JP2832421B2 - Variable electronic components - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION The present invention is constructed such that a rotor member is rotatably mounted on an upper surface of an insulating substrate, such as a variable chip resistor, and the resistance value or the like is adjusted by rotating the rotor member. The present invention relates to a variable electronic component.

[0002]

2. Description of the Related Art The basic structure of a conventional variable chip resistor 1 is as shown in FIGS. 5 to 9 on the upper surface of a ceramic insulating substrate 3 having through holes 2 opened on both upper and lower surfaces. 2 is a metal rotor having a substantially U-shaped planar shape coated thereon so as to surround the metal film 2 and a contact portion 5 elastically in contact with the resistive film 4 and having an annular planar shape. the member 6 is provided, and further become structure linked by eyelets shaft 8 passing through the through-hole 2 and the input electrode 7 provided on the lower surface of the front Kize' edge board 3 and the rotor member 6. A side electrode 9 is provided at one end of the resistive film 4.
The resistance value between the input and the input electrode 7 is changed by rotating the rotor member 6.

Next, a method of manufacturing the variable chip resistor 1 will be described. As shown in FIG. 7, an input electrode 7 is inserted through a through hole 2 of an insulating substrate 3 coated with a resistive film 4 from a lower opening.
The eyelet shaft 8 is penetrated through. Next, as shown in FIG. 8, the rotor member 6 is applied from above the insulating substrate 3, the eyelet shaft 8 penetrates the central opening 6 a of the rotor member 6, and the contact portion 5 is brought into contact with the resistance film 4. . Thereafter, as shown in FIG. 9, the eyelet shaft 8 and the rotor shaft 6 are crimped by pressing with a punch 11 of a press machine.

As a result, the rotor member 6 and the eyelet shaft 8 are crimped and stopped so as to be able to conduct electricity, and the large-diameter portion 8a formed on the lower surface of the eyelet shaft 8 and the input electrode 7 slide in a press-contact state. Become. As shown in FIG. 6, a flat cross-shaped locking portion 8b for locking a driver or the like is provided on the lower surface of the large diameter portion 8a.
Is formed, the tip of the driver is locked here and the eyelet shaft 8 is rotationally urged to rotate the rotor member 6.
Is rotated, and the contact portion 5 slides on the resistive film 4 to adjust the resistance.

When the variable chip resistor 1 is used, a large-diameter portion 8a is inserted into an opening 13 formed in a printed circuit board 12 as shown in FIG. That is, the resistance can be adjusted from the bottom, and the input electrodes 7 and the side electrodes 9 are solder-dipped into a circuit pattern (not shown).

[0006]

The components constituting the conventional variable chip resistor 1 can be roughly classified into an insulating substrate 3 coated with a resistive film 4, a rotor member 6, an input electrode 7, and an input to the rotor member 6. An eyelet shaft 8 and the like for connecting to the electrode 7 are provided, and roughly four components are required, and the number of components is increased. Moreover, the eyelet shaft 8 is not a simple rod, but is formed by processing the large-diameter portion 8a and the concave locking portion 8b, and the manufacturing cost is high.

Further, when manufacturing the variable chip resistor 1, the eyelet shaft 8 must be penetrated through the through hole 2 through the input electrode 7, and then caulked by the punch 11, which increases the number of working steps. . Therefore, the conventional variable chip resistor 1
In the configuration described above, both the number of parts and the number of man-hours are increased, and the cost of parts management is also increased. These factors increase the production cost.

An object of the present invention is to provide a method of manufacturing a variable electronic component capable of reducing both the number of parts and the number of production steps.

[0009]

According to the present invention, an adjusting film such as a resistive film is provided on one side surface of an insulating substrate having a through hole opened on both sides so as to surround the through hole. In a method of manufacturing a variable electronic component provided with a rotor member having a contact portion for a film, a connecting portion passing through a through hole of the insulating substrate is integrally formed at a central portion of the rotor member, and The input electrode is crimped to the connecting portion passing through the through hole together with the formation of the cross-shaped locking portion.

