow advances to step S426 to perform an operation of “C / K × 100 <applicable rate”.

That is, a process of comparing the ratio of the number of terminals to which the net determined to be the bundled wire is connected to the number of terminals of the J-th component with the corresponding ratio is performed.

If the result of the determination in step S426 is affirmative, that is, if “C / K × 100” is less than the applicable rate, it is determined that the I-th component and the J-th component are not memory components, The processing returns to the memory recognition processing routine without performing the subsequent processing.

On the other hand, if the result of the determination in step S426 is negative, that is, if “C / K × 100” is equal to or greater than the applicable rate, it is determined that the I-th component and the J-th component are memory components. Then, the process proceeds to step S428.

In step S428, the part of the block to which the J-th part belongs is moved to the block of the I-th part to form a block of the part that satisfies the criteria for determining that it is a memory part. Return to routine.

By performing the above-described processing, among the components arranged on the printed circuit board, the criterion in the memory recognition processing is cleared, and the component determined as the memory component is placed on the printed circuit board. It is possible to combine them into one block.

Next, the main processing is performed using the block of parts obtained in the above-described memory recognition processing.
As a subroutine of the routine, the process of integrating the bypass capacitor allocation shown in the flowchart of FIG. 7 will be described in detail with reference to the flowchart of FIG.

First, in the bypass capacitor allocation integration processing routine, in step S702, the first block formed in step S428 is read out as a processing target.

When the processing in step S702 is completed, the flow advances to step S704 to determine whether there is a next block.

If the decision result in the step S704 is negative, that is, if the next block exists, the step S70
Then, the process proceeds to step S6, where it is determined whether the components constituting the block to be processed are memory components. This is the storage means 12
The determination is made with reference to the component shape information stored in.

If the result of the determination in step S706 is affirmative, that is, if the component constituting the block to be processed is a memory component, the process proceeds to step S708, where the processing variable C
The calculation result of “the number of components constituting the block to be processed / the number of bypass capacitors” is substituted into the subroutine. Here, the number of bypass capacitors is obtained from the design rule information stored in the storage unit 12, and indicates the total number of bypass capacitors arranged on the printed circuit board.

Therefore, by arranging the bypass capacitors every C components of the block, the bypass capacitors can be evenly arranged between the components of the block.

When the processing in step S708 is completed, the flow advances to step S710 to read out the first component constituting the block as a processing target.

When the processing in step S710 is completed, the flow advances to step S712 to determine whether there is a next part.

If the result of the determination in step S712 is negative, that is, if the next part exists, the flow advances to step S714 to integrate the bypass capacitor and the part as virtual parts.

That is, as shown in FIG.
When 1) is a processing target, the component (IC01) and the bypass capacitor (C01) are integrated as one component to form a virtual component, and component shape information of the virtual component is generated.

When the processing in step S714 is completed, the flow advances to step S716 to read out the C-th order component as a processing target, and returns to step S712 to repeat the processing.

If the result of the determination in step S712 is negative, that is, if there is no component next to the component to be processed, the flow advances to step S718 to read the next block as the processing target, and returns to step S704. And repeat the process.

If the result of the determination in step S706 is negative, that is, if the block to be processed is not a block of a memory component, the flow advances to step S718 to read the next block as a processing target, and returns to step S704 to process. repeat.

If the result of the determination in step S704 is negative, that is, if there is no block next to the block to be processed, the process of integrating the bypass capacitors is terminated, and the process returns to the main routine. ,
The arrangement processing in step S210 is performed.

Therefore, in the processing of this arrangement, the arrangement of the virtual component in which the bypass capacitor and the part are integrated is performed.

As described above with reference to FIG. 8, the component shape information of the virtual component in which the memory component and the bypass capacitor are integrated is generated, and the placement is performed using the virtual component.

Therefore, since the memory component and the bypass capacitor are treated as a virtual component as a set, according to the automatic wiring apparatus in the embodiment of the present invention, as shown in the processing procedure B of FIG. Bypass capacitors can be automatically arranged at the same time, and when the present invention is used in an interactive wiring device, as shown in processing procedure C in FIG. 9, memory components and bypass capacitors are arranged in pairs. be able to.

In the above description, the corresponding rate is 5
Although the ratio is changed from 0% to 60% to 70%, it is needless to say that the corresponding rate is not limited to this, and an arbitrary value may be set. Further, the corresponding rate may not be changed and may be a constant value.

