JP2829151B2 - Conductive material bonding element and circuit configuration - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductive material bonding element comprising a bonding pair of two materials having different conductivity types, an output circuit and a coil of an electromagnetic device for converting an input signal into an output in various forms by using electromagnetic force. The present invention relates to a configuration of an electromagnetic device circuit in which the elements are connected and inserted in series in a coupling circuit.

[0002]

2. Description of the Related Art Conventionally, a bonding pair of two materials having different conductivity types has been used as a thermoelectric element, in which a thermoelectromotive force generated by giving a steady temperature difference between the bonding portions of the bonding element is used as a kind of battery, and a motor is externally provided. It has been used as a thermoelectric generator to connect loads such as lamps and extract power to operate them.Also, a relatively large DC current is applied to the junction element, and Peltier heat absorption and heat generated at the junction are used for cooling and temperature control. Was. In these cases, the amount of Joule heat generated by the flowing current and the amount of conduction heat flowing through the low-temperature junction from the high-temperature junction serve as losses in effective power generation and cooling, and the effect is extremely large.
In addition, a heat exchanger such as a large fin is required at the joint to improve the efficiency.

On the other hand, a coil is generally connected to an output circuit of an electromagnetic device, and by passing an output signal current through the coil, a magnetic field generated in the coil is changed in accordance with the output signal. It is converted into a desired form such as image display and record display. Conventionally, such an electromagnetic device is directly connected without any component such as an electronic element in a coupling circuit between an output circuit and a coil,
It has been difficult to obtain an output faithful to the input signal.

[0004]

However, in such an output circuit of a conventional electromagnetic device, especially in the vicinity of the zero point of the current where the current polarity of the output signal sharply reverses, the interference between the coil and the external magnetic field may occur. The normal output signal is disturbed by a noise current generated by the electromagnetic induction voltage, and this is repeated, thereby causing irregular standing wave noise to be generated and grown near the zero level of the output signal.

[0005] In addition, many other electric and electronic components such as transformers, resistors, capacitors, and semiconductor elements are connected and built in the electromagnetic device in addition to the coils. The output current including the standing wave noise is generated by these components. Under the influence of electrical components such as inductance, conductance, and capacitance of components, thermal noise, and material properties such as electron scattering, the standing wave noise near the zero level of current is further promoted, and sometimes As a result, noise having a large energy due to the interference is generated.

[0006] These standing wave noises are superimposed on a regular output signal that should be faithful to the input signal, and the signal on the input side cannot be faithfully converted. Such conventional electromagnetic devices make the conversion of the input signal into audio, video, data recording, etc. inaccurate and unclear, lose their scientific and artistic abilities, or impair the human audiovisual nerve. Inspire mischief, social environment, arts and culture,
It has a profound effect on mental health and science and technology. Leaving this as it is is a serious socially unacceptable problem.

SUMMARY OF THE INVENTION It is an object of the present invention to solve the above-mentioned drawbacks of the conventional electromagnetic device and to provide a good electromagnetic device which faithfully reproduces an input signal by an extremely effective and inexpensive method.

[0008]

SUMMARY OF THE INVENTION In order to achieve the above object, the present invention provides a structure comprising a joining pair of two materials having different conductivity types, a very simple and inexpensive conductive material joining element, and It is characterized by a circuit configuration of a simple electromagnetic device in which the elements are connected and inserted in series in a coupling circuit between an output circuit and a coil of the electromagnetic device.

The two materials having different conductivity types of the conductive material joining element inserted and connected in series in the tie circuit between the output circuit and the coil have an absolute thermoelectric power of 5 at room temperature.
It has a value of ⁰ μVK ⁻¹ or more, a resistivity of 1 × 10 ⁴ Ω · m or less, and a thermal conductivity of 10 Wm ⁻¹ K ⁻¹ or less. Therefore, the conductive material joining element formed by joining the two is:
The relative thermopower at room temperature has a large value of 100 μVK ⁻¹ or more, the sum of the resistivity has a small value of 2 × 10 ⁴ Ω · m or less, and the sum of the thermal conductivity has a small value of 20 Wm ⁻¹ K ⁻¹ or less; It is characterized in that it has no rectifying action in the part.

