JP2807171B2 - Electrical interconnection contact device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention deals with an electrical interconnection contact device in a broad sense. The present invention relates to a technique for interconnecting with a corresponding terminal provided on a printed circuit board for interfacing with a tester, with the intention of making it look like.
A preferred embodiment according to the invention relates to a contact for performing such an interconnection and to means for mounting the contact.

[0002]

2. Description of the Prior Art There are many proposals for implementing an electrical connection between two conductors. Among them, the most important proposal is to use a lead of an integrated circuit device and a conductive pad or terminal group on a printed circuit board that functions to realize an interface between the integrated circuit device and a device such as a tester. , Are interconnected. Such a device is used to evaluate the characteristics of the integrated circuit device.

[0003] Many inventions relate to the configuration employed for interconnecting the integrated circuit device with the printed circuit board. All of these requirements include electrical and mechanical considerations.

[0004] In one known example intended to achieve the objects of the present invention, the structure of a Yamaic contact is disclosed.
hi Contact). This type of contact includes an inverted L-shaped support and a cantilevered connection at the distal end of the generally horizontal leg of the inverted L-shaped support. . The connection is generally extended in parallel with the leg. The distal end of the connection is bent upward so that the connection point is more likely to be in contact with the lead of the integrated circuit device, thereby making contact with the lead. On the other hand, the support is connected to or through pads or terminals of the printed circuit board by a certain method.

One of the mechanical considerations that must be taken into account when designing such interconnect devices is that the wiping action must be performed between the leads of the integrated circuit device and the contacts themselves. It must be realized. This ensures such a connection. Such sliding action functions to achieve maximum effective connection in terms of possible oxide structures. In fact, such a sliding operation can form a good interface to be formed between the leads and the contacts of the integrated circuit device.

[0006] The sliding operation is achieved by the fact that the cantilever-shaped connecting portion of the yam contact has a certain degree of flexibility. Another mechanical consideration to be taken into account is the requirement to prevent bending of the leads of the integrated circuit device. Yamaichi contacts do not completely achieve this goal.

[0007] A final point of such mechanical considerations is that the sliding operation is preferably implemented at the interface between the printed circuit board and the second end of the contact. From the viewpoint of the structure of the contact, it is excluded that such a sliding operation is realized at the lower end of the contact.

Further, Yamaichi's device provides an electrical description for such an electrical interconnect contact device.
ictates) is not considered enough. Such interconnect contacts need to be fast, have short paths, and in addition such contacts need to have low inductance without having controlled impedance requirements. In view of the structure of the Yamaichi contacts, Yamaichi contacts do not adequately satisfy such requirements.

US Pat. No. 4,445,735, issued May 1, 1984, describes another type of electrical interconnect device. The device of the patent contributes to making an electrical connection between the contacts of the network on the substrate and the connection pads of the network on the printed circuit board. This device improves the Yamaichi contact in that it is faster and has lower inductance than the Yamaichi device. The device has an elastic structure for mounting one or more contacts within a housing. The application of the elastic bias and the elastic grip can realize the sliding operation at both the upper end and the lower end of the contact. That is, the end connected to the lead of the integrated circuit device and the end connected to the contact pad of the printed circuit board are both slid along the surfaces to be brought into contact with each other.

[0010] US Patent No. 4,445,735 describes:
Certain restrictions are in place. That is, while providing the sliding motion at both the upper and lower ends of the contact, the resilient element generally provides a bias rather than being a free floating support for the contact. Therefore, the amount of the sliding operation is relatively limited. As a result of the mounting means used in U.S. Pat. No. 4,445,735, there is a general tendency for the contact to shrink somewhat generally in the vertical direction. There is a slight horizontal motion component for realizing the dynamic motion. Furthermore,
The lack of significant free floating effects causes the leads of the integrated circuit device being tested to bend.

The present invention addresses these shortcomings of the prior art. That is, the present invention is an improved electrical interconnect contact device that seeks to address the shortcomings of the prior art and overcomes those problems.

[0012]

SUMMARY OF THE INVENTION The present invention electrically interconnects a lead of an integrated circuit device with, for example, a terminal of a printed circuit board at a predetermined distance from a corresponding lead of the integrated circuit device. Is an assembling apparatus that functions in the following manner. An apparatus according to the present invention includes a housing disposed between a lead of the integrated circuit device and a correspondingly spaced terminal. The housing is provided with at least one slot extending partially or entirely from a first surface of the housing to a second surface opposite the housing. One or more slots are arranged to extend substantially parallel to the axis on which the corresponding integrated circuit device leads and spaced terminals are arranged.