[0105]

Since the present invention is configured as described above, it has the following excellent effects.

That is, even if the operator does not input information indicating that the component is a memory component, it is possible to form a block by collecting the memory components and arrange the components with a narrower interval between components when arranging the components. Therefore, the operability at the time of arranging the memory components is improved, and it is possible to prevent the occurrence of an error in inputting information indicating the memory components.

Further, since the bypass capacitors can be automatically arranged as needed when arranging the memory components, the operability in arranging the bypass capacitors is improved.

[Brief description of the drawings]

FIG. 1 is a block diagram showing an embodiment of an arrangement device according to the present invention.

FIG. 2 is a flowchart showing a main routine.

FIG. 3 is a flowchart illustrating a memory recognition processing routine;

FIG. 4 is a flowchart showing a routine for processing a net between two parts.

FIGS. 5A and 5B are explanatory diagrams showing component arrangement angles. FIG. 5A shows a component arrangement angle of 0 degrees or 180 degrees, and FIG. 5B shows a component arrangement angle of 90 degrees or 270 degrees.

FIG. 6 is an explanatory diagram for explaining a bundle determination process;

FIG. 7 is a flowchart illustrating a routine of a process of integrating the bypass capacitor allocation.

FIG. 8 is an explanatory diagram illustrating formation of a virtual component.

FIG. 9 is an explanatory diagram showing a procedure of disposing a bypass capacitor. Processing procedure A shows a processing procedure according to a conventional technique.
Processing procedure B and processing procedure C show the processing procedure according to the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Automatic arrangement apparatus 12 Storage means 14 Layout design database 16 Memory recognition means 18 Bypass capacitor allocation integration means 20 Parts arrangement means

Claims (5)

(57) [Claims] 1. Based on component shape information storing the shape of each component, component connection information storing a connection relationship between components, and design rule information storing component placement conditions.
In the placement apparatus for arranging parts, there is provided a memory recognizing means for recognizing a bundle from the part connection information and creating a block using the parts connected by the bundle as a memory part. An arrangement device characterized by being arranged as a memory component group. 2. Based on component shape information storing the shape of each component, component connection information storing a connection relationship between components, and design rule information storing component placement conditions.
A placement apparatus for placing parts, comprising: a bypass capacitor allocating unit for allocating a bypass capacitor to a memory part among the parts to be placed and generating a virtual part integrating the memory part and the bypass capacitor; An arrangement device for arranging a virtual component in which a component and a bypass capacitor are integrated. 3. Based on component shape information storing the shape of each component, component connection information storing a connection relationship between components, and design rule information storing component placement conditions.
In the placement device for arranging parts, a memory recognizing means for recognizing a bundle from the part connection information and creating a block using the parts connected by the bundle as a memory part, and a block created by the memory recognizing means. Means for allocating a bypass capacitor to the component and generating a virtual component in which the component and the bypass capacitor are integrated, and allocating a virtual component in which the component and the bypass capacitor are integrated. Characteristic arrangement device. 4. Based on component shape information storing the shape of each component, component connection information storing a connection relationship between components, and design rule information storing component placement conditions.
In the placement device that places components, it is determined that the number of terminals of the pair to be processed is not different from the component shape information, and the component shape of the pair to be processed is different from the component shape information. And a memory recognition unit for recognizing a bundle from the component connection information and creating a block with the components connected by the bundle as a memory component, for the pair of components to be processed determined not to be present. An arrangement device for arranging blocks created by the above as a memory component group. 5. Based on component shape information storing the shape of each component, component connection information storing a connection relationship between components, and design rule information storing component placement conditions.
A memory recognizing means for recognizing a bundle from component connection information and creating a block using the components connected by the bundle as a memory component in a placement device for arranging components. A first process of determining whether or not the number of terminals of the component is different; a second process of determining whether or not the component shape of a pair to be processed is different from the component shape information; In the process, it is determined from the component shape information that the number of terminals of the component to be processed is not different,
In the second processing, among the parts to be processed, which are determined not to have different component shapes from the part shape information based on the part shape information, of the paired parts based on the component connection information, Regarding a pair of components determined that the terminal is connected to the terminal of the other component in a one-to-one relationship,
Recognize the bundle from the difference in coordinate value between the terminal of one connected part and the terminal of the other connected part meets the bundle standard, and block the part connected by the bundle as a memory part. And a memory recognizing means for performing a process of generating the memory component, and arranging the blocks generated by the memory recognizing means as a memory component group.