JP2638924B2 - Manufacturing method of laminated board - Google Patents

Manufacturing method of laminated board

Info

Publication number
JP2638924B2
JP2638924B2 JP63126463A JP12646388A JP2638924B2 JP 2638924 B2 JP2638924 B2 JP 2638924B2 JP 63126463 A JP63126463 A JP 63126463A JP 12646388 A JP12646388 A JP 12646388A JP 2638924 B2 JP2638924 B2 JP 2638924B2
Authority
JP
Japan
Prior art keywords
resin
long
manufacturing
laminated board
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP63126463A
Other languages
Japanese (ja)
Other versions
JPH01294020A (en
Inventor
正人 松尾
甚昭 小島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP63126463A priority Critical patent/JP2638924B2/en
Publication of JPH01294020A publication Critical patent/JPH01294020A/en
Application granted granted Critical
Publication of JP2638924B2 publication Critical patent/JP2638924B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は電子機器、電気機器、コンピューター、通信
機器等に用いられる積層板の製造方法に関するものであ
る。
Description: TECHNICAL FIELD The present invention relates to a method for manufacturing a laminated board used for electronic equipment, electric equipment, computers, communication equipment and the like.

〔従来の技術〕[Conventional technology]

従来、積層板を連続的に加熱加圧成形する場合、上下
に配設された加圧装置が相互に接触することを防止する
ため、長尺積層体の巾方向端部にプロテクターを配設し
加圧装置の保護としている。
Conventionally, when a laminate is continuously heated and pressed, a protector is provided at an end in the width direction of the long laminate in order to prevent the pressing devices arranged above and below from coming into contact with each other. It protects the pressurizing device.

〔発明が解決しようとする問題点〕[Problems to be solved by the invention]

従来の技術で述べたように、積層板の連続製造におい
ては、プロテクターが存在するがために長尺積層体を連
続的に加熱加圧して得られる積層板は巾方向端部が中央
部より板厚が大になることは避けられないことであっ
た。本発明は従来の技術における上述の問題点に鑑みて
なされたもので、その目的とするところは、巾方向全体
にわたって板厚の均一な積層板が得られる積層板の製造
方法を提供することにある。
As described in the prior art, in the continuous production of a laminated board, a laminate obtained by continuously heating and pressing a long laminated body due to the presence of a protector has a widthwise end portion that is closer to the center than a central portion. Thickening was inevitable. SUMMARY OF THE INVENTION The present invention has been made in view of the above-described problems in the related art, and an object of the present invention is to provide a method for manufacturing a laminated plate capable of obtaining a laminated plate having a uniform thickness in the entire width direction. is there.

〔問題点を解決するための手段〕[Means for solving the problem]

本発明は所要枚数の長尺樹脂含浸乾燥基材の上面及び
又は下面に長尺金属箔を配設した長尺積層体の幅方向に
おいて、その端部にプロテクターその内側に厚みが積層
板厚の±100ミクロンのスペーサーの順に配設し、連続
的に加熱加圧成形後、所要寸法に切断することを特徴と
する積層板の製造方法のため、スペーサーにより加圧力
が均一化されるので板厚の均一な積層板を得ることがで
きるもので、以下本発明を詳細に説明する。
In the width direction of the long laminate in which the long metal foil is disposed on the upper surface and / or the lower surface of the required number of long resin-impregnated dry substrates, the present invention has a protector at its end and a thickness of the laminated plate inside. Since the spacers are arranged in the order of ± 100 microns and continuously cut by heating and pressing, and then cut to required dimensions, the pressing force is made uniform by the spacers. The present invention will be described in detail below.

