JP2865953B2 - Infrared detector - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an infrared detector.
Infrared detectors can detect the presence, shape, and temperature of an object without touching the target object.
It is used in many fields such as meteorological observations by satellites, geological and resource surveys, and medical uses by infrared thermography.

In an infrared detector used in such a field, in order to enhance the detection sensitivity, a viewing angle of infrared light incident on an infrared detecting element from a detection target is appropriately adjusted, and the infrared light comes from a background other than the detection target. It is desirable to eliminate extra radiation. For this reason, generally, an aperture plate (cold aperture) provided with an infrared transmission window for field of view for limiting the viewing angle is arranged in front of each infrared detection element, and infrared light to be detected is passed through the transmission window. Is made to enter.

[0003] In the infrared detector having such an aperture, it is required to improve the reliability.

[0004]

2. Description of the Related Art FIGS. 3 and 4 are explanatory views of the prior art. FIG. 3 (A) is a plan view, FIG. 3 (B) is a side view, and FIG. FIG.

In FIG. 1, reference numeral 1 denotes a substrate made of sapphire or the like. A plurality of compound semiconductor crystals such as HgCdTe are arranged on the substrate 1, and electrodes are formed so as to sandwich these compound semiconductor crystals. A plurality of infrared detecting elements 2 having a portion are configured. When an infrared ray is incident on the infrared ray receiving section of each infrared ray detecting element 2, the resistance value between the electrodes changes according to the intensity, and this change is detected as a voltage change.

[0006] A pair of supports 3 are arranged on the substrate 1 near both ends in the arrangement direction of the infrared detecting elements 2. As best shown in FIG. 4, the support 3 is formed by depositing a low-melting metal on the substrate 1 by a predetermined thickness (h ₁ ).

Reference numeral 4 denotes an aperture plate having an infrared transmitting window at a position corresponding to each of the infrared detecting elements 2. The aperture plate 4 is placed between a pair of supports 3 and near both ends thereof. Are bonded and fixed by the adhesive 5. In addition, 6 is a cooling part.

[0008]

However, as shown in FIG. 3, when the aperture plate 4 is bonded, the adhesive 5 protrudes from the support 3 and is indicated by an arrow in FIG. As described above, the light may come around the both ends of the support base 3 or may flow out from the gap between the support base 3 and the aperture plate 4 to the infrared detecting element 2 side, thereby blocking the light receiving part of the infrared detecting element 2 or peeling off the electrode. And the like, and there is a problem that reliability and yield may be reduced.

The present invention has been made in view of such a point, and an object of the present invention is to prevent the sensitivity characteristic of the infrared detector from deteriorating due to the outflow of the adhesive when the aperture plate is attached, and to prevent the yield from lowering. That is.

[0010]

In order to solve the above-mentioned problems, an infrared detecting element formed on a substrate in an array is provided;
An infrared detector comprising: a pair of support bases which are opposed to each other so that the infrared detection element is located therebetween; and an aperture plate whose both ends are fixed to the substrate via the support base by an adhesive. Is configured as follows.

That is, the pair of support bases are formed to be elongated so that both ends thereof are located outside the aperture plate. Hereinafter, this is referred to as a first configuration. In addition to the first configuration, a support similar to the support is disposed between the infrared detecting element and the pair of supports. Hereinafter, this is referred to as a second configuration.

Further, in addition to the first configuration or the second configuration, a part of each of the supports is formed on the substrate by metal vapor deposition, and another part of each of the supports is connected to the aperture. The aperture plate is formed on the plate by metal deposition, and the aperture plate is fixed to the substrate with an adhesive while a part of the support and another part are pressed against each other. Hereinafter, this is referred to as a third configuration.

[0013]

According to the first aspect of the present invention, since both ends of the support stand are located outside the aperture plate, the adhesive is less likely to flow from the vicinity of both ends of the support stand toward the infrared detecting element. Become.

Further, according to the second configuration of the present invention, even if the adhesive wraps around from both ends of the outer support, or the adhesive flows out from the gap between the support and the aperture plate, the adhesive flows inside the support. Since another supporting base is provided, the flow of the adhesive into the infrared detecting element is prevented by the inner supporting base.

Further, according to the third configuration of the present invention, each support is divided into two, one of which is formed on the aperture plate by metal vapor deposition, and the other is formed by metal vapor deposition on the substrate. Is pressed and slightly deformed, so that the gap between the pressed portions is extremely small, and the outflow of the adhesive from this portion to the infrared detecting element side is extremely small.

[0016]

Embodiments of the present invention will be described below with reference to the drawings. 1 and 2 are explanatory views of an embodiment of the present invention. FIG. 1A is a plan view, FIG. 1B is a side view, and FIG. 2 is FIG.
FIG. 3 is a diagram showing details of a part a.

In FIG. 1, reference numeral 11 denotes a substrate made of sapphire or the like, on which a plurality of compound semiconductor crystals such as HgCdTe are formed in an array. An infrared detecting element 1 having a pair of electrodes formed so as to sandwich these compound semiconductor crystals and having an infrared light receiving portion
2 are configured. When an infrared ray is incident on the infrared ray receiving section of each infrared ray detecting element 12, the resistance value between the pair of electrodes changes according to the intensity, and this change is detected as a voltage change.

Reference numeral 13 denotes an aperture plate formed corresponding to each of the light receiving portions of the infrared detecting elements 12 and having an infrared transmitting window for limiting a visual field. The aperture plate 13 is formed by forming a metal film on the lower surface of a base material such as ZnS except for a portion serving as an infrared transmission window, and forming an antireflection film on the upper surface.

