JP2762990B2 - Resin sealing device - Google Patents
Resin sealing deviceInfo
- Publication number
- JP2762990B2 JP2762990B2 JP13956796A JP13956796A JP2762990B2 JP 2762990 B2 JP2762990 B2 JP 2762990B2 JP 13956796 A JP13956796 A JP 13956796A JP 13956796 A JP13956796 A JP 13956796A JP 2762990 B2 JP2762990 B2 JP 2762990B2
- Authority
- JP
- Japan
- Prior art keywords
- plunger
- pressure
- resin
- compressed air
- air
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
- B29C45/021—Plunger drives; Pressure equalizing means for a plurality of transfer plungers
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、樹脂封止装置に関
し、特に、リードフレーム上に半導体素子を樹脂封止す
るための半導体素子用の樹脂封止装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin sealing device, and more particularly to a resin sealing device for a semiconductor element for sealing a semiconductor element on a lead frame.
【０００２】[0002]
【従来の技術】樹脂封止装置は、一対の封止金型の間に
形成されたキャビティ部に封止用樹脂をプランジャで押
し出して半導体素子等を樹脂封止するものである（特開
平６−１２４９７０号公報等参照）。2. Description of the Related Art A resin sealing device extrudes a sealing resin into a cavity formed between a pair of sealing dies with a plunger to resin seal a semiconductor element or the like. No. 124970).
【０００３】従来の半導体素子樹脂封止装置としては図
３に示すものがある。これは油圧によって、半導体素子
を搭載したリードフレームを型締めする上金型と下金
型、この下金型と上金型との間の成形キャビティ部に封
止用樹脂を押し出す複数のプランジャとから構成されて
いる。FIG. 3 shows a conventional semiconductor device resin sealing device. This is an upper mold and a lower mold that clamps the lead frame on which the semiconductor element is mounted by hydraulic pressure, and a plurality of plungers that extrude sealing resin into the molding cavity between the lower mold and the upper mold. It is composed of
【０００４】図３において、１ａは上金型、１ｂは下金
型である。型締め用の駆動源は図示を省略している。２
は封止用樹脂、３はプランジャ、４はマルチプランジャ
・ユニット 、２５は油圧ポンプ、２４はフィルタ、２
３は減圧弁、２２は方向制御弁、２１はスロットバル
ブ、２０は油圧配管、２６は油圧タンクである。In FIG. 3, reference numeral 1a denotes an upper die, and 1b denotes a lower die. A drive source for mold clamping is not shown. 2
Is a sealing resin, 3 is a plunger, 4 is a multi-plunger unit, 25 is a hydraulic pump, 24 is a filter,
3 is a pressure reducing valve, 22 is a direction control valve, 21 is a slot valve, 20 is a hydraulic pipe, and 26 is a hydraulic tank.
【０００５】このような構成の従来装置の概略動作を説
明する。まず下金型１ｂに半導体素子を搭載したリード
フレーム（図示せず）をのせ、その後、上金型１ａを下
降させ下金型１ｂにプレス圧を所定の圧力に保持して型
締めする。この状態で下金型１ｂの下方に設けられたマ
ルチプランジャ・ユニット４の複数のプランジャ３を油
圧により駆動し、封止用樹脂２を金型内の前記成形キャ
ビティ部（図示せず）に射出し、前記半導体素子を搭載
したリードフレームの樹脂封止を行う。樹脂封止が終了
すれば、上金型１ａを上昇させ、上金型１ａ、下金型１
ｂを離型し樹脂封止したリードフレームを取り出す。[0005] The general operation of the conventional apparatus having such a configuration will be described. First, a lead frame (not shown) on which a semiconductor element is mounted is placed on the lower mold 1b, and then the upper mold 1a is lowered to clamp the lower mold 1b while maintaining the press pressure at a predetermined pressure. In this state, the plurality of plungers 3 of the multi-plunger unit 4 provided below the lower mold 1b are driven by hydraulic pressure to inject the sealing resin 2 into the molding cavity (not shown) in the mold. Then, resin sealing of the lead frame on which the semiconductor element is mounted is performed. When the resin sealing is completed, the upper mold 1a is raised, and the upper mold 1a and the lower mold 1
b is released, and the resin-sealed lead frame is taken out.
【０００６】[0006]
【発明が解決しようとする課題】このような従来装置に
おいては、油圧駆動方式を採用していたため、種々の問
題点を有していた。However, such a conventional apparatus has various problems because it employs a hydraulic drive system.
