JP2868011B1 - Method and apparatus for polishing plastic members - Google Patents
Method and apparatus for polishing plastic membersInfo
- Publication number
- JP2868011B1 JP2868011B1 JP3826498A JP3826498A JP2868011B1 JP 2868011 B1 JP2868011 B1 JP 2868011B1 JP 3826498 A JP3826498 A JP 3826498A JP 3826498 A JP3826498 A JP 3826498A JP 2868011 B1 JP2868011 B1 JP 2868011B1
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- polishing pad
- liquid
- plastic member
- cresol
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
【要約】
【課題】 多芯光コネクタの端面を、光ファイバ挿入孔
周辺にバリのない高精度な面に加工でき、光ファイバの
正確な位置決めを行うことができる研磨加工方法及び加
工装置を提供すること。
【解決手段】 本研磨方法は、砥粒面を研磨パッド面と
して有する研磨パッド２２を回転させ、回転する研磨パ
ッド面に研磨液を供給しながら、研磨パッド面にプラス
チック製部材の被研磨面を接触させ押圧しつつ、研磨パ
ッドに直交する軸の周りに回転させ、又は研磨パッド面
に沿って揺動させることにより、研磨パッドの砥粒の研
磨作用でプラスチック製部材を研磨する研磨方法であ
る。本方法では、液晶ポリエステル製部材を研磨する際
には、クレゾールの濃度が２０〜５０％の範囲にある研
磨液を使用する。研磨液に混合されたクレゾールと液晶
ポリエステル製部材が化学的に反応し、発生したバリを
溶解するため、高精度な加工が可能である。Abstract: PROBLEM TO BE SOLVED: To provide a polishing method and a processing apparatus capable of processing an end face of a multi-core optical connector into a high-precision surface without burrs around an optical fiber insertion hole and performing accurate positioning of an optical fiber. To do. The polishing method includes rotating a polishing pad having an abrasive grain surface as a polishing pad surface, and supplying a polishing liquid to the rotating polishing pad surface while applying a polishing surface of a plastic member to the polishing pad surface. A polishing method in which a plastic member is polished by a polishing action of abrasive grains of a polishing pad by rotating around an axis orthogonal to the polishing pad or swinging along a surface of the polishing pad while contacting and pressing. . In this method, when polishing a liquid crystal polyester member, a polishing liquid having a cresol concentration in the range of 20 to 50% is used. Cresol mixed with the polishing liquid and the liquid crystal polyester member chemically react to dissolve generated burrs, so that high-precision processing is possible.
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、液晶ポリエステル
製部材等のプラスチック製部材の研磨加工方法及び装置
に関し、更に詳細には、液晶ポリエステル製光コネク
タ、特に液晶ポリエステル製多芯光コネクタ接続面の研
磨加工方法及び装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for polishing a plastic member such as a liquid crystal polyester member, and more particularly, to a liquid crystal polyester optical connector, and more particularly, to a liquid crystal polyester multicore optical connector connecting surface. The present invention relates to a polishing method and apparatus.
【０００２】[0002]
【従来の技術】遠く離れた送受信装置間で光信号を伝搬
する長距離光通信システムでは、光ファイバを順次接続
して長距離の光ファイバ通信線を敷設する。光ファイバ
同士を接続する際には、光損失を極力抑制するために、
光ファイバ端部同士を同芯状に接続することが必要であ
って、それには、光ファイバ端部同士を高精度に位置決
めすることが必要である。そこで、通常、専用の光ファ
イバ・多芯コネクタを使って光ファイバを接続してい
る。2. Description of the Related Art In a long-distance optical communication system for transmitting an optical signal between distant transmitting and receiving apparatuses, long-distance optical fiber communication lines are laid by sequentially connecting optical fibers. When connecting optical fibers, in order to minimize optical loss,
It is necessary to connect the ends of the optical fibers concentrically, which requires that the ends of the optical fibers be positioned with high precision. Therefore, usually, optical fibers are connected using a dedicated optical fiber / multi-core connector.
【０００３】ここで、図７を参照して、多芯コネクタの
構成を説明する。図７は多芯コネクタの構成を説明する
斜視図である。多芯コネクタ体１０は、一般に、図７に
示すように、２本のガイドピン１２により位置決めして
連結される２個の長方形状の多芯コネクタ１４Ａ、Ｂか
ら構成されている。多芯コネクタ１４Ａ、Ｂは、両側縁
近傍にそれぞれ設けられたガイドピン孔１３Ａ、Ｂと、
ガイドピン孔１３Ａ、Ｂの間に離隔して相互に平行に配
置された複数個の光ファイバ挿入孔１６と、平坦かつ平
滑に仕上げられた接触面１８とを備えている。接触面１
８は、光ファイバ挿入孔１６の孔芯に直交する面であっ
て、他方の多芯コネクタ１４の対向端面に密着する面で
ある。双方の多芯コネクタ１４Ａ、Ｂの光ファイバ挿入
孔１６に光ファイバをそれぞれ挿入し、２本のガイドピ
ン１２により位置決めして接触面１８同士を密着させる
ことにより、機械的に光ファイバの位置決めを行うこと
ができる。Here, the configuration of the multi-core connector will be described with reference to FIG. FIG. 7 is a perspective view illustrating the configuration of the multi-core connector. As shown in FIG. 7, the multi-core connector body 10 is generally composed of two rectangular multi-core connectors 14A and 14B which are positioned and connected by two guide pins 12. The multi-core connectors 14A and B are provided with guide pin holes 13A and 13B provided near both side edges, respectively.
It has a plurality of optical fiber insertion holes 16 spaced apart from each other between the guide pin holes 13A and 13B, and a contact surface 18 finished flat and smooth. Contact surface 1
Reference numeral 8 denotes a surface orthogonal to the hole core of the optical fiber insertion hole 16 and a surface closely contacting the opposite end surface of the other multi-core connector 14. An optical fiber is inserted into the optical fiber insertion hole 16 of each of the multi-core connectors 14A and B, and is positioned by two guide pins 12 so that the contact surfaces 18 are in close contact with each other, thereby mechanically positioning the optical fiber. It can be carried out.
【０００４】多芯コネクタ１４の接触面１８は、上述の
ように、密着させることにより光ファイバの位置決め、
芯出しを行っているので、平坦かつ平滑な面であること
が必須であって、そのために、研磨仕上げが施されてい
る。ここで、図１を参照して、多芯コネクタの研磨加工
に使用している従来の研磨装置の構成を説明する。図１
は従来の研磨装置の構成を示す模式図である。従来の研
磨装置２０は、図１に示すように、研磨パッド２２を上
面に有して、モータ２４により水平面内で回転する研磨
定盤２６と、研磨定盤２６に対して直交する回転軸の周
りに回転しつつ研磨定盤２６の研磨パッド２２に被加工
物を押圧する被加工物保持具２８と、研磨液を研磨パッ
ド２２に滴下するノズル３０と、研磨定盤２６を収容
し、研磨定盤２６から流れ落ちた過剰の研磨液、即ち排
液を排液パイプ３２を介して排液タンク３４に受ける受
け槽３６を備えている。被加工物保持具２８は、下端に
被加工物を保持し、その上部に備えた加圧機構３８によ
り被加工物を研磨パッド２２に押圧しつつ回転機構（図
示せず）により回転する。多芯光コネクタ２の接触面１
８の研磨加工では、図１に示すように、砥粒を混合した
研磨液を研磨パッド２２表面に供給しながら研磨パッド
２２を回転させ、研磨パッド２２表面に多芯コネクタ１
４を接触させ、砥粒の研磨作用により研磨加工を行う。As described above, the contact surface 18 of the multi-core connector 14 is brought into close contact with the optical fiber for positioning and positioning of the optical fiber.
