JP2694631B2 - High temperature exhaust gas forced rapid cooling device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a PCB gas incinerator in a PCB disposal process for preventing pollution of the global environment due to disposal of a harmful substance PCB (polychlorinated biphenyl) which has been conventionally used as a heat medium or the like. The present invention relates to a forced rapid cooling device for high temperature exhaust gas.

[0002]

2. Description of the Related Art Conventionally, as a method of discarding and incinerating a contaminant PCB contained in a device such as a large transformer or a high-voltage capacitor, a combustion temperature of 1,1 is used in Japan.
A test was performed at 50 ° C., a residence time of 2 seconds, and excess oxygen of 3%, and the decomposition efficiency was 99.9999%, that is, 6-nine was confirmed.

[0003] In order to achieve these conditions efficiently with a relatively small apparatus, for example, a PCB waste oil combustion treatment method (Japanese Patent Application No. 5-241) has been proposed by the same inventor as the present invention.
No. 419) and a waste oil combustion apparatus related to this method (Japanese Patent Application No. 5-229067).

[0004]

However, in the above-mentioned conventional proposals, the combustion gas discharged by the incineration of PCB gas is at a high temperature of 1,400 ° C. or higher, for example, 1,800 ° C. In order to combust and decompose, a gas having an exhaust gas temperature of 1,600 ° C. or higher is discharged from the incinerator, and when cooled, dioxin harmful substances are generated in a temperature range of 700 to 200 ° C. Therefore, it is necessary to take a separate dioxin removing means.

The present invention has been made in view of the above situation, and by forcedly rapidly cooling the high-temperature exhaust gas as described above, the gas can be discharged within 1/10 seconds which is the chemical reaction time of dioxin. It is an object of the present invention to provide a forced rapid cooling device configuration for suppressing the generation of dioxins by controlling the temperature to 200 ° C or lower.

[0006]

Therefore, in the present invention, a high temperature exhaust gas forced rapid cooling device of this type is provided in a PCB.
A device for rapidly cooling high-temperature exhaust gas of 1600 ° C. or higher from a gas incinerator, which comprises primary and secondary cooling means, and the primary cooling means introduces the high-temperature exhaust gas into cooling water. Means for passing the gas, a first high-pressure water spray means for cooling the temperature of the passing gas to 200 ° C. or less within 1/10 seconds, and an outlet means for discharging the cooled gas. And the secondary cooling means supplies a cooling water coil tube, a second high-pressure water spray means for cooling the coil tube, and cooling water of the primary cooling means into the cooling water coil tube. The object is achieved by comprising a high-pressure water pump for supplying the high-pressure water in the coil tube and a high-pressure water pipe for supplying the high-pressure water in the coil tube to the first high-pressure water spray means of the primary cooling means. It is what you are trying to achieve.

[0007]

With the apparatus of the present invention as described above, the temperature of the high temperature exhaust gas from the PCB gas incinerator of the waste PCB liquid is controlled within the chemical reaction temperature range of 700 to 200 ° C. for generating dioxins, and the reaction time is 1/10 seconds. By forcibly and rapidly cooling it within the range, it is possible to move to the next step of removing harmful substances and realize pollution-free atmospheric emission without generating dioxin.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below based on embodiments.
FIG. 1 shows a flow diagram of a schematic configuration of an embodiment of a forced rapid cooling device for hot exhaust gas from a PCB gas incinerator according to the present invention. This cooling system consists of primary and secondary cooling towers 1, 9
Consisting of

Numeral 1 is a primary gas cooling tower, which is 1,80 in the previous step.
High-temperature exhaust gas 2 of 1,600 ° C. or higher from a waste PCB gas incinerator, which is decomposed by combustion at a high temperature of 0 ° C., is introduced from a duct. When these exhaust gas 2 cools, 700-200
Since dioxin is generated in the temperature range of ° C, it is intended to rapidly cool it to 200 ° C or lower within the chemical reaction time of 1/10 seconds of the generation. FIG. 2 is an example of a cross-sectional view of a specific configuration of the primary gas cooling tower 1.

In FIGS. 1 and 2, 3 is a high temperature exhaust gas chamber,
The hot exhaust gas 2 is configured to be sucked from the cooled gas outlet 4 at the top of the tower 1 at a static pressure of -500 mm. 5a is a guide valve for the cooling water 5 stored at the bottom of the tower 1, 6 is an obstruction plate,
7 is a high-pressure water pipe, 8 is a first high-pressure water spray device, 12
Is a high-pressure water pump, 13 is a water level adjusting tank having a float valve 13a, and 15 is a demister / separator for removing residual vapor and dust in the tower 1.

