JP2635791B2 - Method of manufacturing earphone pad and earphone pad - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a method of manufacturing an earphone pad used on the output side of a small-sized audio device such as a portable radio, a portable television, a portable tape recorder, a portable tape player, and an earphone pad. In particular, the present invention relates to a method for manufacturing an earphone pad that allows sound to pass even in a high-frequency range, and an earphone pad.

`` Prior art '' In-earphones used on the output side of small audio equipment such as portable radios, portable televisions, portable tape recorders, portable tape players, etc., have a good fit when inserted into the ear canal, For example, an earphone pad P 'as shown in FIG. 9 has been used to prevent sound leakage to the outside and improve the bass range.

The earphone pad P 'is made of urethane foam (po
The in-earphone type earphone main body H is mounted on the earphone main body H with a mobile phone in which the screen 3 is covered with a fixing ring 4.

"Problems to be Solved by the Invention" To improve the feeling of wearing, to prevent sound leakage to the outside, and to improve the bass range, the earphone pad attached to the earphone body must increase the thickness of the urethane foam material. Alternatively, it is conceivable to increase the density of the urethane foam. However, when the thickness or the density of the urethane foam is increased, the attenuation in a high frequency range is large, and the sound quality is deteriorated. Furthermore, since the opened lip is extended and attached to the earphone main body, the lip is often broken from the lip. Therefore, it was very difficult to select a material for the earphone pad.

The present invention has been made in view of the above points,
It is an object of the present invention to provide a method of manufacturing an earphone pad and a method of manufacturing an earphone pad that provide a good feeling of wearing to an ear, reduce sound leakage to the outside, and guarantee high-quality sound quality.

"Means for Solving the Problems" In order to solve the above problems, in the present invention, there is provided a hole forming step of forming a hole by forming a hole while compressing the periphery of a material sheet such as urethane foam; A method of manufacturing an earphone pad, comprising: a cutting step of cutting a plurality of perforated material sheets while adhering an outer peripheral edge so as to form a donut by back-to-back so that the compressed edge sides of the holes become outer surfaces, and a compressed edge. Characterized in that the associated outer peripheral portions of the two perforated material sheets on which are formed are adhered.

[Operation] The earphone pad P shown in FIG. 1 showing an embodiment of the present invention has an open front surface, so that sound waves obtained by converting electric signals of voices and musical sounds into acoustic vibrations are applied to the material of the earphone pad P. It is radiated directly into the ear canal without being disturbed,
High-pitched sound quality is also guaranteed. Further, since the earphone pad P is mounted around the earphone body H, sound leakage to the outside can be prevented, and the bass range can be improved.

"Example" Next, an example of a method for manufacturing an earphone pad and an embodiment of the earphone pad according to the present invention will be described in detail with reference to the drawings.

FIG. 1 is a cross-sectional view showing a state in which an earphone pad P according to the present invention is mounted on an in-earphone type earphone main body H.

In FIG. 1, the earphone body H covers the entire opening of a housing 2 in which the earphone unit 1 is incorporated with a screen 3, and the periphery of the screen 3 is attached to the housing 2 by a ring 4.

Then, an earphone pad P whose front and rear surfaces are open is attached so as to cover the ring 4 of the earphone main body H.

FIG. 2 is a process chart showing an example of a method for manufacturing the earphone pad P according to the present invention.

Hole-Punching Step The hole 6 is drilled while compressing the periphery of the hole 6 that can be drilled in the material sheet 5 such as urethane foam to form a hole-punched material sheet 51.

More specifically, a material sheet 5 such as urethane foam having excellent sound insulation, elasticity, and tactile sensation is placed on a base 7 serving as a jig, and the hole 6 is pressed by a hole drilling tool 8 from above. .

The drilling tool 8 for drilling the hole 6 in the material sheet 5 has a hollow structure as shown in FIG. 2, and is formed with a cutting blade 8a protruding inside the lower surface as shown in FIG. A flat compressed surface 8c that transitions outward with a curved surface 8b is formed.

Therefore, the hole 6 of the hole-piercing material sheet 51 formed by the above-described hole-piercing tool 8 is not a straight hole, but an enlarged curved surface 6a which spreads upward in a curved shape as shown in FIG.
Then, a compression rim 6b is formed at the lower part. The compression by the drilling tool 8 is performed by high-frequency welding and heating in addition to pressurization.

As shown in FIG. 5, for example, as shown in FIG. 5, a plurality of holes 6 are formed in a single material sheet 5 so that a large number of holes can be simultaneously manufactured.