Since the centering is performed, a flat and smooth surface is indispensable. For that purpose, the surface is polished. Here, a configuration of a conventional polishing apparatus used for polishing a multi-core connector will be described with reference to FIG. FIG.
FIG. 1 is a schematic diagram showing a configuration of a conventional polishing apparatus. As shown in FIG. 1, a conventional polishing apparatus 20 has a polishing pad 22 on its upper surface, a polishing platen 26 rotated in a horizontal plane by a motor 24, and a rotating shaft orthogonal to the polishing platen 26. A workpiece holder 28 that presses the workpiece against the polishing pad 22 of the polishing table 26 while rotating around, a nozzle 30 that drops a polishing liquid onto the polishing pad 22, and a polishing table 26 are housed therein. A receiving tank 36 is provided for receiving an excessive polishing liquid, that is, a drainage liquid flowing down from the surface plate 26 into a drainage tank 34 through a drainage pipe 32. The workpiece holder 28 holds the workpiece at its lower end, and is rotated by a rotation mechanism (not shown) while pressing the workpiece against the polishing pad 22 by a pressing mechanism 38 provided above the workpiece holder. Contact surface 1 of multi-core optical connector 2
In the polishing process No. 8, as shown in FIG. 1, the polishing pad 22 is rotated while supplying a polishing liquid mixed with abrasive grains to the surface of the polishing pad 22, and the multi-core connector 1 is placed on the surface of the polishing pad 22.
4 is brought into contact, and polishing is performed by the polishing action of the abrasive grains.
【０００５】[0005]
【発明が解決しようとする課題】しかし、上述した従来
の研磨装置を使用した研磨方法では、多芯光コネクタ２
端面の光ファイバ挿入孔の開口縁周辺にバリが生じ、光
ファイバの位置決め、芯出しを高精度に行うことができ
ないという問題があった。そこで、本発明の目的は、多
芯光コネクタ等の開口を有するプラスチック製部材の被
研磨面を開口縁にバリのない高精度な平坦面に加工でき
る研磨方法及び装置を提供することにある。However, in the polishing method using the above-mentioned conventional polishing apparatus, the multi-core optical connector 2 is not used.
There is a problem that burrs are generated around the opening edge of the optical fiber insertion hole on the end face, and the positioning and centering of the optical fiber cannot be performed with high accuracy. Accordingly, an object of the present invention is to provide a polishing method and apparatus capable of processing a polished surface of a plastic member having an opening such as a multi-core optical connector into a highly accurate flat surface without burrs at the opening edge.
【０００６】[0006]
【課題を解決するための手段】上記目的を達成するため
に、本発明に係るプラスチック製部材の研磨方法は、砥
粒面を研磨パッド面として有する研磨パッドを回転さ
せ、回転する研磨パッド面に研磨液を供給しながら、研
磨パッド面にプラスチック製部材の被研磨面を接触させ
押圧しつつ、研磨パッドに直交する軸の周りに回転さ
せ、又は研磨パッド面に沿って揺動させて、プラスチッ
ク製部材を研磨する研磨方法において、研磨液として、
プラスチック製部材を溶解する溶解液を含む研磨液を用
いることを特徴としている。In order to achieve the above object, a method of polishing a plastic member according to the present invention comprises rotating a polishing pad having an abrasive surface as a polishing pad surface and rotating the polishing pad surface. While supplying the polishing liquid, the surface to be polished of the plastic member is brought into contact with and pressed against the polishing pad surface, and is rotated around an axis orthogonal to the polishing pad, or is swung along the polishing pad surface, so that the plastic In a polishing method for polishing a member made of, as a polishing liquid,
It is characterized in that a polishing liquid containing a solution for dissolving a plastic member is used.
【０００７】本発明方法では、溶解液の溶解作用により
プラスチック製部材の被研磨面を溶解しながら化学的か
つ機械的に研磨するので、単純に機械的に研磨する従来
の方法と比較して高精度な研磨加工が可能となる。特
に、多芯コネクタのように開口を有する被研磨面を研磨
する際に、開口縁にバリのない高精度な平坦面に研磨加
工できる。In the method of the present invention, the surface to be polished of the plastic member is chemically and mechanically polished while being dissolved by the dissolving action of the dissolving solution. Accurate polishing can be performed. In particular, when polishing a surface to be polished having an opening like a multi-core connector, it is possible to polish a highly accurate flat surface without burrs at the opening edge.
【０００８】本発明方法は、プラスチックの種類を問わ
ず適用できるものの、特に、好適な実施態様は、プラス
チック製部材が被研磨面に開口を有する液晶ポリエステ
ル製部材であって、溶解液がクレゾールである場合に効
果的である。クレゾールの作用により液晶ポリエステル
を溶解しながら化学的かつ機械的に研磨するため、更に
は、発生したバリが研磨液に溶解されるために、単純に
機械的に研磨を行った場合と比較してバリのない高精度
な加工ができる。好適な実施態様では、研磨液中のクレ
ゾールの濃度が２０〜５０％の範囲にある。クレゾール
濃度が２０％未満の場合はバリが除去しきれず、50％を
越えると表面粗さ精度が低下する。クレゾール濃度２０
〜５０％の範囲では、バリのない加工面粗さも良好な面
に加工できる。また、好適な実施態様では、プラスチッ
ク製部材を研磨パッドに押圧する研磨圧力が、５０〜５
００g/cm2 である。研磨圧力が５０g/cm2未満の場合は
バリが除去しきれず、５００ g/cm2を越えると、スクラ
ッチが被研磨面に発生する。研磨圧力５０〜５００g/cm
2 の範囲では、バリ及びスクラッチのない良好な面に被
研磨面を加工できる。Although the method of the present invention can be applied to any kind of plastic, a particularly preferred embodiment is a liquid crystal polyester member having an opening in a surface to be polished, wherein the solution is cresol. It is effective in some cases. In order to polish chemically and mechanically while dissolving the liquid crystal polyester by the action of cresol, furthermore, since the generated burrs are dissolved in the polishing liquid, compared to the case where simply mechanically polished High-precision processing without burrs. In a preferred embodiment, the concentration of cresol in the polishing liquid is in the range of 20-50%. When the cresol concentration is less than 20%, burrs cannot be completely removed, and when it exceeds 50%, the surface roughness accuracy is reduced. Cresol concentration 20
In the range of ５０50%, it is possible to process the surface without burrs into a favorable surface. In a preferred embodiment, the polishing pressure for pressing the plastic member against the polishing pad is 50 to 5 mm.
00 g / cm 2 . When the polishing pressure is less than 50 g / cm 2, burrs cannot be completely removed, and when it exceeds 500 g / cm 2 , scratches are generated on the surface to be polished. Polishing pressure 50-500g / cm
In the range of 2, the polished surface can be machined to a good surface free of burrs and scratches.
【０００９】本発明の更に好適な実施態様では、プラス
チック製部材を冷却しつつ研磨する。液晶ポリエステル
製部材を冷却することにより、液晶ポリエステルの流動
性を低くすることができるので、バリのない高精度な加
工を被研磨面に施すことが可能となる。本実施態様で
は、好適には、凝固点が−２０℃以下の研磨液を使用
し、液晶ポリエステル製部材を冷却し、低温度加工で被
研磨面の流動性を低下させ、バリのない高精度な加工が
できる。本実施態様では、研磨液が凍らないので、低温
度加工が可能になる。In a further preferred embodiment of the present invention, the plastic member is polished while being cooled. By cooling the liquid crystal polyester member, the fluidity of the liquid crystal polyester can be reduced, so that it is possible to perform high-precision processing without burrs on the surface to be polished. In this embodiment, preferably, a polishing liquid having a freezing point of −20 ° C. or less is used, the liquid crystal polyester member is cooled, the flowability of the surface to be polished is reduced by low-temperature processing, and high precision without burrs is obtained. Can be processed. In this embodiment, since the polishing liquid does not freeze, low-temperature processing becomes possible.
