JP2773588B2 - Cooling system - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling device, and more particularly, to a cooling device for cooling a semiconductor device or the like by utilizing a phase change of a condensable refrigerant.

[0002]

2. Description of the Related Art FIG. 3 is a plan view of a conventional cooling device, FIG. 4 is a sectional view thereof, FIG. 5 is an enlarged sectional view of an evaporator, and FIG. It is sectional drawing seen from cutting surface line AA.

In these figures, 1 is a semiconductor element, 2
Is an evaporator that is fastened to and tightly adhered to the semiconductor element 1 with a stack component 3, 4 is a heat transport pipe composed of an insulating pipe joint 5 and a bellows 6, and 7 is connected to the evaporator 2 by the heat transport pipe 4. condenser, the fins for heat dissipation, which is configured inside the evaporator 2 8, 9 ₀ is placed in the heat transport tube 4, the liquid refrigerant condensed in the condenser 7 in the liquid return pipe for returning to the evaporator 2 is there.

Next, the operation of the semiconductor cooling device will be described.

The heat generated in the semiconductor element 1 is transferred to the evaporator 2
Between the fins 8 formed at an inclination angle of 30 °, for example, being transmitted to the fins 8 inside the evaporator 2, being transmitted to the liquid refrigerant through the fins 8, and being changed into a vapor refrigerant by a phase change of the liquid refrigerant. 5 through the inclined transport pipe 4 to the condenser 7 at the upper position, where it exchanges heat with the atmosphere to become a liquid refrigerant, and as shown by the solid line arrows marks in FIG. 5 through the liquid return pipe 9 ₀ from the bottom of, it is collected at the bottom of the evaporator 2.

As described above, in the cooling device, evaporation-condensation is repeated, in which heat of the semiconductor element 1 is deprived and vaporized vapor refrigerant is condensed and used again as a liquid refrigerant for cooling the semiconductor element 1. .

[0007]

[SUMMARY OF THE INVENTION However, in such conventional example, the liquid return pipe 9 ₀ in the evaporator 2, its ends, identical to the ends of the lower fins 8 or upper than Is formed at a level of

[0008] Therefore, when the heating value of the semiconductor element 1 is small, the low pressure less vapor bubble refrigerant generated in the evaporator 2, vapor bubble refrigerant from entering into the liquid return pipe 9 ₀ However, the heating value of the semiconductor element 1 is increased, it bubbles vapor refrigerant enters the liquid return pipe 9 in _0,
If the circulation of the refrigerant is hindered and the liquid refrigerant does not return into the evaporator 2, there is a disadvantage that heat exchange in the evaporator 2 cannot be performed and there is a risk of causing a thermal runaway.

The present invention has been made in view of the above points, and has as its object to prevent the thermal runaway by smoothing the circulation of the refrigerant to increase the amount of heat exchanged with respect to the amount of heat generated by the semiconductor element and the like. I do.

[0010]

In order to achieve the above-mentioned object, the present invention is configured as follows.

That is, the present invention provides an evaporator having a radiating fin therein, a condenser for condensing a gas refrigerant guided from the evaporator, a gradient extending from the condenser to the evaporator, and extending downwardly. A liquid return pipe for returning the liquid refrigerant condensed in the condenser to an evaporator, wherein the shape of the opening end of the liquid return pipe in the evaporator is oblique so that the opening faces upward. In addition to the inclined end surface, the opening end is provided at a position lower than the end of the heat radiation fin.

[0012]

According to the above construction, the opening end of the liquid return pipe for returning the liquid refrigerant to the evaporator is provided at a position lower than the end of the heat radiating fin, and the opening is directed upward, so that the heat is radiated. Bubbles of the gaseous refrigerant generated in the fins do not enter the liquid return pipe, and the refrigerant circulates smoothly.

[0013]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below in detail with reference to the drawings.

