JP2736292B2 - Filament gripping device and cutting method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus and a method for gripping and cutting filaments used for handling filaments.

[0002]

2. Description of the Related Art FIG. 7 shows a side view (a), a bottom view (b) and an operation view (c) of a conventional filament gripping device, wherein 1 is a gripping pin, and 4 is a gripping pin. Reference numeral 1 denotes a slider to which the slider 4 is fixed. Reference numeral 5 denotes a connecting rod connecting the driving device (not shown) to the slider 4 for sliding the slider 4. Reference numeral 12 denotes a filament which is a workpiece to be gripped. A holding body having a portion for holding the filament 12 and a sliding surface of the slider 4;
Reference numeral 0 denotes a lid screwed to the grip body for regulating the grip body 3 and the slider 4.

A conventional gripping device for laying a filament (diameter: 12 μm) is configured as described above.
The filament 12 is formed by the flat surface of the gripper and the gripping pin 1 fixed to the slider 4 driven by the driving of the connecting rod 5.
FIG. 7C shows an operation in a state where the gripping mechanism is opened, and FIGS. 7A and 7B show an operation in a state where the filament 12 is gripped.

[0004]

Generally, the filament to be handled is a wire in which tungsten is used as a core wire and a dry powder-like carbonate substance is adhered around the core wire, so that the powder itself has lubricity. is there. In addition, it has a function as an abrasive, and has a problem that it easily adheres to and accumulates on the gripping part. There is a problem that it cannot be gripped by being buried in a small groove. As shown in FIG. 7, the conventional filament gripping device has a structure where the filament is gripped, that is, the gripping pin 1 and the gripping body 3 are sandwiched between a plane and a cylinder or between a plane and a plane. Even if the surface roughness is improved, it cannot be gripped by the powdery carbonate substance. In order to hold the powder, it is necessary to clean the powder attached to the grip of the grip device. In addition, the edges of the components constituting the grip portion (although the same can be said for the mechanical components in general) are chamfered, and as shown in FIG. If the filament is gripped at the edge of each component, the filament is buried in the gap formed by the filament and cannot be gripped. Therefore, it is necessary to regulate and grip the filament so that it is not gripped by the gap. Also, as shown in FIG. 6, when the cutter 13 for cutting the filament is attached after the filament is gripped, tension is applied to the filament at the time of cutting to push the filament, and the filament slips out of the gripping portion, thereby further increasing the gripping force. Need to be powerful.
Furthermore, in order to be able to grip a filament having a wire diameter of 12 μm anywhere on the gripping part, it is necessary to process the component with high precision, and at present, it is necessary to have a structure capable of grinding. In addition, since the filament gripping device is mounted on another device (for example, a filament spot welding device), the operation speed must be improved and space must be reduced to reduce the weight and reduce the size. It had to be structured.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and solves the problem of slipperiness of the filament, enhances the gripping force, and further comprises a filament gripping portion. An object of the present invention is to provide a filament gripping device that eliminates a gripping error caused by a filament entering a hollow of a member. In addition, since the gripping force is enhanced, a filament gripping device having a cutting function can be obtained because the filament can withstand a tension that is generated by pushing the filament off with a cutter at the time of filament wiring and tends to come off from the gripping portion. And a compact and high-accuracy filament gripping device.

[0006]

SUMMARY OF THE INVENTION In order to grasp a filament without slipping, a filament grasping device according to the present invention has a structure in which a filament is twisted by two V-grooves and a cylindrical pin inserted therein, and can be sandwiched and grasped. It is what it was.

Further, a pin is fixed to the bottom of the V-groove of the grip body, and a hole through which the pin can be fitted is provided on a side surface of the grip pin that engages with the V-groove.

The length of the connecting rod for transmitting the driving of the gripping pin is shortened on the side far from the filament supply device of the filament to be gripped, and lengthened on the near side, and a spring is provided at each end. Attach it so that it is pressed into the groove, and attach a backing plate that drives this connecting rod to the output shaft end of one drive source,
The output shaft end is separated from the connecting rod when the retraction is completed, and the connecting rod can be pushed out when the output shaft protrudes.