【００１０】本実施態様は、液晶ポリエステル製部材の
種類を問わず適用できるものの、特に液晶ポリエステル
製部材が多芯コネクタであるときに、特に、好適に適用
できる。This embodiment can be applied irrespective of the kind of the member made of liquid crystal polyester, but can be preferably applied particularly when the member made of liquid crystal polyester is a multi-core connector.
【００１１】本実施態様方法を実施できる研磨装置は、
研磨パッドを上面に有して、水平面内で回転する研磨定
盤と、下端に被加工物を保持して、研磨パッドに被加工
物を接触、押圧する被加工物保持具とを備え、クレゾー
ルを混入した研磨液を研磨パッド面に供給しつつ液晶ポ
リエステル製部材を研磨パッドに接触、押圧して研磨加
工する研磨装置において、被加工物及び研磨液の少なく
とも一方を冷却する冷却機構を備えていることを特徴と
している。これより、液晶ポリエステル製部材又は研磨
液、又はその双方を冷却しつつ研磨できるので、液晶ポ
リエステルの流動性が低くなり、バリのない高精度な加
工を被研磨面に施すことが可能となる。The polishing apparatus that can carry out the method of the present embodiment is as follows.
A polishing platen having a polishing pad on an upper surface thereof and rotating in a horizontal plane, and a workpiece holder for holding the workpiece at a lower end thereof and contacting and pressing the workpiece with the polishing pad; A polishing apparatus for polishing a liquid crystal polyester member by contacting and pressing a liquid crystal polyester member to a polishing pad while supplying a polishing liquid mixed with a polishing liquid to the polishing pad surface, comprising a cooling mechanism for cooling at least one of the workpiece and the polishing liquid. It is characterized by having. Thus, since the liquid crystal polyester member and / or the polishing liquid can be polished while being cooled, the flowability of the liquid crystal polyester is reduced, and it is possible to perform high-precision processing without burrs on the surface to be polished.
【００１２】また、本発明に係る研磨装置では、研磨定
盤及び被加工物保持具とが、排気吸引装置に接続された
密閉容器内に収容されていることを特徴としている。研
磨装置の研磨定盤及び被加工物保持具が密閉容器内に収
容されているので、クレゾールを含む研磨剤を使った時
にも、クレゾールの臭気が周囲に拡散することがない。Further, the polishing apparatus according to the present invention is characterized in that the polishing platen and the workpiece holder are housed in a closed container connected to an exhaust suction device. Since the polishing platen and the workpiece holder of the polishing apparatus are housed in a closed container, the odor of cresol does not diffuse to the surroundings even when an abrasive containing cresol is used.
【００１３】好適な実施態様では、密閉容器は、開閉自
在な作業用覗き窓と、作業用覗き窓の近傍に設けられた
吸い込みファンとを備えている。吸い込みファンの吸気
作用により、作業用窓を開けてもクレゾールの臭気が周
囲に拡散しない。また、更に実施態様では、密閉容器が
研磨定盤の下方に開閉弁付き排液管を介して排液タンク
を備ている。これにより、密閉容器から排液タンクを取
り外する時には、開閉弁を閉止することにより、排液タ
ンクの開口部が塞がれ、クレゾールの臭気が排液タンク
から周囲に拡散しない。[0013] In a preferred embodiment, the closed container includes a work viewing window that can be opened and closed, and a suction fan provided near the work viewing window. Due to the suction action of the suction fan, the odor of cresol does not diffuse to the surroundings even when the working window is opened. In a further embodiment, the closed vessel has a drainage tank below the polishing platen via a drainage pipe with an on-off valve. Thus, when the drainage tank is removed from the closed container, the opening of the drainage tank is closed by closing the on-off valve, so that the odor of cresol does not diffuse from the drainage tank to the surroundings.
【００１４】[0014]
【発明の実施の形態】以下に、添付図面を参照して、実
施形態例に基づいて本発明をより詳細に説明する。実施形態例１ 本実施形態例は、プラスチック製部材の本発明に係る研
磨方法を液晶ポリエステル製多芯コネクタの研磨に適用
した実施形態の一例である。本実施形態例方法では、図
１に示した従来の研磨装置を使用して被加工物を研磨す
る。即ち、モータ２４を起動して、研磨パッド２２を張
り付けた研磨定盤２６を回転させ、研磨パッド２２表面
に砥粒とクレゾールを混合した研磨液を供給する。液晶
ポリエステル製多芯コネクタ１４を被加工物保持具２８
に保持させ、研磨パッド２２表面に接触させ加圧機構３
８により加圧する。本実施形態例では、砥粒の研磨作用
により、多芯コネクタ１４の接触面１８は加工されてい
くが、この際、研磨液に混合されたクレゾールと多芯コ
ネクタ１４とが化学的に反応し、クレゾールが発生した
バリを溶解するため、高精度な加工が可能である。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in more detail with reference to the accompanying drawings based on embodiments. Embodiment 1 This embodiment is an example of an embodiment in which the method for polishing a plastic member according to the present invention is applied to the polishing of a liquid crystal polyester multi-core connector. In the method of this embodiment, the workpiece is polished using the conventional polishing apparatus shown in FIG. That is, the motor 24 is started, the polishing platen 26 on which the polishing pad 22 is adhered is rotated, and a polishing liquid in which abrasive grains and cresol are mixed is supplied to the surface of the polishing pad 22. The liquid crystal polyester multi-core connector 14 is connected to the workpiece holder 28.
, And brought into contact with the surface of the polishing pad 22 so that the pressing mechanism 3
8 to pressurize. In the present embodiment, the contact surface 18 of the multi-core connector 14 is processed by the polishing action of the abrasive grains. At this time, the cresol mixed in the polishing liquid and the multi-core connector 14 chemically react. Since burrs generated by cresol are dissolved, high-precision processing is possible.
【００１５】実施形態例２ 本実施形態例は、実施形態例２の好適例であって、特
に、研磨液中のクレゾール濃度が２０〜５０％の場合
に、実施形態例１の効果が著しく顕著に現れ、バリの無
い高精度な面となる。 Embodiment 2 This embodiment is a preferred example of Embodiment 2, and the effect of Embodiment 1 is remarkably remarkable especially when the cresol concentration in the polishing liquid is 20 to 50%. And a high-precision surface without burrs.
【００１６】実施形態例３ 本実施形態例は、本発明に係るプラスチック製部材の研
磨方法を液晶ポリエステル製多芯コネクタの研磨に適用
した実施形態の別の例である。本実施形態例方法では、
図１に示した従来の研磨装置を使用して被加工物を研磨
する。即ち、モータ２４を起動して、研磨パッド２２を
張り付けた研磨定盤２６を回転させ、研磨パッド２２表
面に砥粒とクレゾールを混合した研磨液を供給する。多
芯コネクタ１４を被加工物保持具２８に保持し、研磨パ
ッド２２表面に接触させ、加圧機構３８により研磨パッ
ド２２に多芯コネクタ１４を押圧する。押圧力は、加圧
機構３８を調整して５０〜５００g/cm2 に設定する。本
実施形態例では、適切な押圧力の下で、砥粒の研磨作用
により、多芯コネクタ１４の接触面１８は加工されてい
く。この際、研磨液に混合されたクレゾールと多芯コネ
クタ１４とが化学的に反応し、クレゾールが発生したバ
リを溶解するため、高精度な加工が可能である。 Embodiment 3 This embodiment is another embodiment in which the method for polishing a plastic member according to the present invention is applied to the polishing of a liquid crystal polyester multi-core connector. In the method of the present embodiment,
A workpiece is polished using the conventional polishing apparatus shown in FIG. That is, the motor 24 is started, the polishing platen 26 on which the polishing pad 22 is adhered is rotated, and a polishing liquid in which abrasive grains and cresol are mixed is supplied to the surface of the polishing pad 22. The multi-core connector 14 is held by the workpiece holder 28 and brought into contact with the surface of the polishing pad 22, and the multi-core connector 14 is pressed against the polishing pad 22 by the pressing mechanism 38. The pressing force is adjusted to 50 to 500 g / cm 2 by adjusting the pressing mechanism 38. In the present embodiment, the contact surface 18 of the multi-core connector 14 is processed by the abrasive action of the abrasive grains under an appropriate pressing force. At this time, cresol mixed in the polishing liquid and the multi-core connector 14 chemically react with each other to dissolve burrs generated by cresol, so that high-precision processing is possible.