[0010]

The connecting part formed integrally with the rotor member is formed by an insulating base.
Through the through hole of the plate, the engagement of the cross-shaped input electrodes to the lower end
Since crimping stop with the formation of the stop portion, another member for connecting the rotor member and the input electrode becomes unnecessary, it is possible to reduce the number of parts. In addition, at the time of manufacturing, the positioning operation of the rotor member and the operation of penetrating the through-hole of the connecting portion are simultaneously performed, and the drive for rotating the rotor member is performed.
Cross-shaped locking part that locks the tip of the rivet etc. prevents caulking
Formed at the time, the positioning of the rotor
Work and separate forming work of the locking portion can be reduced, and the overall man-hours can be reduced.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a variable electronic component to which the present invention is applied will be described below with reference to FIGS. In the description of the embodiments, the configuration of a variable chip resistor, which is an example of a variable electronic component, will be described, and then a method of manufacturing the variable chip resistor will be described. 1 is a sectional view showing the configuration of the variable chip resistor, FIG. 2 is a bottom view, FIG. 3 is an exploded sectional view showing a method of manufacturing the variable chip resistor, and FIG. It is.

The configuration of the variable chip resistor 21 according to the present embodiment will be described. The variable chip resistor 21 is formed by coating a resistance film 24 having a substantially U-shaped planar shape on the upper surface of a ceramic insulating substrate 23 having through holes 22 opened on both upper and lower surfaces so as to surround the through hole 22. A rotor member 26 having a circular shape in plan view and having a contact portion 25 with the resistance film 24 is provided, and a central portion of the rotor member 26 is further narrowed to be integrally formed. The input electrode 27 is provided at the lower end with a cross-shaped locking portion 28a.
It is formed and crimped.

A side electrode 29 is provided at one end of the resistance film 24, and the resistance between the side electrode 29 and the input electrode 27 is adjusted by rotating the rotor member 26. The input electrode 27 has a plate shape as shown in FIG. 2, a part of which extends to a lower portion of the insulating substrate 23, and a tip thereof is bent along the insulating member 23, so that the input electrode 27 is used at the time of resistance adjustment described later. The rotation of the electrode 27 is prevented. At the lower end of the connecting shaft 28, a flat cross-shaped locking portion 28a is formed at the time of crimping work using a punch or the like described later, and the tip of a driver or the like is locked here to rotate and bias the rotor member. 26 rotates integrally, and the resistance between the input electrode 27 and the side electrode 29 is adjusted.

As is apparent from the above configuration, in the variable chip resistor 21 of the present embodiment, the eyelet shaft described in the conventional example is unnecessary, and the number of parts which require a high processing cost is reduced. In addition, the number of manufacturing steps can be simplified as described below, and together, the manufacturing cost can be significantly reduced.

Next, a method of manufacturing the variable chip resistor 21 will be described. As shown in FIG. 3, a connection portion 28 formed integrally with the rotor member 26 is passed through the through hole 22 from above the insulating substrate 23 to which the resistive film 24 is applied. The connecting portion 28 has a pipe shape, and its total length is set to be longer than a thickness dimension obtained by adding the thickness of the insulating substrate 23 and the thickness of the input electrode 27. Therefore, the connecting portion 28 is connected as shown in FIG.
And, as shown by arrow A in FIG.
Further, at the stage where the through hole 27a of the input electrode 27 is made to penetrate the lower end, the lower end of the connecting portion 28 projects below the input electrode 27 as shown by the imaginary line in FIG.

