JP2900945B2 - Atomic probe microscope and cantilever unit used therein - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a cantilever unit used for an atomic probe microscope or the like.

"Conventional technology" Scanning Tunneling Micro (STM)
scope) since the invention of STM by Binning and Rohrer et al. (G. Binning, H. Rohrer and E. Weibel: Surface Stud
ies by Scanning Tunneling Microscope.Phys.Rev.Let
t., 49 (1982) 57), and its use as a microscope capable of observing surface irregularities on the order of atoms has been promoted in various fields.

As a typical STM configuration, for example, has a probe and a mechanism to scan the probe in the XY direction, while detecting the tunnel current flowing between the probe and the sample while scanning the probe in the XY direction,
One that obtains a two-dimensional image of a sample has been proposed.

However, STM detects tunnel current,
Observable samples were limited to conductive samples, and insulating samples could not be observed.

On the other hand, an atomic force microscope (AFM; Atom) is a microscope that can observe insulating samples with atomic order accuracy.
ic Force Microscope) has been proposed (Japanese Patent Laid-Open No. 62-1).
30302: IBM, G. Vinich, Method and apparatus for imaging a sample surface). FIG. 10 shows an example of the AFM described in the patent specification. The structure of AFM is similar to STM. When a cantilever having a sharp protruding portion (first probe) at the tip is opposed to and close to the sample, an interaction acts between atoms at the tip of the probe and sample atoms. At this time, if the positional relationship between the two is relatively changed by scanning the probe in the XY direction, the cantilever is displaced according to the unevenness of the sample. By measuring the displacement of the cantilever using an STM mechanism with a second probe located on the opposite side of the sample with respect to the cantilever, indirect measurement of insulating samples that could not be measured by STM be able to.

Further, TRAlbrecht et al. Report a cantilever for AFM (micro cantilever) fabricated using anisotropic etching of silicon (TRAlbrecht).
CFQuate: Atomic resolution Imaging of a nonconduc
tor by atomic force microscopy.J.Appl.Pys, 62 (198
7) 2599). Since the microcantilever uses a semiconductor IC fabrication process for its fabrication, it has a feature that it can be a highly accurate cantilever with a high precision of μm. However, in an atomic probe microscope such as STM or AFM, the sample is very close to the probe, and the probe may be deformed due to contact between the sample and the probe, or the probe may be held. The inconvenience that the cantilever is broken may occur. Therefore, it is fundamental to use the device while exchanging the probe. At that time, in order to obtain data with good reproducibility, it is important that the probe tips to be replaced have the same shape.

Furthermore, the accuracy of the data measured by AFM is not only the accuracy of the cantilever itself, but also the accuracy of the cantilever.
It is also affected by how accurate it can be attached to a cantilever displacement measuring system such as a probe. For example, when the cantilever is displaced by the force acting between the probe at the tip of the cantilever and the sample, the displacement of the cantilever is detected by positioning the second probe at the tip of the cantilever (the side opposite to the sample), When the second probe is positioned at the center (the fixed end side of the cantilever) to capture the displacement of the cantilever, the latter is measured with the cantilever displacement reduced to about half. For this reason, considering that the AFM cantilever is used on the premise of replacement, the S / N of an image taken by the AFM is determined by how reproducibly the new cantilever can be attached to the original position.

[Problem to be Solved by the Invention] The above-described conventional technology has the following disadvantages.

The fact that the cantilever is easily replaced and its positioning accuracy is high is a common requirement for many other devices, and determines the usability of the device.

However, no particular proposal has been made for such means.

The present invention has been made in view of such circumstances,
It is an object of the present invention to provide an atomic probe microscope capable of positioning a replaced cantilever with high accuracy and a cantilever unit used for the same. It is preferable that the cantilever can be easily replaced.

"Means for Solving the Problems" In order to solve the above problems, an atomic probe microscope according to a first aspect of the present invention is an atomic probe microscope for detecting a physical quantity generated between a sample and a probe section. A cantilever having a lever portion and a first positioning portion having the probe portion, a lever pedestal having a second positioning portion, and an optical displacement measurement system for optically measuring the displacement of the cantilever based on the physical quantity. Wherein the cantilever is positioned on the lever pedestal when the first positioning portion and the second positioning portion are in contact with each other.