The first surface of the housing has a single truncated portion (tr) near a position of a lead of the integrated circuit device.
ough) is formed and a similar grind is formed on the second surface of the housing. The jaws on the second surface are located near terminals provided at intervals corresponding to the leads of the integrated circuit device.

[0014] A rigid first element is received in a collar provided on the first surface and extends across any slot in which one or more contacts are received. ing. A resilient second element is received within the jaw formed on the second surface of the housing and extends across any one or more slots in which contacts are received. It has been impatient. The resilient second element has some compressibility and tensile extendability.
Is provided.

[0015] A generally planar contact is disposed in one or more slots, each contact having a protrusion extending outwardly from a first surface of the housing. And thereby connect to the leads of the integrated circuit device. Each contact also has a nub extending vertically outwardly from the housing toward a second surface of the housing, which connects to a correspondingly spaced terminal. It is. Further, each contact is provided with a hook portion near the nub of the contact, the hook portion surrounding the resilient second element and securing the contact to the resilient second element. .

Each contact has an elongated channel formed therein for receiving the rigid first element, along which the element is relatively movable. Such relative movement occurs when the protrusion of the contact contacts the lead of the integrated circuit device and is directed into the interior of the housing by the lead of the integrated circuit device. The device is operable to perform a sliding motion as a result of the relative movement of the rigid first element along a channel formed in such a contact, and in such operation. Means that the protrusions of the contacts move along the leads of the integrated circuit device to which they are connected, and that the nubs of the contacts are connected to correspondingly spaced terminals on the printed circuit board. It moves along.

In one embodiment according to the present invention, the jaws formed on the first surface of the housing are substantially symmetric with respect to a plane perpendicular to the first surface. The axis of the extended portion of the channel formed in each contact has an angle with respect to such a plane. Typically in such embodiments, the jaws formed on the second surface of the housing are formed laterally offset from the jaws formed on the first surface. I have. A channel at the contact is received within the contact because a particular lead of the integrated circuit device is connected to the corresponding contact protrusion and the lead generates a downward pressure on the protrusion. The contact moves relative to the rigid first element, the contact rotates to some extent as a result of the relative movement of the rigid first element relative to the contact, and the element forms on the contact. Deeper into the channel.

The downward force on the contact caused by the leads of the integrated circuit device is in the X-axis direction and in the Y-direction.
It will have a component along the axial direction, so that such component will effect a substantial rotation of the contact.
As a result, the protrusion is to some extent laterally moved along the surface of the lead of the integrated circuit device with which it is in contact, and the nub of the contact is the It moves to some extent laterally along the terminals of the circuit board.

In another embodiment of the present invention, a plurality of slots are provided, each receiving the contact. Typically, a plurality of contacts are used, each of which corresponds to each lead of the integrated circuit device. In such a specific example, the printed circuit board is provided with a plurality of terminals, each of which is connected to one of a plurality of contacts in a group.

In such a multiple contact embodiment, an additional second resilient element is used. Such an additional second resilient element is disposed within a second jaw formed on the second surface of the housing, and has an original second resilient element relative to the rigid first element. It is arranged symmetrically with the element. The contacts in adjacent slots can be arranged in a staggered manner with respect to one another. (That is, each contact is alternately engaged with the original second elastic element and the additional second elastic element.)
By providing such a structure, twice the connection density per unit length can be obtained.

In such an embodiment, there is no need to provide a sharp to receive the rigid element. Since there are at least two oppositely acting cooperating contacts, the rigid element will be maintained in the channels of the contacts. Since the channels are angled in opposite directions, they act to hold the rigid element in place, such as a jaw.

Another embodiment according to the present invention uses an elastic and extended element instead of the rigid element for the ridge formed on the first surface in the housing. In this embodiment, instead of the extended channel as in the first embodiment, it is possible to use a hook portion provided at the upper end portion of the contact and near the protrusion of the contact. It is. Such a contact will latch against the upper elastic element as it acts on the lower elastic element. In this embodiment, the contact is in a more free floating state than in each of the embodiments described above.

A final embodiment of the present invention relates to electrically interconnecting both the device leads and the terminals at some distance from the leads when they are in the same planar surface. . In this embodiment, the housing is similar to the other embodiments. That is, a slot is formed in the housing, and the slot extends substantially parallel to an axis extending between the corresponding lead and the remote terminal. However, on the surface adjacent to the slot, a first jaw is formed near the lead and a second jaw is formed near the remote terminal.

In this embodiment, a resilient element is received in each jaw. The contacts received in the slot are:
A nub extending outwardly from the surface and engaging the remote terminal; and a protrusion extending outwardly from the same surface and engaging the lead. The first and second resilient elements maintain proper contact as previously disclosed.

