JP2680886B2 - Manufacturing method of composite material with solder - Google Patents

Manufacturing method of composite material with solder

Info

Publication number
JP2680886B2
JP2680886B2 JP1065647A JP6564789A JP2680886B2 JP 2680886 B2 JP2680886 B2 JP 2680886B2 JP 1065647 A JP1065647 A JP 1065647A JP 6564789 A JP6564789 A JP 6564789A JP 2680886 B2 JP2680886 B2 JP 2680886B2
Authority
JP
Japan
Prior art keywords
solder
composite material
manufacturing
strip
longitudinal direction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1065647A
Other languages
Japanese (ja)
Other versions
JPH02247098A (en
Inventor
隆明 佐川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Kikinzoku Kogyo KK
Original Assignee
Tanaka Kikinzoku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Kikinzoku Kogyo KK filed Critical Tanaka Kikinzoku Kogyo KK
Priority to JP1065647A priority Critical patent/JP2680886B2/en
Publication of JPH02247098A publication Critical patent/JPH02247098A/en
Application granted granted Critical
Publication of JP2680886B2 publication Critical patent/JP2680886B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Manufacture Of Switches (AREA)

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明は、コネクター、スイッチ、リレー、更には集
積回路用リードフレーム等に用いる半田付き複合材料の
製造方法の改良に関する。
Description: TECHNICAL FIELD The present invention relates to an improvement in a method for manufacturing a soldered composite material used for connectors, switches, relays, and lead frames for integrated circuits.

(従来の技術) 従来、半田付き複合材料を製造するには、貴金属又は
貴金属合金の帯材が一側長手方向に重積接合された帯状
金属材料の他側にめっきにより半田を取付けた後圧延加
工するか、又は前記帯状金属材料の他側端長手方向を溶
融半田槽に浸漬して半田を取付けている。
(Prior Art) Conventionally, in order to manufacture a composite material with solder, noble metal or noble metal alloy strips are stacked on one side in a longitudinal direction and solder is attached to the other side by plating and then rolled. The solder is attached by processing or dipping the other side end longitudinal direction of the strip-shaped metal material in a molten solder bath.

(発明が解決しようとする課題) ところで、上記の半田付き複合材料の製造方法で作っ
た半田付き複合材料は、いずれも薄張り半田の為、半田
ボリュームが少なくなり、半田不足となるものが多かっ
た。この為、補助半田作業により半田を補充していた
が、半田厚さにむらが生じたりした為、複合材料を半田
付けした際、接合強度が弱くばらつきが大きくて不安定
となったりした。また半田の補充により必要以外の部分
に半田が取付けられたりした為、複合材料が汚損したり
した。
(Problems to be Solved by the Invention) By the way, all of the composite materials with solder made by the above-described method for manufacturing the composite material with solder are thin solder, so that the solder volume is reduced and the solder is often insufficient. It was Therefore, although the solder was replenished by the auxiliary soldering work, the solder thickness was uneven, and when the composite material was soldered, the bonding strength was weak and the dispersion was large and unstable. In addition, the replenishment of the solder attached the solder to an unnecessary portion, and the composite material was contaminated.

そこで本発明は、半田付けに十分なボリュームの半田
を備えた複合材料を作る方法を提供しようとするもので
ある。
Thus, the present invention seeks to provide a method of making a composite material with a sufficient volume of solder for soldering.

(課題を解決するための手段) 上記課題を解決するための本発明の半田付き複合材料
の製造方法は、一側長手方向に貴金属又は貴金属合金の
帯材がインレイ接合された最終仕上げの厚みに近い帯状
金属材料の他側長手方向に溝を設け、この溝中にノズル
にて溶融半田を流し込むことを特徴とするものである。
(Means for Solving the Problem) The method for manufacturing a composite material with solder of the present invention for solving the above-mentioned problem is a thickness of a final finish in which a strip of a noble metal or a noble metal alloy is inlaid in a longitudinal direction on one side. It is characterized in that a groove is provided in the longitudinal direction on the other side of the similar strip-shaped metal material, and molten solder is poured into the groove by a nozzle.

