JP2740594B2 - Wafer holder for cleaning and etching - Google Patents

Wafer holder for cleaning and etching

Info

Publication number
JP2740594B2
JP2740594B2 JP16925292A JP16925292A JP2740594B2 JP 2740594 B2 JP2740594 B2 JP 2740594B2 JP 16925292 A JP16925292 A JP 16925292A JP 16925292 A JP16925292 A JP 16925292A JP 2740594 B2 JP2740594 B2 JP 2740594B2
Authority
JP
Japan
Prior art keywords
wafer
etching
cleaning
holder
wafer holder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP16925292A
Other languages
Japanese (ja)
Other versions
JPH06112176A (en
Inventor
賢一 上村
正 佐近
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Corp
Original Assignee
Nippon Steel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Corp filed Critical Nippon Steel Corp
Priority to JP16925292A priority Critical patent/JP2740594B2/en
Publication of JPH06112176A publication Critical patent/JPH06112176A/en
Application granted granted Critical
Publication of JP2740594B2 publication Critical patent/JP2740594B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Weting (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明は、半導体製品の製造工程
において、半導体ウェハを洗浄またはエッチングする際
に用いられる洗浄・エッチング用ウェハ保持具に関す
る。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cleaning / etching wafer holder used for cleaning or etching a semiconductor wafer in a semiconductor product manufacturing process.

【0002】[0002]

【従来の技術】半導体製品の製造工程においては半導体
ウェハを洗浄したり、エッチングしたりすることが行わ
れるが、そうした処理工程では半導体ウェハを多数収容
することができる樹脂製のウェハ保持具が利用される。
例えば、特開昭61−189647号公報には、保持具
本体の内面側の対をなす細長いガイドが多数平行して設
けられていて溝を形成すると共に、本体下部にも前記ガ
イドに対応して溝がきられたサポート部が設けられてい
て、半導体ウェハが前記ガイドとサポート部の溝内に挿
入され、保持具下部に円筒面を有する台を設けて、ウェ
ハの保持具の揺動とともに、ウェハを押し上げる型式の
ものが開示されている。
2. Description of the Related Art In a semiconductor product manufacturing process, a semiconductor wafer is cleaned and etched. In such a process, a resin wafer holder capable of accommodating a large number of semiconductor wafers is used. Is done.
For example, in Japanese Patent Application Laid-Open No. 61-189647, a large number of elongated guides forming a pair on the inner surface side of the holder main body are provided in parallel to form a groove, and the lower part of the main body also corresponds to the guide. A grooved support portion is provided, a semiconductor wafer is inserted into the groove of the guide and the support portion, a base having a cylindrical surface is provided below the holder, and the wafer holder is swung and the wafer is swung. Is disclosed.

【0003】洗浄およびエッチングでは均一性を向上さ
せるためにウェハ保持具を回転あるいは揺動させること
が行われる。前記回転および揺動には、処理中に発生す
る気泡を速やかに除いたり、ウェハ近傍の液交換を容易
にする等の効果があり、それによって処理の均一性が増
すのである。しかし、前記公報に開示されているウェハ
保持具の場合、ウェハが脱落してしまうためにウェハ保
持具を回転することは事実上不可能である。したがっ
て、均一性を向上させるにはウェハ保持具の揺動を激し
くする必要があるが、被洗浄・エッチングウェハはウェ
ハ保持具内で振り子のように往復運動しており、反応が
激しい場合には処理中に発生する気泡の除去やウェハ近
傍の液交換が不十分にしか行われず、結果としてウェハ
面内、特にウェハ端部にいたる洗浄およびエッチング均
一性を確保できなくなることが起こる。
In cleaning and etching, the wafer holder is rotated or rocked to improve the uniformity. The rotation and swing have effects such as quickly removing bubbles generated during processing and facilitating liquid exchange near the wafer, thereby increasing the uniformity of processing. However, in the case of the wafer holder disclosed in the above publication, it is practically impossible to rotate the wafer holder because the wafer falls off. Therefore, in order to improve the uniformity, it is necessary to intensify the swing of the wafer holder, but the wafer to be cleaned / etched reciprocates like a pendulum in the wafer holder, and when the reaction is severe, Removal of bubbles generated during processing and liquid exchange near the wafer are performed only insufficiently, and as a result, cleaning and etching uniformity within the wafer surface, particularly at the edge of the wafer, cannot be ensured.