The present invention is an electrical interconnect contact device that improves upon the prior art devices. The more detailed features of the invention or the advantages obtained from such features will become apparent from the following detailed description of the invention, the appended claims and the drawings.

[0026]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. In the figures, like reference numerals indicate like elements throughout the several views.
FIG. 1 shows a housing 20 for mounting a plurality of contacts 22 according to the present invention. Housing 20 shown in FIG.
Shows a housing that can be used virtually in all embodiments of the present invention, but in some embodiments changes could be made, generally independent of the mounting of the contacts. .

Although some portions of the housing 20 have been removed in FIG. 1, at least seven slots 24 formed through the housing 20 can be counted in the figure. The rightmost one of the slots 24 is depicted in cross-section so that only one of the side walls 26 of the slot 24 is visible.

Although seven slots 24 are shown,
Only four contacts 22 are shown as being located in slots 24. However, typically, contacts 22 are mounted in each slot 24 provided in housing 20, but it will be understood that this is not essential. In addition, it is understood that any number of slots 24 can be provided and could be arranged in multiple arrangements. For example, four arrangements of slots 24 forming a quadrilateral could be used. Such an arrangement allows the housing 20 according to the present invention to interconnect a printed circuit board 28 that interfaces with a tester mechanism (not shown) and, for example, leads 30 of a leadless chip carrier integrated circuit device 32. Will be used when it is. FIG. 1 therefore merely illustrates a basic housing 20 according to the invention.

As seen in FIG. 1, the rightmost slot 24 extends vertically through the housing 20 from a first surface 34 facing the housing 20 upwardly to a first surface 34 facing the housing 20 downwardly. 2 is shown extending to the surface 36. The same is true for each of the slots 24.

The second surface 36 of the housing 20 is shown as engaging at least one pad or terminal 38 with the printed circuit board 28 traced thereon. Such a pad 38 is adapted to engage with a nub 40 at the lower end of the contact 22, as described below. Given that the nub 40 is offset to extend at least outwardly with respect to the second surface 36 of the housing 20, the printed circuit board 28 is retained in position to engage the second surface 36 of the housing 20. When the pad 3
Indeed, if the 8 is in place, the contact nub 40 will engage the pad 38.

Referring still to FIGS. 6 and 7 to describe an embodiment of the present invention, the housing 20 is described in the following manner.
Are shown attached to the contact 22 '. The contact 22 'has a small degree of elongation, and has a protrusion 42 at the upper end thereof. The protrusion 42 serves to engage a lead 30 from the integrated circuit device 32 that is intended to be interconnected with the printed circuit board 28. As can be seen in FIGS. 6 and 7, when the contacts 22 ′ are mounted on the housing 20, the protrusions 42 engage the first surface 3 of the housing 20.
Extends upwards beyond four.

As mentioned above, there is a nub 40 at the lower end of the contact 22 '. The nub 40 is, of course, for engaging a terminal or pad 38 on the printed circuit board 28 corresponding to a particular integrated circuit lead 30 that engages the protrusion 42 of each contact 22.

Adjacent to the nub 40 is a hook portion 44 of the contact 22 '. The hook portion 44 forms a generally circular opening 46 that is clamped at an inlet, such as 48, so that when the hook portion 44 is pressed through the resilient element 50 as described below, the contact 22 'will be resilient. It will be kept in the mounted position with respect to element 50.

Contact 22 'has an extended channel 52 near its upper lobe end. This channel 52 is for receiving a rigid element 54 defined hereinafter.

Referring again to FIG. 1, which again depicts a representative housing 20, a first surface 34 of the housing 20 is provided with a trough 56, which includes a plurality of troughs 56. It traverses slot 24 and generally extends transversely. Similarly, the second surface 36 of the housing 20 is formed with a ridge 58. The tongue 58 also extends across the various slots 24 and is generally depicted as traversing the direction in which the slots 24 face. Each jaw 56, 58 is depicted as generally symmetric with respect to an imaginary plane 60 that is perpendicular to the individual surfaces within which the jaws 56, 58 are formed. It should also be noted that the jaws 56, 58 are laterally separated from each other for purposes that will become apparent in the following discussion.

The saw-shaped portion 56 formed on the first surface 34
Is for receiving the rigid element 54 in the case of the embodiment of FIGS. Element 54 is depicted as extending completely across the array of slots 24 that extend across ridges 56 to receive element 54.

In this embodiment, the eyelet 58 formed on the second surface of the housing 20 is intended to receive a compressible, delicately stretchable, and resilient element 50 therein. . When the rigid element 54 is received in a ridge 56 formed on the first surface 34 of the housing 20, the resilient element 50 is received in a ridge 58 formed on the second surface 36 of the housing 20.
Is adapted to extend completely across the array of slots 24 extending across the jaws 58 when the resilient element 50 is received.