An atomic probe microscope according to a second aspect of the present invention is an atomic probe microscope for detecting a physical quantity generated between a sample and a probe, wherein a lever portion including the probe and a first positioning portion are provided. A cantilever having a, a lever pedestal having a second positioning portion, and a modulating means for vibrating the cantilever, wherein the first positioning portion and the second positioning portion contact each other, A cantilever is positioned on the lever base.

An atomic probe microscope according to a third aspect of the present invention is an atomic probe microscope for detecting a physical quantity generated between a sample and a probe, wherein the lever includes the probe and the convex for positioning. A cantilever having a cantilever and a lever pedestal having a convex portion for positioning, the cantilever is positioned on the lever pedestal by contacting the concave portion and the convex portion, and the cantilever unit Is detachable from the atomic probe microscope main body.

An atomic probe microscope according to a fourth aspect of the present invention is an atomic probe microscope for detecting a physical quantity generated between a sample and a probe, wherein a lever portion including the probe and a convex for positioning are provided. A cantilever having a cantilever and a lever pedestal having a positioning concave portion, and the cantilever is positioned on the lever pedestal when the convex portion and the concave portion are in contact with each other, and the cantilever unit is It is characterized by being detachable from the atomic probe microscope main body.

An atomic probe microscope according to a fifth aspect of the present invention is an atomic probe microscope for detecting a physical quantity generated between a sample and a probe, wherein a lever portion including the probe and a first positioning portion are provided. And a lever pedestal having a second positioning portion, and an optical displacement measuring system for optically measuring the displacement of the cantilever based on the physical quantity, wherein the first positioning portion and the second The cantilever is positioned on the lever base by facing the positioning portion.

An atomic probe microscope according to a sixth aspect of the present invention is an atomic probe microscope for detecting a physical quantity generated between a sample and a probe, wherein the lever includes the probe and the first positioning unit. A cantilever having a, a lever pedestal having a second positioning portion, and a modulation means for vibrating the cantilever, by making the first positioning portion and the second positioning portion face each other, The cantilever is positioned on the lever base.

Further, the cantilever unit of the present invention includes a cantilever having a lever portion having a probe portion, a lever pedestal supporting the cantilever, and a chip pedestal supporting the lever pedestal, wherein the lever pedestal and the chip pedestal are Each has a positioning part, and when these positioning parts contact each other, the lever pedestal is positioned on the chip pedestal.

[Operation] By taking the above-described means, in the first and second aspects of the present invention, the cantilever is attached to the lever pedestal by the first positioning portion and the second positioning portion being in contact with each other.

In the third and fourth aspects of the present invention, the cantilever is attached to the lever pedestal by the contact between the concave portion and the convex portion. In addition, the cantilever unit consisting of the cantilever and the lever base is attached to and detached from the microscope body,
Replace the cantilever.

In the fifth and sixth aspects of the present invention, the cantilever is attached to the lever pedestal by causing the first positioning portion and the second positioning portion to face each other.

According to the seventh aspect of the present invention, the positioning portions provided on the lever pedestal and the chip pedestal are in contact with each other,
A lever pedestal supporting the cantilever is attached to the chip pedestal.

Hereinafter, embodiments of the present invention will be specifically described with reference to the accompanying drawings.

FIG. 1 is a configuration diagram of an AFM equipped with a microcantilever according to an embodiment of the present invention. This AFM has a modulation piezoelectric element 104 and a microcantilever attached to the tip of a cantilever-side support arm 102 which is a part of an AFM mirror 101, and operates a tube scanner 114 capable of minute displacement in the XYZ directions. Sample 1 mounted on it
Scan 12 The movement of the microcantilever that is displaced in accordance with the unevenness of the sample is captured by an optical displacement measurement system including the optical fiber 113, and data processing is performed. Then, it is possible to output and display topographical information reflecting the uneven image of the sample on a CRT in the form of a bird's-eye view or the like. In the figure, an optical displacement measurement system other than the optical fiber 113, the drive circuit of the tube scanner 114 and the piezoelectric element for microcantilever modulation, and the unevenness image of the sample are composed of the displacement of the microcantilever and the operation of the tube scanner. A processing device for performing the processing is omitted.
In addition, the size of each part of the apparatus is drawn by changing the enlargement / reduction ratio for the sake of explanation.