[0010]

According to the present invention, a conductive material bonding element of the present invention and a circuit in which the element is connected in series in a coupling circuit between an output circuit of an electromagnetic device and a coil are connected to a junction of the element by an output signal current flowing through the element. Heat is absorbed or generated by the Peltier effect in proportion to the relative thermopower of the element and the current flowing through the element and the absolute temperature thereof, depending on the direction of the current flowing through the element at both opposing electrode portions. The Peltier heat absorption and heat generation are affected by Joule heat generated by the electric resistance of the element and conduction heat flowing through the element from high temperature to low temperature. The influence of the Joule heat and the conduction heat is relatively small, and transiently causes an unsteady temperature difference mainly due to the Peltier effect between the element junction and the two electrodes opposed thereto, and this temperature difference is An unsteady back electromotive force is generated at both electrode portions of the element due to the Seebeck effect proportional to the relative thermopower of the element.

[0011] These phenomena are caused by the rapid action of electrons in the junction boundary layer at the junction of the element, and the current caused by the inverse electromagnetic induction voltage caused by the inductance of the coil, which is the main cause of the standing wave, is generated. Very good electromagnetic devices can be achieved by acting quickly to suppress cancellation, thereby removing harmful standing waves and maintaining a regular output signal that is faithful to the input signal.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to the drawings. FIG. 1 shows a conductive material bonding element of the present invention, FIG. 2 shows a circuit configuration of an audio equipment using the element, FIG. 3 shows an electronic image display circuit configuration, and FIG. 4 shows a deflection "saw" waveform in the electronic image display circuit. Is shown.

As shown in FIG. 1, the conductive material bonding element (1) of the present embodiment comprises a p-type material (2) and n-type materials having different conductivity types.
Lead wires (7) and (8) are connected as electrode terminals to the material end faces (5) and (6) on the opposite side of the joining portion (4). Forming a boundary layer. FIG. 1A shows a conductive material bonding element obtained by bonding bulk materials. FIG. 1 (b) shows a conductive material bonding element in which a thin film or thick film material is bonded. FIG. 1 (c) shows a conductive material joining element in which a bulk material is joined in a triangle shape using a joining metal piece (9).

When a current flows from the p-type (2) to the n-type (3) in such a junction element (1), for example, the junction (4)
Has a Peltier heating value α _R I proportional to the relative thermopower α _R of the element (1), the current I and the absolute temperature T ₄ of the junction (4).
T ₄ , while the two electrodes (5) and (6) have the relative thermopower α _R of the element (1), the current I and the electrode (5),
(6) yields a total α _R IT _5.6 of Peltier endotherms proportional to the absolute temperature T _5.6 . As a result, the joint (4)
Rises in temperature, and both electrodes (5) and (6) fall in temperature.
The temperature difference ΔT changes transiently under the influence of the Joule heat I ² R due to the electrical resistance R of the element and the heat flow rate KΔT due to the thermal conductance K which is the reciprocal of the thermal resistance. However, the abrupt change in the signal current according to the present invention is relatively little affected by the Joule calorific value and the heat flow rate, and the temperature difference ΔT is extremely rapid and transient mainly due to the Peltier heat absorption and heat generation. varying with the temperature T _h of Seddai portion (4), the electrodes (5), at the time when the temperature of (6) becomes _{T c,} the junction (4) and the electrodes (5), During (6), the transient temperature difference ΔT _t = _Th −
Yields _Tc .

The generated transient temperature difference ΔT _t causes a transient back electromotive force α _R ΔT proportional to the relative thermopower α _R of the element due to the Seebeck effect between the two electrodes (5) and (6). give. When a transient signal current flows from the p-type (2) to the n-type (3), the electrode (5) has a positive voltage polarity and the electrode (6) has a negative voltage polarity. When the direction of the signal current flowing through the element is reversed, the junction temperature, the temperature of both electrode portions, and the voltage polarity of the electrodes are reversed.