In addition, cutters which can slide independently are attached to both sides of the gripping device.

[0010] Further, there are provided a groove in which a slider and a cutter which fix the holding pin to the holding body can slide, a hole for guiding the connecting rod to slide, and a V-groove at the tip of the holding body.

[0011]

When a filament is gripped by the filament gripping device constructed as described above, the gripping pin acts as a wedge due to the engagement between the gripping pin and the gripping body, and the filament is twisted in an S shape and gripped.

Further, the pin regulates the gripping position of the filament, and prevents the intrusion into the recess which is unavoidably generated by machining the gripping portion.

[0013] Also, due to the different lengths of the connecting rods, when the caul plate retreats, first the shorter connecting bar separates from the caul plate, and when the caul plate retreats further, the longer connecting bar acts to separate. Therefore, the gripping operation is performed in order from the gripping portion driven by the short connecting rod to the gripping portion driven by the next longer connecting rod. At this time, since the short connecting rod is arranged on the side far from the filament supply device, the gripping operation is completed in the order far from the filament tension device. This means that the filament is gripped while maintaining the tension without sagging at the joint between the gripping body and the gripping pin.

Further, one of the cutters attached to both sides of the gripping device is fixed by the gripping device, and the other, after the wiring, the filament is fixed by, for example, spot welding, and the cutter advances from the gripping device to cut the filament. Work to do.

Further, since the above-mentioned functions are housed in one holding body, the holding device can be made compact.

[0016]

【Example】

Embodiment 1 FIG. FIG. 1 shows an embodiment of the present invention.
(A) is a plan view, (b) is a side sectional view, (c) is a bottom view, and (d) is a front view. In the figure,
Reference numeral 1 denotes a cylindrical gripping pin fixed to the slider 4, and the slider 4 can slide in a guide hole formed by a groove formed in the gripping body 3 and a lid 11 fixed to the groove. I have. A V-shaped groove 3 a that engages with the holding pin 1 is formed at the tip of the holding body 3. Since the V-groove 3a and the gripping pin 1 always contact at two points, the gripping pin 1 is formed on the slider 4 by an adhesive material having a delay hardening property.
Adhered and fixed to the groove. This V-shaped groove 3a
1B, the pin 2 is fixed to the bottom of the V groove 3a as shown in FIGS. 1B and 1C, and is fitted so as to always slide with the hole 1c formed on the side surface of the gripping pin 1. . At this time, as shown in FIG. 4C, the size of the hole 1c of the gripping pin 1 is constituted by the hole and the diameter of the pin 2 which do not interfere with the contact point between the gripping pin 1 and the V groove 3a. I have. Reference numeral 5 denotes a connecting rod fixed to the slider 4 and guided at the rear portion of the grip main body 3 and has different lengths, and the grip pin 1 and the V-groove 3a of the grip main body 3 engage as shown in FIG. 1A, the amount of protrusion of the grip body 3 from the rear portion is different as shown in FIG.
Reference numeral 6 denotes a spring, which is inserted between the retaining ring 7 fixed to the end of the connecting rod 5 and the grip body 3 through the connecting rod 5. 9
Is a cylinder, and a backing plate 8 is attached to the output shaft end thereof. When the cylinder 9 reaches the limit position, the backing plate 8 and the connecting rod 5 are arranged on the base 10 so as to separate from each other. I have.

Next, the operation will be described. In the filament gripping device configured as described above, since the filament is gripped by the gripping pin 1 and the V-groove 3a of the grip body, as shown in FIG. Because the clamping force doubled due to the wedge effect of 3a acts and is gripped in a twisted state,
Since the contact portion between the gripping pin 1 and the filament 12 can be made long, the drag force against the slip acts greatly.