In the prior art, if a microcantilever made by finely processing a silicon wafer is used, the silicon wafer itself may be broken because it is very thin, and cannot be screwed. Therefore, the micro-cantilever is pressed down by the use of an adhesive or the like and the leaf spring pressure using a leaf spring, and the micro-cantilever is directly attached to the cantilever support arm or the like.

In the embodiment of the present invention, first, the micro cantilever 11
1 is bonded to the lever pedestal 109, and the lever pedestal 109 is screwed to the chip pedestal 108 using a screw 110. As a result,
Replacement of the microcantilever can be simplified.

FIG. 2 is a view showing a micro cantilever according to the first embodiment of the present invention, and FIG. 3 is a view showing a state where the micro cantilever is mounted on a lever base. As shown in FIG. 3, the micro cantilever 111 is attached to the lever pedestal 109 to form one chip, and is attached to a chip pedestal (for example, reference numeral 108 in FIG. 1) by using a hole 303 formed in the lever pedestal. Has become.

Another object of the present invention is to provide a mechanism capable of attaching the microcantilever to the original position with good reproducibility even after replacement. For this reason, when the replacement of the microcantilever is simplified by using the lever pedestal as described above, the positional relationship between the microcantilever and the lever pedestal, and the positional relationship between the lever pedestal and the chip pedestal, are each accurately determined. That is a challenge. For this reason, in the present invention, the mounting accuracy of the microcantilever is ensured by utilizing a silicon microfabrication process such as anisotropic etching used when producing the microcantilever. That is, high alignment accuracy is ensured by introducing extremely high manufacturing accuracy achieved by lithography technology to the lever mounting portion of the microcantilever.

The microcantilever according to the first embodiment of the present invention shown in FIG. 2 has the surfaces 204, 205 and 206 simultaneously exposed in a photolithographic exposure process when manufacturing the tip 202 of the cantilever, The surfaces formed later by etching, and the positional relationship between these surfaces and the microcantilever 111 achieves an extremely high level of accuracy in photolithography. When such a micro cantilever is attached to the lever pedestal 109 shown in FIG. 3, a contact surface 304 of the micro cantilever is created on the lever pedestal 109, and a ridge formed by the surface 204 and the surface 211 is applied. If glued, the contact surface on the lever pedestal side
The position of the tip 202 of the cantilever with respect to 304 can be determined with extremely high accuracy.

Further, in order to accurately attach the lever pedestal thus manufactured to the chip pedestal, in FIG. 1, a contact surface 117 is similarly formed on the chip pedestal side, and the lever pedestal 1
After attaching 09, the lever pedestal is fixed with the screw 110. In this way, the contact surfaces 304 and 305 in FIG.
Is accurately determined, the relationship between the tip of the microcantilever and the contact surface 117 of the chip pedestal is always constant, and positioning can be performed with extremely high accuracy. In addition, since a very simple process of applying is sufficient, bonding of the micro cantilever and the lever pedestal or screwing of the chip pedestal of the lever pedestal can be performed extremely easily.

FIGS. 5 and 6 show another example of a micro cantilever having a contact surface also manufactured by etching as the second and third embodiments. If the silicon wafer to be used has a (100) surface and wet anisotropic etching with KOH, etc.,
As shown in the front view and side view of FIG. 2, the etching proceeds at an angle of about 54 degrees so that the (111) plane comes out. In FIGS. In some cases, details are omitted. In the following, the ridge of the contact portion is referred to as a contact surface or a contact portion.