本発明に用いる長尺樹脂含浸乾燥基材の長尺帯状基材
としては、ガラス布、ガラスペーパー、ガラス不織布等
のガラス系基材に加え紙、合成繊維布、合成繊維不織
布、アスベストペーパー、木綿布等が用いられるが、好
ましくは厚み調整効果の大きいガラス布、ガラスペーパ
ー、ガラス不織布等を用いることが望ましい。長尺帯状
基材に含浸させる樹脂としては不飽和ポリエステル系樹
脂、ジアリルフタレート系樹脂、ビニルエステル系樹
脂、エポキシアクリレート系樹脂、エポキシ系樹脂、フ
エノール系樹脂、メラミン系樹脂等の単独、混合物、変
性物等が用いられる。又、樹脂は同一樹脂のみによる含
浸でもよいが、同系樹脂又は異系樹脂により1次含浸は
低粘度樹脂、2次含浸は1次含浸より高粘度樹脂による
含浸と云うように含浸を複数にし、より均一な含浸がで
きるようにしてもよい。勿論樹脂には硬化剤、架橋剤、
重合開始剤、モノマー希釈剤等を加え、更に必要に応じ
て無機粉末充填剤や短繊維充填剤等の添加剤を加えるこ
ともできるものである。かくして長尺帯状基材に上記樹
脂を含浸した後、加熱して長尺樹脂含浸乾燥基材を得る
ものである。長尺金属箔としては銅、アルミニウム、
鉄、ステンレス鋼、ニッケル、亜鉛、真鍮等の単独、合
金、複合箔が用いられ必要に応じて金属箔の片面に接着
剤層を設けておき、より接着性を向上させることもでき
る。硬化時間、硬化温度は樹脂の種類によって異なり使
用する樹脂によって選択することができる。硬化に際し
ての加圧は接触圧乃至40kg/cm2が好ましく、これ又使用
する樹脂によって選択することができるものである。ス
ペーサーとしては紙や布等の積層体、ゴムや樹脂成形品
或は樹脂含浸紙、布、更にはこれらの組合せ品を用いる
ことができ、スペーサーの厚みは積層板厚の±100ミク
ロンのものを用いる必要がある。又スペーサーの巾は20
〜100mmが好ましい。プロテクターとしては通常用いら
れているゴム、樹脂等のプロテクターをそのまま用いる
ことができ、特に限定するものではない。
Examples of the long strip-shaped base material impregnated and dried with the long resin used in the present invention include glass base materials such as glass cloth, glass paper, and glass nonwoven fabric, as well as paper, synthetic fiber cloth, synthetic fiber nonwoven fabric, asbestos paper, and cotton. Although a cloth or the like is used, it is preferable to use a glass cloth, a glass paper, a glass nonwoven fabric, or the like which has a large thickness adjusting effect. As the resin to be impregnated into the long strip-shaped base material, an unsaturated polyester resin, diallyl phthalate resin, vinyl ester resin, epoxy acrylate resin, epoxy resin, phenol resin, melamine resin, etc., alone, mixture, or modified Objects are used. The resin may be impregnated with only the same resin, but the primary impregnation with the same resin or a different resin is a low-viscosity resin, and the secondary impregnation is made into a plurality of impregnations such as impregnation with a higher-viscosity resin than the primary impregnation. More uniform impregnation may be performed. Of course, the resin has a curing agent, a crosslinking agent,
A polymerization initiator, a monomer diluent and the like can be added, and if necessary, additives such as an inorganic powder filler and a short fiber filler can be added. After the long strip-shaped base material is impregnated with the above resin, heating is performed to obtain a long resin-impregnated dry base material. Copper, aluminum, and long metal foil
A single, alloy, or composite foil of iron, stainless steel, nickel, zinc, brass, or the like may be used, and an adhesive layer may be provided on one side of the metal foil as needed to further improve the adhesiveness. The curing time and the curing temperature vary depending on the type of the resin and can be selected depending on the resin used. The pressure for curing is preferably from the contact pressure to 40 kg / cm 2 , and can be selected depending on the resin used. As the spacer, a laminated body of paper or cloth, a rubber or resin molded article or a resin-impregnated paper, cloth, or a combination thereof can be used.The thickness of the spacer is ± 100 μm of the laminated plate thickness. Must be used. The width of the spacer is 20
100100 mm is preferred. As the protector, a commonly used protector such as rubber and resin can be used as it is, and it is not particularly limited.

以下本発明の一実施例を図示実施例にもとづいて説明
すれば次のようである。
An embodiment of the present invention will be described below with reference to the illustrated embodiment.

実施例 第1図は本発明の積層板の製造方法の一実施例を示す
簡略工程図、第2図は加圧部の簡略部分断面図である。
Embodiment FIG. 1 is a simplified process diagram showing one embodiment of a method for manufacturing a laminated board according to the present invention, and FIG. 2 is a simplified partial cross-sectional view of a pressing unit.

