JP2730840B2 - Injection process switching method and apparatus, and resin filling / refilling process switching method and apparatus - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and a device for switching an injection process and a method and a device for switching a resin filling / replenishing process, and more particularly to a surface pressure sensor provided on a mold mating surface or a contact surface between a mold and a board. The present invention relates to a novel improvement for switching between various processes by using a surface pressure signal from a computer.

[0002]

2. Description of the Related Art Conventionally, switching between such an injection step and a resin filling / replenishing step, which are used, is generally performed by detecting a filling pressure, a filling speed, a mold position, and the like.

[0003]

Since the conventional switching between the injection step and the resin filling / replenishing step is constituted as described above, it is necessary to arrange a large number of various sensors and perform complicated signal processing. , As well as a lot of man-hours during assembly,
Maintenance also required a lot of time, and it was not easy to maintain reliability.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and in particular, uses a surface pressure signal from a surface pressure sensor provided on a mold mating surface or a contact surface between a mold and a board. It is an object of the present invention to provide an injection process switching method and apparatus, and a resin filling / replenishing step switching method and apparatus, which perform switching between various processes by using the same.

[0005]

According to the injection process switching method of the present invention, a fixed die provided on a fixed platen and a movable die provided on a movable platen are clamped, and a die of each of the above dies is provided. When the surface pressure signal from the surface pressure sensor provided on the mating surface matches the surface pressure set value, the mold clamping is completed, and then the resin is filled during the injection process and the surface pressure is reduced to obtain the next process. In this method, the start signal is used to switch from the injection step to the start of the next injection step.

In another injection process switching method according to the present invention, a fixed mold provided on a fixed board and a movable mold provided on a movable board are clamped, and any one of the molds and any board is provided. When the surface pressure signal from the surface pressure sensor provided on the contact surface during the time coincides with the surface pressure set value, the mold clamping is completed, and then the surface pressure is reduced by filling the resin during the injection process. In this method, the start of the next injection step is switched from the injection step in response to the next step start signal.

An injection process switching apparatus according to the present invention clamps a fixed die provided on a fixed platen and a movable die provided on a movable platen, and switches the start of the injection process to the start of the next injection process. The above-described injection step switching device has a surface pressure sensor provided on a mold mating surface of each mold, and switches the start of the injection step by a surface pressure signal from the surface pressure sensor. .

Another injection process switching apparatus according to the present invention clamps a fixed mold provided on a fixed platen and a movable mold provided on a movable platen, and switches between the injection step and the start of the next injection step. In the injection step switching device, the surface pressure sensor is provided on a contact surface between any one of the molds and any one of the boards, and the injection step is performed by a surface pressure signal from the surface pressure sensor. Is switched.

A method for switching between a resin filling and replenishing step according to the present invention includes a filling step of filling a resin into a mold cavity formed by a fixed mold provided on a fixed board and a movable mold provided on a movable board. In the resin filling / replenishing step switching method in which the switching to the replenishing step of replenishing the resin after the filling step is performed, using a surface pressure signal from a surface pressure sensor provided on a mold mating surface of each mold. This is a method for switching between the filling and replenishing steps.

Another method for switching between a resin filling and replenishing step according to the present invention is a filling step of filling a resin into a mold cavity formed by a fixed mold provided on a fixed board and a movable mold provided on a movable board. And a method of switching between a filling step and a refilling step for refilling the resin after the filling step, wherein the surface pressure provided on the contact surface between any of the molds and any of the boards is changed. This is a method of switching between the filling and replenishing steps using a surface pressure signal from a sensor.

A resin filling / replenishing step switching device according to the present invention includes a filling step of filling a resin into a mold cavity formed by a fixed mold provided on a fixed board and a movable mold provided on a movable board. In the resin filling / replenishing step switching method in which switching is performed between a refilling step and a resin replenishing step after the filling step, a surface pressure sensor provided on a mold mating surface of each mold is provided.

Another apparatus for switching between a resin filling and replenishing step according to the present invention is a filling step of filling a resin into a mold cavity formed by a fixed mold provided on a fixed board and a movable mold provided on a movable board. And a method for switching between a refilling step and a refilling step for replenishing resin after the filling step, wherein the surface pressure provided on the contact surface between any of the molds and any of the boards is changed. This is a configuration having a sensor.