The micro cantilever shown in FIG. 5 is a further improvement in that the horizontal positioning accuracy of the micro cantilever in the example of FIG. 3 is inferior to the vertical positioning accuracy. As shown, the contact surface 50
3, 504 and 505 are manufactured. Then, by aligning the respective contact surfaces, lateral displacement is eliminated, and high mounting accuracy of the micro cantilever is realized. In this case, since the surfaces 503 to 505 cannot be manufactured using a dicing saw or the like, they are manufactured by anisotropic etching of a silicon wafer. Assuming that the plane direction of the silicon wafer to be used is (100), those planes are manufactured by utilizing the difference in etching rate between the (111) plane direction and other directions. In the microcantilever of FIG. 2, the two corners of 212 and 213 were etched so as not to be a right angle, and the positioning accuracy in the lateral direction was inferior. In this manner, grooves were formed so as to go inside the chip. When fabricated, such etching in other directions can be neglected, and a particularly accurate contact surface can be formed.

The example of FIG. 6 is an example in which the size of the microcantilever 111 is reduced by setting the contact surfaces to two surfaces 603 and 604. If the size of the microcantilever is reduced, more microcantilevers can be taken out from a silicon wafer of the same size, and the cost of the microcantilever can be reduced. Also, if the micro cantilever can be made smaller, it becomes possible to make each part of the AFM device related to its mounting smaller. Then, for example, in FIG.
When the cantilever is oscillated with the piezoelectric element 104 for modulation, as in an AFM device, and the cantilever is vibrated for measurement, the weight of the vibrating part is reduced. It is highly preferred for the device described above.

FIG. 7 shows a fiber according to a fourth embodiment of the present invention.
A method for achieving high positioning accuracy via 705, 706 is shown. This is a method of increasing accuracy based on the application as in the previous case. Micro cantilever 1 with cantilever part 202
Grooves 703 and 704 are also formed on the back side of the surface which is the cantilever portion 11 by using the etching technique. The grooves and cantilevers are positioned with very high lithographic accuracy. Positioning rods 705 and 706 made of an optical fiber or the like are dropped into these grooves. The positioning rod is applied to the inner surface of the V-shaped groove formed by etching, and is accurately positioned. However, in order to accurately position the micro cantilever 111 and the lever pedestal 109, the positioning rod is not embedded in the micro cantilever but slightly sticks to the surface and adheres.
Positioning grooves 707 and 708 are cut on the side of the lever pedestal 109 on which the microcantilever is mounted. And
By aligning the positioning rod adhered to the micro cantilever with the groove, the tip of the cantilever portion 202 of the micro cantilever and the lever base are accurately positioned. The chip manufactured in this way can ensure the position reproducibility even at the time of replacement.

Also, for positioning the lever pedestal 109 and the chip pedestal 108, the same abutment surfaces 711, 712, 713, 7
14 and 715 are prepared, a hole 330 is formed in the lever pedestal, a screw hole 716 is formed in the chip pedestal, and screwed with a screw 110. Therefore, the chip can be replaced very easily.

FIG. 8 relates to a fifth embodiment of the present invention. In FIG. 7, a positioning guide is manufactured using a positioning rod, whereas a cross positioning guide is formed using anisotropic etching of silicon. This is an example of fabrication. It is possible to reduce the number of parts and to reduce the cost as compared with using a fiber or the like.

FIG. 9 shows that the cantilever 111 of the present invention is
2 shows an example in which a plurality of sheets are attached. This mechanism makes it possible to replace the microcantilever with the lever base 109. Furthermore, we adopt revolver mechanism,
Enables replacement of micro cantilevers by rotation,
For the number of pasted micro cantilevers,
Eliminating the need to replace the lever pedestal makes it easier to use. The microcantilever of the present invention can be adapted to such a mechanism, for example.

The microcantilever of the present invention is typically made of a single crystal material such as silicon or a compound thereof, photosensitive glass, metal foil, or the like. Among them, silicon is the most widely used material for semiconductor ICs, and is particularly preferably used in the present invention because a high-level manufacturing process has been established. Similarly, silicon oxide, silicon nitride, and the like are also preferably used as a compound of silicon. In this case, the starting material used in claim 12 refers to a case in which a certain material is subjected to a manufacturing technique in a semiconductor process, such as etching, coating, vapor deposition / deposition, and a part having a certain shape. Refers to the underlying material.