The Peltier heat absorption, heat generation and Seebeck back electromotive force are applied to the junction (4) of the element and both electrodes (5),
This is caused by the extremely agile behavior of electrons based on the signal output in the junction boundary layer of (6), and this is caused by the inductance component of the coil when the direction of the current flowing through the coil circuit of the electromagnetic device is suddenly reversed. The reverse electromagnetic induction voltage generated near the point and causing the standing wave noise is promptly suppressed and suppressed, the output signal is maintained in a normal waveform faithful to the input signal, and the output signal is remarkably improved. Therefore, the conductive material joining element of the present invention has a new function different from the conventional thermoelectric element in thermoelectric power generation and thermoelectric cooling, and has a large heat exchanger for absorbing and dissipating heat at the joint. It is not necessary to attach a heat exchanger with a large heat capacity to the junction in order for the element to functionally follow minute and sudden changes in the signal current of the electromagnetic device. It is rather a hindrance due to the function of the element and its mountability in the electromagnetic device circuit.

As shown in Table 1, as materials having different conductivity types, the absolute thermoelectric powers of metals and compounds are measured and shown as a thermoelectric series in the order of their magnitudes. Large materials exist. Suitable materials include thermoelectric semiconductor materials. This material is
Absolute value of absolute thermoelectric power | α |
(ΜVK ⁻¹ ), the resistivity ρ (Ω · m) and the thermal conductivity

Since κ (Wm ⁻¹ K ⁻¹ ) is low, the effect of generating the temperature difference ΔT _t by the Peltier effect and the generation of the back electromotive force αΔT _t (V) by the Seebeck effect for the same current are large. . z = α ² ρ ⁻¹ κ ⁻¹ is generally called a figure of merit of a thermoelectric material, and a bonding element using a conductive material having a large value is regarded as a good conductive material bonding element of the present invention.

More specifically, examples of materials used for the conductive material bonding element are as follows: at present, bismuth tellurium-based materials, lead-germanium-tellurium-based materials, silicon-germanium-based materials having a large figure of merit z near room temperature. , Selenium compound-based materials, iron silicide materials, and the like.

Examples of the bismuth tellurium-based p-type material include (Sb ₂ Te ₃ ) _A (Bi ₂ Te ₃ ) _B (Sb ₂ S
e ₃ ) _C , where A = 70-72, B = 23-27, C
= 3 to 5 to which Te was added as a donor.

Examples of n-type materials of the same type include (Bi ₂
Te ₃ ) _D (Sb ₂ Te ₃ ) _E (Bi ₂ Se ₃ ) _F , provided that D = 90 to 98, E = 0 to 50, F = 2 to 5 and Sb
There is a material to which a metal halide such as I ₃ and HgBr ₂ is added as a donor. These p-type and n-type materials each have an absolute thermoelectric power at room temperature of 180 μVK
⁻¹ or more, the resistivity is 1 × 10 ⁻⁵ Ω · m or less, and the thermal conductivity is 1.6 Wm ⁻¹ K ⁻¹ or less. Therefore, all of them have a figure of merit at room temperature of 2 × 10 ⁻³ K ^{− 1} or more.

These materials are prepared by a crystal growth method using directional solidification, a cold or hot pressing powder sintering method, a vapor deposition method, a sputtering method, a cluster ion beam method, a plating method,
It can be formed into a bulk, thin film or thick film by a method such as a plasma jet method, a discharge method, and a printing method.
Further, the pn junction can be formed simultaneously or continuously during the production process of these materials.

The conductive material bonding element of the present invention can be formed extremely small, light and inexpensively by bonding using a small amount of the above-mentioned materials having different conductivity types.

In the conductive material bonding element of this embodiment, the bismuth-tellurium-based p-type and n-type materials at room temperature have an absolute thermoelectric power of 200 μVK ⁻¹ and a resistivity of 1 × 10
⁻⁵ Ω · m, thermal conductivity of 1.5 Wm ⁻¹ K ⁻¹ , and therefore a figure of merit of 2.7 × 10 ⁻³ K ⁻¹ and dimensions of 0.4 ×
A device having a size of 0.4 × 1.3 mm to 3.0 × 3.0 × 2.5 mm was soldered to the shape shown in FIG. 1A or FIG. However, this joining method,
The material properties, dimensions and shapes are examples and do not limit the scope of the invention in any way. If thermoelectric materials having a better figure of merit are developed, they can be effectively used as the conductive material of the present invention.