【００１７】実施形態例４ 本実施形態例は、本発明に係るプラスチック製部材の研
磨方法を液晶ポリエステル製多芯コネクタの研磨に適用
した実施形態の更に別の例である。図２は実施形態例４
で使用する研磨装置の模式図である。本実施形態例方法
では、図２に示す本発明に係る研磨装置を使用する。実
施形態例４で使用する研磨装置４０は、図２に示すよう
に、従来の研磨装置２０の構成に加えて、被加工物を冷
却する被加工物冷却機構４２を被加工物保持具２８に備
えている。 Embodiment 4 This embodiment is still another example of an embodiment in which the method of polishing a plastic member according to the present invention is applied to the polishing of a liquid crystal polyester multi-core connector. FIG. 2 shows a fourth embodiment.
FIG. 2 is a schematic view of a polishing apparatus used in the embodiment. In the method of the present embodiment, the polishing apparatus according to the present invention shown in FIG. 2 is used. As shown in FIG. 2, a polishing apparatus 40 used in Embodiment 4 includes a workpiece cooling mechanism 42 for cooling a workpiece on the workpiece holder 28 in addition to the configuration of the conventional polishing apparatus 20. Have.
【００１８】本実施形態例方法では、モータ２４を起動
して、研磨パッド２２を張り付けた研磨定盤２６を回転
させ、研磨パッド２２表面に砥粒とクレゾールを混合し
た研磨液を供給する。多芯コネクタ１４を被加工物保持
具２８に保持させ、被加工物冷却機構４２により冷却す
る。多芯コネクタ１４を研磨パッド２２表面に接触させ
加圧すると、砥粒の研磨作用により、多芯コネクタ１４
の接触面１８は加工されていく。冷却したことにより、
多芯コネクタ１４を形成する液晶ポリエステルの流動性
が低くなり、切削性が高く、バリの発生が少ない高精度
な加工が可能となる。In the method of the present embodiment, the motor 24 is started to rotate the polishing platen 26 on which the polishing pad 22 is attached, and a polishing liquid in which abrasive grains and cresol are mixed is supplied to the surface of the polishing pad 22. The multi-core connector 14 is held by the workpiece holder 28 and cooled by the workpiece cooling mechanism 42. When the multi-core connector 14 is brought into contact with the surface of the polishing pad 22 and pressurized, the multi-core connector 14
Of the contact surface 18 is processed. By cooling,
The liquidity of the liquid crystal polyester forming the multi-core connector 14 is low, the cutting property is high, and high-precision processing with less burrs is possible.
【００１９】実施形態例５ 本実施形態例は、本発明に係るプラスチック製部材の研
磨方法を液晶ポリエステル製多芯コネクタの研磨に適用
した実施形態の更に別の例である。図３は実施形態例５
で使用する研磨装置の模式図である。本実施形態例方法
では、図３に示す本発明に係る研磨装置５０を使用す
る。実施形態例５で使用する研磨装置５０は、図３に示
すように、従来の研磨装置２０の構成に加えて、研磨液
を冷却する研磨液冷却機構５２をノズル３０に備えてい
る。本実施形態例方法では、モータ２４を起動して、研
磨パッド２２を張り付けた研磨定盤２６を回転させ、研
磨パッド２２表面に砥粒とクレゾールを混合した研磨液
を供給する。本実施形態例で用いる研磨液は凝固点が−
２０℃以下の液体とし、研磨液冷却機構５２により０℃
以下に冷却されている。多芯コネクタ１４を被加工物保
持具２８に保持させ、被加工物冷却機構４２により冷却
する。多芯コネクタ１４を研磨パッド２２表面に接触さ
せ加圧すると、砥粒の研磨作用により、多芯コネクタ１
４の接触面１８は加工されていく。研磨液は凍らないた
め、加工面での滑りを抑制できる、また、研磨液は冷却
されているため、多芯コネクタ１４を形成する液晶ポリ
エステルの被研磨面での流動性が低くなり、切削性が高
くバリの発生が少ない高精度な加工が可能となる。 Embodiment 5 This embodiment is still another embodiment in which the method for polishing a plastic member according to the present invention is applied to the polishing of a liquid crystal polyester multi-core connector. FIG. 3 shows a fifth embodiment.
FIG. 2 is a schematic view of a polishing apparatus used in the embodiment. In the method of this embodiment, the polishing apparatus 50 according to the present invention shown in FIG. 3 is used. As shown in FIG. 3, the polishing apparatus 50 used in the fifth embodiment includes a polishing liquid cooling mechanism 52 for cooling the polishing liquid in the nozzle 30 in addition to the configuration of the conventional polishing apparatus 20. In the method of the present embodiment, the motor 24 is started to rotate the polishing platen 26 on which the polishing pad 22 is attached, and a polishing liquid in which abrasive grains and cresol are mixed is supplied to the surface of the polishing pad 22. The polishing liquid used in this embodiment has a freezing point of −
A liquid of 20 ° C. or less, and 0 ° C.
Cooled below. The multi-core connector 14 is held by the workpiece holder 28 and cooled by the workpiece cooling mechanism 42. When the multi-core connector 14 is brought into contact with the surface of the polishing pad 22 and pressurized, the multi-core connector 1
The contact surface 18 of No. 4 is processed. Since the polishing liquid does not freeze, the slip on the processing surface can be suppressed. In addition, since the polishing liquid is cooled, the liquidity of the liquid crystal polyester forming the multi-core connector 14 on the surface to be polished is low, and the cutting property is low. High-precision processing with high burrs and low burr generation is possible.
【００２０】実施形態例６ 本実施形態例は、本発明に係るプラスチック製部材の研
磨方法を液晶ポリエステル製多芯コネクタの研磨に適用
した実施形態の更に別の例である。図４は実施形態例６
で使用する研磨装置の模式図である。本実施形態例方法
では、図４に示す本発明に係る研磨装置６０を使用す
る。実施形態例６で使用する研磨装置６０は、図４に示
すように、従来の研磨装置２０の構成に加えて、研磨定
盤２６及び被加工物保持具２８とを収容し、かつ排気吸
引装置（図示せず）に排気ダクト６２を介して接続され
ている密閉型ケーシング６４を備えている。本実施形態
例方法では、モータ２４を起動して、研磨パッド２２を
張り付けた研磨定盤２６を回転させ、研磨パッド２２表
面に砥粒とクレゾールを混合した研磨液を供給する。液
晶ポリエステル１を被加工物保持具２８に保持させ、研
磨パッド２２表面に接触させ加圧機構３８により加圧す
る。砥粒の研磨作用により、多芯コネクタ１４の接触面
１８は加工されていくが、この際、研磨液に混合された
クレゾールと多芯コネクタ１４とが、化学的に反応し、
クレゾールが発生したバリを溶解するため、高精度な加
工が可能である。クレゾールによる臭気が発生するが、
装置は密閉型ケーシング６４により覆われているため、
臭気が周囲に拡散することはない。 Embodiment 6 This embodiment is still another embodiment in which the method of polishing a plastic member according to the present invention is applied to the polishing of a liquid crystal polyester multi-core connector. FIG. 4 shows a sixth embodiment.