【０００７】第１の問題点は、油漏れの点検、防止のた
めのシール部材の交換等、清掃等その保守が煩雑である
ことである。それは、封止用樹脂２を噴射するとき各プ
ランジャ３に加わる圧力が異なり、プランジャ駆動シリ
ンダ５の内圧がバランスを失うからである。特に、圧力
が強く加わるシール部分から油漏れが発生していた。The first problem is that maintenance such as cleaning such as replacement of a seal member for inspection and prevention of oil leakage and the like is complicated. This is because the pressure applied to each plunger 3 when injecting the sealing resin 2 is different, and the internal pressure of the plunger drive cylinder 5 loses balance. In particular, oil leakage has occurred from the seal portion where pressure is strongly applied.
【０００８】第２の問題点は、射出するときの圧力（以
下射出圧と記す）を高精度に制御することができず、応
答性も悪かった。それは油圧駆動方式を採用しているか
らである。The second problem is that the pressure at the time of injection (hereinafter referred to as injection pressure) cannot be controlled with high accuracy, and the response is poor. This is because a hydraulic drive system is employed.
【０００９】第３の問題点は、装置全体が大きくなり、
コスト高となっていた。これは、油圧ポンプ等のパワー
ユニットが必要となるためである。The third problem is that the whole device becomes large,
The cost was high. This is because a power unit such as a hydraulic pump is required.
【００１０】この発明はかかる点に鑑みてなされたもの
であり、保守性の向上とともに、射出圧を容易に、精度
良く調整することができ、装置全体を小型かつ、安価に
できる樹脂封止装置を提供することを目的としている。[0010] The present invention has been made in view of the above points, and a resin sealing device capable of improving the maintainability, easily adjusting the injection pressure with high accuracy, and reducing the size of the entire device and reducing the cost. It is intended to provide.
【００１１】[0011]
【課題を解決するための手段】上記課題を解決するた
め、本発明においては、一対の封止金型の間に形成され
たキャビティ部に封止用樹脂を押し出す複数のプランジ
ャを備え、前記プランジャの送り側の駆動媒体を非圧縮
性液体とし、戻り側の駆動媒体を圧縮エアとしたプラン
ジャ装置と、前記送り側および戻り側の駆動媒体を制御
する増圧弁とを設けるようにした。According to the present invention, a plurality of plungers for extruding a sealing resin into a cavity formed between a pair of sealing dies are provided. A plunger device that uses a non-compressible liquid as the drive medium on the feed side and uses compressed air as the drive medium on the return side, and a pressure increasing valve that controls the drive medium on the feed side and the return side is provided.
【００１２】この発明においては、図１に示すように、
圧縮エア源１１からの駆動圧力が、増圧弁であるエア・
ハイドロ・ブースタ６に加えられ、送り側配管７ａから
各マルチプランジャ駆動シリンダ５の送り側５ａに加え
られる。このときの射出圧で各プランジャ３は、上金型
１ａと下金型１ｂ間の成形キャビティ（図示せず）に封
止用樹脂２が射出される。送り側５ａの駆動媒体は非圧
縮性液体（たとえば油または水）、戻り側５ｂの駆動媒
体は圧縮エアなので、各プランジャ駆動シリンダ５間で
射出圧のバランスがくずれてもプランジャ３の戻り側５
ｂの駆動媒体の圧縮エアがダンパ作用をして、この圧力
バランスのくずれを吸収する。In the present invention, as shown in FIG.
When the driving pressure from the compressed air source 11 is equal to the pressure of the air
The multi-plunger drive cylinder 5 is supplied to the hydro-booster 6 from the feed-side pipe 7a to the feed side 5a. At the injection pressure at this time, the sealing resin 2 is injected from each plunger 3 into a molding cavity (not shown) between the upper mold 1a and the lower mold 1b. Since the drive medium on the feed side 5a is an incompressible liquid (eg, oil or water) and the drive medium on the return side 5b is compressed air, even if the injection pressure balance between the plunger drive cylinders 5 is lost, the return side 5 of the plunger 3 will not work.
The compressed air of the drive medium b acts as a damper to absorb the pressure balance.