Reference numerals 14 and 15 denote supporting stands for supporting the aperture plate 13 from the infrared detecting element 12 with a predetermined gap therebetween. The supporting stands 14 and 15 are located near both ends in the arrangement direction of the infrared detecting element 12, respectively. Be placed.

The supports 14 and 15 are longer than the width of the aperture plate 13 as is apparent from FIG.
Both end portions are located outside the aperture plate 13. The supports 14 and 15 can be formed by depositing a low melting point metal on the substrate 11 as in FIG.

Further, the supports 14 and 15 can be configured as follows. Referring to FIG. 2, each of the support bases 14 and 15 includes a first member 14a, 15a and a second member 14b, 15b, respectively.
5a is formed by evaporating a low melting point metal on the substrate 11 at one time, and the second members 14b and 15b are formed by the aperture plate 12
A low-melting-point metal is formed by vapor deposition at a time. The reason why the metal deposition is performed at one time is to make the thickness of each of the first members 14a and 15a or each of the second members 14b and 15b uniform.

The thickness (h) of the first members 14a, 15a_Two)When
The thickness (h) of the second members 14b and 15b _Three) Sum is upper
Necessary separation dimension between the chaplate 13 and the substrate 11
(H₁) Is set to be larger by a small amount (Δt). Δ
The reason for setting to be larger by t is that the first member 14 to be performed later is used.
a, 15a and the second members 14b, 15b
This is because the shape is taken into account.

The first members 14a and 15a of the substrate 11 correspond to the second members 14b and 15b of the aperture plate 13, and the two members are pressed against each other. 1
Fix to 1. Due to the pressure contact, the first members 14a, 15a and the second members 14b, 15b are slightly deformed so as to fill the gaps therebetween, and the distance between the aperture plate 13 and the substrate 11 becomes appropriate.

According to this embodiment, as is apparent from FIG. 1A, when the aperture plate 13 is adhered to the substrate 11, the adhesive 1 is applied from the vicinity of both ends of the outer support base 14.
6 is less likely to wrap around. Even if the adhesive 16 goes around, the vicinity of both ends of the inner support 15 does not go around further.

Outer support 14 and aperture plate 1
Even if the adhesive 16 flows from the gap 3, the adhesive 16 is blocked by the inner support 15 and hardly flows into the infrared detecting element 12.

Furthermore, if the supports 14 and 15 are divided into the first members 14a and 15a and the second members 14b and 15b as described above, the flow of the adhesive 16 from the center of the support is extremely reduced. .

Therefore, the adhesive 16 is used for the infrared detecting element 12
, And the deterioration of the sensitivity and the separation of the electrodes due to the flow of the adhesive do not occur. Thus, a highly reliable infrared detector can be realized and the yield can be improved.

[0028]

Since the present invention is constructed as described above, when the aperture plate is bonded to the substrate,
It is possible to eliminate the degradation of sensitivity and the separation of electrodes caused by the flow of the adhesive into the infrared detecting element, thereby providing a highly reliable infrared detector and improving the production yield of the infrared detector. It works.

[Brief description of the drawings]

FIG. 1 is an explanatory view of an embodiment of the present invention, in which (A) is a plan view and (B) is a side view.

FIG. 2 is a diagram showing details of a part a in FIG. 1 (B).

FIG. 3 is an explanatory view of a conventional technique, wherein (A) is a plan view,
(B) is a side view.

FIG. 4 is a diagram showing details of a portion b in FIG. 3 (B).

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 Substrate 12 Infrared detecting element 13 Aperture plate 14, 15 Support base 16 Adhesive

──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Koji Hirota 1015 Uedanaka, Nakahara-ku, Kawasaki City, Kanagawa Prefecture Inside Fujitsu Co., Ltd. 56) References JP-A-2-309219 (JP, A) JP-A-3-60133 (JP, A) (58) Fields investigated (Int. Cl. ⁶ , DB name) G01J 1/00-1/02 G01J 5/00-5/04

Claims (3)

(57) [Claims] 1. A and the infrared detection elements arranged to form on a substrate, a first pair of supports to which the infrared sensing element is arranged opposite so as to be positioned between, the first pair of support And an aperture plate whose both ends are fixed to the substrate by an adhesive via a base, wherein both ends of the first pair of support bases are located outside the aperture plate. elongated form as the parts between the first pair of supports and the infrared sensing element
A second pair of supports similar to the first pair of supports.
The bases are arranged respectively, and the application position of the adhesive is adjusted at least by the first pair of supports.
An infrared detector, which is located near the outside of the support . 2. The infrared detector according to claim 1, wherein a part of each of the first and second pair of support bases is positioned in front of each other.
The other part of each of the first and second pair of supports formed on the substrate by metal deposition.
Is formed on the aperture plate by metal vapor deposition, and in a state where a part of the support base and another part are pressed against each other, the
An infrared detector, wherein an aperture plate is fixed to the substrate with an adhesive . 3. An infrared detector formed in an array on a substrate.
The device and the infrared device are opposed to each other so that the infrared device is located therebetween.
And a pair of support bases, and near both ends of the support base via the support bases
Aperture plate fixed to the substrate by an adhesive
An infrared detector comprising:
It is formed to be elongated so as to be located outside the rate, and a part of each of the pair of supports is metallized on the substrate.
Formed by deposition, the other portion of each of said pair of supports Apachi
Formed on a metal plate by metal vapor deposition, and in a state where a part of the support and another part are pressed against each other,
An aperture plate is fixed to the substrate with an adhesive, and the position where the adhesive is applied is at least the position of the pair of supports.
An infrared detector that is located near the outside .