Next, the operation of the pin 2 will be described with reference to FIGS. FIG. 8 shows a state in which the filament 12 has penetrated into the gap generated in the grip portion when there is no pin 2. FIG.
(A) is sectional drawing before grasping a filament. FIG. 4B is a sectional view after the filament is gripped. FIG. 4C is a cross-sectional plan view at the position of the pin 2. As described above, the pin 2 is provided between the gripping pin 1 which is a component of the gripping portion and the gap of the chamfered portion formed in the corner of the V groove 3a of the gripping body, as shown in FIG.
Is controlled so that the filament does not enter, and an operation of guiding the filament to be gripped at the point where the gripping pin 1 and the V-groove 3a of the gripping body are engaged. FIG.
As shown in (c), a hole 1c drilled in the gripping pin 1
Does not cause a problem in gripping the filament 12.

Further, in the filament holding device configured as described above, one of the filaments is fixed,
The other is the filament 1 supplied by the filament supply device 19.
In a state where tension is applied to 2, the filament can be gripped as shown in FIG. FIG. 2A shows a preparation state before the filament 12 is clamped.
FIG. 2B shows a state where the filament 12 is clamped on a side far from the filament supply device 19 serving as a tension device, and FIG. 2C shows a state where the filament 12 is clamped. FIG. 3 shows the filament 12
Is a detailed illustration of the situation in which is clamped. As described above, the gripping operation is as follows. First, when the output shaft of the cylinder 9 is advanced and the connecting rod 5 is pushed by the contact plate 8 attached to the tip, the V-groove 3a at the tip of the grip body 3 and the gripping pin 1 are opened. , And is in a preparation state in which the filament 12 can be grasped (see FIG. 2A). Next, when the output shaft of the cylinder 9 is returned, the short connecting rod 5 separates from the backing plate 8, and the filament is clamped by the holding pin 1a and the V groove 3a by the spring 6 attached to the connecting rod 5 ( FIG. 2 (b),
FIG. 4 (a)). When the output shaft of the cylinder 9 is further returned, the long connecting rod 5 is similarly separated from the backing plate 8 and is clamped (see FIGS. 2C and 3B). As described above, since the filament 12 is clamped in order from a side far from the tension device, as shown in FIG. 3B, there is no slack between the two V-grooves 3a of the grip body 3 and the tension from the filament supply device The two V-grooves 3 are gripped by the grip pins 1a and 1b while
The gripping force by a can act as a slip resistance in series with an external tension.

Embodiment 2 FIG. In the above-described embodiment, the case where only the gripping device is used has been described. However, a cutter for cutting a filament may be attached to both sides of the gripping device. FIG. 5 shows the embodiment. The cutter 13 can slide in a guide hole formed by a groove formed on both sides of the grip body 3 and a side cover 14. A latch 15 is provided at the rear of the cutter 13.
The cutter 16 on the left and right sides can be driven back and forth by the cylinder 16 via this. The other configuration is completely the same as that of the first embodiment.

In the filament gripping device with the cutter function configured as described above, only the gripping operation performs the same operation as in the first embodiment, and as shown in FIG.
When the filament is gripped, the cutter 13 is retracted without any trouble in the gripping operation. When cutting the filament 12, the cutter 13 can be advanced and cut as shown in FIG. 5 (b).

Embodiment 3 FIG. An embodiment of the above-described method of using the gripping device with a cutter function will be described with reference to the drawings. FIG.
In the figure, reference numeral 17 denotes a work, and after laying the filament 12 by the filament gripping device, the filament is fixed to the work by spot welding. Reference numeral 18 denotes the spot point. Reference numeral 19 denotes a filament supply device for applying a tension for preventing the filament from sagging at the time of supplying and wiring the filament. In this usage, as described in the above embodiment, one of the filaments is fixed by spot welding and the other is under tension from the filament supply device as described in the above embodiment. Enter the gripping operation in the state. Next, the gripping pin 1 farther from the filament supply device performs a clamping operation as shown in FIG. The next closest gripping pin 1 performs the clamping operation in FIG.
(C), and finally, the cutter 13 advances to cut the filament. When the other cutter needs to be cut on the left side of the workpiece 17 after the filament wiring, it operates as shown in FIG.

[0023]

The present invention is configured as described above, and has the following effects. First, the filament can be clamped with a doubled force due to the wedge effect caused by the filament being bitten by the V groove and the cylinder.
And it has a structure that can exhibit slip resistance in series, and by twisting and gripping the filament, a large resistance to slip can be obtained, and a strong gripping effect exceeding the tensile strength of the base material of the filament Is obtained, and a stable gripping operation can be obtained because of the guide mechanism that prevents the filament from entering the gap generated in the gripping component.