【００１３】[0013]
【発明の実施の形態】次に本発明の実施の形態について
図面を参照して詳細に説明する。図１を参照すると、１
ａは上金型、１ｂは下金型、２は封止用樹脂、３はプラ
ンジャ、４はマルチプランジャ・ユニット、５はプラン
ジャ駆動シリンダ、５ａはプランジャ駆動シリンダ５の
送り側の室であり、各シリンダ５の送り側の室５ａは連
通している。５ｂはシリンダ５の戻り側の室であって各
シリンダ５の戻り側の室５ｂは連通している。６は増圧
弁としてのエア・ハイドロ・ブースタ、６ａはエア・ハ
イドロ・ブースタ６の送り側の室、６ｂは戻り側の室で
ある。７ａは、非圧縮性液体が入っている送り側配管で
あり、エア・ハイドロ・ブースタ６とマルチプランジャ
・ユニット４の各プランジャ駆動シリンダ５の送り側５
ａとを接続している。各プランジャ駆動シリンダ５の戻
り側５ｂはエア配管７ｂに接続されている。８は第２方
向切替弁、９ａと９ｂはエアレギュレータ、１０は第１
方向切替弁、１１は圧縮エア源である。Embodiments of the present invention will now be described in detail with reference to the drawings. Referring to FIG.
a is an upper mold, 1b is a lower mold, 2 is a sealing resin, 3 is a plunger, 4 is a multi-plunger unit, 5 is a plunger drive cylinder, 5a is a feed-side chamber of the plunger drive cylinder 5, The chamber 5a on the feed side of each cylinder 5 is in communication. 5b is a return-side chamber of the cylinder 5, and the return-side chamber 5b of each cylinder 5 communicates. Reference numeral 6 denotes an air-hydro booster as a pressure increasing valve, 6a denotes a chamber on the feed side of the air-hydro booster 6, and 6b denotes a chamber on the return side. Reference numeral 7a denotes a feed-side pipe containing an incompressible liquid, and the feed-side pipe 5 of each plunger drive cylinder 5 of the air-hydro booster 6 and the multi-plunger unit 4.
a. The return side 5b of each plunger drive cylinder 5 is connected to an air pipe 7b. 8 is a second directional control valve, 9a and 9b are air regulators, 10 is a first
The direction switching valve 11 is a compressed air source.
【００１４】図２に半導体素子樹脂封止装置の全体図を
示す。通常、封止は加熱した上金型１ａと下金型１ｂの
間にリードフレーム（図示せず）と封止用樹脂２をセッ
トし、高圧で型締めすることで上金型１ａと下金型１ｂ
を密封する。次に、マルチプランジャ・ユニット４をサ
ーボモータ３３を用いた駆動装置で矢印Ｂの方向に押し
上げ、さらにマルチプランジャ・ユニット４の各プラン
ジャ３で加圧し、成形キャビティ（図示せず）に封止用
樹脂２を射出し半導体素子が搭載されたリードフレーム
（図示せず）が樹脂封止される。FIG. 2 shows an overall view of a semiconductor device resin sealing device. Normally, for sealing, a lead frame (not shown) and a sealing resin 2 are set between the heated upper mold 1a and the lower mold 1b, and the mold is clamped at a high pressure so that the upper mold 1a and the lower mold 1a are closed. Mold 1b
Seal. Next, the multi-plunger unit 4 is pushed up in the direction of arrow B by a driving device using a servomotor 33, and is further pressurized by each plunger 3 of the multi-plunger unit 4, and is sealed in a molding cavity (not shown). The resin 2 is injected, and a lead frame (not shown) on which the semiconductor element is mounted is sealed with resin.
【００１５】プランジャ・ユニット４は、図１において
複数のプランジャ３およびプランジャ駆動シリンダ５か
ら構成されている。下金型１ｂに半導体素子を搭載した
リードフレーム（図示せず）および封止用樹脂２をセッ
トし、上金型１ａを下金型１ｂとを型締めした後、プラ
ンジャ・ユニット４が押し上げられる。このとき、封止
用樹脂２の量の差、その他の要因により各プランジャ３
に加わる圧力に差が生じる。従来の装置では、このた
め、各プランジャ駆動シリンダ５の内圧のバランスが失
われ、特にプランジャ３の可動部のシール部（図示せ
ず）から油漏れが発生していた。The plunger unit 4 comprises a plurality of plungers 3 and a plunger drive cylinder 5 in FIG. A lead frame (not shown) on which a semiconductor element is mounted and a sealing resin 2 are set in the lower mold 1b, and after the upper mold 1a is clamped to the lower mold 1b, the plunger unit 4 is pushed up. . At this time, each plunger 3 depends on the difference in the amount of the sealing resin 2 and other factors.