FIG. 2 is a schematic view of a polishing apparatus used in the embodiment. In the method of this embodiment, a polishing apparatus 60 according to the present invention shown in FIG. 4 is used. As shown in FIG. 4, a polishing apparatus 60 used in Embodiment 6 accommodates a polishing platen 26 and a workpiece holder 28 in addition to the configuration of the conventional polishing apparatus 20, and has an exhaust suction apparatus. (Not shown) is provided with a closed casing 64 connected via an exhaust duct 62. In the method of the present embodiment, the motor 24 is started to rotate the polishing platen 26 on which the polishing pad 22 is attached, and a polishing liquid in which abrasive grains and cresol are mixed is supplied to the surface of the polishing pad 22. The liquid crystal polyester 1 is held by the workpiece holder 28, is brought into contact with the surface of the polishing pad 22, and is pressed by the pressing mechanism 38. The contact surface 18 of the multi-core connector 14 is processed by the polishing action of the abrasive grains. At this time, the cresol mixed with the polishing liquid and the multi-core connector 14 chemically react,
Since burrs generated by cresol are dissolved, high-precision processing is possible. Odor is generated by cresol,
Since the device is covered by a closed casing 64,
The odor does not spread to the surroundings.
【００２１】図５を参照して、更に、密閉型ケーシング
６４の構成を説明する。図５は、研磨装置６０に設けら
れた密閉型ケーシング６４の構成を示す斜視図である。
密閉型ケーシング６４は、図５に示すように、作業を行
うために適所に設けられた作業用窓６６と、作業用窓６
６の近傍に設けられた吸気ファン６８と、作業用窓６６
の扉７０と、扉７０を開放した吸気ファン６８を動作さ
せるスイッチ７２とを備えている。以上の構成により、
扉７０を開けたときスイッチ７２がその旨を検知し、吸
気ファン６８を起動するので、臭気が作業用窓６６から
密閉型ケーシング６４外に拡散することはない。研磨液
に混合されたクレゾールと多芯コネクタ１４が化学的に
反応し、発生したバリを溶解するため、高精度な加工が
可能である。Referring to FIG. 5, the structure of the closed casing 64 will be further described. FIG. 5 is a perspective view showing the configuration of the closed casing 64 provided in the polishing apparatus 60.
As shown in FIG. 5, the closed casing 64 includes a work window 66 provided at an appropriate position for performing work, and a work window 6.
6, an intake fan 68 provided in the vicinity of
And a switch 72 for operating an intake fan 68 having the door 70 opened. With the above configuration,
When the door 70 is opened, the switch 72 detects that fact and activates the intake fan 68, so that the odor does not diffuse out of the closed casing 64 from the work window 66. Cresol mixed in the polishing liquid and the multi-core connector 14 chemically react to dissolve generated burrs, so that high-precision processing is possible.
【００２２】実施形態例７ 本実施形態例は、本発明に係るプラスチック製部材の研
磨方法を液晶ポリエステル製多芯コネクタの研磨に適用
した実施形態の更に別の例である。図６は実施形態例７
で使用する研磨装置の要部の構成を示す模式図である。
本実施形態例方法では、要部お図６に示す本発明に係る
研磨装置を使用する。実施形態例７で使用する研磨装置
は、従来の研磨装置２０の構成に加えて、図６に示すよ
うに、排液タンク３４が排液パイプ３２との接続部に開
閉弁７２を備えている。まず、モータ２４によって研磨
パッド２２を張り付けた研磨定盤２６を回転させ、研磨
パッド２２表面に砥粒とクレゾールを混合した研磨液を
供給する。多芯コネクタ１４を被加工物保持具２８に保
持させ、研磨パッド２２表面に接触させ加圧すると、砥
粒の研磨作用により、多芯コネクタ１４の接触面１８は
加工されていく。研磨液に混合されたクレゾールと多芯
コネクタ１４が化学的に反応し、発生したバリを溶解す
るため、高精度な加工が可能である。排液タンク３４が
一杯になったら溜まった排液を処理する。この際、排液
パイプ３２を排液タンク３４から外した瞬間に、開閉弁
７２を閉止することにより排液タンク３４の開口部が塞
がれるため、排液処理の際にクレゾールの臭気が周囲に
拡散することがない。以下に、実施例を挙げ、添付図面
を参照して、本発明を具体的かつ詳細に説明する。 Embodiment 7 This embodiment is still another embodiment in which the method for polishing a plastic member according to the present invention is applied to the polishing of a liquid crystal polyester multi-core connector. FIG. 6 shows a seventh embodiment.
FIG. 2 is a schematic view showing a configuration of a main part of a polishing apparatus used in the embodiment.
In the method of this embodiment, a polishing apparatus according to the present invention shown in FIG. 6 is used. In the polishing apparatus used in the seventh embodiment, in addition to the configuration of the conventional polishing apparatus 20, the drainage tank 34 is provided with an on-off valve 72 at a connection portion with the drainage pipe 32, as shown in FIG. . First, the polishing platen 26 on which the polishing pad 22 is attached is rotated by the motor 24, and a polishing liquid in which abrasive grains and cresol are mixed is supplied to the surface of the polishing pad 22. When the multi-core connector 14 is held by the workpiece holder 28 and brought into contact with the surface of the polishing pad 22 and pressed, the contact surface 18 of the multi-core connector 14 is processed by the polishing action of the abrasive grains. Cresol mixed in the polishing liquid and the multi-core connector 14 chemically react to dissolve generated burrs, so that high-precision processing is possible. When the drainage tank 34 is full, the collected drainage is processed. At this time, the opening of the drainage tank 34 is closed by closing the on-off valve 72 at the moment when the drainage pipe 32 is removed from the drainage tank 34, so that the odor of cresol during surrounding drainage processing is reduced. Does not spread. Hereinafter, the present invention will be described specifically and in detail with reference to examples and the accompanying drawings.
【００２３】[0023]
【実施例】実施例１ 図１を参照して、実施形態例１及び実施形態例２の研磨
方法を具体的に説明す。本実施例では、ポリウレタン製
の研磨パッド２２を用い、研磨液に混合する砥粒として
５μm 径ＳｉＣ 砥粒を用い、クレゾール濃度は１０
％、３５％、及び６０％の３段階のクレゾール濃度の研
磨液を用いて、半芳香族２型の液晶ポリエステル製の多
芯コネクタ１４を研磨した。先ず、加圧機構３８により
多芯コネクタ１４に３００g/cm2 の垂直方向荷重を与
え、ノズル３０より研磨パッド２２表面に１０秒毎に研
磨液を１cc供給し、研磨定盤２６を６０rpm で回転させ
て１５分間の研磨加工を行った。本実施例では、多芯光
コネクタ２の接触面１８は、クレゾール濃度１０％、及
び３５％の場合、表面粗さ０. ２μmRmax 以下の良好な
面が得られた。また、クレゾール濃度６０％の場合、表
面粗さ０．４μmRmax であった。光ファイバ挿入孔１６
の周辺バリ量（突出長さ）は、クレゾール濃度１０％の
場合、平均７〜１５μm 、３５％及び６０％の場合、０
〜６μm であった。クレゾール濃度３５％で、表面粗
さ、バリ量ともに良好な値が得られた。本実施例では、
クレゾール濃度３５％としたが、２０〜５０％であれば
表面粗さ良好でバリ量も小さくでき、同様の効果が得ら
れる。EXAMPLES Referring to Examples 1 1, to specifically explaining the polishing process of embodiment 1 and embodiment 2. In this embodiment, a polishing pad 22 made of polyurethane was used, SiC abrasive grains having a diameter of 5 μm were used as abrasive grains to be mixed with the polishing solution, and a cresol concentration of 10 μm was used.