In the embodiment of FIGS. 6 and 7, the mounting or suspension of the individual contacts 22 'can be achieved in any suitable manner. One simple manual method of achieving suspension is to insert the contacts 22 'down through the slots 24, inside which a nub (n
ub) Should be accepted by impulsing the end of 40. Note that these two elements are received in their respective jaws 56,58. Once hook portion 44 is inserted at a point reaching a position below the elastic element, hook portion 44 is laterally movable to "catch" elastic element 50 therein.

After such "catching" has occurred, the contact 22 'is raised to a point such that the entrance of the extension channel 52 in the contact 22' is above the upper end of the rigid element 54. The projecting end of the contact 22 ′ and the entrance 62 to the channel 52
It is moved to the right as shown in FIGS. 6 and 7 until it is above 4. It can be seen that the resilient element 50 is below the tension when the contact 22 ′ is at a position where the entrance 62 to the channel 52 is above the rigid element 54 because the contact 22 ′ is pulled upward. When the contact 22 'is in such a position, the contact 22' is relaxed downward so that the rigid element 54 enters the channel 52. Elastic element 50
The upper tension is thereby released and contact 2
2 'is its "stationary" position. This procedure is also performed for a group of contacts 22 'and for multiple contacts 22' when an array is used.

The "rest" position of the contact 22 'is represented by the bold line in FIG. Centerline axis 6 of channel 52
4 is slightly inclined to the right of the plane of symmetry 60 with respect to the jaw 56 in which the rigid element 54 is received. Its plane of symmetry 60 is generally perpendicular to the first surface 34 of the housing 20 and is shown in dashed lines. Centerline axis 64 of channel 52 formed in contact 22 '
Is slightly tilted with respect to the line representing the plane of symmetry 60 of the torso 56 and is depicted by the line 64 added to FIG. The angle display 66 indicates that the channel 52 has the symmetry plane 60 of the
It shows the angle inclined from. This angle 66 is very small at the "rest" position of the contact 22 ', and is expected to be between approximately 3 and 30 degrees.

FIG. 7 shows the projection 4 of the contact 22 '.
2 illustrates the operation of the contact 22 'when engaged with the lead 30 of the integrated circuit device 32. When the integrated circuit device 32 is engaged at the lobe engagement point and the downward pressure is continuous, the rigid element 54 engages the extension channel 5 of the contact 22 '.
2 from above and the axis 64 of the channel 52
Is more emphasized.
If this occurs, the point of engagement of the protrusion 42 is moved down and to the right. The rightward movement of the point of engagement of the protrusion 42 permits relative movement of the point of engagement across the surface of the integrated circuit lead 30. This sliding action provides a better current path between the integrated circuit lead 30 and the protrusion 42 of the contact 22 '.

One reason for the apparent rotation of the contacts 22 'is that the nub ends of the contacts 22' cannot be moved down by the terminals or pads 38 of the printed circuit board 28. As discussed above, in the embodiment depicted in FIGS. 6 and 7, the printed circuit board 28 is substantially engaged with the second surface 36 of the housing 22 '. Contact 2
The deepest vertical position of the ridge 58 formed on the second surface 36 of the housing 20 as compared to the lower scale of 2 'biases the nub 40 of the contact 22' to engage the printed circuit board pad 38. give. The integrated circuit 32 urges the protrusion of the contact 22 'downward, so that the nub 40 is driven to the left as shown in FIG. The sliding action is thereby caused and the nub 40 of the contact 22 '
The current path between the terminal and the printed circuit board terminal 38 is optimized.

FIGS. 8 and 9 show the contacts and contact suspension means depicted in FIGS. 6 and 7 to show the signal and uncoupled mode of the housing 20. FIG. FIG. 8 illustrates an embodiment of the present invention in a signal mode configuration. This figure shows the signal terminals or lands on the printed circuit board 28.
d) shows a contact 22 'configured to interface with 68.

FIG. 9 shows the non-coupling mode. In the uncoupled mode, the integrated circuit device 32 has multiple grounds and often multiple power leads, which are connected by a capacitor 70 to allow a current response when the output of the integrated circuit device 32 is switched. Need to be In the prior art, customers have been assisted in meeting the requirements for a particular configuration of ground and power arrangements. These arrangements are always placed vertically near the center of the edge due to the minimum internal lead inductance. The housing 20 has center contacts folded (mirror) to allow the ground and power leads to directly contact one of the multiple non-coupling surfaces 72.
Designed to be. Each decoupling surface 72 used is shown as either a ground or power plane, so that when the chip capacitors 70 are soldered through these surfaces 72, a decoupling circuit is formed.

