JP2700243B2 - Heating equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Field of Industrial Application) The present invention relates to a heating device. (Prior Art) In recent years, as an annealing technique, light energy of a high-energy ray beam is absorbed by a surface of an object to be processed, for example, a semiconductor wafer, and converted into a form of thermal energy to perform heat treatment (annealing) of a surface layer of the object to be processed. Attention has been paid to a beam annealing technique to be performed, and in semiconductor manufacturing, it is a technique mainly used for recovering crystallinity of a semiconductor wafer surface layer, activating introduced impurities, and the like. For example, SOI (Sil
icon On Insulator) technology is a technology in which a silicon single crystal is further formed on an insulating film formed on the surface of a substrate and an element is formed on the silicon single crystal. In this SOI technology, a single crystal is formed on the insulating film. One of the ways to form
The above-mentioned beam annealing technique is receiving attention. For example, a non-single-crystal silicon layer formed on an insulating film by chemical vapor deposition (CVD) or the like is irradiated with a high-energy ray beam such as a laser to convert the non-single-crystal silicon layer into a single-crystal silicon layer. It is applied to the technology that is becoming As a beam annealing apparatus used for beam annealing in such semiconductor manufacturing, a disk-shaped susceptor for pre-heating an object to be processed is provided inside a cylindrical chamber which can be divided into upper and lower parts. There is a method in which, for example, a semiconductor wafer is suction-held on a lower surface, and annealing is performed by scanning and irradiating a laser beam from below the semiconductor wafer. Generally, such a beam annealing apparatus is provided with a susceptor heating mechanism.
A lamp or the like is provided, and the susceptor is preheated to, for example, about 500 ° C. by radiating heat of a photothermal source from quartz glass or the like attached to the upper surface of the chamber. (Problems to be Solved by the Invention) However, in the above-described conventional beam annealing apparatus, not only the susceptor but also its peripheral devices such as a drive system, various sensors, and control devices are generated by the heat from the heating mechanism and the radiant heat of the susceptor. Also heats peripheral devices such as, and due to this thermal effect, drive system, for example, malfunction of the bearing,
There is a problem that a malfunction of the sensor or the like is caused. In addition, since it is necessary to take measures against heat of these peripheral devices, there is a problem that the cost of the device is increased. SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems, and can reduce the thermal effect on peripheral devices from a susceptor or a susceptor heating mechanism, prevent thermal damage to chamber peripheral devices, and reduce the cost of the apparatus. It is intended to provide a device. [Structure of the Invention] (Means for Solving the Problems) The heating apparatus of the present invention has a processing chamber formed therein, a chamber having a heating window made of a transparent member, and the heating chamber in the chamber. A holder for holding an object to be processed, which is disposed so as to face the window for use; a support for supporting the holder on the inner wall of the chamber; and a support provided outside the chamber through the heating window. A heating mechanism for irradiating the holding section with heat rays to heat the workpiece, wherein the object to be processed held by the holding section is heated by heat transfer from the holding section. And a heat insulating member interposed between the holding portion and the support portion, and a cooling mechanism disposed on the chamber wall or the support portion. The heating device according to claim 2 is formed in a substantially cylindrical shape and has a heating window made of a transparent member. The heating device is disposed in the chamber so as to face the heating window, A disk-shaped holding portion made of carbon graphite for holding an object; a rotating ring provided around the holding portion to support a radial direction of the holding portion; and a bearing inserted between the rotating ring and the inner wall of the chamber. A light heat source that is disposed outside the chamber and irradiates the holding unit with heat rays through the window to heat the holding unit, thereby heating the workpiece held by the holding unit. A first annular cooling pipe buried near the inner peripheral surface of the rotating ring; a second annular cooling pipe buried near the surface of the upper wall of the chamber; and the first and second cooling pipes To circulate cooling water And a water supply unit. (Operation) A cooling pipe, which is provided on a chamber wall or a support section and introduces cooling water, a cooling mechanism including a cooling water supply mechanism for supplying the cooling water to the cooling pipe, and a section between the holding section and the support section. With the heat insulating member interposed in the, it is possible to prevent the temperature rise of the peripheral equipment due to the heat from the holding part of the workpiece and the heating mechanism,
This prevents thermal damage to the peripheral equipment of the chamber and reduces the cost of the apparatus. (Embodiment) An embodiment in which the present invention is applied to a laser annealing apparatus will be described below with reference to FIGS. The processing chamber 1 is defined by a chamber 4 composed of a cylindrical upper lid 2 made of, for example, stainless steel or aluminum, and a cylindrical lower lid 3 made of, for example, aluminum. The upper lid 2 and the lower lid 3 are shown in FIG. The opening / closing mechanism is omitted, for example, by an air cylinder. During the processing operation, the upper lid 2 and the lower lid 3 are closed,
A gas inlet provided on the side wall of the chamber, for example, nitrogen gas is discharged from a plurality of outlets formed on the inner peripheral surface of the gas inlet pipe 5 formed in an arc shape along the inner wall of the chamber as shown in FIG. Gas or oxygen gas is introduced, flows almost parallel to the processing surface of the processing object, and is discharged from an exhaust port 6 formed in an inner wall facing the gas introduction pipe 5. Exhaust gas C is third
As shown in the figure, the gas is guided to a discharge pipe 7 provided at the upper part of the apparatus, and is discharged to the outside of the apparatus together with the filling gas in the upper part of the apparatus. The upper wall of the upper lid 2 and the lower wall of the lower lid 3 have openings 2 respectively.