Further, the secondary cooling tower 9 has a cooling water coil tube 9a in the tower, and the cooling water 5 at the bottom of the primary cooling tower 1 is supplied to the cooling water coil tube 9a from below by a high-pressure water pump 12. It is pressure-fed and guided from the upper end of the pipe to the high-pressure water spray device 8 in the primary cooling tower through the high-pressure water feed pipe 7. 10
Is a blower for ventilating the high-pressure spray device 8 from above to below.

The water in the cooling coil tube 9a in the secondary cooling tower 9 is supplied by a high pressure spray device 17 in which the bottom cooling water 16 (14 is a water level adjusting tank with its float valve 14a) is guided by a high pressure water pump 11. The high-temperature gas 2 that has been cooled and guided to the second high-pressure spray device 8 in the primary cooling tower 1 through the high-pressure water supply pipe 7 and has passed through the cooling water 5 is rapidly cooled.

As described above, in the primary cooling tower 1, since the high temperature exhaust gas 2 is rapidly cooled, the high heat of the gas is converted into steam, and the heat of vaporization removes the gas heat, so that a huge amount of steam is generated. In order to suppress this, the high-pressure water spray 8 is tapped downward from above to lower the temperature of the steam, and the gas and the steam are cooled in the tower 1. The inside of the tower 1 is sealed, and a sealing process is performed so that neither the exhaust gas nor the steam leaks to the outside.

To summarize the above operation, the cooled gas outlet 4
The high-temperature exhaust gas 2 of 1,600 ° C. drawn into the gas chamber 3 of the primary cooling tower 1 with a static pressure of −500 mm passes through the cooling water 5 under the obstruction plate 6 and passes through the guide valve 5a. Attempt to pass through Exit 4. At this time, the water 5 and the high-temperature exhaust gas 2 come into contact with each other, and a large amount of steam generated is highly heated by the high-pressure water spray 8 from the high-pressure water pipe 7 (cooling water in the pipe is 50 ° C. or lower here). and by blowing the steam intended to rapid cooling, water of the spray 8, for example, 33l / s with respect to the gas 1 m ^3, that is, is configured to 33l per second as blowing the gas of 33m ^3, the The speed of water is 16m
/ S.

The cooling water in the high-pressure water supply pipe 7 is circulated in the secondary cooling tower 9 by the high-pressure water pump 11, and the cooling tower 9 cools this cooling water to 50 ° C. or less by the cooling water coil pipe 9a. doing. The water 16 at the bottom of the tower is supplied to the high-pressure water pump 11.
Thus, the high-pressure spray water sent to the high-pressure spray 17 and ejected from the high-pressure spray 17 is configured to exchange heat with the surrounding atmosphere by the large blower 10.

With the above cooling device, the high temperature exhaust gas 2 is reduced to 1
Within 10 seconds, it is rapidly cooled to below 200 ° C (actually about 100 ° C), and without producing dioxin, remove harmful components such as NO _{x in the} next step and emit it to the atmosphere without pollution. You can

[0017]

As described above, according to the high temperature exhaust gas forced rapid cooling device according to the present invention, the PCB of the waste PCB liquid is
The temperature of the hot exhaust gas from the gas incinerator is forcibly and rapidly cooled within the chemical reaction temperature range of 700 to 200 ° C. for generating dioxin within 1/10 s of the reaction time, without generating dioxin. It is possible to move to the process of removing harmful substances to achieve pollution-free atmospheric emission.

[Brief description of the drawings]

FIG. 1 is a schematic configuration flowchart of an apparatus according to an embodiment.

[FIG. 2] Example of one cross-sectional view of a specific configuration of a primary gas cooling tower

[Explanation of symbols]

 1 Primary Gas Cooling Tower 2 High Temperature Exhaust Gas 4 Cooled Gas Outlet 5,16 Cooling Water 5a Cooling Water Guide 7 High Pressure Water Pipe 8,17 High Pressure Water Spray Device 9 Secondary Cooling Tower 9a Cooling Water Coil Pipe 11,12 High Pressure Water Pump

Claims (1)

(57) [Claims] 1. An apparatus for rapidly cooling high-temperature exhaust gas at 1600 ° C. or higher from a PCB gas incinerator, comprising primary and secondary cooling means, wherein the primary cooling means controls the high-temperature exhaust gas. Guide means for introducing downward from above and passing through the inside of the cooling water;
The temperature of the passing gas passing through the
A first high-pressure water spray means for cooling below ℃,
The secondary cooling means has a cooling water coil tube, a second high-pressure water spraying means for cooling the coil tube, and an outlet means for discharging the cooled gas. A high pressure water pump for supplying the cooling water into the cooling water coil tube, and a high pressure water pipe for supplying the cooled high pressure water in the coil tube to the first high pressure water spray means of the primary cooling means. A high-temperature exhaust gas forced rapid cooling device characterized by having.