The signal terminal, that is, the land 68 and the non-coupling surface 7
Both are connected to an external customer circuit. Contact 22 ′ is depicted as folded to allow direct integrated circuit electrical connection to non-coupling surface 72. The non-coupling surface 72 is non-coupled by the chip capacitor 70.

Contact 72 depicted in FIGS.
Are different from those depicted in FIGS. FIG. 2 depicts the deformed contact 22 separated from the slot 24 inside the housing 20. The main difference between this contact 22 and the one previously described is that the contact 22 does not have an extension channel 52 near the upper overhang portion. Rather, the contact 22 of FIGS. 1-5 is provided with a hook portion 74 similar to the hook portion 44 closest to the nub 40 of the previously described contact embodiment.

When the contact 22 depicted in FIGS. 1-5 is used, a different type of element 76 is placed in a ridge 56 formed on the first, upper surface 34 of the housing 20. Rather than providing a rigid element 54, the element 76, which in this embodiment is received in the lobe 56 in the first surface 34 of the housing 20, is inherently resilient and is formed on the second surface 36 of the housing 20. It is similar to the element 50 in the saw 58. Both elements therefore have some degree of compressibility and extensibility, rather than just one element having such compressibility and extensibility as in the embodiment of FIGS.

In the two elements which are elastic in their natural state, the projection 42 of the contact 22 and the nub 4
Both movements of zero can occur along two mutually perpendicular axes. That is, the protrusion 42 of the contact 22
And both nub 40 are generally horizontally and vertically movable to compress the two elements. Thus, the embodiments of FIGS. 1 to 5 achieve the desired sliding movement. At the same time, damage to the integrated circuit leads is minimized because the contacts 22 are essentially free floating in the suspension in the housing 20.

It will be appreciated that the response of this structure can be controlled by changing the durometer of the element 76 received in the jaw 56 formed in the upper surface 34 of the housing 20. The stiffer the element 76, the more resistance the lateral movement of the contact protrusion 42 will have and the less sliding movement of the protrusion 42 across the lead 30 of the integrated circuit 32. Typical durometers are between 30 and 90 Shore D hardness.

FIG. 3 shows a normal rest state of the contact 22 in the embodiment of FIGS. In this position, the two elastic elements 50 and 76 extend essentially linearly.

FIG. 5 shows how the elastic elements 50 and 76 are handled for mounting. FIG. 5 shows that the contacts 22 are inserted upwardly through the bottom or second surface 36 of the housing 20,
Projecting portion 42 passes between the two elastic elements 50 and 76 and has a hook portion 74 near the projecting portion 42 of the contact 22.
Is adapted to rest on a resilient element 76 received in a spike 56 formed on the first surface 34 of the housing 20.

[0052] The upper hook portion 74 is then moved downward to grip an elastic element 76 received in the ridge 56 formed on the first surface 34 of the housing 20. FIG. 5 shows a resilient element 76 received in a spike 56 formed on the first surface 34 of the housing 20.
The contact 22 attached to the lower hook portion 4
4 shows that element 4 has been pulled down to deform element 76 so that it is in an arrangement capable of catching resilient element 50 received on a ridge 58 formed on second surface 36 of housing 20. ing. When the lower hook portion 44 is moved to such a position, the contact 2
2 is gradually opened to catch a resilient element 50 received on a lobe 58 formed on the second surface 36 of the housing 20. Thereafter, the contact 22 and the resilient elements 50 and 76 are located in the position of FIG.

FIG. 4 shows the response of the assembly when the leads 30 of the integrated circuit 32 have been brought into engagement with the protrusions 42 of the contacts 22. As can be seen, the resilient element 76 received in the barb 56 formed on the first surface 34 of the housing 20 deforms downward under compression and tension.

Along with the nubs 40 of the contacts 22 which engage the terminals 38 on the printed circuit board 28, there is also a deformation in the resilient element 50 which is received in a barb 58 formed on the second surface 36 of the housing 20. As can be seen from FIG. 4, this deformation is clearly an upward movement.

In the embodiment depicted in FIGS. 1-5, the printed circuit board 28 initially includes a second surface 36 of the housing 20.
Is located away from. The lead 30 of the integrated circuit device 32 engages with the protrusion 42 of the contact 22 so that the protrusion 4
When the 2 is pushed down, the lower tip of contact 22 (ie, nub 40) engages terminal 38 of printed circuit board 28. Subsequent downward movement of the protrusion 42 of the contact 22 causes upward movement of the nub 40. This movement of the contacts 22 serves to slide and protect the leads 30 of the integrated circuit.