The openings 2a and 3a are provided with transparent members such as quartz glass 8 and 9 having a diameter of 220 mm. A susceptor 10 made of, for example, carbon graphite having a diameter of 220 mm and a thickness of 20 mm, for example, for preheating the semiconductor wafer is disposed near a central portion inside the processing chamber 1, and the lower surface of the susceptor 10 has a vacuum chuck. The semiconductor wafer 11 transferred by a transfer mechanism (not shown) is suction-held on the lower surface of the susceptor 10. A rotating ring 12 made of stainless steel having an outer diameter of 250 mm, a height of 50 mm, and a thickness of 10 mm is provided around the outer peripheral surface of the susceptor 10 while maintaining an interval therefrom.
And a plurality of heat-insulating support members provided at intervals between the susceptor 10 and the susceptor 10, for example, a ceramic support member 13.
Are held by the rotating ring 12. The rotating ring 12 is attached to the inner wall of the upper lid via a bearing 14 provided on the outer peripheral surface thereof, and a ring rotating mechanism (not shown) finely adjusts the angle in the θ direction of the semiconductor wafer 11 sucked and held on the susceptor. Do. Above the chamber 4, as a heating mechanism for the susceptor 10,
An IR lamp (Infrared Ray Ramp) 16 of several kilowatts provided with a light heat source such as a reflection plate 15 is provided, and infrared rays from the IR lamp 16 pass through the quartz glass 8 and cause the susceptor 10 to reach, for example, 500 ° C. It is configured to preheat. On the other hand, a laser irradiation mechanism (not shown) is provided below the chamber 4. The laser light output from the laser output mechanism, for example, a CW-Ar gas laser light A
Is irradiated on the surface of the semiconductor wafer 8 through the quartz glass 9 to perform an annealing process. By the way, in the laser annealing apparatus having such a configuration, due to infrared rays from the IR lamp 16 and radiant heat from the susceptor 10, sensors, control devices, For example, the temperature of the peripheral devices becomes high, for example, 500 ° C.Therefore, these peripheral devices may be damaged by high heat.For example, the bearing 14 of the rotating ring uses a honbling lease or the like as a lubricating oil. There is a risk that this grease will be degraded by the use of. In order to reduce such thermal effects, a cooling mechanism is provided on the rotating ring 12 and the upper lid 2. The cooling mechanism includes a ring cooling water passage 17 provided inside the rotating ring 12, an upper cover cooling water passage 18 provided inside the upper surface of the upper cover 2, and a circulation pump 19 for circulating cooling water through these water passages 17, 18. It is composed of As shown in FIG. 4, the ring cooling water passage 17 is formed by forming a water passage having a cross section of, for example, 50 mm square along the inner periphery of the ring at the upper part of the inner peripheral surface of the rotating ring 10. And
At least one location on the upper surface of the rotating ring
A cooling water supply port 20 communicating with the circulating pump 19 is provided.A cooling water supply pipe 21 is inserted into a side surface of the cooling water supply port 20 and communicates with the cooling water 8B. Water supply jack for introducing from the supply port 20 to the cooling water passage 17
22 are installed. Cooling water B
After being introduced into the ring cooling water passage 17 from 22 and subjected to heat exchange, it is discharged from a cooling water outlet not shown. Since the configuration of the cooling water passage 17 is very simple, in manufacturing the cooling water passage 17, the cooling groove 23 is previously formed on the inner peripheral surface of the rotating ring 12.