The multi-core connector 14 made of semi-aromatic type 2 liquid crystal polyester was polished using a polishing liquid having three stages of cresol concentrations of 35% and 35%. First, a vertical load of 300 g / cm 2 is applied to the multi-core connector 14 by the pressing mechanism 38, 1 cc of the polishing liquid is supplied from the nozzle 30 to the surface of the polishing pad 22 every 10 seconds, and the polishing platen 26 is rotated at 60 rpm. Then, polishing was performed for 15 minutes. In the present embodiment, when the cresol concentration was 10% and 35%, a good surface having a surface roughness of 0.2 μmRmax or less was obtained on the contact surface 18 of the multi-core optical connector 2. When the cresol concentration was 60%, the surface roughness was 0.4 μm Rmax. Optical fiber insertion hole 16
The average burr amount (projection length) is 7 to 15 μm when the cresol concentration is 10%, and 0 when the cresol concentration is 35% and 60%.
６6 μm. At a cresol concentration of 35%, good values were obtained for both the surface roughness and the burr amount. In this embodiment,
Although the cresol concentration was 35%, if the cresol concentration was 20 to 50%, the surface roughness was good and the burr amount could be reduced, and the same effect was obtained.
【００２４】実施例２ 図１を参照して、実施形態例３の研磨方法を具体的に説
明す。本実施例では、研磨パッド２２はポリウレタン
製、研磨液に混合する砥粒は、５μm 径ＳｉＣ砥粒を用
い、クレゾール濃度は３５％として、半芳香族２型の液
晶ポリエステル製の多芯コネクタ１４を研磨した。加圧
機構３８により多芯コネクタ１４にかける圧力は、３０
g/cm2 、３００g/cm2 、６００g/cm2 の３段階の圧力と
した。先ず、加圧機構３８により多芯コネクタ１４に垂
直方向荷重を与え、ノズル３０より研磨パッド２２表面
に１０秒毎に研磨液を１cc供給し、研磨定盤２６を６０
rpm で回転させて１５分間の加工を行った。本実施例で
は、多芯光コネクタ２の接触面１８は、研磨圧力が３０
g/cm2 及び３００g/cm2 の場合、表面粗さ０．２μmRma
x 以下の良好な面が得られたが、６００g/cm2 ではスク
ラッチが発生し、表面粗さ０．５μmRmax であった。光
ファイバ挿入孔１６の周辺バリ量は、研磨圧力３０g/cm
2 の場合、平均５〜１０μm 、３００g/cm2 の場合が０
〜６μm 、６００g/cm2 の場合、８〜２０μm であっ
た。即ち、研磨圧力３００g/cm2 の時に、スクラッチ及
びバリのない良好な加工を行うことができた。本実施例
では研磨圧力３００g/cm2 としたが、５０〜５００g/cm
2 であればスクラッチが生じず、バリ量も小さくでき、
同様の効果が得られる。 Embodiment 2 A polishing method according to Embodiment 3 will be specifically described with reference to FIG. In the present embodiment, the polishing pad 22 is made of polyurethane, the abrasive mixed with the polishing liquid is 5 μm diameter SiC abrasive, the cresol concentration is 35%, and the semi-aromatic type 2 liquid crystal polyester multi-core connector 14 is used. Was polished. The pressure applied to the multi-core connector 14 by the pressing mechanism 38 is 30
g / cm 2 , 300 g / cm 2 , and 600 g / cm 2 . First, a vertical load is applied to the multi-core connector 14 by the pressurizing mechanism 38, and 1 cc of the polishing liquid is supplied from the nozzle 30 to the surface of the polishing pad 22 every 10 seconds.
Processing was performed for 15 minutes by rotating at rpm. In this embodiment, the contact surface 18 of the multi-core optical connector 2 has a polishing pressure of 30.
g / cm 2 and 300 g / cm 2 , surface roughness 0.2 μm Rma
Although a good surface of x or less was obtained, scratches occurred at 600 g / cm 2 , and the surface roughness was 0.5 μmRmax. The amount of burrs around the optical fiber insertion hole 16 is 30 g / cm of polishing pressure.
In the case of 2 , the average is 5 to 10 μm, and in the case of 300 g / cm 2 , it is 0.
In the case of ６6 μm and 600 g / cm 2 , it was 8 to 20 μm. That is, when the polishing pressure was 300 g / cm 2 , good processing without scratches and burrs could be performed. In this embodiment, the polishing pressure was 300 g / cm 2 , but 50 to 500 g / cm 2
If it is 2 , scratch will not occur, the burr amount can be reduced,
Similar effects can be obtained.
【００２５】実施例３ 図２を参照して、実施形態例４の研磨方法を具体的に説
明する。本実施例では、実施例２の同じ研磨パッド２
２、同じ研磨液を用いて、実施例２と同じ多芯コネクタ
１４を実施形態例４の方法により研磨した。先ず、 被
加工物冷却機構４２により多芯コネクタ１４を−２０℃
に冷却し、加圧機構３８により多芯コネクタ１４に３０
０g/cm2 の垂直方向荷重を与え、ノズル３０より研磨パ
ッド２２表面に１０秒毎に研磨液を１cc供給し、研磨定
盤２６を６０rpm で回転させて１０分間の加工を行っ
た。本実施例では、多芯光コネクタ２の接触面１８は表
面粗さ０. １５μmRmax 以下の良好な面が得られた。光
ファイバ挿入孔１６の周辺バリ量は平均０〜３μmと小
さく、良好に加工できた。 Embodiment 3 A polishing method according to Embodiment 4 will be specifically described with reference to FIG. In this embodiment, the same polishing pad 2 of the second embodiment is used.
2. The same multi-core connector 14 as in Example 2 was polished by the method of Embodiment 4 using the same polishing liquid. First, the multi-core connector 14 is set to −20 ° C. by the workpiece cooling mechanism 42.
To the multi-core connector 14 by the pressing mechanism 38.
A vertical load of 0 g / cm 2 was applied, 1 cc of the polishing liquid was supplied from the nozzle 30 to the surface of the polishing pad 22 every 10 seconds, and the polishing platen 26 was rotated at 60 rpm to perform processing for 10 minutes. In this embodiment, the contact surface 18 of the multi-fiber optical connector 2 has a good surface with a surface roughness of 0.15 μm Rmax or less. The peripheral burrs of the optical fiber insertion hole 16 were as small as 0 to 3 μm on average, and were satisfactorily processed.
【００２６】実施例４ 図３を参照して、実施形態例４の研磨方法を具体的に説
明する。本実施例では、実施例２の同じ研磨パッド２
２、同じ研磨液を用いて、実施例２と同じ多芯コネクタ
１４を実施形態例４の方法により研磨した。先ず、研磨
液冷却機構５２により研磨液を−１０℃に冷却し、加圧
機構３８により多芯コネクタ１４に３００g/cm2 の垂直
方向荷重を与え、ノズル３０より研磨パッド２２表面に
１０秒毎に研磨液を１cc供給し、研磨定盤２６を６０rp
m で回転させて１０分間の加工を行った。本実施例で
は、多芯光コネクタ２の接触面１８は表面粗さ０. １５
μmRmax以下の良好な面が得られた。光ファイバ挿入
孔１６の周辺バリ量は平均０〜３μm と小さく、良好に
加工できた。[0026] With reference to the embodiment 4 FIG. 3 will be specifically described the polishing method of the embodiment 4. In this embodiment, the same polishing pad 2 of the second embodiment is used.