第1図に示すように巾105cm、厚さ0.15mmの長尺エポ
キシ樹脂含浸乾燥ガラス布1の3枚を重ね、更にその上
下面に巾105cm、厚さ0.035mmの長尺銅箔2を配設しラミ
ネートロール3で連続的に重ね合わせた長尺積層体4
を、巾方向端部に夫々厚さ0.5mm、巾50mmの紙製スペー
サー5、次いでゴム製プロテクター6の順に配設したダ
ブルペルトロール装置7に送り、成形圧力10kg/cm2、16
5℃で10分間連続加熱加圧積層成形後、硬化した長尺積
層体をカッター8で100cm毎に切断して厚み0.5mmの両面
銅張ガラス布基材エポキシ樹脂積層板を得た。
As shown in FIG. 1, three pieces of long epoxy resin impregnated dry glass cloth 1 having a width of 105 cm and a thickness of 0.15 mm are stacked, and a long copper foil 2 having a width of 105 cm and a thickness of 0.035 mm is disposed on the upper and lower surfaces thereof. Long laminated body 4 which is installed and continuously laminated by laminating rolls 3
At a width direction end to a paper spar 5 having a thickness of 0.5 mm and a width of 50 mm, and a rubber protector 6 in that order, and a molding pressure of 10 kg / cm 2 , 16
After continuous heat and pressure laminating at 5 ° C. for 10 minutes, the cured long laminated body was cut at intervals of 100 cm with a cutter 8 to obtain a 0.5 mm-thick double-sided copper-clad glass cloth-based epoxy resin laminate.

比較例 スペーサーを用いない以外は実施例と同様に処理して
厚み0.5mmの両面銅張ガラス布基材エポキシ樹脂積層板
を得た。
Comparative Example A treatment was performed in the same manner as in the example except that the spacer was not used to obtain a 0.5 mm-thick double-sided copper-clad glass cloth-based epoxy resin laminate.

実施例及び比較例の積層板の板厚精度は第1表のよう
である。
Table 1 shows the thickness accuracy of the laminates of the examples and the comparative examples.

〔発明の効果〕 本発明は上述した如く構成されている。特許請求の範
囲第1項に記載した構成を有する積層板の製造方法にお
いては、積層板の板厚精度が向上する効果を有してい
る。
[Effect of the Invention] The present invention is configured as described above. The method for manufacturing a laminate having the configuration described in claim 1 has the effect of improving the accuracy of the thickness of the laminate.

【図面の簡単な説明】[Brief description of the drawings]

第1図は本発明の積層板の製造方法の一実施例を示す簡
略工程図、第2図は加圧部の簡略部分断面図である。 1は長尺樹脂含浸乾燥基材、2は長尺金属箔、3はラミ
ネートロール、4は長尺積層体、5はスペーサー、6は
プロテクター、7はダブルベルト装置、8はカッター、
9は積層板、10はエンドレスベルトである。
FIG. 1 is a simplified process diagram showing one embodiment of a method for manufacturing a laminated board according to the present invention, and FIG. 2 is a simplified partial cross-sectional view of a pressing unit. 1 is a long resin impregnated and dried base material, 2 is a long metal foil, 3 is a laminating roll, 4 is a long laminate, 5 is a spacer, 6 is a protector, 7 is a double belt device, 8 is a cutter,
9 is a laminated board, 10 is an endless belt.

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】所要枚数の長尺樹脂含浸乾燥基材の上面及
び又は下面に長尺金属箔を配設した長尺積層体の幅方向
において、その端部にプロテクターその内側に厚みが積
層板厚の±100ミクロンのスペーサーの順に配設し、連
続的に加熱加圧成形後、所要寸法に切断することを特徴
とする積層板の製造方法。
1. A protector is provided at an end portion in a width direction of a long laminate in which a long metal foil is disposed on an upper surface and / or a lower surface of a required number of long resin-impregnated dry substrates. A method of manufacturing a laminated board, comprising arranging spacers having a thickness of ± 100 μm in order, continuously forming them by heating and pressing, and then cutting them to required dimensions.
JP63126463A 1988-05-23 1988-05-23 Manufacturing method of laminated board Expired - Fee Related JP2638924B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63126463A JP2638924B2 (en) 1988-05-23 1988-05-23 Manufacturing method of laminated board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63126463A JP2638924B2 (en) 1988-05-23 1988-05-23 Manufacturing method of laminated board

Publications (2)

Publication Number Publication Date
JPH01294020A JPH01294020A (en) 1989-11-28
JP2638924B2 true JP2638924B2 (en) 1997-08-06

Family

ID=14935842

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63126463A Expired - Fee Related JP2638924B2 (en) 1988-05-23 1988-05-23 Manufacturing method of laminated board

Country Status (1)

Country Link
JP (1) JP2638924B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013021893A1 (en) * 2011-08-09 2013-02-14 宇部日東化成株式会社 Laminated body production device and laminated body production method
TW202116522A (en) * 2019-10-18 2021-05-01 日商Dic股份有限公司 Method for manufacturing molded article

Also Published As

Publication number Publication date
JPH01294020A (en) 1989-11-28

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