There is a difference in the pressure applied to In the conventional device, therefore, the balance of the internal pressure of each plunger drive cylinder 5 is lost, and oil leakage particularly occurs from a seal portion (not shown) of the movable portion of the plunger 3.
【００１６】そこで、本発明においては、図１に示すよ
うにマルチプランジャ駆動シリンダ５の送り側５ａの駆
動媒体を非圧縮性液体（例えば油または水）とし、戻り
側５ｂの駆動媒体に圧縮エアを使用している。さらに、
マルチプランジャ駆動シリンダ５を駆動するためにエア
・ハイドロ・ブースタ６を介して増圧を行っている。こ
のようにすると、各プランジャ３に加わる圧力差はプラ
ンジャ駆動シリンダ５の戻り側５ｂの圧縮エアのダンパ
作用により吸収され、各プランジャ３には等圧がかかる
ことになり、一部に強い圧力が加わることを回避でき
る。Therefore, in the present invention, as shown in FIG. 1, the drive medium on the feed side 5a of the multi-plunger drive cylinder 5 is an incompressible liquid (eg, oil or water), and the drive medium on the return side 5b is compressed air. You are using further,
The pressure is increased via an air-hydro booster 6 to drive the multi-plunger drive cylinder 5. In this way, the pressure difference applied to each plunger 3 is absorbed by the damper action of the compressed air on the return side 5b of the plunger drive cylinder 5, and an equal pressure is applied to each plunger 3, and a strong pressure is partially applied. Joining can be avoided.
【００１７】圧縮エアの圧力は、エアレギュレータ９
ａ，９ｂを設け第１方向切替弁１０により切り替え選択
されるので射出圧を精度良く制御できる。第２方向切替
弁８は、エア・ハイドロ・ブースタ６の送りと戻りの切
り替えを行い、結果として、複数の各プランジャ３の送
りと戻りを切り替える。すなわち、送りの時には、ブー
ス６の送り側６ａへ圧縮エアを供給し、プランジャ・ユ
ニット４の戻り側５ｂおよびブースタ６の戻り側６ｂの
圧縮エアをエア源１１側へ戻す。圧縮エアの射出圧によ
り各プランジャ３は押し出され、上金型１ａと下金型１
ｂ間の成形キャビティ（図示せず）に封止用樹脂２を射
出する。射出終了後、第２方向切替弁８が切り替わりエ
ア配管７ｂを通じて各プランジャ駆動シリンダ５の戻り
側５ｂおよびブースタ６の戻り側６ｂに圧縮エアが供給
され、各プランジャ３は元の位置に戻る。The pressure of the compressed air is controlled by an air regulator 9.
Since a and b are provided and selected by the first direction switching valve 10, the injection pressure can be accurately controlled. The second directional switching valve 8 switches between sending and returning of the air-hydro booster 6, and as a result, switches between sending and returning of each of the plurality of plungers 3. That is, at the time of feeding, compressed air is supplied to the feed side 6a of the booth 6, and the compressed air on the return side 5b of the plunger unit 4 and the return side 6b of the booster 6 is returned to the air source 11 side. Each plunger 3 is pushed out by the injection pressure of the compressed air, and the upper die 1a and the lower die 1
The sealing resin 2 is injected into a molding cavity (not shown) between b. After the injection is completed, the second direction switching valve 8 is switched to supply compressed air to the return side 5b of each plunger drive cylinder 5 and the return side 6b of the booster 6 through the air pipe 7b, and each plunger 3 returns to the original position.
【００１８】圧縮エア源１１からの圧縮エアは、圧力変
換部であるエアレギュレータ９ａか９ｂのどちらかが第
１方向切替弁１０により切替選択されエア・ハイドロ・
ブースタ６に加えられる。例えば９ａを５ｋｇ／ｃ
ｍ2、９ｂを２ｋｇ／ｃｍ2に設定するとエア・ハイドロ
・ブースタ６は、選択された圧力で駆動される。その結
果、各プランジャ３の射出圧は精度良く制御される。The compressed air from the compressed air source 11 is switched by the first directional switching valve 10 to select one of the air regulators 9a and 9b, which are pressure converters, and the air-hydro system is selected.
Added to booster 6. For example, 9a is 5kg / c
When m 2 and 9b are set to 2 kg / cm 2 , the air-hydro booster 6 is driven at the selected pressure. As a result, the injection pressure of each plunger 3 is accurately controlled.