◎ Gluing process The two perforated material sheets 51, 51 are combined with the compressed rim 6b of the hole 6,
Cutting is performed while bonding the outer peripheral edges 51a, 51a so as to form a donut by back-to-back alignment with the holes 6, 6 so that the 6b sides are the outer surfaces of each other.

More specifically, as shown in FIG. 2, the two perforated material sheets 51, 51 produced in the perforating step are combined with the guide pins of the guide base 9 so that the compression rims 6b, 6b become the upper and lower outer surfaces. 10 and the outer edges 51a, 51a
Cut into donut shape while gluing the parts to be.

The guide base 9 to which the two perforated material sheets 51, 51 are attached has, for example, a large number of guide pins 10 as shown in FIG.
Are erected at equal intervals.

The guide pin 10 erected on the guide base 9 has a hemispherical or tapered upper end so that the hole 6 of the perforated material sheet 51 can be smoothly inserted.

The bonding tool 11 for bonding the outer peripheries 51a, 51a of the two perforated material sheets 51, 51 has a pipe shape as shown in FIG. 2, and has a cutting blade 11a formed on the outside of the lower surface as shown in FIG. At the same time, a flat adhesive surface 11b is formed on the inside. The bonding by the bonding tool 11 is performed by high-frequency welding (ultrasonic bonding), heating (thermal fusion), or the like.

The earphone pad P bonded with the bonding tool 11 is
As shown in FIG. 8, it is cut into a predetermined shape, and only the outer peripheral edge 51a in contact with the bonding surface 11b and the lower surface thereof are bonded.

Therefore, the meeting surfaces 51b, 51b inside the outer peripheral edges 51a, 51a
(See FIG. 8) are not bonded. The earphone pad P thus manufactured can be used as it is, but the product value can be improved by performing the next step.

◎ Inverting process Earphone pad P cut into a donut shape in the cutting process
And the outer edges 51a, 51a are directed inward.

As described above, the holed material sheet 5 of the earphone pad P
Since only the outer peripheral edge 51a of the bonding tool 11 and the lower surface thereof are in contact with the bonding surface 11b of the bonding tool 11, they can be easily turned over.

By turning over in this way, the outer peripheral edge 51a is inside, so that the wearing feeling of the earphone pad P is not spoiled. The appearance is also good.

[Effects of the Invention] As described above, the method for manufacturing an earphone pad according to the present invention is made by combining two identical perforated material sheets, so that there is no waste that only one material is left in excess, and Since both holes have holes, alignment can be easily performed by the guide pins, and a large number can be easily obtained.

Further, the earphone pad according to the present invention has a donut shape with an open front, so that it is possible to prevent sound leakage without impairing the treble range, and to turn the outer peripheral edge inward so that the earphone pad has a feeling of wearing to the ear. Can be improved,
Since the front and rear surfaces are the same, the mounting surface to the ear can be changed. In addition, since the inner diameter portion is compressed, it is difficult to be torn and has high durability. Further, there are practical and economical effects such as easy selection of the material of the earphone pad.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view illustrating a state of use of an earphone pad according to the present invention, FIG. 2 is a process diagram illustrating an example of a method of manufacturing the earphone pad according to the present invention, and FIG. FIG. 4 is a partially enlarged cross-sectional view of a perforated material sheet, FIG. 5 is a perspective view of a perforated material sheet, and FIG. 6 is a perspective view showing an example of a superposed material sheet and a guide base. FIG. 7, FIG. 7 is a partially enlarged sectional view of an adhesive tool used in a manufacturing process, FIG. 8 is a partially enlarged sectional view of an earphone pad according to the present invention, and FIG. 9 is a sectional view showing a state of use of a conventional earphone pad. FIG. P: Earphone pad H: Earphone body 5: Material sheet 6: Hole 6b: Compression rim 51: Perforated material sheet 51a: Outer edge

Claims (3)

(57) [Claims] 1. A perforating step of perforating a perforated material sheet by compressing the periphery of a material sheet such as urethane foam, etc .; A cutting step of cutting while adhering the outer peripheral edge so as to form a donut with the backs as close as possible. 2. The method for manufacturing an earphone pad according to claim 1, wherein after the cutting step, a step of turning the donut-shaped earphone pad upside down and turning the outer peripheral edge inward is performed. 3. An earphone wherein two perforated material sheets each having a compressed rim formed thereon are back-to-back so that the compressed rim has an outer surface, and an associated peripheral portion of the perforated material sheet is adhered. pad.