JP2829304B2 - Zr alloy plating method on ceramic - Google Patents

Zr alloy plating method on ceramic

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Publication number
JP2829304B2
JP2829304B2 JP4339411A JP33941192A JP2829304B2 JP 2829304 B2 JP2829304 B2 JP 2829304B2 JP 4339411 A JP4339411 A JP 4339411A JP 33941192 A JP33941192 A JP 33941192A JP 2829304 B2 JP2829304 B2 JP 2829304B2
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JP
Japan
Prior art keywords
ceramic
plating
alloy
bath
metal
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Expired - Fee Related
Application number
JP4339411A
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Japanese (ja)
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JPH06207295A (en
Inventor
誠 河瀬
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Individual
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Individual
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Priority to JP4339411A priority Critical patent/JP2829304B2/en
Publication of JPH06207295A publication Critical patent/JPH06207295A/en
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Publication of JP2829304B2 publication Critical patent/JP2829304B2/en
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Expired - Fee Related legal-status Critical Current

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  • Electroplating Methods And Accessories (AREA)

Description

【発明の詳細な説明】 [0001] [産業上の利用分野]本発明は、電気めっき法によりセ
ラミック上にZrまたはZr合金めっきする方法に関す
る。 [0002] [従来の技術とその問題点]セラミック上をZrまたは
Zr合金で被覆した複合材料は、優れた耐食性と耐熱性
を有し、また熱中性子吸収断面積が小さいことから、そ
の開発が期待されている。従来一般に、セラミックをZ
rまたはZr合金で被覆する方法としては、真空蒸着
法、CVD法、ろう付け法によるものがある。真空蒸着
法、CVD法は、Zrの沸点が高いために装置構成が複
雑化し、大量生産規模で実用化されたものはない。ろう
付け法もまた、Zrの沸点が高いために装置構成が複雑
化し、密着性、平滑性、均一性に乏しい。このため比較
的安価に大量生産でき、密着性、平滑性、均一性にすぐ
れた被覆法が要望されていた。 [0003] [問題を解決するための手段]この発明は、Zrイオン
を含有したLiCl−KCl系の溶融塩のめっき浴に
て、金属にセラミックを接触させているセラミック付き
金属電極の金属部にZrを電解析出させ、同時にセラミ
ック上にZrまたはZr合金めっきさせることにより、
セラミック上ヘZrおよびZr合金を被覆できるように
した。これらの被膜の成長は、金属とセラミックの接触
部分からセラミック上ヘ二次元的に成長していく。セラ
ミック付き金属電極の金属部にZr,Ti,Fe,Ni
を用いた場合、セラミック上にZr被膜が形成され、金
属部にAlを用いた場合、セラミック上にZr−Al合
金被膜が形成される。このZr−Al合金の組成はめっ
き条件によって変化する。めっき条件としては、めっき
浴のZrイオン濃度を1.5×10−2mol/dm
にし、Zrイオン濃度のバランスを保つために陽極に金
属Zrを用い、Zrの陽極溶解を行った。また浴温を5
00〜560℃にして、直流電流またパルス電流により
電流密度0.4〜1.5A/dmでめっきする。さら
に均一なめっきを行うために浴を撹拌することが望まし
い。浴温を500〜560℃の範囲にするのは、Zrイ
オンが450〜560℃の範囲において、2価、4価の
原子価を取り、温度によってその存在比が変化し、45
0℃付近では4価,550℃付近では2価で安定に存在
するという性質を持つため、450℃ではZrの析出が
Zr(IV)→Zr(II)→Zrのような2段階反応
となり、安定してZrを析出できない。つまり安定して
Zrを析出させるためには低原子価のイオンが必要とな
るため、500℃以下でのめっきは困難である。またZ
rClは450℃付近において、かなり揮発性が高
く、浴中のZrイオン濃度が減少するために、均一なめ
っきが得られない。逆に560℃より高くなると、浴の
分解が起こるという欠点を持つ。次に電流密度に関して
は、電流密度が0.4A/dmより低いと、金属部へ
のZrの析出は起こるがセラミック上へのめっきが困難
となる、また1.5A/dmより高いと、密着性の良
い均一なめっきは得られず、粉末状または樹枝状に析出
する。 [0004] [実施例] [0005]実施例1 Alを主成分とするセラミックの板状試験片(2
mm厚×20mm長×10mm巾)をめっき母材に用
い、表面をアセトン脱脂し、10%硝酸で酸洗および水
洗処理し、乾燥させた後、陰極となる電極(素材Zr,
Ti,Fe,Ni2mm厚×9mm長×10mm巾)と
接するように取り付けた。次にこのセラミック付き電極
を乾燥させた後、乾燥Ar雰囲気にした溶融塩めっき浴
を使用して下記の条件で電気めっきを施した。その結
果、どの素材の電極においても、めっき表面が灰色を呈
し、均一で密着性の良いZrめっきが形成された。 [0006]実施例2 実施例1と同じセラミックの板状試験片に、陰極となる
電極(素材Al 2mm厚×9mm長×10mm巾)と
接するように取り付け、実施例1と同様にして、電気め
っきを施した。その結果、めっき表面が銀白色を呈し、
均一で密着性の良いZr−Al合金めっきが形成され
た。組成分析をした結果、被膜の組成はZr45.1a
t%,Al54.9at%であった。 [0007] [めっき条件] 浴組成: LiCl:KCl=58.5mol%:4
1.5mol% 浴 温: 540℃ 添加物: Zrイオン 1.5×10−2mol/d
電流密度:0.4〜0.9A/dm 陽 極: Zr 時 間: 3時間
Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for plating Zr or a Zr alloy on ceramic by electroplating. [0002] [Conventional technology and its problems] A composite material in which ceramic is coated with Zr or a Zr alloy has excellent corrosion resistance and heat resistance, and has a small thermal neutron absorption cross-sectional area. Expected. Conventionally, ceramics are generally Z