In this state, the central portion of the rotor member 26, in other words, the base of the connecting portion 28 is held down from above, and the connecting portion 28
Is pressed so that the tip of the punch 31 is pushed into the hollow part 28b from the lower end of the punch 31. The tip of the punch 31 has a cross-shaped chevron shape, and is gradually pushed into the hollow portion 28b from the tip by pressurizing, and at the same time, the connecting portion 28 is squeezed outward by the tapered surface to be crimped to the input electrode 27. I do.

Next, when the punch 31 is removed, a trace of the punch 31 biting into the connecting portion 28 remains, and a cross-shaped locking portion 28a is formed as shown in FIG. Then, a driver or the like is locked in the locking portion 28a, and the rotor member 26 is rotated by urging the rotation.
4 to adjust the resistance.

The variable chip resistor 21 is mass-produced, and an outline of mass production will be described below with reference to FIG. That is, the input electrodes 27 are formed on the metal frame 32 at predetermined intervals by punching or the like. The insulating substrate 23 positioned at a predetermined position during manufacturing
Of positioning the input electrode 27 at the bottom, align it heavy input electrode 27 on the bottom of the insulating substrate 23. As a result, the through hole 2
2, 27a communicate with each other, and then the connecting portion 28 is passed through the through hole 22. After the crimping is performed as described above, the input electrode 27 is separated from the frame 32.

As described above, in the variable chip resistor 21 according to the present embodiment, since the connecting shaft 28 is formed integrally with the rotor member 26, the positioning of the rotor member 26 and the operation of penetrating the connecting portion 28 are simultaneously performed. Thus, both the number of parts and the number of work steps can be reduced.

[0020]

As described above, according to the present invention,
To form a pipe-shaped connecting portion together in Russia over data member, penetrates the connecting section in a through hole formed in the insulating substrate in the production, formation of the locking portion of the cross-shaped input electrodes to the lower end
Since so as to crimp stop with, eliminating the need for separate members for connecting the input electrode and Russia over data member, it is possible to reduce the number of parts.

In addition, since the operation of positioning the rotor member and the operation of penetrating the through-hole of the connecting portion are performed at the same time during manufacturing, the number of operation steps can be reduced , and
It is necessary to separately form a locking part for locking the tip of a bar, etc.
Work is reduced, and the number of parts
The manufacturing cost can be significantly reduced in combination with the reduction in the number of work steps .

[Brief description of the drawings]

FIG. 1 is a sectional view showing a configuration of a variable chip resistor according to an embodiment of the present invention.

FIG. 2 is a bottom view showing a configuration of a variable chip resistor.

FIG. 3 is an exploded cross-sectional view illustrating a method of manufacturing a variable chip resistor.

FIG. 4 is an exploded perspective view showing a method for manufacturing a variable chip resistor.

FIG. 5 is a sectional view showing an example of a conventional variable chip resistor.

FIG. 6 is a plan view showing a configuration of a conventional variable chip resistor.

FIG. 7 is a cross-sectional view of a main part showing a penetrating operation of the eyelet shaft.

FIG. 8 is a sectional view showing a positioning operation of the rotor member.

FIG. 9 is a cross-sectional view showing a caulking operation using a punch.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 21 Variable chip resistor 22 Through-hole 23 Insulating substrate 24 Resistance film 25 Contact part 26 Rotor member 27 Input electrode 28 Connecting part 28a Locking part 29 Side electrode 31 Punch 32 Frame

Claims (1)

(57) [Claims] 1. An adjusting film such as a resistive film is provided on one side surface of an insulating substrate having a through hole formed on both side surfaces so as to surround the through hole, and a contact portion for the adjusting film is provided. In the method of manufacturing a variable electronic component provided with the rotor member, a pipe-shaped connecting portion is integrally formed at the center of the rotor member, and the pipe-shaped connecting portion is formed through the through-hole of the insulating substrate and the input electrode. Manufacturing of a variable electronic component in which a cross-shaped chevron-shaped punch having a tapered surface is pushed into the pipe from the end of the pipe-shaped connecting portion, and the input electrode is crimped to the connecting portion. Method.