2. The same multi-core connector 14 as in Example 2 was polished by the method of Embodiment 4 using the same polishing liquid. First, the polishing liquid is cooled to −10 ° C. by the polishing liquid cooling mechanism 52, a vertical load of 300 g / cm 2 is applied to the multi-core connector 14 by the pressurizing mechanism 38, and the nozzle 30 applies the polishing liquid to the surface of the polishing pad 22 every 10 seconds. 1 cc of the polishing liquid is supplied to the polishing table 26 at 60 rp.
Processing was performed for 10 minutes while rotating at m. In this embodiment, the contact surface 18 of the multi-core optical connector 2 has a surface roughness of 0.15.
A good surface of μmRmax or less was obtained. The average amount of burrs around the optical fiber insertion hole 16 was as small as 0 to 3 μm, and the optical fiber was successfully processed.
【００２７】実施例５ 図４及び図５を参照して、実施形態例６の研磨方法を具
体的に説明する。本実施例では、実施例２の同じ研磨パ
ッド２２、同じ研磨液を用いて、実施例２と同じ多芯コ
ネクタ１４を実施形態例５の方法により研磨した。本実
施例では、密閉型ケーシング６４上部の排気ダクト６２
で常に空気を吸引するため、密閉型ケーシング６４から
外部への空気の流れはない。加圧機構３８により多芯コ
ネクタ１４に３００g/cm2 の垂直方向荷重を与え、ノズ
ル３０より研磨パッド２２表面に１０秒毎に研磨液を１
cc供給し、研磨定盤２６を６０rpm で回転させて１５分
間の加工を行った。本実施例では、多芯光コネクタ２の
接触面１８は、表面粗さ０．２μmRmax 以下の面が得ら
れ、光ファイバ挿入孔１６の周辺バリ量も平均０〜６μ
m と小さい。また周囲にクレゾール臭も拡散せず良好な
加工を行うことができた。 Embodiment 5 A polishing method according to Embodiment 6 will be specifically described with reference to FIGS. In the present embodiment, the same multi-core connector 14 as in Embodiment 2 was polished by the method of Embodiment 5 using the same polishing pad 22 and the same polishing liquid of Embodiment 2. In this embodiment, the exhaust duct 62 on the upper part of the closed casing 64 is used.
Therefore, there is no flow of air from the closed casing 64 to the outside. A vertical load of 300 g / cm 2 is applied to the multi-core connector 14 by the pressure mechanism 38, and the polishing liquid is applied to the surface of the polishing pad 22 from the nozzle 30 every 10 seconds.
cc was supplied, and the polishing platen 26 was rotated at 60 rpm to perform processing for 15 minutes. In this embodiment, the contact surface 18 of the multi-core optical connector 2 has a surface roughness of 0.2 μm Rmax or less, and the amount of burrs around the optical fiber insertion hole 16 is 0 to 6 μm on average.
m and small. Also, good processing could be performed without the cresol odor being diffused around.
【００２８】実施例６ 図６を参照して、実施形態例７の研磨方法を具体的に説
明する。本実施例では、実施例２の同じ研磨パッド２
２、同じ研磨液を用いて、実施形態例６の同じようにし
て、実施例２と同じ多芯コネクタ１４を研磨した。本実
施例では、作業を行うために作業用窓６６を開けても、
吸気ファン６８により吸引され、周囲にクレゾール臭が
拡散することなく、良好な加工を行うことができた。 Embodiment 6 With reference to FIG. 6, a polishing method according to Embodiment 7 will be specifically described. In this embodiment, the same polishing pad 2 of the second embodiment is used.
2. The same multi-core connector 14 as in Example 2 was polished in the same manner as in Example 6 by using the same polishing liquid. In this embodiment, even if the work window 66 is opened to perform the work,
Good processing could be performed without being sucked by the intake fan 68 and diffusing the cresol odor around.
【００２９】実施例７ 図６を参照して、実施形態例７の研磨方法を具体的に説
明する。本実施例では、実施例２の同じ研磨パッド２
２、同じ研磨液を用いて、実施形態例６の同じようにし
て、実施例２と同じ多芯コネクタ１４を研磨した。本実
施例では、排液パイプ３２をタンク３４から外した瞬間
に、開閉弁７２を閉止することにより、排液タンク３４
の開口部が塞がれるため、排液処理の際にクレゾールの
臭気が周囲に拡散することが無かった。 Embodiment 7 With reference to FIG. 6, a polishing method according to Embodiment 7 will be specifically described. In this embodiment, the same polishing pad 2 of the second embodiment is used.
2. The same multi-core connector 14 as in Example 2 was polished in the same manner as in Example 6 by using the same polishing liquid. In this embodiment, the drainage tank 34 is closed by closing the on-off valve 72 at the moment when the drainage pipe 32 is removed from the tank 34.
Since the opening was closed, the odor of cresol did not diffuse to the surroundings during the drainage treatment.
【００３０】以上の実施例において、砥粒としてＳｉＣ
を用いているが、Ａｌ2 Ｏ3 、ダイヤモンド等を用いて
も同様の効果が得られる。In the above embodiment, SiC was used as the abrasive.
However, similar effects can be obtained by using Al 2 O 3 , diamond or the like.
【００３１】[0031]
【発明の効果】本発明方法によれば、クレオゾールを含
む研磨液を使用したり、研磨液を冷却したり、液晶ポリ
エステル製部材を冷却したりすることにより、液晶ポリ
エステル製フェルールを用いた多芯光コネクタの接触端
面を、光ファイバ挿入孔周辺にバリのない高精度な面に
加工でき、光ファイバを正確に位置決めし、芯出しする
ことができる。本発明に係る研磨装置は、本発明方法を
容易に実施できる研磨装置を実現している。According to the method of the present invention, by using a polishing liquid containing cresol, cooling the polishing liquid, or cooling a liquid crystal polyester member, a multifilament using a liquid crystal polyester ferrule is obtained. The contact end surface of the optical connector can be processed into a highly accurate surface without burrs around the optical fiber insertion hole, and the optical fiber can be accurately positioned and centered. The polishing apparatus according to the present invention realizes a polishing apparatus that can easily carry out the method of the present invention.
【図１】従来の研磨装置の構成を示す模式図である。FIG. 1 is a schematic diagram showing a configuration of a conventional polishing apparatus.
【図２】実施形態例４で使用する研磨装置の模式図であ
る。FIG. 2 is a schematic diagram of a polishing apparatus used in a fourth embodiment.
【図３】実施形態例５で使用する研磨装置の模式図であ
る。FIG. 3 is a schematic diagram of a polishing apparatus used in a fifth embodiment.
【図４】実施形態例６で使用する研磨装置の模式図であ
る。FIG. 4 is a schematic diagram of a polishing apparatus used in Embodiment 6;
【図５】密閉型ケーシングの構成を示す模式図である。FIG. 5 is a schematic view showing a configuration of a closed casing.
【図６】排液タンクの構成を示す模式図である。FIG. 6 is a schematic view illustrating a configuration of a drainage tank.
【図７】多芯光コネクタの接続を示す斜視図である。FIG. 7 is a perspective view showing the connection of the multi-core optical connector.