As a method of forming the contact surface of the microcantilever of the present invention, there is a method of forming the cut surface of the microcantilever as the contact surface using a device such as a dicing saw or a laser cutter. However, when manufacturing the cantilever portion of the microcantilever, it is preferable to use a lithography technology to manufacture the cantilever portion because the shape of the microcantilever that can be manufactured can be freely selected. Furthermore, it is preferable to simultaneously form the contact surface portion by lithography from the viewpoint of reducing the number of manufacturing steps and reducing costs. In addition, from the viewpoint that the position of the cantilever portion of the microcantilever and the contact surface can be aligned at an extremely high alignment level of the lithography technology, the lithography technology is preferably used as the method for manufacturing the microcantilever of the present invention. For example, when manufacturing the micro cantilever of the present invention using photolithography technology, which is one of the lithography technologies, the cantilever portion and the contact surface are printed by exposure of the same pattern mask, and the final positions of both are determined. If you do
The microcantilever can be manufactured in one system of the order of μm, so that it is particularly preferably used.

When making micro cantilevers from silicon wafers using lithography technology, etching is performed from both the front and back surfaces, and when removing the silicon wafer, the mask pattern on the front and back surfaces is aligned firmly so that it can be applied to the cantilevers. It is possible to obtain high alignment accuracy with the surface. In addition to photolithography, for example, lithography using electron beam exposure is also suitable for producing the microcantilever of the present invention.

The lever pedestal and the chip pedestal are made of metal, glass, ceramics, plastics or the like. In particular, the atomic probe microscope is a device that matters the size of the atomic order, and the thermal expansion of small parts can also affect the data, so the material is highly rigid,
A material having a small coefficient of thermal expansion is selected. Also, a single crystal material such as silicon can be used.

In the processing of these pedestals, an abutment surface is formed on the pedestal in the same manner as the microcantilever, and it is important to manufacture the abutment surface with high accuracy. Therefore, it is preferable to manufacture the pedestal using lithography technology. However, for metals and the like, numerical precision processing machines (NC machines) have already been able to achieve an accuracy of 10 μm or less, so conventional machine parts such as machining with NC machines are also used in the present invention in the same manner as lithography technology. It is preferably used.

Hereinafter, a method for producing the microcantilever according to the present invention will be described.

(1) A 1.5-μm silicon oxide film is formed on both sides of a silicon wafer with a plane orientation of (100) and a thickness of 400 μm by thermal oxidation, resist coating, exposure, and photolithography of wet anisotropic etching with KOH. Through the process, as shown in FIG. 4, one silicon wafer 401
Multiple microcantilever tips on top (402-406)
Was prepared. The hatched portion in the figure penetrates to the back surface by anisotropic etching. The micro cantilever finally removed from the wafer is shown in FIG. The approximate size of each micro cantilever is 5m
m × 5 mm. The size of the cantilever is 200μ from the tip of the cantilever to its root.
m, and the width of the root portion was 120 μm. As shown in FIG. 4, for example, a micro cantilever 402 is connected to a silicon wafer at a portion 408. This is shown in the front view of FIG. That is, 408 in FIG. 4 corresponds to the groove 210 in FIG. 2, and etching proceeds only from the surface while etching does not proceed from this portion. When such a groove is formed in the silicon wafer, the micro cantilever can be cut off easily from the position of the groove. In FIG. 2, the portion of the silicon wafer to be cut off is indicated by a dotted line at 209.

Before detachment, when incorporated into an AFM device, the displacement of the cantilever was measured using an optical displacement meter, and in order to increase the reflectivity of the probe light, chromium and gold were deposited at 10 nm and 200 nm, respectively. . The two-sided deposition was performed while rotating the silicon wafer so that the microcantilever was not warped by the film formation. The separated microcantilever is the surface of the microcantilever in Fig. 4.
The surface corresponding to the surface 407 or the surfaces 204 and 211 in FIG. 2 was accurately etched to obtain a clean surface.

(2) The microcantilever manufactured in this manner was mounted on a lever pedestal manufactured by processing Super Invar (trade name, manufactured by Sumitomo Metal) using an NC machine to manufacture a chip.
When the dimensional accuracy was measured by the magnifying projector, an accuracy of 10 μm, which is the accuracy of the processing machine, was realized.