FIG. 2 shows an acoustic device as an example of an electromagnetic device. At least one conductive material joining element of the present invention is connected in series to a coupling circuit between an acoustic output circuit of an amplifying circuit of the acoustic device and a voice coil. 7 is an embodiment of an electromagnetic device circuit of the present invention to be inserted. Conventional audio equipment has two types of speakers: electrodynamic type and electrostatic type.
Most are electrokinetic. This embodiment relates to an electrodynamic speaker circuit. In an electrodynamic loudspeaker, a diaphragm having a voice coil, that is, a coil part of a vibration system is placed in a magnetic field of a magnet, and when an acoustic current flows through the coil, the diaphragm vibrates due to an electromagnetic induction action to emit sound waves. When the original sound is silent, the acoustic drive current of the speaker is 0, the voice coil is at the neutral point of the vibration system, and the voice coil of the speaker, that is, the diaphragm must not be vibrated. However, at the neutral point of such a vibration system, it is difficult to generate noise in an area that should be silent by easily following weak mechanical and electromagnetic forces even when viewed from an elastodynamic point of view. It is clear. After the vibration of the vibration system due to the original sound current, the vibration system remains mechanically elastic in the neutral point region where the sound should be silenced. Inevitable above. The mechanical residual vibration of the coil portion causes a current caused by a back electromotive force caused by an electromagnetic induction action between the coil and the magnetic field to flow through the voice coil, and this radiates noise, that is, noise at a neutral point region where noise should be generated. Makes sound indistinct and unpleasant. This noise is further fed back to the voice coil and causes electrical interference, and such a phenomenon is repeatedly and repeatedly superimposed.
The reproduced sound contains standing wave noise due to these acoustic and electrical interferences, and sometimes extremely complex and harmful noises which are not present in the original sound having high energy such as resonance and resonance. This noise is likely to occur at the neutral point of the voice coil, and in the neutral point area where it is supposed to be silent, it mixes with the reproduced sound of the audio equipment as an unpleasant sound that irritates the auditory nerve that is not in the original sound, and impairs the sound quality .

FIG. 2 (a) shows an example in which one conductive material bonding element is connected in series to the circuit (10) of the monaural speaker (9 '). FIG. 2 (b) shows an example in which one element is connected to each of the circuits (10) and (11) of the monaural speaker (9 '), and a total of two elements are connected in series. Fig. 2 (c)
Shows an example in which one element is connected and inserted in series to a common circuit of a stereo speaker (9 ′), that is, a common (12). FIG. 2 (d) shows an example in which one element is connected to each of the left and right circuits (13) and (14) of the stereo speaker (9 '). The conductive material bonding element of the present invention and a circuit in which this is connected and inserted in series in a coupling circuit of an audio device and a speaker voice coil are connected by an acoustic current flowing through the element at the element bonding part and the two bonding parts opposed thereto. Depending on the direction of the current flowing through the element,
Heat absorption or heat generation occurs due to the Peltier effect in proportion to the relative thermopower of the element, the current flowing through the element, and its absolute temperature. When the element (1) is connected so that a current flows from the p-type (2) to the n-type (3), Peltier heat is generated in the element junction (4), and the electrode junctions (5), ( 6), Peltier heat absorption occurs, and the element junction (4) becomes higher in temperature than the electrode junctions (5) and (6), and the element junction (4) and the electrode junctions (5) and (6) become hotter. )
At the same time, a positive electromotive force is generated by the Seebeck effect at the electrode junction (5) and a negative one at (6). This back electromotive force suppresses the counter electromagnetic induction electromotive force generated by the interaction between the coil and the magnet magnetic field generated when the acoustic current becomes 0, and causes the standing wave generated near the 0 level. Suppress noise.