As a method of coating with an r or Zr alloy, there are a vacuum deposition method, a CVD method, and a brazing method. The vacuum evaporation method and the CVD method have a complicated apparatus configuration due to the high boiling point of Zr, and none of them has been put to practical use on a mass production scale. The brazing method also has a complicated apparatus configuration due to the high boiling point of Zr and is poor in adhesion, smoothness and uniformity. For this reason, there has been a demand for a coating method which can be mass-produced relatively inexpensively and has excellent adhesion, smoothness and uniformity. [0003] [Means for solving the problem] The present invention relates to a metal part of a metal electrode with ceramic in which a ceramic is brought into contact with a metal in a plating bath of a LiCl-KCl-based molten salt containing Zr ions. By electrolytically depositing Zr and simultaneously plating Zr or Zr alloy on ceramic,
Zr and Zr alloy can be coated on the ceramic. These films grow two-dimensionally on the ceramic from the contact portion between the metal and the ceramic. Zr, Ti, Fe, Ni on metal part of metal electrode with ceramic
Is used, a Zr film is formed on the ceramic, and when Al is used for the metal part, a Zr-Al alloy film is formed on the ceramic. The composition of the Zr-Al alloy changes depending on the plating conditions. The plating conditions were such that the Zr ion concentration of the plating bath was 1.5 × 10 −2 mol / dm 2
Then, in order to maintain the balance of the Zr ion concentration, metal Zr was used for the anode, and the anode was dissolved in Zr. Also set the bath temperature to 5
The temperature is set to 00 to 560 ° C., and plating is performed at a current density of 0.4 to 1.5 A / dm 2 by a direct current or a pulse current. It is desirable to stir the bath to achieve more uniform plating. The reason for setting the bath temperature in the range of 500 to 560 ° C. is that Zr ions take divalent and tetravalent valences in the range of 450 to 560 ° C., and the abundance ratio changes depending on the temperature.
Since it has the property of being tetravalent at around 0 ° C. and divalent at around 550 ° C., Zr precipitates at 450 ° C. in a two-step reaction such as Zr (IV) → Zr (II) → Zr, Zr cannot be deposited stably. That is, low-valent ions are required to stably precipitate Zr, so that plating at 500 ° C. or lower is difficult. Also Z
rCl 4 has a considerably high volatility at around 450 ° C., and a uniform plating cannot be obtained because the concentration of Zr ions in the bath decreases. Conversely, if the temperature is higher than 560 ° C., there is a disadvantage that the bath is decomposed. Next, regarding the current density, when the current density is lower than 0.4 A / dm 2 , Zr is deposited on the metal part but plating on the ceramic becomes difficult, and when the current density is higher than 1.5 A / dm 2. In addition, uniform plating with good adhesion cannot be obtained, and precipitates in a powdery or dendritic form. [0004] [Example] [0005] Example 1 A ceramic plate-like test piece containing Al 2 O 3 as a main component (2
mm thickness × 20 mm length × 10 mm width) was used as a plating base material, the surface was degreased with acetone, pickled and washed with 10% nitric acid, and dried.
Ti, Fe, Ni 2 mm thick x 9 mm long x 10 mm wide). Next, after drying the electrode with ceramic, electroplating was performed under the following conditions using a molten salt plating bath in a dry Ar atmosphere. As a result, the plating surface of each of the electrodes of any material was gray, and Zr plating with uniform and good adhesion was formed. [0006] Example 2 The same ceramic plate test piece as in Example 1 was attached so as to be in contact with the electrode serving as the cathode (material: Al 2 mm thick x 9 mm length x 10 mm width). Plating was applied. As a result, the plating surface has a silvery white color,
Uniform and good adhesion Zr-Al alloy plating was formed. As a result of composition analysis, the composition of the film was Zr45.1a.
t% and Al 54.9 at%. [Plating conditions] Bath composition: LiCl: KCl = 58.5 mol%: 4
1.5 mol% bath temperature: 540 ° C. Additive: Zr ion 1.5 × 10 −2 mol / d
m 2 current density: 0.4~0.9A / dm 2 positive electrode: Zr at between: 3 hours