FIGS. 10 and 11 show an embodiment which is similar in some respects to the embodiment of FIGS. In this embodiment, a rigid element is used and a plurality of contacts 2
2 'is received in each extended channel 52. However, in this embodiment the contacts 22 'in adjacent slots 24 are staggered. That is, one of the contacts 22 'extends to the right in FIG.
The next contact 22 'extends to the left.

As depicted in FIGS. 10 and 11, additional elastic elements 78 are provided on either side of the central rigid element 54 so that the hooks 44 of the plurality of contacts 22 'of the array extend. ing. The second surface 36 of the housing 20 is provided with a second
A tongue-shaped part 80 is formed. The jaws 80 are laterally spaced from the intended location of the rigid element 54 by a distance essentially equal to that of the first elastic element 50 in the opposite direction. As a result, the contact arrangement is symmetric. This arrangement is best seen in FIG.

In the embodiment of FIGS. 10 and 11, it is not necessary to provide a ridge on the first surface 34 of the housing 20 to receive the rigid element 54. For opposing and simultaneously operating contacts, the rigid element 54 can be received in a plurality of extension channels 52 of the contact 22 ′, and the reciprocal movement of the contact channel 52 is such that the rigid element 54 The pinching effect is maintained inside.

Since no jaws are required to receive the rigid element, it is not necessary to extend the material forming the housing 20 to the location where the rigid element 54 is located. Thus, as can be seen in FIG. 10, a generally V-shaped recess 82 is formed in housing 20 with a central wall 84 extending upwardly from second surface 36 of housing 20 for separating the right and left slots 24. Is done. Therefore housing 2
It is possible to save the material forming 0.

As can be seen from FIG. 11, the slots 24 typically have a shaft diameter larger than the shaft diameter of the individual contacts 22 '. Thus, contact 22 'can operate without maintaining a continuously defined plane. Since the contact 22 ′ is originally conductive, the insulating washer 8 is used.
6 can be located along a rigid element 54 between adjacent contacts 22 '. The axial diameter of the washer 86 can be such that movement between the contacts 22 'is minimized.

FIG. 10 shows an integrated circuit 3 having leads 30 for engaging the protrusions 42 of the plurality of contacts 22 '.
2 is shown. FIG. 10 shows the leads 30 laterally spaced to match the location of the protrusion 42 of the contact 22 '. In fact, the slots 24 and the corresponding contacts 22 'received therein can be assembled to carry integrated circuits 32 assembled in a particular way.

Next, an alternative embodiment will be described with reference to FIGS. This alternative embodiment relates to a specific design for a device used to electrically interconnect a device lead and a terminal laterally spaced a distance from the lead on the same side of the housing. It is. In this embodiment, the contacts are designed with nubs and protrusions that extend beyond the common planar surface 100 of the housing 20.

As shown in FIG. 12, in this alternative embodiment, a housing 20 is provided and, as previously described,
The housing has a slot extending substantially parallel to an axis extending between the corresponding lead and the remote terminal. On a side surface (not shown) of the housing 20, a first bar portion 102 extending near the lead 103 is formed. Opposite side terminals (not shown) have remote terminals 10
A second tooth 104 extending near 5 is formed.

The first elastic element 106 is received in the first shank 102. The second elastic element 107 includes a second elastic element 107.
Is received in the tongue 104. Both elastic elements have some compressibility and tensile elongation.

A generally planar contact 110 is received in slot 24. The contact is on the surface 10
It has a protrusion 111 extending outward from zero and engaged by a lead 103. A generally planar contact 11
0 also extends outwardly from the surface 100 and
5 having a nub that engages. The nub 102 also has the protrusion 111
Also generally lie in the same plane in the embodiment of FIG.

FIG. 13 shows an embodiment similar to the embodiment of FIG. However, contact 120
Are of different designs and are made of a spring type. The contact 110 of FIG. 12 includes a nub 112 and a protrusion 111, which are integral extensions of the contact, which are made near each hook portion 108,109. An example of integral elongation is in cutting or forming its nubs and protrusions from the contact material during steps such as stamping or cutting during the manufacture of the contact. In contrast, the contact 120 of FIG. 13 includes a nub 122 and a protrusion 124 formed by bending a spring-shaped contact near each of similarly formed hook portions 126,128.

As in the other embodiments, the protrusion is engaged by a lead and the first and second resilient elements allow movement of the contact in directions along two mutually orthogonal axes. In which case a beneficial sliding action of the protrusion across the lead and the nub across the standoff occurs. It should be noted that in the embodiment shown in FIG. 13, the jaws 130, 1 receive elastic elements.
32 is formed in a housing that enters at an angle from surface 100. This angle of entry is such that when the contacts 120 are pulled through the resilient elements, those elements are retained within the tangs 130, 132.