Furthermore, the chip was placed on a chip pedestal made by Super Invar, positioned, fixed with screws, and attached to an AFM device. Then, when the chip was replaced with another chip for replacement, the replacement operation could be performed very easily, and the chip could be mounted with good positional reproducibility.

As described in the above several embodiments, a contact surface is formed on the micro cantilever using lithography technology or the like, and the contact surface is adhered to the lever pedestal, and the micro cantilever and the lever pedestal are integrally formed. doing. Therefore, when replacing the microcantilever, the entire lever pedestal can be replaced, and the replacement of the microcantilever can be extremely simplified. Further, by manufacturing the micro cantilever using lithography technology or the like, highly accurate positioning can be performed, and the cantilever can be accurately and reproducibly attached to the original position.

The cantilever made in this way is compatible with other Force Microsco such as a magnetic force microscope (Mgnetic Force Microscope).
It can be applied to most atomic probe microscopes including pe or STM.

As for STM, for example, a micro cantilever with low rigidity is used in the AFM apparatus of FIG. 1, and its displacement according to the sample is captured by an optical displacement meter including an optical fiber and operated. Using a micro-cantilever treated with high conductivity, the STM can capture the tunnel current flowing between the micro-cantilever and the sample.
The micro-cantilever of the present invention can be mounted very easily even when mounted on such an STM.

In addition, TRAlbrecht and others announced (TRAlbrecht, S.Aka
mine, MJZdeblick and CFQuate: Microfabrication o
f Integrated Scanning Tunneling Microscope, 4th Int
ernational Conferennce on Scanning Tunneling Micro
The present invention can be applied to a new cantilever type STM (micro STM) loaded with the function as an actuator which performs scopy / Spectroscopy (Jury 9-14, 1989) S10-2). In addition to simplicity, it is possible to ensure data reproducibility before and after replacement.

[Effects of the Invention] According to the atomic probe microscope of the present invention and the cantilever unit used therein, when replacing the cantilever, the cantilever after the replacement is positioned with high accuracy.

[Brief description of the drawings]

FIG. 1 is a diagram showing a state in which a microcantilever of the present invention is attached to an atomic force microscope, FIG. 2 is a diagram showing a first embodiment of a microcantilever of the present invention, FIG. 2A is a plan view, Figure 2B is a front view,
2C is a side view, FIG. 3 is a view showing a state in which the microcantilever shown in FIG. 2 is attached to the lever base, FIG. 4 is a view showing a state in which the microcantilever shown in FIG. 2 is etched from a silicon wafer, FIG. 5 shows a second embodiment of the microcantilever,
FIG. 6 shows a state in which this is attached to a lever pedestal. FIG. 6 shows a third embodiment of a micro cantilever.
FIG. 7 shows a state in which this is attached to a lever base. FIG. 7 shows a micro cantilever according to a fourth embodiment;
FIG. 8 shows a state in which a lever pedestal and a chip pedestal are attached. FIG. 8 shows a fifth embodiment of the microcantilever. FIGS. 9A and 9B show a plurality of cantilevers of the present invention attached to the lever pedestal. 9A is a front view, FIG. 9B is a bottom view, and FIG. 10 is a view showing a conventional atomic force microscope. 108 …… Chip pedestal, 109 …… Lever pedestal, 110 …… Screw, 11
1… Micro cantilever, 202… Cantilever part.

Claims (19)