[0013]

In the method and apparatus for switching the injection process according to the first to fourth aspects of the present invention, a surface pressure signal from a surface pressure sensor provided on a mold mating surface or a contact surface between a mold and a board is used. Compared with the set value, mold clamping is completed by the surface pressure achievement signal when this surface pressure signal reaches the surface pressure set value, the value decreases as the resin fills the mold during the injection process, The start of the next injection step is switched by obtaining the next step start signal.

Further, in the method and apparatus for switching between the resin filling and replenishing steps according to claims 5 to 8 of the present invention, the surface from the surface pressure sensor provided on the mold mating surface or the contact surface between the mold and the board The pressure signal is compared with the surface pressure set value, and when this surface pressure signal reaches the surface pressure set value, the mold clamping is completed by the surface pressure achievement signal, and after the resin is filled in the filling process, a decrease in the value is detected. Then, switching and control to a replenishment step (that is, a pressure-holding step) for replenishing an amount of resin corresponding to shrinkage of the resin in the mold are performed.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of a method and an apparatus for switching an injection process and a method and an apparatus for switching a resin filling / replenishing process according to the present invention will be described in detail with reference to the drawings. In FIG. 1, reference numeral 1 denotes a mold having a mold cavity 1a. The mold 1 includes a fixed mold 3 provided on a fixed platen 2 and a movable mold provided on a movable platen 4. The movable platen 4 is configured so that the mold 1 can be opened and closed and the mold can be clamped by well-known mold clamping means (not shown).

A surface pressure sensor 10 comprising a load sensor or the like is provided on a mold mating surface 1A of the fixed mold 3 and the movable mold 5 (there are four places in FIG. 1, one of which is used). A surface pressure signal 10 a obtained from the surface pressure sensor 10 is provided with a surface pressure set value 11 a from a surface pressure setter 11.
Is input to the comparator 12 to which the input is input. The surface pressure sensor 10 is not limited to the configuration shown in FIG. 1, but may be provided on a contact surface 1B between any of the dies 3, 5 and any of the boards 2, 4.

The surface pressure attainment signal 12a obtained from the comparator 12 provides a next step start signal 13a, ie, an injection switching signal for switching the start of the next injection step, through a processing unit 13 such as a timer. It is configured as follows.

Next, the operation will be described. When the mold 1 is clamped by the mold clamping means described above, the surface pressure signal 10a from the surface pressure sensor 10 is compared with the surface pressure set value 11a, and when the surface pressure signal 10a matches the surface pressure set value 11a (at this time, When the surface pressure is the maximum value), the mold clamping is completed. Thereafter, the resin is injected and filled into the mold cavity 1a via an injection cylinder and an injection nozzle (not shown). As the resin is filled during the injection step, the surface pressure decreases, and the decrease in the surface pressure is determined by the processing unit 13.
To generate a next process start signal 13a for switching the start of the next injection process.

Further, the present invention is not limited to the above-described switching of the start of the injection process. For example, the surface pressure signal 10a from the surface pressure sensor 10 is used, and the surface pressure signal 10a is used as the surface pressure set value 11a.
The mold clamping is completed by the surface pressure attainment signal 12a at the time when the pressure has reached, and after the resin is filled in the filling step, a decrease in the value is detected, and an amount of resin equivalent to the contraction of the resin in the mold 1 is replenished. To the replenishment step (that is, the pressure-holding step).

Further, as means for detecting the degree of filling in the mold 1 using the above-mentioned surface pressure signal 10a, other devices required in the filling step (for example, a device for piercing a molded article in the mold 1) Can also be applied as an operation start signal.

[0021]

The method and apparatus for switching the injection process and the method and apparatus for switching the resin filling / replenishing process according to the present invention are constructed as described above, so that they can be controlled without using many sensors as in the prior art. By using only the surface pressure sensor, switching of the start of the injection process, switching from the filling process to the refilling process, and the like can be easily and accurately performed, and the control accuracy of the injection molding machine can be greatly improved. .