【0004】このような不都合はウェハ保持具を回転可
能な構造にすることである程度は緩和されるが、ウェハ
が前記保持具内でウェハ保持溝に引っかかって回転しな
くなったり、洗浄・エッチング中に発生する気泡が表面
に付着して被洗浄ウェハが上方へ押さえつけられてウェ
ハの回転が抑制されたりすることが散発する。
Such disadvantages can be alleviated to some extent by making the wafer holder rotatable, but the wafer is caught in the wafer holding groove in the holder and does not rotate, or during cleaning / etching. It occurs sporadically that the generated air bubbles adhere to the surface and the wafer to be cleaned is pressed upward and the rotation of the wafer is suppressed.

【0005】[0005]

【発明が解決しようとする課題】本発明は被ウェハの浮
上を防止しかつ被処理ウェハを保持具内で確実に回転さ
せる機構をウェハ保持具に付与することで前記問題点を
解消し、均一な洗浄あるいはエッチングを安定して行う
ことができる洗浄・エッチング用ウェハ保持具を提供す
るものである。
SUMMARY OF THE INVENTION The present invention solves the above problem by providing a mechanism for preventing the floating of a wafer to be lifted and for reliably rotating the wafer to be processed in the holder to the wafer holder. An object of the present invention is to provide a cleaning / etching wafer holder capable of performing stable cleaning or etching stably.

【0006】[0006]

【課題を解決するための手段】本発明の洗浄・エッチン
グ用ウェハ保持具は、ウェハを保持するための少なくと
も2本以上の固定保持棒と1本以上の可動保持棒とを、
ウェハを脱落させないように互いの間隔を開けて、かつ
一対の対向する側板を離間させるように取り付け、前記
固定保持棒あるいは可動保持棒のいづれか少なくとも1
つを取り外し可能とし、固定保持棒のうち少なくとも2
本にはウェハを保持するための溝を設け、可動保持棒を
前記側板に対して平行な方向に可動とし、かつ前記側板
には回転支持部を設けたことを特徴とする。
The cleaning / etching wafer holder of the present invention comprises at least two or more fixed holding rods and one or more movable holding rods for holding a wafer.
At least one of the fixed holding rod or the movable holding rod is attached so that the wafers are separated from each other so as not to fall off, and the pair of opposed side plates are separated from each other.
At least two of the fixed holding rods
The book is provided with a groove for holding a wafer, the movable holding rod is movable in a direction parallel to the side plate, and the side plate is
Is provided with a rotation support portion .

【0007】[0007]

【作用】以下、図を参照しながら、本発明の具体的構成
と作用を説明する。
The specific structure and operation of the present invention will be described below with reference to the drawings.

【0008】図1、2、および3は本発明のウェハ保持
具の一例で、その外観図と2つの断面図である。図2は
側断面図、そして、図3は、図2の紙面に垂直でかつS
S′線を通る断面を表した断面図である。図示されてい
るように、ウェハ保持具本体は一対の側板3からなる。
側板3には固定保持棒1と可動保持棒2が取り付けられ
ている。側板3には回転支持部4がある。固定保持棒1
にはウェハ5を保持するための溝が設けられている。可
動保持棒2の場合、側板3には前記棒の直径よりも大き
な孔6が設けてあり、この孔6で支持されると同時に、
孔6の中で自在に動くことができる。また、被洗浄ウェ
ハの出し入れを容易にするため、固定保持棒あるいは可
動保持棒のいづれか少なくとも1つは取り外し可能であ
る。
FIGS. 1, 2, and 3 show an example of the wafer holder of the present invention, and are an external view and two sectional views. FIG. 2 is a side sectional view, and FIG. 3 is perpendicular to the plane of FIG.
It is sectional drawing showing the cross section which passes along S 'line. As shown, the wafer holder main body includes a pair of side plates 3.
A fixed holding rod 1 and a movable holding rod 2 are attached to the side plate 3. The side plate 3 has a rotation support 4. Fixed holding rod 1
Is provided with a groove for holding the wafer 5. In the case of the movable holding rod 2, the side plate 3 is provided with a hole 6 having a diameter larger than the diameter of the rod.
It can move freely in the hole 6. In addition, at least one of the fixed holding rod and the movable holding rod is removable so as to facilitate loading and unloading of the wafer to be cleaned.

