JP2922072B2 - Transparent switch - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a transparent switch, and more particularly, to a sealing structure for two electrode substrates .

[0002]

2. Description of the Related Art FIGS. 3 to 5 show an example of a conventionally proposed transparent switch. 3 is a plan view of a transparent switch according to a conventional example, FIG. 4 is an enlarged plan view of a main part of a transfer forming unit, and FIG. 5 is a cross-sectional view taken along line BB of FIG. As shown in these figures, the transparent switch of the present example has an upper transparent electrode 1
The upper electrode substrate 2 on which the pattern is formed and the lower electrode substrate 4 on which the lower transparent electrode 3 is formed are arranged to face each other with the transparent electrodes 1 and 3 inside and the dot spacers 5 therebetween. The upper transparent electrode 1 and the lower transparent electrode 3 are electrically connected via a transfer 6, and a conductive lead 7 drawn from each of the transparent electrodes 1, 3 is exposed at one end of the lower electrode substrate 4. An electrode terminal 8 is formed by laminating a silver layer (not shown) on the exposed portion and in the vicinity thereof.

The upper electrode substrate 2 and the lower electrode substrate 4
Are bonded together with a sealing material and are integrally assembled. The seal pattern 9 for bonding the outer peripheral portions of the upper and lower electrode substrates 2 and 4 adheres the two electrode substrates 2 and 4 at a fixed interval regulated by the dot spacer 5. A vent hole 10 is partially opened. On the other hand, the seal pattern 11 for bonding the peripheral portion of the transfer 6 causes peeling or cracking of the transfer 6,
As a result, it is provided to prevent poor contact between the transparent electrodes 1 and 3, and as shown in FIGS. 3 and 4,
A vent hole 11a is opened in a part thereof. Since the upper transparent electrode 1 and the lower transparent electrode 3 are formed sufficiently wider than the size of the transfer 6, the ring-shaped sealing material 11 is formed on the transparent electrodes 1 and 3.

[0004] Generally, the upper electrode substrate 2 and the lower electrode substrate 4 are formed of glass plates, the upper transparent electrode 1 and the lower transparent electrode 3 are formed of indium oxide (ITO), and the sealing material 10, Reference numeral 11 is formed of a thermosetting resin such as an epoxy resin.

[0005]

As described above, in the conventional transparent switch, the sealing material 11 for bonding the periphery of the transfer 6 is formed on the transparent electrodes 1 and 3. However, compared to the adhesion between the transparent electrodes 1 and 3 made of ITO and the electrode substrates 2 and 4 made of glass, the adhesion between the transparent electrodes 1 and 3 made of ITO and the sealing material 11 made of a thermosetting resin is smaller. Due to the low temperature, the sealing material 11 made of thermosetting resin is easily peeled off from the transparent electrodes 1 and 3 made of ITO due to uneven heat conduction and subtle uneven curing pressure in the thermosetting process of the sealant 11. There is a disadvantage that the protection effect of the transfer 6 cannot be sufficiently exhibited. Therefore, in order to solve such inconvenience, it is necessary to improve the bonding strength of the sealing material 11 for bonding the periphery of the transfer 6.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a transparent switch which is less likely to cause peeling or disconnection of a transfer and has excellent durability and reliability. is there.

[0007]

According to the present invention, in order to achieve the above object, two electrode substrates are arranged to face each other with a transparent electrode inside, and the transparent electrodes of each electrode substrate are connected to each other via a transfer. co When electrically connected, the transparent switch formed by adhering the peripheral portion of the two electrode substrates in the sealant, the bets around the transfer forming section
Seal pattern having a vent communicating with a transfer forming part
And forming a part of the seal pattern with the transparent electrode.
It adhered to the said electrode substrate through the notch formed in the pole .

[0008]

The adhesion between the electrode substrate made of glass and the sealing material made of thermosetting resin is much larger than the adhesion between the transparent electrode made of ITO and the sealing material made of thermosetting resin. Therefore, when the electrode substrate is exposed by cutting out a part of the transparent electrode, and the exposed electrode substrates are directly bonded to each other via the sealing material, the transparent electrodes formed on the electrode substrate are bonded to each other via the sealing material. A remarkably high adhesion can be obtained as compared with the case, and the electrode substrate is not easily peeled off even when an improper external force due to uneven heat conduction or curing pressure acts upon curing of the sealing material. Therefore, peeling or disconnection of the transfer is prevented, and a transparent switch with high durability and reliability is obtained.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the transparent switch according to the present invention will be described below with reference to FIGS. FIG. 1 is a plan view of a main part of a transparent switch according to the present invention, and FIG. 2 is a sectional view taken along line AA of FIG. In these figures, reference numeral 21 denotes a notch formed in the transparent electrode, and other portions corresponding to those shown in FIGS. 3 to 5 are denoted by the same reference numerals.