(作用) 上述の如く本発明の半田付き複合材料の製造方法で
は、最終仕上げの厚みに近い帯状金属材料に設けた溝中
に溶融半田を流し込むので、半田を厚付けできて、半田
付けに十分なボリュームの半田を備えた複合材料が得ら
れる。またこの半田を厚付けした帯状金属材料は、既に
中間熱処理や熱処理矯正工程を経ているので、その必要
が無く、半田を溶かすことが無い。
(Operation) As described above, in the method for manufacturing a composite material with solder of the present invention, the molten solder is poured into the groove provided in the strip-shaped metal material having a thickness close to the final finish, so that the solder can be thickened and is sufficient for soldering. Composite materials with different volumes of solder are obtained. Further, since the band-shaped metal material having the solder thickened has already undergone the intermediate heat treatment and the heat treatment straightening step, it is not necessary and the solder is not melted.

(実施例) 本発明の半田付き複合材料の製造方法の一実施例を図
によって説明すると、第1図に示す最終仕上げの厚みに
近い幅10mm、厚さ0.08mmのCu−Ni7%−Sn2%より成る帯
状金属材料1の一側長手方向に幅3mm、厚さ0.01mmのAg
−Pd50%の帯材2がインレイ接合された該帯状金属材料
1の他側長手方向に幅5mm、深さ0.02mmの溝3を設け、
この溝3中にヒーター4を外周に備えたノズル5にて溶
融半田(Pb40%−Sn60%)6を流し込んで第2図に示す
如く20〜22μmの半田6を厚付けした処、半田付けに十
分なボリュームの半田6を備えた複合材料7が得られ
た。
(Example) An example of a method for manufacturing a composite material with solder according to the present invention will be described with reference to the drawings. A Cu-Ni7% -Sn2% having a width of 10 mm and a thickness of 0.08 mm, which is close to the thickness of the final finish shown in FIG. 3 mm wide and 0.01 mm thick Ag in the longitudinal direction on one side of the strip-shaped metal material 1
-Providing a groove 3 having a width of 5 mm and a depth of 0.02 mm in the longitudinal direction on the other side of the strip-shaped metal material 1 in which the strip material 2 of 50% Pd is inlaid.
Molten solder (Pb40% -Sn60%) 6 was poured into the groove 3 with a nozzle 5 equipped with a heater 4 on the outer periphery, and 20 to 22 μm of solder 6 was thickened as shown in FIG. A composite material 7 was obtained with a sufficient volume of solder 6.

尚、この複合材料7は第3図に示されるように更に僅
かに圧延加工して接合強度、寸法精度の向上及び半田6
の表面を滑らかにした。
The composite material 7 is further slightly rolled as shown in FIG.
Smoothed the surface of.

一方従来例として、前記実施例の場合と同じ帯状金属
材料の一側長手方向に幅3mm、厚さ0.01mmのAg−Pd50%
の帯状を重積接合した後、該帯状金属材料の他側端長手
方向を溶融半田槽に浸漬した処、2〜3μmの厚みの半
田を有する複合材料が得られた。この複合材料は半田不
足なので補助半田作業により半田を補充した。
On the other hand, as a conventional example, one side of the same strip metal material as in the above-mentioned embodiment has a width of 3 mm in one longitudinal direction and a thickness of 0.01 mm of Ag-Pd 50%.
After stack-bonding the strip-shaped metal sheets, the other side end longitudinal direction of the strip-shaped metal material was immersed in a molten solder bath to obtain a composite material having a solder having a thickness of 2 to 3 μm. Since this composite material lacks solder, supplementary solder was used to supplement the solder.