Regardless of the embodiment, the housing 20 is substantially identical, and the contacts 22 ', 110, 120
It will only vary based on the intended position of the head and the position of the inlet of the grind. Slots 24 are formed in housing 20 by a laser machine (typically in the case of prototypes or low volume production) or by injection molding of the entire housing 20 (typically in economical mass production). The contacts 22, 22 ', 110, 120
Supported as described above. As can be foreseen, the contacts 22, 22 ', 110, 120 are individually removable.

Contacts 22, 22 ', 110, 120
Are designed with very short electrical paths. Typically, the overall contact length does not exceed 0.14 inches. In a contact according to the invention, this length gives an inductance of 2.0 nanohenries between the surfaces.
As a result, very high frequency digital signals (typically 5 GHz and higher) can be transmitted without significant loss of fidelity. A contact 22, which actually contacts the integrated circuit device lead 30 and the printed circuit board terminal 38,
The area of 22 ', 110 and 120 is minimized, and the amount of crosstalk between signal lines is also minimized. It also has a high degree of isolation of the transmitted analog signal.

[0070] Numerous features and advantages of the invention result from the foregoing description. Of course, it will be understood that this description is, in many respects, only illustrative. Changes may be made in details, particularly in matters of shape, size and arrangement of parts without departing from the scope of the invention. The scope of the present invention is defined by the matters described in the claims.

[0071]

As described above, according to the present invention, there is provided an improved electrical interconnection contact device which overcomes the problems of the prior art.

[Brief description of the drawings]

FIG. 1 is an enlarged partial perspective view of one embodiment of the present invention, showing a plurality of contacts.

FIG. 2 is a perspective view of one contact of the embodiment of FIG. 1;

FIG. 3 is a partial functional diagram showing a stationary vertical cross section of the embodiment of the invention shown in FIG. 1;

FIG. 4 is a view similar to FIG. 3, showing the contacts engaged with the leads of the integrated circuit device.

FIG. 5 is a view similar to FIG. 3, showing the contacts being operated to provide connection or disconnection to rigid and elastic members.

FIG. 6 is a partial side view of another embodiment of the present invention, with some portions cut away.

FIG. 7 is an enlarged view similar to FIG. 6, showing the junction of the contacts by dotted lines.

FIG. 8 is a partial side view showing an embodiment of the present invention in a signal mode contact structure, with some portions cut away.

FIG. 9 is a view similar to FIG. 8, showing the embodiment in a non-bonded contact configuration;

FIG. 10 is a partial side view showing another embodiment of the present invention, with some portions cut away.

11 is a partial plan view of the embodiment of FIG.

FIG. 12 is a partial side view with some parts separated, showing an alternative embodiment in which the leads and standoffs are located on a common side of the housing.

FIG. 13 is a partial side view with some parts cut away showing an alternative contact to the embodiment of FIG. 12;

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 20 ... Housing 22, 22 ', 110, 120 ... Contact 24 ... Slot 26 ... Side wall 28 ... Printed circuit board 30, 103 ... Lead 32 ... Integrated circuit device 34 ... First surface facing the housing 20 above 36 ... Housing A second surface 38 facing downwards 20 pad or terminal 40, 102, 122 nub 42, 111, 124 protrusion 44, 108, 109, 126, 128 hook part 46 opening 48 inlet 50. Elastic element 52 Channel 54 Rigid element 56, 58, 80, 102, 104, 103, 132 ...
Cutter portion 60 Virtual surface 62 Inlet 64 Central line axis 66 Offset angle 70 Capacitor 72 Non-coupling surface 74 Hook portion 76, 78, 106, 107 Elastic element 82 Recess 84 Central wall 86 Connection Washers

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁶ , DB name) H01R 33/76 H01R 23/68

Claims (9)

