JP2808948B2 - Electronics - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to electronic equipment such as a cable television receiver.

[0002]

2. Description of the Related Art A conventional technique will be described below with reference to the drawings.

FIG. 5 is a perspective view of a high-frequency module, and FIG. 6 is an assembly view when the high-frequency module is mounted on an electronic device.

In FIG. 5, reference numeral 1 denotes a high-frequency module, on the front of which a connector 2 as a signal input terminal is mounted. Reference numeral 3 denotes a screw fastening hole provided on the upper surface of the high frequency module 1.

Next, the assembly of the high-frequency module 1 will be described with reference to FIGS. In FIG. 6, reference numeral 4 denotes a shield case, and the high-frequency module 1 is mounted on a part of the shield case 4. The high-frequency module 1 and the shield case 4 penetrate a screw 5 into a fixing hole 4 a on the upper surface of the shield case 4. And high frequency module 1
It was fixed by screwing it into the screw hole 3 on the upper surface. Further, in FIG.
Was fixed to the shield case 4 by soldering at a soldered portion 6.

The plug 2 of the shield case 4 assembled in this manner is fitted into a through hole 9 provided in a rising wall 8 of a chassis 7 and fixed with a nut 10, and is attached to a side plate of the chassis 7. It was fixed to the fixing hole 11 provided by screwing together with the fixing side 13 of the shield case 4 with a screw 12.

[0007]

However, in such a conventional configuration, the high-frequency module 1 and the shield case 4 are fixed by the screw 5 and the high-frequency module 1 is fixed.
And the shield case 4 must be fixed by soldering with a soldering portion 6, and furthermore, the side plate of the chassis 7 and the fixed side 13 of the shield case 4 need to be fixed together by screws 12 and the like. It was very difficult.

An object of the present invention is to solve such a problem, and an object of the present invention is to provide an electronic device to which a high-frequency module can be easily attached.

[0009]

In order to achieve this object, an electronic apparatus according to the present invention includes a chassis having a rising wall provided with a through hole, a main board mounted in the chassis, and A high-frequency module having a connector fitted into the hole from the inside of the chassis to the outside, and a sub-substrate provided with a convex portion on the lower side is mounted on a side surface of the high-frequency module, and the main substrate is attached to the main substrate. Has a configuration in which a positioning hole into which the projection is inserted is provided.

[0010]

With this configuration, the positioning of the high frequency module can be easily performed by inserting the convex portion of the sub-substrate attached to the side surface of the high frequency module into the positioning hole provided in the main substrate. .

[0011]

An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is an assembled sectional view of one embodiment of the present invention, and FIG. 2 is a perspective view of a high-frequency module block. FIG. 3 is a perspective view of the chassis, and FIG. 4 is a side view of a main part.

In FIG. 2, reference numeral 21 denotes a high-frequency module.
Is installed. A sub-substrate 23 is mounted on a side surface of the high-frequency module 21 to form a high-frequency module block 24. Further, two projections 25 are formed on the bottom surface of the sub-substrate 23.

FIG. 3 is a perspective view of the metal chassis 26. Reference numeral 27 denotes a rising wall provided integrally with the chassis 26. The rising wall 27 is provided with a hole 28 into which the plug 22 is inserted, and projections 29 and 30 for positioning the high-frequency module 21 in the vertical direction.
The projections 29 and 30 are formed by cutting and raising the rising wall 27. The distance D1 between the protrusions 29 and 30 is slightly larger than the height D2 of the high-frequency module 21. In addition, the convex portion 29 has the L-shaped cutout portion 2.
9a.

FIG. 4 is a side view of a main part when the high-frequency module 21 is mounted on the chassis 26.

In FIG. 4, the distance between the lower side 30a of the projection 30 and the upper side 29b of the L-shaped cutout of the projection 29 is D1.
This distance is the height dimension D of the high-frequency module 21.
Slightly larger than 2.

The lower side surface 30a of the projection 30 has a taper that expands outward. Numeral 31 denotes a spacer fitted in the plug 22, and the thickness D3 of the spacer is substantially equal to the distance D4 between the other surface 29c of the L-shaped notch and the rising wall.

FIG. 1 is an assembled sectional view. 32 is a main board mounted on the chassis 26.

Reference numerals 32a and 32b denote rectangular holes provided on the main board 32. Two convex portions 25 provided on the lower side of the sub board 23 are inserted into the holes 32a and 32b, respectively. You. Bottom dimension D5 of projection 25
Is about 70% of the dimension D6 of the hole 32b provided in the main board 32. On the other hand, the dimension D7 of the hole 32a is larger than the dimension D6 of the hole 32b, and is about twice as large as D5. With this dimensional relationship, the high-frequency module block 24 can be easily inserted.

That is, the plug 2 of the high-frequency module 21
2 is inserted into the through hole 28, and then the high-frequency module 21 is inserted.
The upper end surface 21a is brought into contact with the convex portion 30 and is rotated in the direction C in FIG. At this time, since the hole 32a is large, the high-frequency module block 24 can be easily inserted.