FIG. 3 shows an embodiment of an electromagnetic device circuit according to the present invention in which an electronic image display device such as a television receiver is used as an example of an electromagnetic device, and a conductive material bonding element is used in this output circuit. 2. Description of the Related Art In an electronic image display device, a synchronous deflection circuit is used to correctly reproduce an image. This circuit controls the direction of the electron beam irradiating the phosphor screen so that the assembly and inspection of the video signal on the image receiving side coincides with the timing of the disassembly and inspection on the image transmitting side. Generally, in an electronic image display apparatus, two sets of horizontal and vertical deflection coils (15) and (16) are placed vertically and horizontally on the neck of a picture tube.
As shown in FIG. 7A, the frequency is about 15.734 KHz for the horizontal coil and about 59.94 H for the vertical coil, respectively.
The zigzag wave current ABC whose current direction changes repeatedly around the zero point of the current having the scanning line period t _s and the retrace period t _b in the drawing of FIG. A force is applied in the direction of the vector sum of the forces due to the magnetic fields of the respective coils, and the electron beam is deflected up and down, left and right, and a prescribed row of luminescent spots, ie, a raster, is obtained on the phosphor screen.

However, an electron beam runs in the air core of the deflection coil circuit, and the circuit includes an electric component having an inductance component such as a deflection coil and a transformer, and the electric current in the current direction of the "saw" wave is included in the circuit. A back electromotive voltage due to electromagnetic induction is generated at a point in the vicinity of the reversal, particularly at the point where the current crosses the zero point during the period of BC, and this is repeated, so that the area around the zero level of the “saw” wave current is obtained. As shown in FIG. 4 (b), an irregular standing-wave noise current is always standing, and this is superimposed on a regular "saw" wave current. ”Wave current, which causes a deviation from the regular raster. As a result, the electronic image display reproduced on the phosphor screen becomes extremely unclear.

In the embodiment of the present invention, as shown in FIG. 3, the terminals (17) and (18) of the horizontal deflection coil (15), the horizontal deflection output terminals (21) and (22) and the vertical deflection coil (16) ) Are connected in series with, for example, the coil terminals (17) and (20) in the middle of the wiring connecting the terminals (19) and (20) and the vertical deflection output terminals (23) and (24). As shown in the figure, the material joining element (1) has a circuit configuration in which each one is connected.

Taking the horizontal deflection circuit (15) having such a circuit configuration as an example, the horizontal deflection output terminal (22) has a positive polarity of a "saw" wave, and the element (1) has an n-type ( When the connection is made so that a current flows from 3) to the p-type (2), the element junction (4) absorbs Peltier heat,
Peltier heat is generated at the electrode junctions (5) and (6), and the temperature of the element junction (4) becomes lower than that of the electrode junctions (5) and (6). (5),
A temperature difference is generated between (6) and (6), and the temperature difference generates a positive electromotive force due to the Seebeck effect at the electrode junction (5) and a negative value at (6).

The current due to the Seebeck back electromotive force suppresses the counter electro-magnetic induced electromotive force current due to the interaction between the coil and the current which causes the standing wave generated when the “saw” wave current crosses the zero point. . This effect is the same regardless of the polarity of the element and the horizontal deflection output terminal.

A similar phenomenon occurs in the process of reversing the current direction of the "saw" wave of the horizontal and vertical deflection coil circuits, and the normal "saw" waveform of the electronic image display device can be maintained at all times. As a result, a clear electronic image display faithful to the input signal can be obtained with a very regular raster.

In the embodiment in which the element is inserted in series into the cathode of the picture tube of a color television and the video output circuit, black, white and intermediate colors are particularly good, and small characters and displays are clearly displayed. It became so.

The insertion location of the conductive material bonding element of this embodiment is an example, and does not specify the insertion location of the element in the electromagnetic device.

[0035]

As described above, the conductive material bonding element of the present invention has a very simple structure, unlike conventional thermoelectric elements used for thermoelectric power generation based on a steady temperature difference or thermoelectric cooling based on a steady DC current. The element does not require a special heat exchanger for heat absorption and heat radiation, and is extremely small, lightweight, inexpensive, and can be manufactured in large quantities. Further, the electromagnetic circuit having the conductive material mounting element of the present invention can be realized by an extremely simple operation of connecting and inserting the element in series with the connecting circuit between the signal output circuit and the coil of the conventional electromagnetic device and the coil. it can.