【0009】図4はウェハ保持具を回転させた場合の被
洗浄ウェハ5の位置について示している。洗浄またはエ
ッチング前のウェハ5は図4においてAで表される状態
になっている。溝にセットされたウェハ5は重力により
すべて下側に接している。ウェハ保持具を回転させる
と、ウェハ5は重力により図4のBの状態になり、ウェ
ハと各保持棒間のクリアランス分だけウェハ5が回転す
る。更に、可動保持棒2もウェハ保持具の回転とともに
側板3の孔6の中で自在に移動してウェハ5を下部に押
し下げる。ウェハ保持具を更に回転させると、図4のC
およびDで表すような状態になり、かくしてウェハ保持
具の回転にともないウェハ5を確実に回転させることが
できる。従来のウェハ保持具では洗浄あるいはエッチン
グ反応により発生する気泡が付着することによりウェハ
5が浮上して回転が妨げられ、洗浄やエッチングの均一
性が損なわれることがあったが、このような場合に、可
動保持棒2がウェハ5の周面を押し下げる本発明の洗浄
・エッチング用ウェハ保持具は極めて有効であり、ウェ
ハ5を確実に回転させることができる。また、従来のウ
ェハ保持具では固定保持棒1に設けられた溝部にウェハ
4が挾まって回転が妨げられて洗浄・エッチングむらが
生ずる場合があったが、ウェハ4を確実に回転できる本
発明の洗浄・エッチング用保持具ではこのようなことが
起こらず、むらを生じない。なお、可動保持棒の材料と
してはテフロン等の比重の大きな物質が好適である。
FIG. 4 shows the position of the wafer 5 to be cleaned when the wafer holder is rotated. The wafer 5 before cleaning or etching is in a state represented by A in FIG. All the wafers 5 set in the grooves are in contact with the lower side due to gravity. When the wafer holder is rotated, the wafer 5 is brought into the state shown in FIG. 4B by gravity, and the wafer 5 rotates by the clearance between the wafer and each holding rod. Further, the movable holding rod 2 also moves freely in the hole 6 of the side plate 3 with the rotation of the wafer holder, and pushes the wafer 5 downward. When the wafer holder is further rotated, C in FIG.
And D, and the wafer 5 can be surely rotated with the rotation of the wafer holder. In the conventional wafer holder, bubbles generated by the cleaning or etching reaction adhere to the wafer 5 and the rotation is hindered, and the uniformity of cleaning and etching may be impaired. In addition, the cleaning / etching wafer holder of the present invention in which the movable holding rod 2 pushes down the peripheral surface of the wafer 5 is extremely effective, and the wafer 5 can be surely rotated. Further, in the conventional wafer holder, the wafer 4 was pinched in the groove provided in the fixed holding rod 1 and the rotation was hindered in some cases, resulting in uneven cleaning and etching. Such a phenomenon does not occur in the holder for cleaning and etching described above, and unevenness does not occur. Note that a material having a large specific gravity, such as Teflon, is suitable as a material for the movable holding rod.

【0010】以上詳述したように、本発明の洗浄・エッ
チング用ウェハ保持具ではウェハ保持具を回転するだけ
でウェハが保持具内で常に安定に回転するため、洗浄や
エッチングの状況が不均一になったりすることがない。
これに対し、従来のウェハ保持具ではウェハの回転が不
可能または困難な場合があり、洗浄やエッチングの状況
が不均一になったりする。
As described above in detail, in the cleaning / etching wafer holder of the present invention, the wafer is always stably rotated in the holder only by rotating the wafer holder, so that the cleaning and etching conditions are not uniform. It does not become.
On the other hand, the rotation of the wafer may be impossible or difficult with the conventional wafer holder, and the situation of cleaning and etching may be uneven.

【0011】[0011]

【実施例】ラッピング工程において荒研磨されたシリコ
ンウェハを洗浄した後、図1に示すウェハ保持具にセッ
トした。図1の保持具は本発明のウェハ保持具である。
次に、弗硝酸溶液(50%弗酸:70%硝酸:100%
酢酸を3:5:3の容量比で混合した混酸)中に前記ウ
ェハがセットされた保持具を浸漬して、回転、揺動しな
がらエッチングを行った。比較のために可動保持棒のな
いウェハ保持具でも同様の試験を行った。超純水により
リンスした後、保持具から取り出して乾燥し、エッチン
グむらの有無を調べた。
EXAMPLE After a silicon wafer roughly polished in a lapping step was washed, it was set on a wafer holder shown in FIG. The holder of FIG. 1 is the wafer holder of the present invention.
Next, a hydrofluoric acid solution (50% hydrofluoric acid: 70% nitric acid: 100%)
The holder on which the wafer was set was immersed in a mixed acid obtained by mixing acetic acid at a volume ratio of 3: 5: 3), and etching was performed while rotating and rocking. For comparison, a similar test was performed on a wafer holder having no movable holding rod. After rinsing with ultrapure water, it was taken out of the holder and dried, and the presence or absence of uneven etching was examined.