Can be easily manufactured by welding a thin ring body 24 to the opening of the cooling groove 23. On the other hand, the upper lid cooling water passage 18 provided on the upper lid 2 has the same concept as the cooling mechanism of the rotating ring. As shown in FIG.
An annular cooling groove 25 having a depth of 5 mm and a length of 5 mm is formed, and a thin ring body 26 is welded to the opening. Note that the cross-sectional shape of the cooling groove 25 may have a wide upper surface area, for example, a wide shape in order to efficiently absorb the heat from the IR lamp 16. The temperature of the cooling water circulating in these cooling water passages 17 and 18 is
The lower the temperature, the better, but it is not particularly necessary to cool, and may be room temperature, for example, about 20 ° C. If the temperature of the susceptor 10 is heated to 500 ° C., even the room temperature cooling water can be used near the upper surface and side surfaces of the chamber 4. Decreased to 50-60 ° C. Therefore, there is no possibility of damage to the bearing 14 of the rotating ring, the upper cover 2 of the chamber, and other peripheral devices of the chamber due to the heat, and the durability of the entire apparatus can be improved. Furthermore, the degree of freedom in selecting components and equipment increases,
For example, since there is no need to use expensive heat-resistant members or heat-resistant equipment, the cost of the apparatus can be reduced. still,
Since the cooling mechanism of this example has a simple configuration, the increase in cost due to this is negligible in the entire apparatus. By the way, in the above-described embodiment, the cooling mechanism is provided in the chamber upper lid 2 and the rotating ring 12, but the present invention is not limited to this mounting position. If it is provided in a high-temperature portion, the effect can be obtained at any position. For example, it is possible to reduce the influence of heat on a laser optical device or the like (not shown). Further, the configuration of the cooling water passage is not limited to the above-described embodiment. For example, a configuration may be adopted in which a cooling water circulation pipe is buried inside a rotating ring or a chamber upper lid. [Effects of the Invention] As described above, according to the heating device of the present invention, the influence of heat between the susceptor and the chamber can be reduced.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a view showing a configuration around a chamber of an embodiment in which the present invention is applied to a laser annealing apparatus, FIG. 2 is a sectional view in a radial direction of a chamber, and FIG. Diagram showing the flow, fourth
FIG. 5 is a sectional view showing the ring cooling water passage of FIG. 1, and FIG. 5 is a sectional view showing the upper lid cooling water passage of FIG. 1 processing chamber, 2 top lid, 3 bottom lid, 4 chamber, 10 susceptor, 11 semiconductor wafer, 12 rotating ring, 14 bearing, 16 IR lamp, 17… Rotating ring cooling water passage, 18… Cover cooling water passage, 19… Circulation pump.

Claims (1)

(57) [Claims] A chamber having a processing chamber formed therein and having a heating window made of a transparent member; a holding unit disposed in the chamber so as to face the heating window and holding an object to be processed; A supporting unit that supports the unit on the inner wall of the chamber; and a heating mechanism that is provided outside the chamber and irradiates the holding unit with heat rays through the heating window to heat the holding unit. In a heating device configured to heat the held object to be processed by heat transfer from the holding unit, a heat insulating member interposed between the holding unit and the support unit, and the chamber A heating device, comprising: a cooling mechanism provided on a wall or the support portion. 2. A chamber having a heating window formed of a substantially cylindrical shape and made of a transparent member; and a disk-shaped member made of carbon graphite disposed in the chamber so as to face the heating window and holding an object to be processed. A rotating part provided around the holding part and supporting a radial direction of the holding part; a bearing inserted between the rotating ring and the inner wall of the chamber; and a rotating part disposed outside the chamber; By irradiating the holding unit with heat rays through the window and heating the holding unit, a light heat source for heating the workpiece held by the holding unit, and embedded in the vicinity of the inner peripheral surface of the rotating ring A first annular cooling pipe, a second annular cooling pipe buried near a surface of the upper wall of the chamber, and a cooling water supply unit for circulating cooling water to the first and second cooling pipes. That you have Characteristic heating device.