JP2682583B2 - Thin mounting device for semiconductor memory device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of a connector and a semiconductor memory device in which a portable semiconductor memory device can be mounted with the thinnest and high density.

[0002]

2. Description of the Related Art FIG. 8A shows a conventional portable semiconductor memory device 1
6 shows a connector 14 and FIG. 6B is a view of FIG. 6A viewed from the front, showing how the upper and lower surfaces of the portable semiconductor memory device 16 in the thickness direction are guided. 15 is a portable semiconductor memory device
16 is an electrode provided as a means for connecting the external terminal and the interface circuit.

As shown in FIG. 8, the conventional connector has a conventional connector for supporting and guiding the upper surface and the lower surface thereof against the thickness T ₂ of the portable semiconductor memory device 16 for guiding the portable semiconductor memory device 16. A structure having a thickness T ₃ and a thickness T ₄ was indispensable for the connector 14. These thicknesses T ₃ and T ₄ cannot be made too thin from the viewpoints of flowability during resin molding and mechanical strength. In a commercially available connector, when T ₂ is 3.3 to 3.4 mm, T ₃ = T ₄ = 1.3 mm is required, and therefore the total connector is 6 mm.

[0004]

According to the conventional connector 14 and the portable semiconductor memory device 16, there is no supporting method other than supporting and guiding the thickness T ₂ of the portable semiconductor memory device 16, and the conventional connector 14 is used. 8 was the only structure. Therefore, there is a problem that the thickness of the connector cannot be reduced. In the future, it will be difficult for the conventional connector 14 to mount a plurality of portable semiconductor memory devices on small and thin devices.

The present invention has been made in order to solve the above problems, and an object thereof is to obtain a structure method in which the thickness of a connector can be made the thinnest and a structure of a portable semiconductor memory device adaptable to this connector. And

[0006]

A semiconductor memory device mounting apparatus according to the present invention is provided with convex or concave guide bodies on both side surfaces of the semiconductor memory device, while the convex or concave guide bodies are provided on a connector side for receiving the semiconductor memory device. A concave or convex guide groove corresponding to the concave guide body is provided.

[0007]

The connector according to the present invention is designed so that it can be guided within the thickness of the portable semiconductor memory device, and a structure in which the thickness of the connector can be minimized can be realized.
Most portable semiconductor memory devices can be mounted most efficiently and with high density.

[0008]

1 (a) shows a connector 1 according to an embodiment of the present invention. In the present invention, the members having the thicknesses T ₃ and T ₄ in the conventional connector 14 are unnecessary. The projection type guide members 2a and 2b for guiding the portable semiconductor memory device 7 (see FIG. 3) of the present invention are provided. Mounting hole 4a ~
4d is for fixing the connector 1 to the printed circuit board 17 (see FIG. 2). The electrode 3 is used for connecting an external terminal. In FIG. 1 (b), the convex guide members 2a and 2b have different vertical position dimensions G ₁ and G ₂ with respect to the thickness direction in order to prevent reverse insertion.

FIG. 3 shows a portable semiconductor memory device 7 according to an embodiment of the present invention. Guide grooves 9a, the 2b provided within the thickness, the guide groove is provided from the upper surface in the thickness direction at the position of the dimension G _1, G _2.

FIG. 2 shows an example of mounting the connector 1 and the portable semiconductor memory device 7 on the printed circuit board 17. According to this drawing, it is clear that the portable semiconductor memory device 7 can be mounted since it is the thinnest. Become. An example of mounting the printed circuit board 17 with the screws 5a to 5d is shown.

FIG. 4 is a view in which the connector 1 and the portable semiconductor memory device 7 of the present invention are easily inserted and understood. The card extraction tool 11 is a hole provided in the portable semiconductor memory device 7.
The card is inserted into 10a and 10b so that the card can be easily removed.

In the above embodiment, the convex guide member is provided on the connector side and the concave guide groove is provided on the portable semiconductor memory device side. However, the reverse is true, that is, the concave guide groove is provided on the connector side and the portable type. It is obvious that the same effect can be obtained by using the convex guide body on the semiconductor memory device side.

A plurality of connectors 1 are shown in FIG.
An example implemented in is shown below. This connector 1 uses a straight type of the electrode 3 shown in FIG. 1 (a). It is a means for mounting the portable semiconductor memory device at the highest density. To remove the portable semiconductor memory device 7, a card extraction tool 11
Can be used.

FIG. 6 shows a case where the connectors 1 are stacked in multiple stages. The connector 1 in which the lead length of the electrode 3 of the connector 1 of the present invention is changed is stacked in multiple stages, and the portable semiconductor memory device 7 can be mounted at the highest density.

It is obvious that the thickness when the connector 1 and the portable semiconductor memory device 7 of the present invention are combined can be suppressed to the thickness T ₂ of the portable semiconductor memory device in principle. When multi-stage mounting according to FIG. 6 is required, it is necessary to determine the thickness of the connector 1 in consideration of the thickness tolerance of the portable semiconductor memory device 7. Now T
_{When 2} ± a, multi-stage mounting is possible by setting T ₁ = T ₂ + a + b. a is the tolerance of the thickness of the portable semiconductor memory device 7, and b is the space dimension. Now, a = 0.1m
When m and b = 0.05 mm, T ₁ = T ₂ +0.15 mm.

FIG. 7 shows a connector 1 provided with standoffs. By installing stand-off T ₅ , connector 1
It is possible to mount components underneath.

[0017]

According to the present invention, the thinnest connector for a portable semiconductor memory device can be realized, which facilitates mounting on a thin and small device. In addition, the most efficient mounting can be realized when mounting a large number of portable semiconductor memory devices such as semiconductor disk devices.

[Brief description of the drawings]

FIG. 1 is a plan view (a) showing a connector according to an embodiment of the present invention and a front view (b) when the connector (a) is viewed from the front.

FIG. 2 is a side view showing an example of mounting the connector and the portable semiconductor memory device of the present invention on a printed circuit board.

FIG. 3 is a plan view showing a portable semiconductor memory device according to an embodiment of the present invention.

FIG. 4 is a perspective view showing a mounting example of the connector and the portable semiconductor memory device of the present invention.

FIG.

FIG. 6 is a side view showing an example in which the connector and the portable semiconductor memory device of the present invention are mounted in multiple stages.

FIG. 7 is a side view of the connector of the present invention provided with a standoff.

FIG. 8 is a plan view (a) and a front view (b) showing a conventional connector and a portable semiconductor memory device.

[Explanation of symbols]

 1 Connector 2a, 2b Convex guide member 3 Electrode 4a-4d Mounting hole 5a-5d Screw 7 Portable semiconductor memory device 9a, 9b Guide groove 10a, 10b Extraction hole 11 Card extraction tool 17 Printed circuit board

Claims (1)

(57) [Claims] 1. A mounting device of a semiconductor memory device comprising a connector for supporting the semiconductor memory device by inserting or removing the semiconductor memory device and electrically connecting to the semiconductor memory device. Providing convex or concave guide portions on both sides, and providing concave or convex guide portions that fit into the guide portions at corresponding positions of the connector , the semiconductor memory device and the connector have the same thickness.
Thin mounting device for a semiconductor memory device characterized by comprising a body.