[Brief description of the drawings]

FIG. 1 shows an injection process switching device and a resin filling / injection device according to the present invention.
It is a block diagram which shows a replenishment process switching apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Die 2 Fixed plate 3 Fixed die 4 Movable plate 5 Movable die 1A Die mating surface 1B Contact surface 10 Surface pressure sensor 10a Surface pressure signal

Claims (8)

(57) [Claims] A fixed mold (3) provided on a fixed board (2) and a movable mold (5) provided on a movable board (4) are clamped, and the respective molds (3,5) are clamped. When the surface pressure signal (10a) from the surface pressure sensor (10) provided on the mold mating surface (1A) for detecting the surface pressure matches the surface pressure set value (11a), mold clamping is completed. After that, switching from the injection step to the start of the next injection step is performed by a next step start signal (13a) obtained by filling the resin during the injection step and reducing the surface pressure. Process switching method. 2. A fixed mold (3) provided on a fixed board (2) and a movable mold (5) provided on a movable board (4) are clamped, and any one of the molds (3 , 5) and the surface pressure signal (10a) from the surface pressure sensor (10) provided on the contact surface between any of the panels (2, 4) is the surface pressure set value (11a).
The mold closing is completed when the value coincides with, and thereafter, the next process start signal (13a) obtained by filling the resin during the injection process and reducing the surface pressure is used to start the next injection process from the injection process. An injection process switching method, wherein switching is performed. 3. A fixed mold (3) provided on a fixed board (2) and a movable mold (5) provided on a movable board (4) are clamped. In the injection process switching apparatus configured to switch the start, the mold mating surfaces of the molds (3, 5) are used.
(1A) provided with a surface pressure sensor (10), wherein the surface pressure sensor (1
An injection process switching device, characterized in that the start of the injection process is switched by the surface pressure signal (10a) from (0). 4. A fixed mold (3) provided on a fixed board (2) and a movable mold (5) provided on a movable board (4) are clamped, and an injection step is performed in the next injection step. In the injection process switching device configured to switch the start, the surface pressure sensor (1B) provided on the contact surface (1B) between any of the molds (3, 5) and any of the panels (2, 4) 10) An injection process switching apparatus, wherein the switching of the start of the injection process is performed by a surface pressure signal (10a) from the surface pressure sensor (10). 5. A resin is filled into a mold cavity (1a) formed by a fixed mold (3) provided on a fixed board (2) and a movable mold (5) provided on a movable board (4). In the method of switching between a filling step and a refilling step of replenishing the resin after the filling step, the method for switching between the filling and refilling steps of the resin is performed.
(3, 5) switching between the filling and replenishing process using a surface pressure signal (10a) from a surface pressure sensor (10) provided on a mold mating surface (1A) of the resin filling and filling step. Replenishment process switching method. 6. A resin is filled into a mold cavity (1a) formed by a fixed mold (3) provided on a fixed board (2) and a movable mold (5) provided on a movable board (4). In the resin filling / replenishing process switching method in which the filling process and the refilling process of replenishing the resin after the filling process are switched, any one of the molds (3, 5) and any one of the boards (2 , 4) switching between the filling and replenishing process using a surface pressure signal (10a) from a surface pressure sensor (10) provided on a contact surface (1B) between the resin filling and replenishing process. Switching method. 7. A resin is filled into a mold cavity (1a) formed by a fixed mold (3) provided on a fixed board (2) and a movable mold (5) provided on a movable board (4). In the method of switching between a filling step and a refilling step of replenishing the resin after the filling step, the method for switching between the filling and refilling steps of the resin is performed.
A resin filling / replenishing process switching device, comprising: a surface pressure sensor (10) provided on a mold mating surface (1A) of (3, 5). 8. A resin is filled in a mold cavity (1a) formed by a fixed mold (3) provided on a fixed board (2) and a movable mold (5) provided on a movable board (4). In the resin filling / replenishing process switching method in which the filling process and the refilling process of replenishing the resin after the filling process are switched, any one of the molds (3, 5) and any one of the boards (2 , 4) having a surface pressure sensor (10) provided on the contact surface (1B).
Refill process switching device.