As a secondary effect of obtaining a strong gripping force, as shown in FIG. 5, even if a cutter capable of gripping and cutting the filament is attached to both sides of the gripping portion, it can withstand the tension generated at the time of cutting. Therefore, there is also an effect that the filament does not slip out of the grip portion at the time of cutting, and the cutting position is stably and accurately maintained. In addition, if the cutting position accuracy is not required, if the device is operated to tear the filament fixing side in the filament gripping state in FIG. 2C, the filament can be cut between the fixing point and the gripping device. Needless to say.

When the gripping device according to the present invention is used, as shown in FIG.
For example, when the other gripping pin first engages with the V-groove and then one of the gripping pins engages, the filament already has a slack between the gripping pin and the spot welding point of the work. When the gripping pin bites into the V groove in the next operation, the filament needs an extra length of this biting,
This portion needs to be drawn from the filament supply device, but there is no supply of filament due to slippage between the spot welding point and the clamp pin. Therefore, a tension acts between the two when the gripping pin is engaged in the V-groove, thereby breaking the filament, and one of the gripping pins and the other of the gripping pins are simultaneously V-shaped.
Even if the pin is engaged in the groove, the wire is disconnected between the two gripping pins for the same reason. However, in this device, after one of the gripping pins is engaged in the V-groove, the other of the gripping pins operates. For this reason, the gripping pin operates in the V-groove so that it does not hinder the extra length of filament that is required from being drawn in from the filament supply device and supplements the filament, and unnecessary tension may be applied during the gripping operation as described above. There is no disconnection.

[Brief description of the drawings]

FIG. 1A is a plan view showing a first embodiment of the present invention,
(B) is a front sectional view, (c) is a bottom view, and (d) is a left side view.

FIG. 2 is a plan view showing a filament gripping operation according to the first embodiment of the present invention.

FIG. 3 is an enlarged view of a main part showing a detailed operation of a gripping portion of a filament, showing Embodiment 1 of the present invention.

FIG. 4 is a cross-sectional view showing the operation of regulating the position of the filament according to the first embodiment of the present invention.

FIG. 5 is a perspective view showing the operation of the second embodiment of the present invention.

FIG. 6 is a schematic diagram illustrating a method according to a third embodiment of the present invention.

7A is a side view, FIG. 7B is a bottom plan view, and FIG. 7C is a side view for explaining an operation of the conventional filament gripping device.

FIG. 8 is a partially enlarged side view showing a filament gripping defect of the conventional device.

[Explanation of symbols]

 Reference Signs List 1 gripping pin 1c hole 2 pin 3 gripping body 3a V groove 4 slider 5 connecting rod 6 spring 7 retaining ring 8 patch plate 9 cylinder 10 base 11 lid 12 filament 13 cutter 14 side lid 15 latch 16 cylinder 17 work 18 spot point 19 filament Supply device

Claims (4)

(57) [Claims] 1. A gripping body for gripping a filament.
A V-groove provided in the V- shaped portion, a pin standing on the bottom of the V-groove, and a hole through which the pin is slidably inserted.
Cylindrical shape provided on a slider that slides against the holding body
Gripping pin consists, and the V-groove, said cylindrical meshing so as to oppose the V groove
Simultaneously contact the filaments with the gripping pins
A filament gripping device characterized in that it is inserted at two points . 2. A connecting rod for driving a gripping pin is set at a distance from the filament supply device so that a plurality of gripping pins can be engaged with a wire rod to be gripped in order from the farthest from the filament supply device. 2. The filament gripping device according to claim 1, wherein a shorter one is longer and a closer one is longer, and the actuator is driven by one actuator. 3. A gripping body, wherein a sliding groove of a cutter for cutting a filament is provided on a grip body.
The filament gripping device as described in the above. 4. A filament cutting method comprising the steps of: laying a filament on a work using the filament gripping device according to claim 1; and cutting the filament on both sides of the work.