The notch 21 is, as shown in FIGS.
The transparent electrodes 1 and 3 are formed around the transfer 6 forming portion so as to expose the electrode substrates 2 and 4. The shape and size of the notch 21 can be arbitrarily set within a range that does not affect the resistance values of the transparent electrodes 1 and 3. In the example of FIGS. 1 and 2, two small hole-shaped notches 21 are formed at symmetrical positions via the transfer 6. The transparent electrodes are generally formed by patterning a transparent conductor such as ITO on one side of the electrode substrate by screen printing or the like, and the transparent electrodes 1 and 3 having the cutouts 21 are also provided on the screen with desired shapes. By forming an electrode pattern having a notch, it can be formed by a method similar to the conventional method.
The transfer 6 can be formed by screen printing or the like of a thermosetting resin such as a phenol resin or an epoxy resin to which 50 to 80% of a conductive powder such as silver, copper, nickel, or carbon is applied.

At least a part of the seal pattern 11 for bonding the peripheral portion of the transfer 6 is formed by the notch 21.
Is formed. The shape can be arbitrarily selected. However, in order to prevent air from being sealed in the seal pattern 11, it is preferable to provide a ventilation hole in at least a part thereof. In the example of FIGS. 1 and 2, the seal pattern 11 is formed in a ring shape passing over the notch 21, and two vent holes 11 a are opened at a portion orthogonal to the arrangement direction of the two notches 21. The seal pattern 11 can also be formed by screen-printing a thermosetting resin such as a phenol resin or an epoxy resin.

The transparent switch of the above embodiment has an electrode substrate 2 on a portion where the seal pattern 11 of the upper and lower transparent electrodes 1 and 3 is formed.
A notch 21 exposing the electrode substrate 2 is formed.
Since the four members are directly bonded to each other via the sealing material, a remarkably higher adhesive force can be obtained as compared with the case where the transparent electrodes 1 and 3 formed on the electrode substrates 2 and 4 are bonded to each other. Therefore, even if there is non-uniformity of heat conduction or subtle non-uniformity of the curing pressure in the thermosetting process of the sealant 11, the electrode substrates 2 and 4 are not easily separated, and the transfer 6 is prevented from being separated or disconnected. It becomes a transparent switch with high durability and reliability. Further, since the ventilation holes 10 and 11a are opened in the seal patterns 9 and 11, the transparent switches are hardly affected by changes in air temperature and atmospheric pressure, and in this respect, a highly durable and highly reliable transparent switch can be obtained. In the transparent switch of the above embodiment, the notch 21
1, the protection effect of the transfer 6 can be improved without affecting the resistance values of the transparent electrodes 1 and 3.

The present invention is characterized in that the periphery of the transfer 6 forming portion of the transparent electrodes 1 and 3 is partially cut out, and the exposed electrode substrates 2 and 4 are bonded together with a sealing material. It goes without saying that the shape, material, forming method of each part of the panel, and the shape and dimensions of the notch 21 and the seal pattern 11 can be arbitrarily designed irrespective of the above embodiment.

[0014]

As described above, according to the present invention,
A seal pattern was formed around the transfer forming part
Therefore, external forces acting on the transfer can be reduced.
Between the transparent electrodes due to transfer separation or cracking
Poor contact can be prevented. Also, seal putter
Part of the electrode substrate through the notch formed in the transparent electrode
To the seal pattern on the transparent electrode.
The adhesion strength of the electrode substrate is higher than
Separation and disconnection of the sufa are more effectively prevented,
The durability and reliability of the transparent switch are improved. Further
Since a ventilation hole was formed in the seal pattern,
Can prevent air from being sealed inside the
Because it is less susceptible to change,
The durability and reliability of the transparent switch are improved.

[Brief description of the drawings]

FIG. 1 is an enlarged plan view of a transfer forming portion of a transparent switch according to an embodiment.

FIG. 2 is a sectional view taken along line AA of FIG.

FIG. 3 is a plan view of a transparent switch according to a conventional example.

FIG. 4 is an enlarged plan view of a transfer forming portion of a transparent switch according to a conventional example.

FIG. 5 is a sectional view taken along line BB of FIG. 4;

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 upper transparent electrode 2 upper electrode substrate 3 lower transparent electrode 4 lower electrode substrate 6 transfer 9 seal pattern for bonding the outer peripheral portion of electrode substrate 11 seal pattern for bonding the periphery of transfer 11 a ventilation hole 21 notch

Claims (1)

(57) [Claims] [Claim 1] A two electrode substrates disposed opposite to the transparent electrodes on the inside, the transparent electrodes to each other of each electrode substrate co the electrical connection through the transfer, the outer periphery of the two electrode substrates In a transparent switch in which a portion is adhered with a sealing material, the transparent switch is formed around the transfer forming portion.
Seal pattern having a vent communicating with a transfer forming part
And forming a part of the seal pattern with the transparent electrode.
A transparent switch adhered to the electrode substrate via a notch formed in a pole .