こうして製造した実施例及び従来例の半田付き複合材
料を打抜き、切断等の加工を行って、コネクター用接触
子を作り、これを厚さ1mm、幅10mm、長さ50mmの銅より
成る台材に半田付けして、接合強度を測定した処、下記
の表に示すような結果を得た。
The composite material with solder of the example and the conventional example manufactured in this way is punched and processed such as cutting to make a contact for a connector, which is made into a base material made of copper with a thickness of 1 mm, a width of 10 mm, and a length of 50 mm. After soldering and measuring the bonding strength, the results shown in the following table were obtained.

上記の表で明らかなように実施例の半田付き複合材料
にて作ったコネクター用接触子の半田付けの接合強度
は、従来例の半田付き複合材料にて作ったコネクター用
接触子の半田付けの接合強度よりも高くばらつきが少な
く安定していることが判る。
As is clear from the above table, the soldering joint strength of the connector contactor made of the soldered composite material of the embodiment is the same as that of the connector contactor made of the conventional soldered composite material. It can be seen that the bond strength is higher than the bonding strength and the dispersion is small and stable.

(発明の効果) 以上の説明で判るように本発明の半田付き複合材料の
製造方法は、最終仕上げの厚みに近い帯状金属材料に設
けた溝中に溶融半田を流し込むので、半田を厚付けでき
て、半田付けに十分なボリュームの半田を備えた複合材
料を得ることができる。そしてこの半田を備えた複合材
料にて作った電気接触子は台材との半田付けによる接合
強度が高くばらつきが少なくて安定したものとなると言
う効果を奏する。
(Effect of the invention) As can be seen from the above description, in the method for manufacturing a composite material with solder of the present invention, the molten solder is poured into the groove provided in the strip-shaped metal material having a thickness close to the final finish, so that the solder can be thickened. As a result, a composite material having a sufficient volume of solder for soldering can be obtained. Then, the electric contact made of the composite material including the solder has an effect that it has a high bonding strength by soldering with the base material and has little variation and becomes stable.

【図面の簡単な説明】[Brief description of the drawings]

第1図及び第2図は本発明の半田付き複合材料の製造方
法の一実施例の工程を示す図、第3図は本発明の製造方
法により得た半田付き複合材料をさらに圧延加工した状
態を示す図である。
1 and 2 are diagrams showing steps of an embodiment of a method for manufacturing a soldered composite material of the present invention, and FIG. 3 is a state in which the soldered composite material obtained by the manufacturing method of the present invention is further rolled. FIG.

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】一側長手方向に貴金属又は貴金属合金の帯
材がインレイ接合された最終仕上げの厚みに近い帯状金
属材料の他側長手方向に溝を設け、この溝中にノズルに
て溶融半田を流し込むことを特徴とする半田付き複合材
料の製造方法。
1. A groove is provided in a longitudinal direction on the other side of a strip-shaped metal material having a thickness close to a final finish in which a strip of a noble metal or a noble metal alloy is inlaid on the longitudinal direction on one side, and a molten solder is formed in the groove at a nozzle. A method for manufacturing a composite material with solder, comprising pouring.
JP1065647A 1989-03-17 1989-03-17 Manufacturing method of composite material with solder Expired - Lifetime JP2680886B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1065647A JP2680886B2 (en) 1989-03-17 1989-03-17 Manufacturing method of composite material with solder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1065647A JP2680886B2 (en) 1989-03-17 1989-03-17 Manufacturing method of composite material with solder

Publications (2)

Publication Number Publication Date
JPH02247098A JPH02247098A (en) 1990-10-02
JP2680886B2 true JP2680886B2 (en) 1997-11-19

Family

ID=13293008

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1065647A Expired - Lifetime JP2680886B2 (en) 1989-03-17 1989-03-17 Manufacturing method of composite material with solder

Country Status (1)

Country Link
JP (1) JP2680886B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102107272A (en) * 2010-12-16 2011-06-29 张家港市江南利玛特设备制造有限公司 Compound tube plate

Also Published As

Publication number Publication date
JPH02247098A (en) 1990-10-02

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