【００１９】[0019]
【発明の効果】以上の発明による効果は次のとおりであ
る。第１の効果は、従来の油圧制御方式からシンプルな
空圧制御にしたことにより油漏れを防止でき、保守性を
向上できたことである。かつ、同時に複雑な構成を簡単
化し小型化、低価格化できたことである。The effects of the present invention are as follows. The first effect is that a simple pneumatic control is used instead of the conventional hydraulic control method to prevent oil leakage and improve maintainability. At the same time, a complicated configuration can be simplified, downsized, and reduced in price.
【００２０】第２の効果は、空圧制御方式の採用によ
り、従来に比べ精度のよい射出圧の制御か可能となった
ことである。The second effect is that the adoption of the pneumatic pressure control system enables the injection pressure to be controlled with higher accuracy than in the past.
【図１】本発明の実施の形態の一例を示す構成図FIG. 1 is a configuration diagram illustrating an example of an embodiment of the present invention.
【図２】半導体素子樹脂封止装置の全体図FIG. 2 is an overall view of a semiconductor device resin sealing device.
【図３】従来マルチプランジャ機構の構成図FIG. 3 is a configuration diagram of a conventional multi-plunger mechanism.
１ａ 上金型 １ｂ 下金型 ２ 封止用樹脂 ３ プランジャ ４ マルチプランジャ・ユニット ５ プランジャ駆動シリンダ ６ エア・ハイドロ・ブースタ ８ 第２方向切替弁 ９ａ エアレギュレータ ９ｂ エアレギュレータ １０ 第１方向切替弁 １１ 圧縮エア源 ２０ 油圧配管 ２４ フィルタ ２５ 油圧ポンプ ２６ オイルタンク ３０ 上ベース ３１ 下ベース ３２ タイバー ３３ サーボモータ Reference Signs List 1a Upper mold 1b Lower mold 2 Sealing resin 3 Plunger 4 Multi plunger unit 5 Plunger drive cylinder 6 Air-hydro booster 8 Second directional switching valve 9a Air regulator 9b Air regulator 10 First directional switching valve 11 Compression Air source 20 Hydraulic piping 24 Filter 25 Hydraulic pump 26 Oil tank 30 Upper base 31 Lower base 32 Tie bar 33 Servo motor
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 ＦＩ // Ｂ２９Ｌ 31:34 (58)調査した分野(Int.Cl.6，ＤＢ名) B29C 45/02 B29C 45/14 B29C 45/46 - 45/53 B29C 45/82 H01L 21/56──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 6 identification symbol FI // B29L 31:34 (58) Field surveyed (Int.Cl. 6 , DB name) B29C 45/02 B29C 45/14 B29C 45 / 46-45/53 B29C 45/82 H01L 21/56
Claims (3)
ティ部に封止用樹脂を押し出す複数のプランジャを備
え、前記プランジャの送り側の駆動媒体を非圧縮性液体
とし、戻り側の駆動媒体を圧縮エアとしたプランジャ装
置と、前記送り側および戻り側の駆動媒体を制御する増
圧弁とを備えたことを特徴とする樹脂封止装置。1. A plunger for extruding a sealing resin in a cavity formed between a pair of sealing dies, wherein a driving medium on a feed side of the plunger is an incompressible liquid, and a driving medium on a return side is A resin sealing device comprising: a plunger device using compressed air as a drive medium; and a pressure-intensifying valve for controlling the drive media on the sending side and the return side.
る請求項１に記載の樹脂封止装置。2. The resin sealing device according to claim 1, wherein the drive medium on the sending side is oil or water.
けた請求項１または２に記載の樹脂封止装置。3. The resin sealing device according to claim 1, further comprising means for controlling a pressure of the compressed air.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13956796A JP2762990B2 (en) | 1996-05-09 | 1996-05-09 | Resin sealing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13956796A JP2762990B2 (en) | 1996-05-09 | 1996-05-09 | Resin sealing device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH09300411A JPH09300411A (en) | 1997-11-25 |
| JP2762990B2 true JP2762990B2 (en) | 1998-06-11 |
Family
ID=15248283
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13956796A Expired - Lifetime JP2762990B2 (en) | 1996-05-09 | 1996-05-09 | Resin sealing device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2762990B2 (en) |
-
1996
- 1996-05-09 JP JP13956796A patent/JP2762990B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH09300411A (en) | 1997-11-25 |
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