Embodiment 1 FIG. FIG. 1 is a sectional view of an evaporator 2 according to an embodiment of the present invention, and FIG. 2 is a sectional view taken along a line AA in FIG.
FIG. 3 is a cross-sectional view as viewed from above, and portions corresponding to the above-described conventional example are denoted by the same reference numerals.

The evaporator 2 of this embodiment is shown in FIGS.
Is connected to the condenser 7 through the inclined heat transport pipe 4 and the liquid return pipe 9 inside the heat transport pipe 4 like the conventional cooling device shown in FIG. The vaporized vapor refrigerant is condensed and used again as a liquid refrigerant for cooling the semiconductor element 1.

In this embodiment, the following configuration is used to smoothly circulate the refrigerant in the evaporator 2 to increase the amount of heat exchanged with respect to the amount of heat generated by the semiconductor element 1 and the like to prevent thermal runaway. .

That is, the shape of the opening end 9a of the liquid return pipe 9 in the evaporator 2 is made obliquely inclined so that the opening faces upward, and the opening end 9a is formed in the evaporator 2 inside. The heat dissipating fins 8 are provided below the ends.

Next, the operation of the cooling device having such a configuration will be described.

The heat generated in the semiconductor element 1 is transferred to the evaporator 2
Through the fins 8 inside the evaporator 2 and from the fins 8 to the liquid refrigerant, and becomes a vapor refrigerant due to the phase change of the liquid refrigerant. At this time, bubbles of the vapor refrigerant generated in the fins 8 below the liquid return pipe 9 are
However, since the opening of the liquid return pipe 9 is directed upward, bubbles of the vapor refrigerant are guided between the fins 8 along the outer periphery of the liquid return pipe 9, and the like,
It is prevented from entering the liquid return pipe 9. As shown by the dashed arrows in FIG. 1, the vapor refrigerant having moved upward through the space between the fins 8 passes through the inclined heat transport pipe 4 and passes through the condenser 7.
, And exchanges heat with the atmosphere to become a liquid refrigerant.
From the lower part of the evaporator 2 through the liquid return pipe 9 as shown by the solid arrow in FIG.

As described above, since the bubbles of the vapor refrigerant generated in the radiating fins 8 are prevented from entering the liquid return pipe 9, the refrigerant is smoothly circulated.

Although the above embodiment has been described with reference to the cooling of the semiconductor element 1, the present invention is not limited to the cooling of the semiconductor element 1, but can be similarly applied to the cooling of other heat-generating electric components. Of course.

[0022]

As described above, according to the present invention, the opening end of the liquid return pipe in the evaporator is disposed at a position lower than the end of the radiating fin, and the opening is directed upward. Since the inclined end surface is used, bubbles of the vapor refrigerant generated by the radiating fins are prevented from entering the liquid return pipe, and the refrigerant is smoothly circulated.
It is possible to prevent thermal runaway by increasing the amount of heat exchanged with respect to the amount of heat generated by a semiconductor element or the like.

[Brief description of the drawings]

FIG. 1 is a sectional view of an evaporator according to an embodiment of the present invention.

FIG. 2 is a sectional view taken along line AA of FIG. 1;

FIG. 3 is a plan view of the cooling device.

FIG. 4 is a sectional view of FIG. 3;

FIG. 5 is a sectional view of a conventional evaporator.

FIG. 6 is a cross-sectional view taken along the line AA of FIG. 1;

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Semiconductor element 2 Evaporator 4 Heat transport pipe 7 Condenser 8 Fin 9,9 ₀ Liquid return pipe 9a Open end

Claims (1)

(57) [Claims] 1. An evaporator having a radiation fin therein.
A condenser for condensing the gas refrigerant guided from the evaporator,
A liquid return pipe extending downhill from the condenser to the evaporator and returning the liquid refrigerant condensed in the condenser to the evaporator; and an opening end of the liquid return pipe in the evaporator. The cooling device according to claim 1, wherein the shape of the fin is a slanted end face such that the opening faces upward, and the opening end is provided at a position lower than the end of the radiating fin.