(57) [Claims] An apparatus lead (103) and said lead (1)
03) a device for electrical interconnection with a terminal (105) laterally spaced at a distance from said device, said device for electrical interconnection comprising: (a) a housing (20); the housing are at least one contact receiving slot (24) is formed, said slot extends substantially parallel to the axis extending between the terminals spaced corresponding lead and lateral, the lead (103) and the terminal (105)
Located on the same side of the housing (20)
The housing has a surface (1) intersecting the slot.
00), wherein the housing has a first jaw (102, 130) formed near the lead and a second jaw (104, 130) near the laterally spaced terminals.
132); (b) a first elastic element (106) received in the first jaws (102, 130) formed in the housing (20); A first elastic element having a measure of compressibility and tensile elongation; (c) a second elastic element (104, 132) formed in the housing (20) and received in the second elastic element (104, 132). An elastic element (107), said second elastic element having a measure of compressibility and tensile elongation; and (d) a generally flat plate received in said slot (24). A contact (110, 120), wherein the contact extends outwardly from the surface (100) and protrudes (111, 1) for engagement by a lead (103).
24) and a nub (112, 112) extending outwardly from said surface (100) for engaging said laterally spaced terminals (105).
122) and surrounding the first elastic element (106) in the vicinity of the protrusion (111, 124) and surrounding the contact (110, 120) with the first elastic element (10).
6) a first hook portion (108,
126) and near the nub (112, 122), surrounding the second elastic element (107) and connecting the contacts (110, 120) to the second elastic element (107).
Second hook portions (109, 12
(E) wherein the first and second elastic elements (11, 124) are engaged when the protrusions (111, 124) are engaged by the leads (103). 106, 107) are said contacts (110, 12) in a direction along two mutually perpendicular axes.
0) to allow the movement of the lead (10).
3) and said nub (112, 124) across said laterally spaced terminals (105) and said laterally spaced terminals (105).
122) A device for electrical interconnection in which the sliding operation of 122) occurs. 2. When the protrusion (111, 124) is engaged by the lead (103) , the lead (10
3) and the first and second elastic elements (106, 1 ).
07) , the first and second resilient elements (106, 107) are laterally spaced from each other such that a force applied to the contacts (110, 120 ) by ( 07) facilitates the sliding movement. Item 10. The apparatus according to Item 1. 3. The first and second elastic elements (10)
6, 107) wherein a durometer range of 30 and 90 Shore D is provided. 4. The nub (112, 122) on the contact (110, 120 ) and the protrusion (111, 122) .
124) are the hook portions (109, 108; 12).
8, 126), the contact (1)
10. The device according to claim 1, which is an integral extension of ( 10,120) . 5. The nub on the contact (120)
(122) and the protrusion (124), said formed by bending each said contact in the vicinity of each hook portion (128, 126), said contact (1
20. The device according to claim 1, which is an integral extension of 20) . Wherein said housing (20) said first and second trough-like portion is formed on the (102, 104) is formed on each side facing opposite of the housing, in claim 1 The described device. 7. The first and second jaws (130, 132) formed on the housing (20) are formed on the surface (100) intersecting the slots (24). Item 10. The apparatus according to Item 1. 8. Each of the jaws (130, 132) includes:
8. The device of claim 7, wherein the device bends downward and inward with respect to one another. 9. A device for electrical interconnection between a terminal of a first device and a terminal of a second device, wherein said terminal of said second device is connected to said terminal of said first device. The device for electrical interconnection, laterally spaced a distance, comprises: (a) a housing (20), wherein the housing has at least one contact receiving slot (24) formed therein; slot (24) extends substantially parallel to the axis extending between the said terminal of the corresponding terminal and the second device of the first device, the lead (103)
The terminal (105) is the same as the housing (20).
And the housing (20) further has a surface (100) intersecting the slot, the housing having a first jaw (102) proximate the terminal of the first device. , 130) are formed and a second jaw (104, 132) is provided near the terminal of the second device.
(B) a first elastic element (106) received in the first jaws (102, 130) formed in the housing (20), wherein the first elastic element (106) is The elastic element having a measure of compressibility and tensile elongation; (c) a second elastic element received in the second jaws (104, 132) formed in the housing (20). (107) wherein the second elastic element has a measure of compressibility and tensile elongation; and (d) a generally planar contact (24) received within the slot (24). 110, 120) wherein the contact extends outwardly from the surface (100) and
Protrusion (11) for engagement by the terminal of the device of
, 124) and a nub (112, 1) extending outwardly from said surface (100) to engage with said terminal of said second device.
22) and surrounding the first elastic element (106) in the vicinity of the protrusions (111, 124) and enclosing the contacts (110, 120) with the first elastic element (106).
The first hook portions (108, 12
6) to surround the second elastic element (107) in the vicinity of the nub (112, 122) and to hold the contact (110, 120) against the second elastic element (107). Of the second hook portion (109, 12)
8) and (e) wherein the first portion (111, 124) is engaged when the protrusion (111, 124) is engaged by the terminal of the first device.
And a second resilient element (106, 107) is provided with the contact (110, 1) in a direction along two mutually perpendicular axes.
20) deformed to allow the movement of the protrusions (111, 124) across the terminals of the first device and the nubs (112, 12) across the terminals of the second device.
A device for electrical interconnection in which the sliding operation of 2) occurs.