Reference numeral 23a denotes a second projection provided between the two projections 25, which is lower than the height of the projection 25. The projection 23a abuts on the main board 32 to maintain the height relationship between the high-frequency module block 24 and the main board 32.

The assembling method of the electronic device configured as described above will be described below. As shown in FIG. 2, the sub-board 23 is mounted on the high-frequency module 21, and the spacer 31 is inserted into the plug 22. As shown in FIG. 1, the high-frequency module block 24 is first inserted with the plug 22 into the through hole 28, and then the high-frequency module upper surface 2
1a is brought into contact with the projection 30 while the projection 2
5 is inserted into the hole 32a of the main board 32. Subsequently, while rotating the high-frequency module block 24 in the direction C in FIG.
Insert into b. Then, the nut 33 is fastened to the plug 22 to fix the high-frequency module block 24 and the rising wall 27 of the chassis 26.

As described above, according to the present embodiment, the projection 25 of the sub-substrate 23 mounted on the side surface of the high-frequency module 21
With positioning holes 32 a provided in main board 31.
By inserting the nut 33 into the plug 32 and the nut 32b, the positioning before the nut 33 is tightened to the plug 22 can be surely performed, and the tightening of the nut 33 can be simplified.

The rising wall 27 of the chassis 26
Is provided with a convex portion 29 and a convex portion 30 for fitting the high-frequency module 21 to the high-frequency module 21 when the nut 33 is tightened or removed.
Can be prevented from rotating in the rotation direction E or F (FIG. 2).

Further, by providing the raised wall 27 of the metal chassis 26 with the raised portions 29 and 30 formed by cutting and raising a part of the raised wall, the ground connection between the high-frequency module 21 and the raised wall 27 is established. Easy and reliable. Further, the high-frequency module 21
No material such as a mounting bracket is required to attach the mounting member to the chassis 26.

Also, an L-shaped notch 29a is provided in a projection 29 provided on a rising wall 27 of the chassis 26, and a taper 30a which extends outward is provided in the other projection 30. Insert the spacer 31 into
By making the dimensions D3 and D4 (FIG. 4) substantially equal, the positioning of the rising wall 27 and the high-frequency module 21 can be performed. Here, the taper 30a is for positioning the high-frequency module 21 in the vertical direction.

Further, the lower side 23a of the sub-substrate 23 of the high-frequency module 21 is brought into contact with the main substrate 32, so that the positioning of the high-frequency module block 24 in the vertical direction can be simplified.

[0028]

As described above, according to the present invention, a chassis having a rising wall provided with a through hole, a main board mounted in the chassis, and a through hole extending from the inside of the chassis to the outside. A high-frequency module having a connector fitted to the main board, a sub-substrate provided with a convex portion on the lower side is mounted on a side surface of the high-frequency module, and By providing the holes described above, there is an effect that the positioning of the high-frequency module before fastening with the plug can be easily performed, and the mounting can be easily performed.

Further, since the high-frequency module block 7 can be fixed with one nut, the number of parts and man-hours are reduced.

[Brief description of the drawings]

FIG. 1 is a sectional view of an electronic apparatus according to an embodiment of the present invention.

FIG. 2 is a perspective view of a high-frequency module block of an electronic device according to an embodiment of the present invention.

FIG. 3 is a perspective view of a chassis of the electronic device according to the embodiment of the present invention.

FIG. 4 is a side view of a main part of an electronic device according to an embodiment of the invention.

FIG. 5 is a perspective view of a conventional high-frequency module.

FIG. 6 is a perspective view of a conventional high-frequency module block.

FIG. 7 is a perspective view of a conventional electronic device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 21 High frequency module 22 Plug 23 Sub board 25 Sub board convex part 26 Chassis 27 Rising wall 28 Through hole 32 Main board 32a, 32b Positioning hole

Claims (5)

(57) [Claims] 1. A high-frequency device comprising: a chassis having a rising wall provided with a through-hole; a main board mounted in the chassis; and a plug fitted into the through-hole outward from the chassis. An electronic device comprising a module, wherein a sub-substrate provided with a convex portion on a lower side is mounted on a side surface of the high-frequency module, and a positioning hole for inserting the convex portion is provided on the main substrate. 2. The electronic apparatus according to claim 1, wherein a convex portion for positioning the high-frequency module in a vertical direction is provided on a rising wall of the chassis. 3. A projection provided on a rising wall of a chassis,
3. The electronic device according to claim 2, wherein a part of the rising wall is cut and raised. 4. An L-shaped notch is provided on one of the two protrusions provided on the rising wall of the chassis, and the other protrusion is provided with a taper extending outward. 4. The electronic device according to claim 3, wherein a spacer is inserted into the plug. 5. The electronic device according to claim 1, wherein the lower side of the sub-board contacts the main board.