【0012】本発明のウェハ保持具を利用した場合には
エッチングむらは全く発生しないが、比較例ではエッチ
ングむらが散発した。また、エッチング後の形状にも差
があり、本発明のウェハ保持具を用いた場合にはウェハ
毎の差はほとんどなかった。
When the wafer holder of the present invention is used, no etching unevenness occurs at all, but in the comparative example, etching unevenness was sporadic. Further, there was also a difference in the shape after etching, and when the wafer holder of the present invention was used, there was almost no difference for each wafer.

【0013】以上のように、本発明の洗浄・エッチング
用ウェハ保持具ではエッチングが均一に起こり、ウェハ
毎の差異が小さい。
As described above, in the cleaning / etching wafer holder of the present invention, etching occurs uniformly, and the difference between wafers is small.

【発明の効果】以上詳述したように、本発明の洗浄・エ
ッチング用ウェハ保持具によれば、洗浄またはエッチン
グ処理の均一性および安定性が増し、ウェハ処理後の表
面品質が安定する。
As described in detail above, according to the cleaning / etching wafer holder of the present invention, the uniformity and stability of the cleaning or etching process are increased, and the surface quality after the wafer processing is stabilized.

【図面の簡単な説明】[Brief description of the drawings]

【図1】 本発明の洗浄・エッチング用ウェハ保持具
(外観図)の一例。
FIG. 1 shows an example of a cleaning / etching wafer holder (external view) of the present invention.

【図2】 図1の保持具の側断面図。FIG. 2 is a side sectional view of the holder shown in FIG. 1;

【図3】 図1の保持の断面図。FIG. 3 is a sectional view of the holding unit shown in FIG. 1;

【図4】 本発明の洗浄・エッチング用ウェハ保持具を
用いた時の被処理ウェハの位置図。
FIG. 4 is a position diagram of a wafer to be processed when the cleaning / etching wafer holder of the present invention is used.

【符号の説明】[Explanation of symbols]

1…固定保持棒、 2…可保持棒、 3…側板、
4…回転支持部、5…ウェハ、 6…孔。
1 ... fixed holding rod, 2 ... holding rod, 3 ... side plate,
4 ... rotation support part, 5 ... wafer, 6 ... hole.

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】ウェハを保持するための少なくとも2本以
上の固定保持棒と1本以上の可動保持棒とを、ウェハを
脱落させないように互いの間隔を開けて、かつ一対の対
向する側板を離間させるように取り付け、前記固定保持
棒あるいは可動保持棒のいづれか少なくとも1つを取り
外し可能とし、固定保持棒のうち少なくとも2本にはウ
ェハを保持するための溝を設け、可動保持棒を前記側板
に対して平行な方向に可動とし、かつ前記側板には回転
支持部を設けたことを特徴とする洗浄・エッチング用ウ
ェハ保持具。
At least two or more fixed holding rods and one or more movable holding rods for holding a wafer are spaced apart from each other so as not to drop the wafer, and a pair of opposed side plates are formed. At least one of the fixed holding rod and the movable holding rod is detachable, at least two of the fixed holding rods are provided with grooves for holding a wafer, and the movable holding rod is attached to the side plate. and movable in a direction parallel to, and rotate in the side plates
A wafer holder for cleaning / etching, comprising a support portion .
JP16925292A 1992-06-26 1992-06-26 Wafer holder for cleaning and etching Expired - Lifetime JP2740594B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16925292A JP2740594B2 (en) 1992-06-26 1992-06-26 Wafer holder for cleaning and etching

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16925292A JP2740594B2 (en) 1992-06-26 1992-06-26 Wafer holder for cleaning and etching

Publications (2)

Publication Number Publication Date
JPH06112176A JPH06112176A (en) 1994-04-22
JP2740594B2 true JP2740594B2 (en) 1998-04-15

Family

ID=15883068

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16925292A Expired - Lifetime JP2740594B2 (en) 1992-06-26 1992-06-26 Wafer holder for cleaning and etching

Country Status (1)

Country Link
JP (1) JP2740594B2 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI481737B (en) * 2014-08-20 2015-04-21 Powerchip Technology Corp Bearing fixture
FR3124887B1 (en) * 2021-07-02 2023-06-23 Commissariat Energie Atomique Platelet immersion device

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5911338A (en) * 1982-07-12 1984-01-20 Hoechst Gosei Kk Expandable composition

Also Published As

Publication number Publication date
JPH06112176A (en) 1994-04-22

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