Claims (1)

(57)【特許請求の範囲】 [請求項1] Zrイオンを含んだ溶融塩のめっき浴に
て、金属にセラミックを接触させた電極を用い、金属部
にZrを電解析出させ、同時にセラミック上にZrめっ
きすることを特徴とするセラミック上ヘのZrめっき方
法。 [請求項2] Zrイオンを含んだ溶融塩のめっき浴に
て、金属にセラミックを接触させた電極を用い、Al部
分にZrを電解析出させ、同時にセラミック上にZr−
Al合金めっきすることを特徴とするセラミック上への
Zr−Al合金めっき方法。
(Claim 1) [Claim 1] In a plating bath of a molten salt containing Zr ions, Zr is electrolytically deposited on a metal portion using an electrode in which ceramic is brought into contact with a metal, and at the same time, ceramic is deposited. Zr plating method on a ceramic, wherein Zr plating is performed on the ceramic. [Claim 2] In a plating bath of a molten salt containing Zr ions, Zr is electrolytically deposited on an Al portion using an electrode in which ceramic is brought into contact with a metal, and Zr-
A method for plating a Zr-Al alloy on a ceramic, comprising plating an Al alloy.
JP4339411A 1992-11-05 1992-11-05 Zr alloy plating method on ceramic Expired - Fee Related JP2829304B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4339411A JP2829304B2 (en) 1992-11-05 1992-11-05 Zr alloy plating method on ceramic

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4339411A JP2829304B2 (en) 1992-11-05 1992-11-05 Zr alloy plating method on ceramic

Publications (2)

Publication Number Publication Date
JPH06207295A JPH06207295A (en) 1994-07-26
JP2829304B2 true JP2829304B2 (en) 1998-11-25

Family

ID=18327223

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4339411A Expired - Fee Related JP2829304B2 (en) 1992-11-05 1992-11-05 Zr alloy plating method on ceramic

Country Status (1)

Country Link
JP (1) JP2829304B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2799475B1 (en) * 1999-10-11 2002-02-01 Centre Nat Rech Scient METHOD OF METALLIZING AN ELECTROCHEMICAL INSULATING SUBSTRATE

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0361304A (en) * 1989-07-27 1991-03-18 Nkk Corp Manufacture of complex material

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Publication number Publication date
JPH06207295A (en) 1994-07-26

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