As the electromagnetic device, in addition to the audio equipment and the electronic image display device described in the embodiments, a large number of switching regulators, tape recorders, pen recorders, input transformers, microphones, transmitting antennas, inverters, converters and the like are used. However, the conductive material bonding element of the present invention can be easily added and connected to a coupling circuit between the signal output circuit and the coil of the existing electromagnetic device, but the effect is remarkable. The electromagnetic device circuit with is regarded as a very novel invention. Also,
Although it is not an electromagnetic device, it is effective in preventing standing waves due to inductance which is inevitably generated in design in electronic printed circuits, electronic wiring, and the like.

In addition, a coil circuit such as an electromagnetic device to be manufactured in the future requires an extremely simple operation when manufacturing the conductive material bonding element of the present invention in the middle of the output circuit printed circuit board portion, the coil terminal portion, or the coil circuit wiring. It can be added inexpensively in the process.

The electromagnetic device or the like having the conductive material bonding element according to the present invention provides an extremely high-quality electromagnetic device or the like in which standing wave noise generated in a coil circuit is removed over the entire output frequency band. .

Therefore, the conductive material bonding element of the present invention and the circuit having the same in an electromagnetic device or the like can be used not only in industrial applications but also in all social environments, arts and culture, mental health and science and technology using electromagnetic devices and the like. The contributions are extremely large.

[Brief description of the drawings]

FIG. 1 is a view showing a configuration of a conductive material bonding element according to the present invention, and FIG. 1 (a) shows an element in which a bulk material is bonded. FIG. 2B shows an element in which thin-film / thick-film materials are joined. Figure (c)
The figure shows the structure of a device in which a bulk material is bonded in a metal strip shape.

FIG. 2 is a diagram showing an embodiment of a coil circuit of an audio equipment having a conductive material joining element according to the present invention, wherein FIG.
(B) is a monaural speaker circuit, FIGS. (C) and (d)
Is an example using the element in a stereo speaker circuit.

FIG. 3 is an embodiment of a horizontal or vertical deflection coil circuit of an electronic image display device having a conductive material bonding element according to the present invention.

FIG. 4 is a diagram showing a “saw” waveform, and FIG.
Is a regular “saw” waveform, and FIG. 2B is an irregular “saw” waveform with standing wave noise superimposed.

[Description of sign]

 (1) Conductive material bonding element (2) P-type conductive material (3) N-type conductive material (4) pn junction (5) P-side electrode (6) N-side electrode (7) P-side lead wire (8 ) N-side lead wire (9) bonded metal piece (9 ') speaker, receiver, earphone, etc. (10) monaural speaker wiring (11) monaural speaker wiring (12) stereo speaker wiring (common) (13) stereo speaker wiring (left) (14) Stereo speaker wiring (right) (15) Horizontal deflection coil (16) Vertical deflection coil (17) Horizontal deflection coil terminal (18) Horizontal deflection coil terminal (19) Vertical deflection coil terminal (20) Vertical deflection coil terminal (21) Horizontal deflection output circuit terminal (22) Horizontal deflection output circuit terminal (23) Vertical deflection output circuit terminal (24) Vertical deflection output circuit terminal

[Table 1]

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-58-10874 (JP, A) JP-A-1-106478 (JP, A) (58) Fields investigated (Int. Cl. ⁶ , DB name) H01L 35/28 H01L 35/32 H04R 1/28 310

Claims (2)

(57) [Claims] 1. A method for joining two materials 2 and 3 having different conductivity types.
Part 4 and on each of the material end faces opposite the joints
A junction pair including the electrode portions 5 and 6 , wherein (a) the absolute value of the absolute thermoelectric power of each conductive material is 50 μm at room temperature;
And it has a large value of VK ^-1 or more, (b) and that each of the conductive material has a 1 × 10 ⁴ Ω · m or less small resistivity at room temperature, in (c) conductive material at normal temperature Each Having a small thermal conductivity of 10 Wm ^-1 K ^-1 or less;
And that there is no rectifying action at (d) the junction,
(E) When a transient current flows through the joint 4,
Indeterminate due to Peltier effect between part 4 and between electrodes 5 and 6
A normal temperature difference occurs, and the temperature difference is caused by the Seebeck effect.
A back electromotive force is generated between the two electrode portions 5 and 6 . 2. A circuit configuration wherein the conductive material bonding element according to claim 1 is connected and inserted in series into a coupling circuit including an output circuit of an electromagnetic device and a coil.