(57) [Claims] 1. An atomic probe microscope for detecting a physical quantity generated between a sample and a probe, comprising: a cantilever having a lever portion provided with the probe portion and a first positioning portion; and a second positioning portion. A lever pedestal having an optical displacement measurement system for optically measuring the displacement of the cantilever based on the physical quantity, wherein the first positioning portion and the second positioning portion are brought into contact with each other, whereby the cantilever is provided. Is positioned on the lever base. 2. An atomic probe microscope for detecting a physical quantity generated between a sample and a probe, comprising: a cantilever having a lever portion having the probe portion and a first positioning portion; and a second positioning portion. And a modulating means for vibrating the cantilever, wherein the cantilever is positioned on the lever pedestal by contacting the first positioning portion and the second positioning portion. Atomic probe microscope characterized by the above-mentioned. 3. The atomic probe microscope according to claim 2, wherein said modulating means comprises a piezoelectric element. 4. The atomic probe microscope according to claim 2, wherein the modulating means vibrates the lever pedestal, and vibrates the cantilever using the vibration of the lever pedestal. 5. The atomic probe microscope according to claim 2, wherein the physical quantity is detected by an optical displacement measuring system that optically measures the vibration of the cantilever. 6. The atomic probe microscope according to claim 1, wherein one of the first and second positioning portions is a convex portion while the other is a concave portion. 7. The first positioning portion is a ridge as a contact portion formed by two different surfaces, and the second positioning portion is a ridge formed by two different surfaces.
The atomic probe according to any one of claims 1 to 5, wherein the positioning portion is a contact surface formed of one surface, and the cantilever is positioned when the ridge and the surface are in contact with each other. microscope. 8. The cantilever is positioned on the lever pedestal when the first and second positioning portions have the same number of abutting portions facing each other, and all of the abutting portions come into contact with each other. The atomic probe microscope according to any one of claims 1 to 5, wherein: 9. The atomic probe microscope according to claim 1, wherein said lever pedestal is detachable from an atomic probe microscope main body. 10. The apparatus according to claim 10, further comprising a chip pedestal supporting said lever pedestal, said lever pedestal having a third positioning part, said chip pedestal having a fourth positioning part, and The atomic probe microscope according to any one of claims 1 to 8, wherein the lever pedestal is positioned on the chip pedestal by contacting a fourth positioning portion. 11. The first and second cantilever units.
The atomic probe microscope according to any one of claims 1 to 10, wherein at least the first positioning portion of the positioning portions is manufactured by a lithography technique. 12. The atomic probe microscope according to claim 1, wherein the cantilever is formed using a crystalline material as a starting material. 13. An atomic probe microscope for detecting a physical quantity generated between a sample and a probe, comprising: a cantilever having a lever portion provided with the probe portion and a concave portion for positioning; and a convex portion for positioning. A lever pedestal having a cantilever unit, wherein the cantilever is positioned on the lever pedestal when the concave portion and the convex portion are in contact with each other, and the cantilever unit is detachable from the atomic probe microscope main body. An atomic probe microscope characterized by the following. 14. An atomic probe microscope for detecting a physical quantity generated between a sample and a probe, comprising: a cantilever having a lever portion provided with the probe portion and a convex portion for positioning; and a concave portion for positioning. A lever pedestal having a cantilever unit, wherein the cantilever is positioned on the lever pedestal by contacting the convex portion and the concave portion, and the cantilever unit is detachable from the atomic probe microscope main body. An atomic probe microscope characterized by the following. 15. The atomic probe microscope according to claim 13, wherein the physical quantity is detected by an optical displacement measuring system that optically measures the displacement of the cantilever. 16. An atomic probe microscope for detecting a physical quantity generated between a sample and a probe, comprising: a cantilever having a lever portion provided with the probe and a first positioning portion; and a second positioning portion. A lever pedestal having an optical displacement measurement system for optically measuring the displacement of the cantilever based on the physical quantity, wherein the first positioning portion and the second positioning portion face each other, An atomic probe microscope, wherein a cantilever is positioned on the lever base. 17. An atomic probe microscope for detecting a physical quantity generated between a sample and a probe, comprising: a cantilever having a lever portion provided with the probe and a first positioning portion; and a second positioning portion. And a modulating means for vibrating the cantilever. The cantilever is positioned on the lever pedestal by causing the first positioning portion and the second positioning portion to face each other. An atomic probe microscope characterized in that: 18. A cantilever having a lever portion having a probe portion, a lever pedestal for supporting the cantilever, and a chip pedestal for supporting the lever pedestal, wherein the lever pedestal and the chip pedestal each have a positioning part. The cantilever unit, wherein the lever pedestal is positioned on the chip pedestal when the positioning portions contact each other. 19. The cantilever and the lever pedestal are each provided with a positioning portion, and when the positioning portions contact each other, the cantilever is positioned on the lever pedestal. Cantilever unit.