１０ 多芯コネクタ体 １２ ガイドピン １３ ガイドピン孔 １４ 多芯コネクタ １６ 光ファイバ挿入孔 １８ 接触面 ２０ 従来の研磨装置 ２２ 研磨パッド ２４ モータ ２６ 研磨定盤 ２８ 被加工物保持具 ３０ ノズル ３２ 排液パイプ ３４ 排液タンク ３６ 受け槽 ３８ 加圧機構 ４０ 実施形態例４で使用する研磨装置 ４２ 被加工物冷却機構 ５０ 実施形態例５で使用する研磨装置 ５２ 研磨液冷却機構 ６０ 実施形態例６で使用する研磨装置 ６２ 排気ダクト ６４ 密閉型ケーシング ６６ 作業用窓 ６８ 吸気ファン ７０ 扉 ７２ スイッチ DESCRIPTION OF SYMBOLS 10 Multi-core connector body 12 Guide pin 13 Guide pin hole 14 Multi-core connector 16 Optical fiber insertion hole 18 Contact surface 20 Conventional polishing device 22 Polishing pad 24 Motor 26 Polishing platen 28 Workpiece holder 30 Nozzle 32 Drainage pipe Reference Signs List 34 Drainage tank 36 Receiving tank 38 Pressurizing mechanism 40 Polishing device used in Embodiment 4 42 Workpiece cooling mechanism 50 Polishing device used in Embodiment 5 52 Polishing liquid cooling mechanism 60 Used in Embodiment 6 Polishing device 62 Exhaust duct 64 Sealed casing 66 Working window 68 Intake fan 70 Door 72 Switch
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.6，ＤＢ名) B24B 37/00 B24B 7/30 ──────────────────────────────────────────────────続 き Continued on front page (58) Field surveyed (Int.Cl. 6 , DB name) B24B 37/00 B24B 7/30
Claims (11)
パッドを回転させ、回転する研磨パッド面に研磨液を供
給しながら、研磨パッド面にプラスチック製部材の被研
磨面を接触させ押圧しつつ、研磨パッドに直交する軸の
周りに回転させ、又は研磨パッド面に沿って揺動させ
て、プラスチック製部材を研磨する研磨方法において、 研磨液として、プラスチック製部材を溶解する溶解液を
含む研磨液を用いることを特徴とするプラスチック製部
材の研磨方法。A polishing pad having an abrasive grain surface as a polishing pad surface is rotated, and while a polishing liquid is supplied to the rotating polishing pad surface, a polishing target surface of a plastic member is brought into contact with and pressed against the polishing pad surface. A polishing method for polishing a plastic member by rotating about an axis perpendicular to the polishing pad or swinging along the surface of the polishing pad, wherein the polishing liquid contains a dissolving liquid for dissolving the plastic member as a polishing liquid. A method for polishing a plastic member, characterized by using a liquid.
有する液晶ポリエステル製部材であって、溶解液がクレ
ゾールであることを特徴とする請求項１に記載のプラス
チック製部材の研磨方法。2. The method for polishing a plastic member according to claim 1, wherein the plastic member is a liquid crystal polyester member having an opening on a surface to be polished, and the solution is cresol.
０％の範囲にあることを特徴とする請求項２に記載のプ
ラスチック製部材の研磨方法。3. A polishing liquid having a cresol concentration of 20 to 5
3. The method for polishing a plastic member according to claim 2, wherein the amount is in a range of 0%.
する研磨圧力が、５０〜５００g/cm2 であることを特徴
とする請求項２又は３に記載のプラスチック製部品の研
磨方法。4. The method for polishing a plastic part according to claim 2 , wherein a polishing pressure for pressing the plastic member against the polishing pad is 50 to 500 g / cm 2 .
ることを特徴とする請求項２から４のいずれか１項に記
載のプラスチック製部材の研磨方法。5. The method for polishing a plastic member according to claim 2, wherein the polishing is performed while cooling the plastic member.
とを特徴とする請求項２から５のうちのいずれか１項に
記載のプラスチック製部材の研磨方法。6. The method for polishing a plastic member according to claim 2, wherein the freezing point of the polishing liquid is −20 ° C. or lower.
製の多芯コネクタであることを特徴とする請求項１から
６のいずれか１項に記載のプラスチック製部材の研磨方
法。7. The method for polishing a plastic member according to claim 1, wherein the plastic member is a multi-core connector made of liquid crystal polyester.
回転する研磨定盤と、下端に被加工物を保持して、研磨
パッドに被加工物を接触、押圧する被加工物保持具とを
備え、クレゾールを混入した研磨液を研磨パッド面に供
給しつつ液晶ポリエステル製部材を研磨パッドに接触、
押圧して研磨加工する研磨装置において、 被加工物及び研磨液の少なくとも一方を冷却する冷却機
構を備えていることを特徴とするプラスチック製部材の
研磨装置。8. A polishing platen having a polishing pad on its upper surface and rotating in a horizontal plane, and a workpiece holder for holding and holding a workpiece at a lower end thereof to contact and press the workpiece with the polishing pad. With the liquid crystal polyester member contacting the polishing pad while supplying a polishing liquid mixed with cresol to the polishing pad surface,
A polishing apparatus for pressing and polishing, comprising a cooling mechanism for cooling at least one of a workpiece and a polishing liquid.
回転する研磨定盤と、下端に被加工物を保持して、研磨
パッドに被加工物を接触、押圧する被加工物保持具とを
備え、クレゾールを混入した研磨液を研磨パッド面に供
給しつつ液晶ポリエステル製部材を研磨パッドに接触、
押圧して研磨加工する研磨装置において、 研磨定盤及び被加工物保持具とが、排気吸引装置に接続
された密閉容器内に収容されていることを特徴とするプ
ラスチック製部材の研磨装置。9. A polishing plate having an upper surface with a polishing pad and rotating in a horizontal plane, and a workpiece holder for holding and holding a workpiece at a lower end thereof and contacting and pressing the workpiece with the polishing pad. With the liquid crystal polyester member contacting the polishing pad while supplying a polishing liquid mixed with cresol to the polishing pad surface,
A polishing apparatus for performing polishing by pressing, wherein a polishing platen and a workpiece holder are housed in an airtight container connected to an exhaust suction device.
と、作業用覗き窓の近傍に設けられた吸い込みファンと
を備えていることを特徴とする請求項９に記載のプラス
チック製部材の研磨装置。10. The plastic member according to claim 9, wherein the closed container includes a work viewing window that can be opened and closed, and a suction fan provided near the work viewing window. Polishing equipment.
付き排液管を介して排液タンクを備ていることを特徴と
する請求項９又は１０に記載のプラスチック製部材の研
磨装置。11. The apparatus for polishing a plastic member according to claim 9, wherein the closed vessel is provided with a drainage tank below the polishing platen through a drainage pipe with an on-off valve. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3826498A JP2868011B1 (en) | 1998-02-20 | 1998-02-20 | Method and apparatus for polishing plastic members |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3826498A JP2868011B1 (en) | 1998-02-20 | 1998-02-20 | Method and apparatus for polishing plastic members |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2868011B1 true JP2868011B1 (en) | 1999-03-10 |
| JPH11235657A JPH11235657A (en) | 1999-08-31 |
Family
ID=12520475
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3826498A Expired - Fee Related JP2868011B1 (en) | 1998-02-20 | 1998-02-20 | Method and apparatus for polishing plastic members |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2868011B1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109420975A (en) * | 2017-08-22 | 2019-03-05 | 株式会社迪思科 | Grinding pad |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6009959B2 (en) * | 2013-02-06 | 2016-10-19 | 株式会社荏原製作所 | Liquid flow control device used in polishing equipment |
-
1998
- 1998-02-20 JP JP3826498A patent/JP2868011B1/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109420975A (en) * | 2017-08-22 | 2019-03-05 | 株式会社迪思科 | Grinding pad |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH11235657A (en) | 1999-08-31 |
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